Patent Application
20090103858
This application is based on and claims priority under 35 USC 119 from Japanese Patent Application No. 2007-275507 filed on Oct. 23, 2007.
1. Technical Field
The present invention relates to an optical waveguide film, a method for manufacturing the same, and an optical transmission and reception module.
2. Related Art
Flexible electric wiring circuits have been generally used in variety of ways. However, accompanied by demand for high-speed signal processing techniques, signal transmission on the order of gigahertz (GHz) has been required. Hence, with regard to signal transmission on the order of gigahertz, a photo-electric combined substrate using optical communication so as to address noise problems has been studied.
According to an aspect of the invention, there is provided an optical waveguide film including:
an optical waveguide film main body having an optical waveguide core through which light is propagated, and a cladding portion that encloses the optical waveguide core and has a lower refractive index than that of the optical waveguide core; and
an electric wiring layer formed on at least a part of a principal surface of the optical waveguide film main body.
Exemplary embodiments of the present invention will be described in detail based on the following figures, wherein:
Exemplary embodiments of the present invention will be hereinafter described with reference to the attached drawings. Note that the same reference character is assigned to members having substantially the same function and operation throughout the drawings, and overlapping descriptions may be omitted.
The optical waveguide film 10 according to an exemplary embodiment of the present invention is, for example, a belt-shaped optical waveguide as shown in
The refractive index of the optical waveguide core 112 is made higher than that of the cladding 114. For example, assuming that, by way of example, the difference in the refractive index between the optical waveguide core 112 and the cladding 114 is 3%, an optical waveguide film may be obtained which has almost no bending loss until the optical waveguide file is bent to a curvature radius of 1.5 mm. A greater difference in the refractive index enables a smaller bending radius without causing bending loss. In view of a mechanical bending property of the optical waveguide film, connection loss caused by connection to an optical transmission and reception elements, and the like, the difference in the refractive index may be in the range of from 2% to 5%. If the difference in the refractive index is in the range of from 3% to 4%, even if the optical waveguide film is bent at the bending radius of 1 mm, optical loss at the time of practical bending becomes very small, and connection with the optical transmission and reception elements is also easy, which is preferable from the practical viewpoint.
Plural optical waveguide cores 112 are provided on the same plane and arranged in parallel so that optical rays separated in the widthwise direction of the optical waveguide film 10 are propagated in parallel. In the present exemplary embodiment, two optical waveguide cores 112 are disposed. The mirror surfaces 116A are provided at the longitudinal-direction end portions of the optical waveguide cores 112, and each mirror surface 116A makes an angle with the longitudinal direction. The mirror surface 116A is configured to form an angle of, for example, 45 degrees with the longitudinal direction of the optical waveguide core 112. When light propagated through the optical waveguide core 112 arrives at the mirror surface 116A, it is reflected by a layer adjacent to the mirror surface 116A (in the present exemplary embodiment, by a mirror layer 118), so that the propagation direction of the light is changed. Although the angle of the mirror surface is described herein as 45 degrees, satisfactory diversion of the optical path via a metal reflecting surface may be performed as long as the difference between the actual angle and 45 degrees is less than the critical angle of the waveguide. For example, when the difference in the refractive index between the waveguide core and the cladding is 3%, the critical angle is 23.6 degrees, and a mirror surface at an angle within the range of from 21.4 to 68.6 degrees functions as a reflecting surface having a function of diverting the optical path by 90 degrees.
Incidentally, when the optical waveguide film 10 is coated with a flame retardant resin as described below, the flame retardant resin enters a space between the optical transmission and reception element and the optical waveguide film through a canaliculus phenomenon, and the amount of light decreases due to absorption by the flame retardant resin. However, when the optical transmission and reception element and the optical waveguide are adhered to each other by filling a transparent material therebetween and the mirror layer 118 (metal layer) is provided on the mirror surface 116A, intrusion of the flame retardant resin may be avoided, and reduction in the amount of light propagated through the optical waveguide film may be avoided.
The cladding 114 is made of a material having a lower refractive index than that of the optical waveguide core 112, and is disposed to surround the optical waveguide core 112.
