Patent Application
20110052130
The present invention relates to an organic device and a method of manufacturing the organic device.
In recent years, optical communication network enabling large capacity data communication at high speed is expanding. The optical communication network is assumed to be mounted on a consumer device in the future. An electrical input/output optical data transmission cable (optical cable) capable of being used no different from the present electrical cable is desired for the application of large capacity data transfer at higher speed, noise countermeasures, and data transmission between substrates in the device. In view of flexibility, a light guide is desirably used for the optical cable.
The light guide is formed by a core having a large index of refraction and a clad having a small index of refraction arranged in contact with the periphery of the core, and propagates the light signal entered to the core while repeating total-reflection at the boundary of the core and the clad. The light guide has flexibility since the core and the clad are made of flexible polymeric material.
In recent years, in particular, a flexible (similar to electrical wiring) optical wiring mounted on bendable displays and smaller and thinner consumer devices is desirably realized with the light guide. That is, the light guide is desirably a film-form light guide.
The number and the importance of the organic device using polymer including the light guide are increasing year after year. The organic device includes an optical memory, a liquid crystal device, and the like. Such organic devices are often formed on a substrate generally made of polymer.
In recent years, flexibility is demanded on the organic device such as the light guide, electronic paper, or flexible solar battery. In the organic device demanded with flexibility, the adhesiveness between the substrate and the polymer layer greatly influences a performance of the organic device.
In particular, the light guide having flexibility is expected to be used in a narrow wiring of the electronic device such as the portable telephone. Thus, the light guide is placed in an ultra-bent state or an ultra-twisted state depending on the usage state of the electronic device. An unexpected stress thus concentrates between the light guide and the substrate, and the optical characteristics of the light guide are greatly influenced by stripping, and the like. Enhancement in the adhesiveness between the substrate and the polymer layer (light guide) is thus an urgent need in the light guide serving as the organic device.
In a general organic device, the adhesiveness between the substrate and the polymer layer is sufficiently ensured by applying primer on the substrate surface in the technique described in patent document 1.
The technique described in patent document 1 is effective as a means for enhancing the adhesiveness between the substrate and the polymer layer in a general organic device. However, the adhesiveness between the substrate and the light guide may not be sufficiently ensured in the light guide placed under adverse conditions such as ultra-bent state or ultra-twisted state. Thus, if the light guide serving as the organic device is manufactured using the technique described in patent document 1, the optical characteristics of the light guide may degrade as the light guide strips from the substrate.
The influence of the optical characteristics caused by the stripping of the light guide from the substrate will be described below.
In the optical module for light transmitting information with the light guide as a medium, optical axis alignment of the light guide and the light emitting element (or light receiving element) is required on the light incident side end (or light exit side end) of the light guide. High accuracy is demanded on the positional relationship of the light emitting element (or light receiving element) and the light guide to efficiently transmit information. The optical axis alignment also influences the coupling loss. The variation in the coupling loss leads to degradation of the S/N ratio.
As shown in
The light guide generally has a configuration of being weak to local bending. As shown in
Patent document 1: Japanese Unexamined Patent Publication “Japanese Unexamined Patent Publication No. 2005-62424 (published Mar. 10, 2005)”.
One or more embodiments of the present invention provides an organic device in which a polymer layer is formed on a substrate made of polymer, where the adhesiveness between the substrate and the polymer layer can be enhanced, and a method of manufacturing the organic device.
Characteristics strong to pulling can be ensured while ensuring the adhesiveness of the substrate and the polymer layer even when placed under an adverse condition of ultra-bent state or ultra-twisted state by causing the adhesive surface of the substrate with the polymer layer to have a crystallization degree lower than the interior.
One or more embodiments of the present invention provides an organic device including a substrate made of polymer and including a polymer layer adhered on the substrate, wherein a crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate.
Here, “crystallization degree” refers to the proportion of the crystallized site in a specific region in the adhesive surface. In other words, the crystallized site and the non-crystallized site coexist in the adhesive surface, and the crystallization degree is the proportion of the crystallized site with respect to the total of the crystallized site and the non-crystallized site.
