This Application claims priority of Taiwan Patent Application No. 101119031, filed on May 29, 2012, the entirety of which is incorporated by reference herein.
1. Field of the Invention
The invention relates to an optoelectronic device, and in particular relates to a light emitting diode device.
2. Description of the Related Art
Optical lenses are often disposed on optoelectronic devices for assisting with light transmission. Typically, the optical lens is adhered onto a lead frame through an adhesive layer.
However, when an optical lens is adhered onto a lead frame, problems of tilt or dislocation may easily arise, which cause differences in light transmission and negatively affect the performance of the optoelectronic device.
Thus, it is desired to have technique to resolve and/or reduce the above-mentioned problems.
According to an embodiment of the invention, an optoelectronic device is provided. The optoelectronic device includes: a lead frame having a reflective structure, wherein the reflective structure has an opening; an optoelectronic element disposed in the opening; at least one electrode disposed in the lead frame and electrically connected to the optoelectronic element; a lens disposed on the lead frame and having an adhesive portion having a holding surface, an alignment surface, and an adhesive surface, wherein the adhesive surface has a convex surface or a concave surface; and a covering adhesive layer filling a region defined by the reflective structure, covering the optoelectronic element, and adhering the lens to the lead frame through the adhesive portion of the lens.
According to an embodiment of the invention, an optoelectronic device is provided. The optoelectronic device includes: a lead frame having a reflective structure, wherein the reflective structure has an opening; an optoelectronic element disposed in the opening; at least one electrode disposed in the lead frame and electrically connected to the optoelectronic element; a lens disposed on the lead frame and having an adhesive portion having a holding surface, an alignment surface, and an adhesive surface, wherein the adhesive surface has an adhesive sidewall and an adhesive bottom surface; and a covering adhesive layer filling a region surrounded by the reflective structure and covering the optoelectronic element, wherein the lens is adhered to the lead frame through the adhesive portion of the lens.
According to an embodiment of the invention, a method for forming an optoelectronic device is provided. The method includes: providing a lead frame; disposing an optoelectronic element on the lead frame; filling a covering adhesive layer in a region surrounded. by the reflective structure, wherein the covering adhesive layer covers the optoelectronic element; disposing a lens on an opening of the lead frame and the covering adhesive layer, wherein the lens has a holding surface, an alignment surface and an adhesive surface, and the adhesive surface has a convex surface or a concave surface; and curing the covering adhesive layer.
According to an embodiment of the invention, a method for forming an optoelectronic device is provided. The method includes: providing a lead frame; disposing
an optoelectronic element on the lead frame; filling a covering adhesive layer in a region surrounded by the reflective structure, wherein the covering adhesive layer covers the optoelectronic element; disposing a lens on an opening of the lead frame and the covering adhesive layer, wherein the lens has a holding surface, an alignment surface and an adhesive surface, wherein the adhesive surface has an adhesive sidewall and an adhesive bottom surface; and curing the covering adhesive layer.
A detailed description is given in the following embodiments with reference to the accompanying drawings.
The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
The manufacturing method and method for use of the embodiment of the invention are illustrated in detail as follows. It is understood that the following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. In addition, the present disclosure may repeat reference numbers and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Furthermore, descriptions of a first layer “on,” “overlying,” (and like descriptions) a second layer, include embodiments where the first and second layers are in direct contact and those where one or more layers are interposing the first and second layers.
The optoelectronic device includes an optoelectronic element 110 disposed in the opening of the reflective structure 100. The optoelectronic element 110 can be a light emitting element (e.g. a light emitting diode) or a light sensing element. Taking a light emitting diode as an example, the optoelectronic element 110 has a P-type electrode and a N-type electrode (not shown), wherein the P-type electrode and the N-type electrode are electrically connected to conductive regions 102a and 102b of the lead frame 10 through the conductive wires 112a and 112b (e.g. by wire bonding or flip chip bonding), respectively. The conductive regions 102a and 102b are electrically connected to the electrodes 104a and 104b disposed on the lead frame 10 through conductive wires (not shown).
Then, as shown in
The lens 13 includes silicone resin, epoxy resin, glass, or combinations thereof. Alternatively, the lens 13 can include other suitable transparent materials. The lens 13 includes an output light portion 131, and the output light portion 131 has a convex profile (or a convex shape) or a concave profile (or a concave shape). The lens 13 includes an adhesive portion, and the adhesive portion has a holding surface 132H, an alignment surface 132S and an adhesive surface 132P.
Then, the lens 13 is disposed on the reflective structure 100, and the lens 13 can be embedded in and fixed to the covering adhesive layer 140, as shown in
The disposing of the lens 13 on the reflective structure 100 includes the steps of contacting the holding surface 132H of the lens 13 with a surface 100T of the reflective structure 100, and putting the alignment surface 132S into the opening along a sidewall 100R of the reflective structure 100.
As shown in
The alignment surface 132S of the lens 13 can be used to help the alignment of the lens 13. The lens 13 moves downwardly along the sidewall 100R of the reflective structure 100. The alignment surface 132S can be substantially parallel to the sidewall 100R of the reflective structure 100. The alignment surface 132S can be in direct contact with the sidewall 100R of the reflective structure 100. Alternatively, other material layers can be formed between the alignment surface 132S and the sidewall 100R of the opening. The alignment surface 132S connects the holding surface 132H.
The adhesive surface 132P of the lens 13 extends from the alignment surface 132S to the optoelectronic element 110. The adhesive surface 132P is in direct contact with the covering adhesive layer 140. The adhesive surface 132P includes a convex surface or a concave surface. The adhesive surface 132P of the lens 13 helps the lens 13 to be pressed into the covering adhesive layer 140 and avoids and/or reduces the generation of bubbles in the covering adhesive layer 140. Thus, light can be successfully transmitted out from the optoelectronic element 110, or light can be successfully transmitted from the environment into the optoelectronic element 110.
The lens of the optoelectronic device of the embodiments of the invention has a specific adhesive portion, which can facilitate the self-alignment between the lens and the covering adhesive layer during the bonding of the lens to the covering adhesive layer, and thus the tilt of the lens and the mismatch of the lens and the covering adhesive layer can be reduced and/or be avoided, which helps the lens to be positioned accurately and set firmly onto the optoelectronic element. Moreover, the transmission error of light can be reduced, the performance of the device can be improved, the manufacturing process can be simplified, and the manufacturing cost can be reduced. Furthermore, the generation of bubbles in the covering adhesive layer can be effectively avoided by the design of the convex surface or the concave surface of the bottom of the lens so as to improve the performance of the optoelectronic device.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, it intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should he accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
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101119031 | May 2012 | TW | national |