The materials of the optical waveguide core 112 and the cladding 114 are not particularly limited as long as the materials are transparent to the wavelength to be used for the optical waveguide film 10 and there is a desired difference in the refractive index between the optical waveguide core 112 and the cladding 14. Examples thereof include alicyclic olefin resins, acrylic resins, epoxy resins, and polyimide resins.
When the optical waveguide film 10 is coated with a flame retardant resin as described below, in order to realize excellent adhesion to the frame retardant resin layer, it is possible to use an acrylic resin or an epoxy resin as the material of the cladding 114 at least in a region that comes into contact with the flame retardant resin layer.
The electric wiring layer 120 is disposed to extend along the longitudinal direction of the optical waveguide film main body 116 from one end to the other end thereof. In the present exemplary embodiment, the electric wiring layer 120 is divided into five strips. The five strips are disposed in parallel at predetermined intervals and separated in the widthwise direction of the optical waveguide film main body 116. These five strips of the electric wiring layer 120 function, for example, as one power source line, two signal lines and two grounding wires.
The electric wiring layer 120 is, for example, formed from the same kind of metal layer as that of the mirror layer 118. The metal layer may include Au, Ag, Cu or an alloy thereof. Further, the electric wiring layer 120 and the mirror layer 118 each may be a metal layer having a thickness of from 500 nm to 5 μm, preferably from 500 nm to 2 μm. Here, the metal layer that constitutes the electric wiring layer 120 is required to have, for example, conductivity and adhesiveness between the metal film and the optical waveguide film main body 116, which is required for electric wiring by wire bonding. Hence, the film thickness of the metal film required for wire bonding may be 300 nm or greater, and conductivity required for electric wiring may be 500 nm or greater when using an Ag alloy, for example. For this reason, when a metal layer of Au, Ag, Cu or an alloy thereof is used as the electric wiring layer, the thickness thereof may be within the aforementioned range. Further, when the metal layer (electric wiring layer) has such a thickness, the electric wiring layer may also be used as the mirror layer 118, which is preferable from the practical viewpoint and realizes reduction in the cost.
The optical waveguide film 10 includes a flexible transparent resin film. As shown in
The optical waveguide film 10 preferably has a thickness of from 50 μm to 500 μm, and more preferably from 50 μm to 200 μm. The width of the optical waveguide film 10 is preferably from 0.2 mm to 10 mm, and more preferably from 0.25 mm to 5 mm.
A description will be given of a method for manufacturing an optical waveguide film according to the present exemplary embodiment.
In the method for manufacturing the optical waveguide film 10 according to the present exemplary embodiment, first, as shown in
The material that constitutes the cladding layer 114A is not particularly limited as long as there is a predetermined difference in the refractive index between the core layer 112A (optical waveguide core 112) and the cladding layer 114A. According to the purposes, the material is selected in consideration of optical properties such as refractive index and optical transmittance thereof, mechanical strength, heat-resistant property, flexibility and the like. For example, it is preferable to select a material from radiation-curable resins, electron beam-curable resins, and thermosetting resins, more preferably from ultraviolet ray-curable resins and thermosetting resins. A preferable example is a ultraviolet rays-curable or thermosetting monomer or oligomer, or a mixture of the monomer and the oligomer. It is more preferable to select an ultraviolet ray-curable resin is selected.
Examples of specific materials that can constitute the cladding layer 114A include epoxy resins, acrylic resins (such as polymethyl methacrylate), alicyclic acrylic resins, styrene resins (such as polystyrene and acrylonitrile-styrene copolymers), olefin resins (such as polyethylene, polypropylene, and ethylene-propylene copolymer), alicyclic olefin resins, vinyl chloride resins, vinylidene chloride resins, vinyl alcohol resins, vinyl butyral resins, arylate resins, fluorine-containing resins, polyester resins (such as polyethylene terephthalate and polyethylene naphthalate), polycarbonate resins, cellulose diacetate (or cellulose triactate), amide resins (such as aliphatic polyamide and aromatic polyamide), imide resins, sulfone resins, polyether-sulfone resins, polyether-ether ketone resins, polyphenylene sulfide resins, polyoxymethylene resins, and blends of these resins.
The cladding layer 114A may be formed by dropping a liquid-like resin selected from the aforementioned materials onto a substrate made of glass or the like, making the thickness uniform by spin coating, and thereafter curing the resin. Alternatively, it is also possible to use as the cladding layer 114A a resin film that has been formed in advance.