According to the above configuration, the crystallization degree of the adhesive surface with the polymer layer in the substrate is smaller than the crystallization degree of the interior of the substrate, and thus satisfactory adhesiveness between the substrate and the polymer layer is obtained. Thus, according to the above configuration, the adhesiveness of the substrate and the polymer layer can be ensured even when placed under an adverse condition of ultra-bent state or ultra-twisted state.
Furthermore, in the above configuration, the crystallization degree differs for the adhesive surface with the polymer layer in the substrate and the interior of the substrate, and thus the crystallization degree of the interior of the substrate is maintained large. A structure that is strong to pulling and the like can be achieved by the above configuration. Therefore, according to the above configuration, a pulling resistance property can be enhanced in a structure in which the crystallization degree of the adhesive surface is low to enhance the adhesiveness, compared to a structure in which the crystallization degree is the same for the adhesive surface with the polymer layer in the substrate and the interior of the substrate, or the crystallization degree is higher in the adhesive surface than the interior of the substrate.
Advantages of one or more embodiments of the present invention should become apparent from the following description.
a) and 3(b) are explanatory views for describing the method of low crystallization process of the substrate in the organic device of
a) to 5(d) are explanatory views for describing the method of low crystallization process of the substrate in the organic device of
a) and 10(b) show a schematic configuration of the present organic device including a light guide serving as a polymer layer, where
a) to 11(f) are cross-sectional views showing a fabricating method (duplicating method) of the light guide using a die.
a) to 12(e) are cross-sectional views showing a fabricating method of the light guide using the dry etching method.
a) is a perspective view showing an outer appearance of a foldable portable telephone including the light guide according to the present embodiment, 15(b) is a block diagram of a portion where the light guide is applied in the foldable portable telephone shown in 15(a), and 15(c) is a perspective plan view of a hinge portion in the foldable portable telephone shown in 15(a).
a) is a perspective view showing an outer appearance of a printing device including the light guide according to the present embodiment, 16(b) is a block diagram showing main parts of the printing device shown in 16(a), and 16(c) and 16(d) are perspective views showing a curved state of the light guide when the printer head is moved (driven) in the printing device.
a) and 18(b) are cross-sectional views showing a schematic configuration of the organic device applied as an organic light emitting element.
In embodiments of the invention, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to one of ordinary skill in the art that the invention may be practiced without these specific details. In other instances, well-known features have not been described in detail to avoid obscuring the invention. One embodiment of the present invention will be described below.
The adhesiveness of the substrate and the polymer layer can be ensured even when placed under an adverse condition of ultra-bent state or ultra-twisted state by causing the adhesive surface of the substrate with the polymer layer to have a crystallization degree lower than the interior. The organic device according to one or more embodiments of the present invention is an organic device including a substrate made of polymer and in which a polymer layer is adhered to the substrate, where the crystallization degree of the adhesive surface of the substrate with the polymer layer is smaller than the crystallization degree of the interior of the substrate.
The result of reviewing the relationship between the adhesiveness of the substrate with the polymer layer and the crystallization degree of the substrate is shown in table 1. In this review, the crystallization degree of the substrate is measured using an X-ray diffraction apparatus. The review is made using PI (polyimide), PET (polyethylene terephalate), and PP (polypropylene) for the material of the substrate.
The adhesive force of the substrate and the polymer layer is measured by a 90° stripping test. The difference in the crystallization degree in table 1 shows how much % the crystallization degree of the adhesive surface of the substrate reduced through the low crystallization process of causing the adhesive surface of the substrate with the polymer layer to have the crystallization degree lower than the interior (difference between crystallization degree of before low crystallization process and crystallization degree of after low crystallization process). An adhesive force enhancement percentage in table 1 shows how much % the adhesive force enhanced by the low crystallization process of the substrate, with the adhesive force of the substrate and the polymer layer measured when the low crystallization process is not performed defined as 100%.
