Claims
- 1. An integrated active optical system comprising:
an opto-electronic device; an optics block; and a spacer, separate from said optics block, providing spacing between said opto-electronic device and said optics block, said opto-electronic device, said optics block and said spacer being aligned and bonded together.
- 2. The system of claim 1, wherein the spacer and the optics block are aligned and bonded on a wafer level prior to dicing.
- 3. The system of claim 1, wherein the spacer surrounds the opto-electronic device.
- 4. The system of claim 1, further comprising a substrate, both a bottom of said opto-electronic device and the spacer being bonded to the substrate.
- 5. The system of claim 4, wherein the opto-electronic device is bonded to the substrate on a wafer level prior to dicing.
- 6. The system of claim 1, wherein a top surface of said opto-electronic device is bonded to the spacer and the spacer further comprises interconnection tracks.
- 7. The system of claim 6, wherein the opto-electronic device is bonded to the spacer on a wafer level prior to dicing.
- 8. The system of claim 6, wherein the substrate, the optics block and the spacer are all made of silicon.
- 9. The system of claim 1, wherein the system is surface mounted to an electrical interface.
- 10. The system of claim 1, wherein said opto-electronic device comprises at least two opto-electronic devices.
- 11. The system of claim 10, wherein said at least two opto-electronic devices comprise a light source and a light detector.
- 12. The system of claim 10, wherein said at least two opto-electronic devices comprise an array of identical opto-electronic devices.
- 13. A system comprising:
a housing having a fiber; an opto-electronic device, and an optics block having two surfaces, each surface having an optical element thereon, said optics block coupling light between the opto-electronic device and the fiber, the housing, the opto-electronic device and the optics block being integrated together.
- 14. The system of claim 13, wherein said opto-electronic device comprises at least two opto-electronic devices and the fiber comprises at least two fibers.
- 15. The system of claim 14, wherein said at least two opto-electronic devices are separated from each other in at least one direction by more than said at least two fibers are separated from one another.
- 16. The system of claim 14, wherein said at least two opto-electronic devices are separated from each other in at least two directions by more than said at least two fibers are separated from one another in each respective direction.
- 17. The system of claim 14, wherein said at least two opto-electronic devices comprise a light source and a light detector.
- 18. The system of claim 14, wherein said at least two opto-electronic devices comprise an array of identical opto-electronic devices.
- 19. The system of claim 13, further comprising a spacer block between the optics block and the opto-electronic device.
- 20. The system of claim 19, further comprising a substrate, both a bottom of said opto-electronic device and the spacer being bonded to the substrate.
- 21. The system of claim 19, wherein a top surface of said opto-electronic device is bonded to the spacer and the spacer further comprises interconnection tracks.
- 22. The system of claim 13, wherein an optical axis of the fiber and an optical axis of the opto-electronic device are at an angle.
- 23. The system of claim 22, further comprising a reflective surface directing light between the opto-electronic device and the fiber.
- 24. The system of claim 13, wherein said at least one optical element on the optics block homogenizes light.
- 25. The system of claim 13, wherein the system is surface mounted to an electrical interface.
- 26. The system of claim 13, wherein the optical elements on the optics block are made on a wafer level.
- 27. A system comprising:
an opto-electronic device; an optics block having at least one optical element thereon; and a sealing structure surrounding the opto-electronic device, the opto-electronic device, the optics block and the sealing structure being integrated.
- 28. The system of claim 27, wherein the system is surface mounted to an electrical interface.
- 29. The system of claim 27, further comprising a spacer between the optics block and the opto-electronic device.
- 30. The system of claim 29, wherein the sealing structure comprises a bottom surface of the optics block and the spacer.
- 31. The system of claim 29, wherein an optical element is provided on the spacer.
- 32. The system of claim 27, further comprising a substrate receiving the opto-electronic device therein.
- 33. The system of claim 32, wherein the sealing structure comprises the substrate and a bottom surface of the optics block.
- 34. The system of claim 32, further comprising a spacer block between the optics block and the opto-electronic device.
- 35. The system of claim 34, wherein the sealing structure comprises the substrate and a bottom surface of the spacer.
- 36. The system of claim 32, further comprising vias through the substrate connecting the opto-electronic device to other systems.
- 37. The system of claim 32, wherein the opto-electronic device is in contact with the substrate, the substrate serving as a heat sink for the opto-electronic device.
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] The present application is related to the commonly assigned, co-pending application entitled “Interface Between Opto-Electronic Devices and Fibers”, attorney docket number DOC.051, filed concurrently herewith, the entire contents of which are hereby incorporated by reference for all purposes.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10032911 |
Dec 2001 |
US |
Child |
10178337 |
Jun 2002 |
US |