The thickness of the cladding layer 114A is not particularly limited, and from the viewpoint of optical properties, flexibility, processability at cutting described below, strength and the like, it is preferably in the range of from 10 μm to 100 μm, and more preferably from 20 μm to 50 μm.
As the core layer 112A, for example, an ultraviolet-ray curable resin is used, and an ultraviolet-ray curable monomer or oligomer, or a mixture of the monomer and the oligomer may be used. Specific examples of the core include epoxy ultraviolet-ray curable resins and acrylic ultraviolet-ray curable resins.
The core layer 112A is formed by, for example, coating the cladding layer 114A with a core curable resin (ultraviolet-ray curable resin) in a liquid state in a uniform thickness, and thereafter, curing the resin by irradiation with ultraviolet rays using an ultraviolet lamp, a ultraviolet LED, or a UV irradiation device.
The thickness of the core layer 112A is not particularly limited, and may be appropriately set according to the purpose. From the viewpoint of optical properties, flexibility, processability at cutting described below, strength and the like, the thickness is preferably from 20 μm to 120 μm, and more preferably from 30 μm to 90 μm.
Further, the size and total thickness of the polymer film 10A are not particularly limited, and may be appropriately set depending upon the material, applications thereof, and the like. For example, in order to form a flexible optical waveguide film 10, the thickness of the polymer film 10A is preferably from 50 μm to 500 μm, and more preferably from 50 μm to 200 μm. The width of the polymer film 10A is preferably from 0.2 mm to 10 mm, and more preferably from 0.25 mm to 5 mm. The bending property and strength as the optical waveguide may be readily ensured when the thickness and width of the optical waveguide film 10 are respectively within the aforementioned ranges.
Next, as shown in
As shown in
The cladding-forming curable resin for forming the cladding layer 114B is a liquid material, and may be selected, for example from radiation curable resins, electron-beam curable resins, thermosetting resins and the like. Among them, preferred curable resins include ultraviolet-ray curable resins and thermosetting resins, and ultraviolet-ray curable resins are more preferable. As the ultraviolet-ray curable resins and the thermosetting curable resins, it is preferable to use a ultraviolet-ray curable or thermosetting monomer or oligomer, or a mixture of the monomer and the oligomer. As the ultraviolet-ray curable resins, epoxy ultraviolet-ray curable resins and acrylic ultraviolet-ray curable resins may be used. The thermosetting resins may be selected from polyimide resins and silicone resins.
Next, although not illustrated in the drawings, both of the longitudinal-direction end portions of the polymer film 10A, having the optical waveguide cores 112 formed therein, are cut to form a mirror surface (a slanted structure) on the end surface of the cladding 114 and also on the end surface of the optical waveguide core 112, wherein the mirror surface forms an angle of, for example, 45 degrees with the longitudinal direction of the polymer film 10A. The aforementioned cutting by which the end surface of the cladding 114 and the end surface of the optical waveguide core 112 are made mirror surfaces is performed by, for example, cutting the polymer film 10A with a dicing saw having a blade with a 45-degree slanted structure at its blade edge.
In such a manner, the optical waveguide film main body 116 is prepared.
Subsequently, as shown in
Next, as shown in
In such a manner as described above, the optical waveguide film 10 with the electric wiring layer 120 formed thereon is prepared.
In a method for manufacturing an optical waveguide film 10 according to another exemplary embodiment, as shown in
Here, the material of the cladding layer 114C is not particularly limited as long as a predetermined difference in the refractive index between the material and the core layer 112A can be set. It is possible to use the same material as that of the cladding layer 114A. For example, the same liquid resin as that used for forming the cladding layer 114A may be applied in a uniform thickness onto the core layer 112A, and thereafter, the applied resin may be cured to form the cladding layer 114C.
The thickness of the cladding layer 114C is preferably in the range of from 5 μm to 100 μm, and more preferably from 10 μm to 50 m, from the viewpoint of optical properties, flexibility, processability at cutting described below, and strength.
Incidentally, the respective thicknesses of the cladding layer 114A and the cladding layer 114C do not have to be the same. For example, the thickness of the cladding layer 114C may be made smaller than that of the cladding layer 114A, so as to achieve a small total thickness of the polymer film 10A.