As apparent from table 1, the adhesive force with the polymer layer is enhanced in the substrate where the adhesive surface with the polymer layer is made lower than the interior by 2% (difference crystallization degree of before low crystallization process and crystallization degree of after low crystallization process) through the low crystallization process. In particular, if the material of the substrate is PET (polyethylene terephalate) or PP (polypropylene), the adhesive force with the polymer layer is enhanced by about 60%.
The low crystallization process of lowering the crystallization degree refers to the process performed on the substrate surface having a relatively high crystallization degree to have the crystallization degree lower than the original crystallization degree. That is, the adhesive surface 1a of the substrate 1 has lower crystallization degree than the crystallization degree of before being subjected to the low crystallization process (i.e., crystallization degree of interior of substrate 1). Therefore, the crystallization degree of the adhesive surface 1a of the substrate 1 becomes smaller than the crystallization degree of the interior of the substrate 1 by performing the low crystallization process.
Therefore, in the present organic device, the adhesiveness of the substrate 1 and the polymer layer 2 is satisfactory since the low crystallization process is performed on the adhesive surface 1a of the substrate 1. Thus, according to the present organic device, the adhesiveness between the substrate 1 and the polymer layer 2 can be ensured even when placed under an adverse condition of ultra-bent state or ultra-twisted state.
Furthermore, in the present organic device, the primer processing is preferably performed on the adhesive surface 1a of the substrate 1 with the polymer layer 2. The adhesiveness between the substrate 1 and the polymer layer 2 further is enhanced by performing the low crystallization process and also performing the primer processing on the contacting surface 1a, and an organic device having higher reliability can be realized.
The method of manufacturing the present organic device has characteristics in including a low crystallization step of performing the low crystallization process of lowering the crystallization degree to lower than the crystallization degree of the interior of the substrate 1 with respect to the adhesive surface 1a of the substrate 1 with the polymer layer 2. The low crystallization step is implemented by a heating stage of heating the substrate 1 to higher than or equal to a crystallization temperature, and a cooling stage of cooling the adhesive surface 1a after the heating stage. The low crystallization process of the substrate 1 in the organic device shown in
The method of the low crystallization process of the substrate 1 in the organic device shown in
As shown in
In the low crystallization process of the substrate 1, the adhesive surface 1a and the back surface of the substrate 1 are cooled by a cooler 4 at the downstream of the heater 3 in the substrate conveying direction A. The adhesive surface 1a and the back surface of the substrate 1 thus have a crystallization degree smaller than the crystallization degree obtained after heating.
The heater 3 and the cooler 4 are installed at the upstream and the downstream in the substrate conveying direction A, respectively, and the substrate 1 is conveyed to thereby complete the substrate 1 subjected to the low crystallization process. In the low crystallization process, the crystallization degree of the adhesive surface 1a of the substrate 1 can be reduced through a simple method of only heating and cooling by the heater 3 and the cooler 4.
The shapes of the heater 3 and the cooler 4 are not limited as long as the adhesive surface 1a of the substrate 1 can be heated and cooled. For instance, the cooler 4 may be a roll-shape, as shown in
The substrate 1 shown in
The tensile strength of the substrate 1 generally becomes weaker as the crystallization degree of the substrate 1 becomes lower. In the above configuration, the crystallization degree is different for the adhesive surface 1a and the back surface 1b, and the crystallization degree of the back surface 1b is maintained large. Thus, the organic device shown in
a) to 5(d) are explanatory views for describing the method of low crystallization process of the substrate 1 in the organic device of
First, as shown in
As shown in
Therefore, the substrate 1 in which the crystallization degree of the adhesive surface 1a is smaller than the crystallization degree of the back surface 1b is completed by installing the heater 3 and heating at least the adhesive surface 1a of the substrate 1, and installing the cooler 4 and cooling only the adhesive surface 1a of the substrate 1 at the downstream of the substrate conveying direction A. In the low crystallization process, the crystallization degree of the adhesive surface 1a can be made smaller than the crystallization degree of the back surface 1b through a simple method of only heating and cooling with the heater 3 and the cooler 4.
