Claims
- 1. A waveguide comprising:
a waveguide core, and an air-gap cladding engaging a portion of the waveguide core.
- 2. The waveguide of claim 1, wherein the waveguide core includes at least one coupling element.
- 3. The waveguide of claim 1, further comprising:
at least one coupling element disposed adjacent to the waveguide core.
- 4. The waveguide of claim 1, further comprising:
a second waveguide cladding adjacent to the waveguide core.
- 5. The waveguide of claim 1, further comprising:
a second waveguide core.
- 6. A device, comprising:
a waveguide having a waveguide core and an air-gap cladding engaging a portion of waveguide core.
- 7. The device of claim 6, wherein the waveguide is included in a microelectronic device.
- 8. The device of claim 6, wherein the waveguide is included in an integrated optical device.
- 9. The device of claim 6, wherein the waveguide is included in a photonic crystal device.
- 10. A method for fabricating a waveguide comprising:
(a) providing a substrate having a lower cladding layer disposed on the substrate; (b) disposing a waveguide core on a portion of the lower cladding layer; (c) disposing a sacrificial layer onto at least one portion of the lower cladding layer and the waveguide core; (d) disposing an overcoat layer onto the lower cladding layer and the sacrificial layer; and (e) removing the sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and engaging a portion of the waveguide core.
- 11. The method of claim 10, further including:
disposing an optical grating layer adjacent to the waveguide core after (b) and before (c).
- 12. A method for fabricating a device comprising:
(a) providing a substrate; (b) disposing a waveguide core on a portion of the substrate; (c) disposing a sacrificial layer onto at least one portion of the substrate and the waveguide core; (d) disposing an overcoat layer onto the substrate and the sacrificial layer; and (e) removing the sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and engaging a portion of the waveguide core.
- 13. A system for fabricating a waveguide comprising:
(a) means for providing a substrate having a lower cladding layer disposed on the substrate; (b) means for disposing a waveguide core on a portion of the lower cladding layer; (c) means for disposing a sacrificial layer onto at least one portion of the lower cladding layer and the waveguide core; (d) means for disposing an overcoat layer onto the lower cladding layer and the sacrificial layer; and (e) means for removing the sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and engaging a portion of the waveguide core.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to co-pending U.S. provisional application entitled, “Guided-wave Optical Interconnection Using Volume Grating Coupler and Air Gap Technologies Embedded Within A Microelectronic Package,” having ser. No. 60/268,142, filed Feb. 11, 2001, which is entirely incorporated herein by reference.
[0002] This application is related to copending U.S utility patent application entitled “Guided-wave Optical Interconnections Embedded Within a Microelectronic Package,” filed on Feb. 11, 2002, which is entirely incorporated herein by reference.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0003] The U.S. government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of MDA 972-99-1-0002 awarded by the DARPA of the U.S. Government.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60268142 |
Feb 2001 |
US |