Next, as shown in
As shown in
Next, although not illustrated in the drawings, both longitudinal-direction end portions of the polymer film 10A, at which the optical waveguide cores 112 are formed, are cut, and mirror surfaces 116A (slanted structures) are formed on the end surfaces of the optical waveguide core 112 and on the end surface of the cladding 114 so as to form an angle of, for example, 45 degrees with the longitudinal direction of the polymer film 10A.
In such a manner as described above, the optical waveguide film main body 116 is prepared.
Next, as shown in
Subsequently, as shown in
In such a manner as described above, the optical waveguide film 10 having the electric wiring layer 120 formed thereon is prepared. The other portions of the manufacturing method than those described above are the same as the method for manufacturing the optical waveguide film 10 illustrated in
The optical waveguide film 10 according to the present exemplary embodiment as described above has a structure in which the electric wiring layer 120 is provided on the principal surface of the optical waveguide film main body 116. The optical waveguide film 10 has both of an electronic element and an optical element and allows propagation of light as well as transmission of electricity. Therefore, the optical waveguide film 10 has a simple structure and high bending property. As a result, low power consumption and high-speed signal processing are realized at the same time.
Further, the electric wiring layer 120 is provided and arranged simply by forming a metal layer by deposition or sputtering, and cutting the metal layer with a dicing saw or the like; therefore lower cost is realized. Moreover, a further cost reduction may be realized by the providing the same metal layer 122 to form both of the electric wiring layer 120 formed on the principal surface 116B of the optical waveguide film main body 116 and the mirror layer 118 formed on the mirror surface 116A, simultaneously.
The optical transmission and reception section 12 includes a holding member 22, and one end portion of the optical waveguide film 10 is held on the holding member 22. The optical transmission and reception section 14 includes a holding member 24, and the other end portion of the optical waveguide film 10 is held on the holding member 24.
The holding member 22 and the holding member 24 are each provided with a light receiving element 34, a light emitting element 32, a wire connecting section 44 for transmission and reception of a signal by the light receiving and emitting elements, and a wire connecting section 42 that provides electric connection to the electric wiring layer 120 of the optical waveguide film 10. Although not illustrated in the drawings, at least one driving circuit and at least one amplification circuit for the light receiving element 34 and the light emitting element 32 may also be provided.
At the wire connecting section 42 for performing transmission and reception of a signal by the light receiving and emitting element, the light receiving element 34 and the light emitting element 32 are connected by wires 54A to electrodes 52A provided at each of the holding member 22 and 24 (in the present exemplary embodiment, two electrodes 52A are provided at each holding member), in order to allow, from outside of the module, amplification of a signal transmitted and received by the light receiving and emitting element and driving of the light receiving and emitting element.
At the wire connecting section 44 for providing electric connection to the electric wiring layer 120 of the optical waveguide film 10, an end of the electric wiring layer 120 is connected by wires 54B to electrodes 52B (in the present exemplary embodiment, five electrodes are provided since five strips of an electric wiring layer are provided) provided at each of the holding member 22 and the holding member 24, in order to provide power supply, transmission and reception of electric signals, earth connection and the like by providing electric connection to the electric wiring layer 120 from outside of the module.
The optical waveguide film 10 provided in the optical transmission and reception module 11, and the light receiving element 34, the light emitting element 32, the wire connecting section 42, and the wire connecting section 44 provided at each of the holding member 22 and the holding member 24, are coated with a flame retardant resin, so that a flame retardant resin layer 13 is formed on the surfaces of these members. The flame retardant resin layer 13 covers the electric wiring layer 120 provided in the optical waveguide film 10, and functions as the protective layer for the electric wiring layer 120.
In the present exemplary embodiment, the state of “being coated with the flame retardant resin” refers to a state in which due to the formation of the flame retardant resin layer 13 made of the flame retardant resin on members to be coated, the members are not exposed to the outside air.
In the present exemplary embodiment, explanation is given assuming that all of the optical waveguide film 10, and the light receiving element 34, the light emitting element 32, the wire connecting section 42 and the wire connecting section 44 provided at each of the holding member 22 and the holding member 24, are coated with the flame retardant resin.