When heating with the heater 3, at least the back surface 1b of the substrate 1 needs to be heated, and both the adhesive surface 1a and the back surface 1b of the substrate 1 may be heated by the heater 3, as shown in
The shapes of the heater 3 and the cooler 4 are not limited as long as the adhesive surface 1a of the substrate 1 can be heated and cooled. For instance, the cooler 4 may be a roll-shape, as shown in
The present organic device is not particularly limited as long as it has a configuration in which the polymer layer is adhered to the substrate made of polymer. The configurations shown in
Specifically, the organic device shown in
The organic device shown in
The material of the intermediate layer 6 is not particularly limited as long as it is a material that satisfies the adhesive force between the intermediate layer 6 and the substrate 1 and the adhesive force between the intermediate layer 6 and the polymer layer 2>the adhesive force between the substrate 1 and the polymer layer 2 (equation 1), and may be a heat curable resin or UV curable resin.
From equation 1, the material of the intermediate layer 6 can be appropriately set according to the characteristics of the materials of the substrate 1 and the polymer layer 2. For instance, if the material of the substrate 1 is PI (polyimide) and the material of the polymer layer 2 is acryl resin, the material of the intermediate layer 6 is preferably silane modified epoxy resin. If the material of the substrate 1 is PET (polyethylene terephalate) and the material of the polymer layer 2 is acryl resin, the material of the intermediate layer 6 is preferably polyester resin, acryl resin, or urethane resin. If the material of the resin 1 is PP (polypropylene) and the material of the polymer layer 2 is acryl resin, the material of the intermediate layer 6 is preferably polyethylene imine resin, polybutadiene resin, or urethane resin.
(Regarding Organic Device to which One or More Embodiments of the Present Invention is Applicable)
An organic device in which the polymer layer is an optical function layer having an optical function is preferable as an organic device to which one or more embodiments of the present is applicable. The optical function layer includes a light guide, a diffraction element, an electronic paper, and the like.
Flexibility of the device is particularly demanded on the organic device in which such optical function layer is adhered to the substrate. Thus, the adhesiveness of the optical function layer and the substrate is directly related to the characteristics and the reliability of the device. Therefore, through application of one or more embodiments of the present invention to the organic device including the optical function layer, the adhesiveness of the substrate and the optical function layer is enhanced, and a flexible optical function device (organic device) excelling in characteristics and reliability can be realized.
The organic device to which one or more embodiments of the invention can be applied will be specifically described below.
(1.1) Organic Device Serving as Light Guide
The present organic device may be an organic device in which a light guide serving as the optical function layer is adhered to the substrate made of polymer. First, the light guide and the optical module including the light guide will be described below.
(Configuration of Organic Device Serving as Light Guide)
Glass, plastic, and the like can be used for the material for forming the core 20a and the clad 20b, but a flexible material having an elasticity of lower than or equal to 1000 MPa is preferable to configure the light guide 20 having sufficient flexibility. The material for configuring the light guide 20 includes resin material such as acryl series, epoxy series, urethane series, and silicone series. The clad 20b may be configured by gas such as air. Furthermore, similar effects are obtained by using the clad 20b under a liquid atmosphere having a smaller index of refraction than the core 20a.
Furthermore, as shown in
Thus, the signal light transmitted through the core 20a is reflected at the light path conversion mirror surface 20d on the light exit side of the light guide 20, and exit towards the optical element from the light path conversion mirror surface 20d with the advancing direction changed.
The inclined angle θ of the optical path changing mirror surface 20d is normally set to 45° so that the alignment of the optical path changing mirror surface 20d and the optical element is facilitated. The optical path changing mirror may be obtained by externally attaching a mirror to the end of the light guide 20.