It is preferable that all of the optical waveguide film 10 and the light receiving element 34, the light emitting element 32, the wire connecting section 42, and the wire connecting section 44 provided at each of the holding members 22 and 24 are coated from the viewpoint of improvement in the flame retardancy of the optical transmission and reception module 11. However, coating at least the optical waveguide film 10 with the flame retardant resin may suffice. It is more preferable to coat the optical waveguide film 10 and at least one of the light receiving element 34, the light emitting element 32, the wire connecting section 42, and the wire connecting section 44 provided at each of the holding members 22 and 24, with the flame retardant resin.
The flame retardant resin used in the present exemplary embodiment is a resin having a flame retardancy of HB or higher on a UL 94 test wherein the optical waveguide film 10, when its surface is coated with the flame retardant resin layer 13, has a minimum bending radius of 1 mm to 3 mm (or about 1 mm to about 3 mm).
The UL 94 test of the flame retardant resin is conducted using a strip-shaped specimen having a width of 13.0 mm, a length of 125 mm, and a thickness of 100 μm (, which is a practically minimum value). The UL 94 test is a known flame test in which the degree of the specimen burning is inspected by applying flame from a gas burner to the specimen according to a vertical flame test or a horizontal flame test. The grade of flame retardancy of general materials based on UV 94 test includes 5VA, 5VB, V-0, V-1, V-2, and HB in the order of from highest flame retardancy to lowest flame retardancy. The flame retardant resin of the present exemplary embodiment has a flame retardancy of HB or higher in a UL 94 test when formed as a flame retardant resin layer, preferably V-2 or higher, and more preferably V-0 or higher. The UL 94 test is incorporated herein by reference.
In the present exemplary embodiment, the flame retardant resin having the aforementioned properties may be a resin including, as a main component, a dimethyl polysiloxane (HO—[Si(CH3)2O]—H) having a degree of polymerization of 200 to 1000. The flame retardant resin including, as the main component, a dimethyl polysiloxane refers to a resin that contains a dimethyl polysiloxane in an amount of at least 30 weight %.
It is known that a slight amount of cyclic dimethyl polysiloxane is contained in a dimethyl polysiloxane obtained by a normal production process. Since the cyclic dimethyl polysiloxance has no reactivity and is volatile, troubles caused by electric contact may occur.
For this reason, in the present exemplary embodiment, a flame retardant resin in which the content of cyclic low-molecular siloxane containing 3 to 20 (trimer to 20-mer, D3 to D20) cyclic dimethyl units (D body) is 500 ppm or less (or about 500 ppm or less), preferably 300 ppm or less.
The flame retardant resin may contain a filler having flame retardancy (a flame retardant filler). The flame retardant filler may be titanium oxide, silicon oxide, aluminum oxide or the like
When the flame retardant resin contains the flame retardant filler, the amount of the flame retardant filler relative to 100 weight parts of dimethyl siloxane may be in the range of from 1 weight part to 70 weight parts.
The flame retardant resin is applied onto respective members to be coated, and is cured by being left at room temperature or by heating, so that the flame retardant resin layer 13 is provided on the surfaces of the respective members. The application of the flame retardant resin is carried out with a dispenser or the like. Therefore the viscosity of the flame retardant resin at the time of the application may be sufficiently low. Specifically, the viscosity may be from 1 Pa·s to 30 Pa·s (or about 1 Pa·s to about 30 Pa·s), preferably 2 Pa·s to 20 Pa·s. For the purpose of viscosity adjustment, a solvent may be added to such a degree that no adverse effect is exerted by the solvent.
The thickness of the flame retardant resin layer 13, formed by applying the flame retardant resin onto the respective members and curing the flame retardant resin, may be from 20 μm to 100 μm (or about 20 μm to 100 μm) in the straight-line portion that is required to have bending property, more preferably 30 μm to 80 μm. At the holding members 22 and 24 that are not required to have bending property, since wires that connect electrodes is preferably entirely coated, the thickness of the flame retardant resin layer may be determined depending on cases.
Further, the tensile strength of the frame retardant resin layer 13 may be from 0.5 MPa to 5 MPa (or about 0.5 MPa to about 5 MPa), preferably from 1.0 MPa to 4.0 MPa.
Measurement of the tensile strength and the viscosity is performed based on JIS-K6249, which is incorporated herein by reference.
Moreover, the optical waveguide film 10 having the flame retardant resin layer 13 on a surface thereof, formed by applying the flame retardant resin, may have a minimum bending radius of 1 mm to 3 mm. The optical waveguide film 10 coated with the flame retardant resin preferably has a thickness of from 50 μm to 500 μm, in order to enhance flexibility when deformed, more preferably from 100 μm to 300 μm. Furthermore, for a similar reason, the optical waveguide film 10 preferably has a width of from 0.25 mm to 10 mm, more preferably from 0.3 mm to 3 mm. In this case, the thickness of the optical waveguide film 10 (in an uncoated state) may be in the range of from 60 μm to 100 μm.
Next, the structure of the optical transmission and reception section 12 having the holding member 22 will be described. Since the holding member 24 has the same structure as that of the holding member 22 and the optical transmission and reception section 14 has the same structure as that of the optical transmission and reception section 12, descriptions of the holding member 24 and the optical transmission and reception section 14 are omitted.
The holding member 22 is made of a substrate that is substantially rectangular parallelepiped. The holding member 22 is provided with the light receiving element 34, the light emitting element 32, the wire connecting section 42, and the wire connecting section 44.
In the present exemplary embodiment, an optical waveguide used to transmit an optical signal from the optical transmission and reception section 12 is called an optical waveguide for transmission of the signal, and an optical waveguide used to receive an optical signal from the optical transmission and reception section 12 is called an optical waveguide for receiving the signal. However, when these optical waveguides are considered in terms of the function of the optical transmission and reception section 14, the optical waveguide for transmission of the signal and the optical waveguide for receiving the signal are reversed.
In the optical transmission and reception section 12, for example, the light emitting element 32 and the light receiving element 34 are mounted on the holding member 22 by using a flip chip bonder or the like. Next, the optical waveguide film 10 is mounted on the light emitting element 32 and the light receiving element 34 by using a flip chip bonder. As a result, the optical waveguide film 10 is brought into the state of being held by the holding member 22 and the holding member 24. Then, the light emitting element 32 and the light receiving element 34 are connected to the electrodes 52A by wires 54A. Further, one end portion of the electric wiring layer 120 is connected to the electrodes 52B by wires 54B.
Further, the surfaces of the light emitting element 32, the light receiving element 34, the wire connecting section 42, the wire connecting section 44, and the optical waveguide film 10, which members are mounted or held on each of the holding member 22 and holding member 24, are coated with a flame retardant resin by using a dispenser, whereby the flame retardant resin layer 13 is formed by the flame retardant resin on the surfaces of these members. The coating using a dispenser may be carried out by putting a module in a mold having a depression.
Through the aforementioned process, the optical transmission and reception module 11 of the present exemplary embodiment in which the surfaces of the light emitting element 32, light receiving element 34, wire connecting section 42, wire connecting section 44 and optical waveguide film 10 as components of the optical transmission and reception module 11 are coated with the flame retardant resin, is prepared.
Next, an operation of the optical transmission and reception module 11 according to the present exemplary embodiment will be described. In the description given herein, an optical waveguide for transmission of an optical signal refers to an optical waveguide to which the optical transmission and reception section 12 transmits an optical signal, and an optical waveguide for receiving an optical signal refers to an optical waveguide from which the optical transmission and reception section 12 receives an optical signal.
In the optical transmission and reception module according to the present exemplary embodiment, when an optical signal is transmitted from the optical transmission and reception section 12 to the optical transmission and reception section 14, light emitted from the light emitting element 32 held by the holding member 22 of the optical transmission and reception section 12 enters the optical waveguide core 112 from an incident end surface of the optical waveguide core 112 of the optical waveguide for transmission of the signal, and is transmitted through the optical waveguide for transmission of the signal formed in the optical waveguide film; the light coming out of the outputting end surface of the optical waveguide core 112 of the optical waveguide for transmission is received by the light receiving element 34 held by the holding member 24 of the optical transmission and reception section 14.