The present organic device has a configuration in which the light guide 20 is adhered to the substrate 1 made of polymer. The low crystallization process is performed on the adhesive surface 1a with the light guide 20 of the substrate 1. Thus, adhesiveness between the substrate 1 and the light guide 20 can be sufficiently ensured even under adverse conditions of ultra-bent state and ultra-twisted state.
The film light guide is applied under a specific environment of ultra-bent R=1 mm·twist 270°. According to such configuration, the separation between the substrate 1 and the light guide 20 can be prevented even if stress concentrates under a usage environment specific to the film light guide. Furthermore, the separation between the substrate 1 and the light guide 20 can be prevented even with respect to the reliability test specific to the light guide of R=1 mm bendability resistance for one hundred thousand times or 85° C. 85RH % and leaving for 200 hours, and hence a light guide having high reliability can be realized.
For instance, if the present organic device serving as the light guide is applied to the portable telephone, the light guide can be installed in an area where ultra-bend and ultra-twist occurs such as the hinge portion or a microscopic narrow portion of the portable telephone. An effect in that the light transmission at the area where ultra-bent and ultra-twist occurs becomes satisfactory is obtained.
(Manufacturing Method of Organic Device Serving as Light Guide)
The manufacturing method of the light guide includes the following two manufacturing methods. One or more embodiments of the present invention is applicable to all four manufacturing methods. The manufacturing method of the present organic device serving as the light guide will be specifically described below.
a) to 11(f) are cross-sectional views showing a fabricating method (duplicating method) of the light guide using a die. First, as shown in
As shown in
As shown in
The die 30 is formed with a projecting portion 30a. The resin B is held down with the die 30 so that the projecting portion 30a contacts the resin B. Thus, after the resin B is cured, a core groove 20e formed by the projecting portion 30a is formed in the formed lower clad layer 20′b. The material that configures the core 20a is filled and cured in the core groove 20e, thereby forming the core 20a (see
As shown in
Through the procedures shown in
a) to 12(e) are cross-sectional views showing a fabricating method of the light guide using the dry etching method. First, as shown in
As shown in
One or more embodiments of the present invention is applicable to the manufacturing methods of the light guide shown in
(Configuration of Optical Module Including Light Guide)
The light transmission processing unit 102 has a configuration including a light emitting drive portion 105 and a light emitting portion (optical element) 106. The light emitting drive portion 105 drives the light emission of the light emitting portion 106 based on an electrical signal inputted from the outside. The light emitting drive portion 105 is configured by a light emission drive IC (Integrated Circuit). Although not shown in the figure, the light emitting drive portion 105 includes an electrical connecting part with respect to an electrical wiring for transmitting the electrical signal from the outside.
The light emitting portion 106 emits light based on a drive control by the light emitting drive portion 105. The light emitting portion 106 is configured by a light emitting element such as VCSEL (Vertical Cavity-Surface Emitting Laser). A light incident side end of the light guide 20 is irradiated with the light emitted from the light emitting portion 106 as a light signal
The light reception processing unit 103 has a configuration including an amplifier 107 and a light receiving portion (optical element) 108. The light receiving portion 108 receives the light serving as a light signal exit from a light exit side end of the light guide 20, and outputs an electrical signal through photoelectric conversion. The light receiving portion 108 is configured by a light receiving element such as PD (Photo-Diode).
The amplifier 107 amplifies the electric signal outputted from the light receiving portion 108 and outputs the same to the outside. The amplifier 107 is configured by amplification IC, for example. Although not shown, the amplifier 107 includes an electrical connecting part with respect to the electrical wiring for transmitting the electrical signal to the outside.
The light guide 20 is a medium for transmitting the light exit from the light emitting portion 106 to the light receiving portion 108.
The light exit from the light emitting portion 106 enters from a direction perpendicular to the light transmission direction of the light guide 20 with respect to the light incident side end of the light guide 20. The incident light advances through the light guide 20 by being reflected at the light incident surface 21. The light that advances through the light guide 20 and reaches the light exit side end is reflected at the light exit surface 22 and exits in a direction perpendicular to the light transmission direction of the light guide 20. The light receiving portion 108 is irradiated with the exit light, and photoelectric conversion is performed in the light receiving portion 108.