Similarly, when the optical signal transmitted from the optical transmission and reception section 14 is received by the optical transmission and reception section 12, light emitted from the light emitting element 32 held by the holding member 24 of the optical transmission and reception section 14 enters the optical waveguide core 112 from an incident end surface (mirror surface 116A) of the optical waveguide core 112 of the optical waveguide for receiving the signal, and is transmitted through the optical waveguide for receiving the signal formed in the optical waveguide film 10. Then, the light coming out of the outputting end surface (mirror surface 116A) of the optical waveguide core 112 of the optical waveguide for receiving the signal is received by the light receiving element 34 held by the holding member 22 of the optical transmission and reception section 12.
Along with the aforementioned optical transmission and reception, for example, electrical processing such as power supply, transmission and reception of an electrical signal, earth connection or the like is also performed via the electric wiring layer 120 provided to the optical waveguide film 10.
In the aforementioned exemplary embodiment, a description was given of an optical transmission and reception module that allows two-way optical communication between the optical transmission and reception sections each having both of a light emitting element and a light receiving element mounted thereon. However, the module may alternatively be an optical transmission and reception module in which one-way optical communication is carried out between a light transmitting section having a light emitting element and a light receiving section having a light receiving element.
The present invention will be hereinafter described specifically by way of examples. However, the examples should not be construed as limiting the invention.
First, an epoxy film which has a high refractive index and which will serve as a core (thickness: 50 μm, refractive index: 1.57) is prepared. Next, an epoxy ultraviolet-ray curable resin having a refractive index of 1.51 is applied by spin coating onto both surfaces of the epoxy film, such that the applied resin has a thickness of 20 μm. The applied epoxy ultraviolet-ray curable resin is cured by irradiation with ultraviolet rays, whereby a three-layer film is obtained.
Next, the three-layer film is placed in a dicing saw (DAD 321, available from DISCO Corporation), and is cut from the principal surface side (uppermost surface side) by using a dicing saw equipped with a blade having a thickness of 100 μm at a cutting precision of 75 μm±5 μm. Subsequently, cutting position is shifted by 50 μm, and cutting is conducted again to form a protruding portion corresponding to a core having a core diameter of 50 μm. Then, the cutting position is shifted by 450 μm and cutting is conducted, and the cutting position is shifted by 50 μm and cutting is conducted. As a result, two cores having a core diameter of 50 μm and core pitch of 500 μm are formed.
Next, the epoxy ultraviolet-ray curable resin having a refractive index of 1.51 is applied to fill the groove portion formed by the aforementioned cutting, and thereafter cured by irradiation with ultraviolet rays, whereby a belt-shaped optical waveguide film having a width of 1.0 mm and a thickness of 90 μm is formed.
Subsequently, both ends of the optical waveguide film are cut at an angle of 45 degrees relative to the optical axis, by using a dicing saw equipped with a blade having an angle of 45 degrees for silicon, whereby a mirror surface is formed at an angle of 45 degrees where the cores are exposed.
Thus, an optical waveguide film main body is prepared.
Then, an Ag alloy layer having a thickness of 1.7 μm is deposited on the entire surface of the waveguide film main body (including the 45-degree mirror surface but excluding the surface that contacts the floor) by sputtering of an Ag alloy. The sputtering for forming the Ag alloy layer is conducted by using a high-rate sputtering apparatus (SH-450 available from ULVAC) at a power of 0.8 kW and a pressure of 0.17 Pa, and the sputtering time for film formation is 10 minutes.
Next, in order to separate the Ag alloy layer formed on the mirror surface of the optical waveguide film main body and the Ag alloy layer formed on the upper surface of the optical waveguide film main body, cutting is conducted with a dicing saw having a 50 μm-thick dicing blade at positions each of which is 0.5 mm apart from either of the end portions of the upper surface of the optical waveguide film in the longitudinal direction, whereby the Ag alloy layer formed on the mirror surface and the Ag alloy layer formed on the upper surface are separated (a separation width, at which the Ag alloy layer is absent, is 53 μm).
Subsequently, the Ag alloy layer formed on the upper surface of the optical waveguide film main body is cut four times with the dicing blade having a thickness of 50 μm along the longitudinal direction of the film at pitches of 200 μm. As a result, five lines of electric wiring layer are formed on the upper surface of the optical waveguide film main body wherein the five lines extend along the longitudinal direction of the optical waveguide film main body from one end portion to the other end portion of the optical waveguide film main body, have intervals of 200 μm in the widthwise direction of the optical waveguide film main body, and each have a widthwise dimension of 150 μm. As a result, an optical waveguide film having a mirror layer having a thickness of 90 μm, a length of 100 mm, a width of 1 mm (Ag alloy layer), and five lines of an electric wiring layer (Ag alloy layer having a thickness of 1.7 μm) is prepared.