According to such configuration, the light emitting portion 106 serving as a light source can be arranged in a transverse direction with respect to the light transmitting direction with respect to the light guide 20. Thus, if the light guide 20 needs to be arranged parallel to the mounting substrate surface for mounting the light emitting portion 106 and the like, the light emitting portion 106 is to be installed between the light guide 20 and the mounting substrate surface so as to emit light in the normal direction of the mounting substrate surface. With such configuration, the mounting becomes easier than the configuration of installing the light emitting portion 106 so as to emit light parallel to the mounting substrate surface, and the configuration is also more compact. This is because the general configuration of the light emitting portion 106 has a size in the direction perpendicular to the direction of emitting light greater than the size in the direction of emitting light. Furthermore, application can be made to the configuration of using a plane mounting light emitting element in which the electrode and the light emitting portion are in the same plane.
The optical module 100 of the present embodiment has a configuration in which the signal light propagated through the light guide 20 is reflected by the light exit surface 21 and guided to the light receiving portion 108 (i.e., configuration of using the light exit surface 22 as the reflection surface for changing the optical path), but the configuration of the optical module 100 is not limited to such a configuration, and may be any configuration as long as the signal light exit from the light exit surface 22 can be received by the light receiving portion 108. For instance, the light guide 20 may have a configuration in which the light exit surface 22 does not function as the reflection surface, and the signal light may exit in the light transmission direction from the light exit surface 22. In this case, the light receiving portion 108 is arranged such that the light receiving surface is in a direction perpendicular to the substrate surface (i.e., direction perpendicular to the light transmission direction) so as to receive the signal light exit in the light transmission direction from the light exit surface 22.
The optical module 100 of the present embodiment can be applied to the following application examples.
First, as a first application example, use can be made at a hinge portion in a foldable electronic device such as a foldable portable telephone, a foldable PHS (Personal Handyphone System), a foldable PDA (Personal Digital Assistant), and a foldable notebook computer.
a) to (c) show an example in which the light guide 20 is applied to a foldable portable telephone 40. In other words,
b) is a block diagram of a portion where the light guide 20 is applied in the foldable portable telephone 40 shown in
c) is a perspective plan view of the hinge portion (portion surrounded with a broken line) in
High speed and large capacity communication can be realized in a limited space by applying the light guide 20 to the foldable electronic device. Therefore, it is particularly suitable in devices where high speed and large capacity data communication is necessary and miniaturization is demanded such as the foldable liquid crystal display.
As a second application example, the light guide 20 is applied to a device having a drive portion such as a printer head in a printing device (electronic device) and a reading unit in a hard disk recording and reproducing device.
a) to (c) show an example in which the light guide 20 is applied to a printing device 50.
b) is a block diagram of a portion where the light guide 20 is applied in the printing device 50. As shown in the figure, one end of the light guide 20 is connected to the printer head 51, and the other end is connected to a body side substrate in the printing device 50. The body side substrate includes control means etc. for controlling the operation of each unit of the printing device 50, and the like.
c) and
Therefore, the optical module 100 according to the present embodiment is suited for such a drive portion. High speed and large capacity communication using the drive portion can be realized by applying the optical module 100 to such drive portions.
As shown in the figure, the hard disk recording and reproducing device 60 includes a disk (hard disk) 61, a head (read/write head) 62, a substrate introducing portion 63, a drive portion (drive motor) 64, and the light guide 20.
The drive portion 64 drives the head 62 along a radial direction of the disk 61. The head 62 reads the information recorded on the disk 61 and writes information on the disk 61. The head 62 is connected to the substrate introducing portion 63 by way of the light guide 20, and propagates the information read from the disk 61 to the substrate introducing portion 63 as a light signal and receives the light signal of the information to write to the disk 61 propagated from the substrate introducing portion 63.
Therefore, high speed and large capacity communication can be realized by applying the light guide 20 to the drive portion such as the head 62 in the hard disk recording and reproducing device 60.