A VCSEL element (trade name: AM-0001; available from Fuji Xerox Co., Ltd.) and a photodiode element (trade name: D8485-1026; available from EMCORE CORPORATION) are mounted on a silicon substrate having the thickness of 600 μm by using a flip chip bonder, and thereafter, the electrodes of the respective chips are connected by a wire bonder to electrodes provided on the silicon substrate.
Subsequently, the optical waveguide film thus obtained is mounted on the VCSEL element and also on the photodiode element by using a flip chip bonder. At the time of mounting, an epoxy-type ultraviolet-ray curable resin is used for bonding, and the film is cured by irradiation of ultraviolet rays. Finally, one end portion of each of the lines of the electric wiring layer of the optical waveguide film is connected by a wire bonder to an electrode provided on the silicon substrate. As a result, an optical transmission and reception module is prepared.
As the flame retardant resin, one liquid-type condensation curable silicone resin available from Shin-Etsu Chemical Co., Ltd. is prepared. Properties of the frame retardant resin used in Example 1
The flame-retardant resin is applied by using a coating robot (trade name: FAD320S; available from Musashi Enginnering Inc.) so as to coat the surface of the optical waveguide film of the optical transmission and reception module prepared in Example 1 and the VCSEL element, the photodiode element, and the respective wire connecting sections (electrodes, wires and the like) mounted on the substrate. Thereafter, the flame-retardant resin is cured by being left at room temperature (25° C.) for 10 minutes.
The thickness of the flame retardant resin layer formed by curing the applied flame retardant resin is measured, and is found to be 0.2 mm.
The minimum bending radius of the optical waveguide film whose surface is coated with the flame retardant resin is measured according to ASTM D-2176, which is incorporated herein by reference. As a result, the minimum bending radium of the optical waveguide film coated with the flame retardant resin is 1.5 mm.
Accordingly, it is found that a photoelectric module capable of optical transmittance and reception is provided which has a simple structure, high bending property and excellent flame retardancy.
An optical transmission and reception module is prepared by using the same material and in the same manner as in Example 1, except that the three-layer film prepared in Example 1 is cut by a dicing saw from the principal surface side (uppermost surface side) with a precision of 75 μm±5 μm, the cutting position is shifted by 50 μm and the cutting is again conducted, thereby forming a single core having a core diameter of 50 μm.
Using the prepared optical transmission and reception module, the minimum bending radius of the surface-coated optical waveguide film is measured according to ASTM D-2176. As a result, the minimum bending radius of the optical waveguide film coated with the flame retardant resin is 1.5 mm.
Accordingly, it is found that a photoelectric module capable of optical transmission and reception module is provided which has a simple structure, high bending property and excellent flame retardancy.
An optical transmission and reception module is prepared using the same material and in the same manner as in Example 2, except that the flame retardant resin is replaced by a flame retardant resin having the following properties and curing of the flame retardant resin is performed by heating at 120° C. for one hour after coating.
In Example 3, an addition-curable silicone resin of two-liquid type available from Shin-Etsu Chemical Co., Ltd. is prepared as the flame retardant resin. Properties of the flame retardant resin used in Example 3
Viscosity in the uncured state: 1 Pa·s
Tensile strength: 1.0 MPa
Amount of cyclic dimethyl type low-molecular siloxane contained, having the amount combined in the range of D3 (trimer) to D10 (10-mers): less than 500 ppm
Kind of flame retardant filler: silicon oxide
Content of the flame retardant filler: 10 weight %
Flame retardancy according to UL-94 test: V-0
Using the optical transmission and reception module thus prepared, the minimum bending radius of the surface-coated optical waveguide film is measured according to ASTM D-2176. As a result, the minimum bending radius of the optical waveguide film coated with the flame retardant resin is 1.5 mm.
Accordingly, it is found that a photoelectric module capable of optical transmission and reception is provided which has a simple structure, high bending property and excellent flame retardancy.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2007-275507 | Oct 2007 | JP | national |