(1.2) Organic Device Serving as Organic Light Emitting Element or Liquid Crystal Panel Cell
a) and 18(b) are cross-sectional views showing a schematic configuration of the present organic device applied as an organic light emitting element. As shown in
Since the low crystallization process is performed on the adhesive surface 1a of the substrate 1, the adhesiveness of the polymer layer and the substrate is enhanced. According to such configuration, the stripping of the substrate and the polymer layer by the concentration of stress at the time of bend and twist can be prevented and the anti-bendability is also enhanced. The stripping of the substrate and the polymer layer due to heat generation in the device operation can also be prevented.
In particular, when one or more embodiments of the present invention is applied to the organic light emitting element or the liquid crystal panel cell, the organic light emitting element or the liquid crystal panel cell can be installed at areas where bending and twisting are required such as a curved portion in a flexible display.
(1.3) Organic Device Serving as Organic Solar Battery
Polymer layers 131, 131′ configured by a conductive polymer are formed on the surface on the electrolyte layer 132 side in the substrates 1, 1′. The low crystallization process is performed on the adhesive surfaces 1a, 1a′ with the polymer layers 131, 131′ in the substrates 1, 1′.
In this configuration as well, the adhesiveness of the substrates 1, 1′ and the polymer layers 131, 131′ is enhanced. In particular, when one or more embodiments of the present invention is applied to the organic solar battery, the organic solar battery cell can be installed at areas where bending and twisting are required such as a curved portion of a curtain, blinder, and the like.
(1.4) Organic Device Serving as Micro-Lens
The adhesiveness of the substrate 1 and the micro-lens 141 thus is enhanced. When applied as the micro-lens serving as the polymer layer, the micro-lens can be used at areas where bending and twisting are required.
The organic device shown in
Through the use of the inkjet method, the organic device can be more easily manufactured. The photomask does not need to be used to form the micro-lens 141. Thus, resin such as resist (necessary when using photomask) does not need to be used, and the micro-lens can be manufactured at low cost.
(1.5) Organic Device Serving Print Wiring Substrate
The adhesiveness between the substrate 1 and the wiring layer 151 can be sufficiently ensured even under adverse conditions of ultra-bent state and ultra-twisted state. The stripping between the substrate 1 and the wiring layer 151 due to concentration of stress at the time of bend and twist can be prevented.
Thus, when the present organic device serving as the print wiring substrate is applied to a portable telephone, the print wiring substrate can be installed at areas where ultra-bend and ultra-twist occur such as the hinge portion or the microscopic narrow portion of the portable telephone. The organic electric transmission at areas where ultra-bend and ultra-twist occur thus becomes satisfactory.
The present invention is not limited to the embodiments described above, and various modifications may be made within the scope of the Claims. In other words, the embodiments obtained by combining the technical means appropriately changed within the scope of the Claims are also encompassed in the technical scope of the invention.
In the organic device according to one or more embodiments of the present invention, as described above, the crystallization degree of the adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of a back surface on a side opposite to the adhesive surface of the substrate.
The manufacturing method of the organic device according to one or more embodiments of the present invention includes a low crystallization step of performing the low crystallization process, which is for lowering the crystallization degree to lower than the crystallization degree of the interior of the substrate, on the adhesive surface with the polymer layer in the substrate.
In the above configuration, the crystallization degree of the adhesive surface with the polymer layer in the substrate is smaller than the crystallization degree of the interior in the substrate, and thus the adhesiveness of the substrate and the polymer layer becomes satisfactory. Thus, the adhesiveness of the substrate and the polymer layer can be ensured even when placed in an adverse condition of ultra-bent state or ultra-twisted state.
Further, in the organic device according to one or more embodiments of the present invention, it is preferable that the crystallization degree of the adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of a back surface on a side opposite to the adhesive surface of the substrate.
According to the above configuration, the adhesiveness is further enhanced between the polymer layer and the substrate.
Further, in the organic device according to one or more embodiments of the present invention, the polymer layer is an optical function layer having an optical function.
The organic device in which the optical function layer is adhered to the substrate is particularly demanded flexibility of the device. Thus, the adhesiveness between the optical function layer and the substrate is directly related to the characteristics and the reliability of the device. Therefore, the adhesiveness of the substrate and the optical function layer is enhanced by applying one or more embodiments of the invention to the organic device including the optical function layer, and a flexible optical function device (organic device) excelling in characteristics and reliability can be realized.
Particularly, in the organic device according to one or more embodiments of the present invention, the polymer layer is a light guide.
The adhesiveness between the substrate and the light guide can be sufficiently ensured even under an adverse condition of ultra-bent state and ultra-twisted state. The stripping between the substrate and the light thus can be prevented even if the stress concentrates under a light guide specific usage environment.
Further, in the organic device according to one or more embodiments of the present invention, an intermediate layer is arranged between the substrate and the polymer layer.
According to the above configuration, the adhesiveness between the substrate and the polymer layer further is enhanced since an intermediate layer is arranged between the substrate and the polymer layer.
Furthermore, in the organic device according to one or more embodiments of the present invention, a primer processing is performed on an adhesive surface with the polymer layer or the intermediate layer of the substrate.
The adhesiveness between the substrate and the polymer layer is further enhanced by performing the primer processing on the contacting surface, and an organic device having higher reliability can be realized.
One or more embodiments of the present invention provides a manufacturing method of an organic device including a substrate made of polymer and having a polymer layer adhered on the substrate, the manufacturing method including the step of: performing low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.
The “low crystallization process” refers to the process performed with respect to the substrate surface having a relatively high crystallization degree so that the crystallization degree becomes lower than the original crystallization degree.
According to the above configuration, an organic device in which the adhesiveness between the substrate and the polymer layer can be enhanced can be manufactured since the organic device includes the low crystallization step of performing the low crystallization process, which is for lowering the crystallization degree to lower than the crystallization degree in the interior of the substrate, on the adhesive surface with the polymer layer in the substrate.
In the manufacturing method of the organic device according to one or more embodiments of the present invention, the low crystallization step includes, heating stage of heating the substrate to higher than or equal to a crystallization temperature, and cooling stage of cooling the adhesive surface with the polymer layer in the substrate after the heating stage.
The “crystallization temperature” refers to the temperature at which the polymer molecules configuring the substrate start to regularly line and crystallize. According to the above configuration, the low crystallization step includes a heating step of heating the substrate to higher than or equal to the crystallization temperature and a cooling step of cooling the adhesive surface with the polymer layer in the substrate after the heating step, and thus the polymer molecules configuring the adhesive surface of the substrate remain in a state of low crystallization degree without being relatively regularly lined if the adhesive surface of the substrate is rapidly cooled after the substrate is heated to higher than or equal to the crystallization temperature. That is, the crystallization degree of the adhesive surface of the substrate is relatively low after heating, and is maintained in such low state even after rapid cooling. Thus, an organic device in which the adhesiveness of the polymer layer and the substrate is enhanced can be realized by adhering the polymer layer to the adhesive surface.
In the manufacturing method of the organic device according to one or more embodiments of the present invention, the adhesive surface with the polymer layer in the substrate and a back surface thereof are both heated to higher than or equal to the crystallization temperature in the heating stage, and both surfaces are rapidly cooled in the cooling stage.
Thus, the low crystallization process can be performed on both surfaces of the adhesive surface and the back surface, of the substrate.
In the manufacturing method of the organic device according to one or more embodiments of the present invention, at least a back surface of the adhesive surface with the polymer layer in the substrate and the back surface is heated to higher than or equal to the crystallization temperature in the heating stage, and only the adhesive surface is rapidly cooled in the cooling stage.
A substrate, in which the crystallization degree of the adhesive surface and the crystallization degree of the back surface differ, thus can be realized.
One or more embodiments of the present invention provides an organic device manufactured through the manufacturing method of the organic device.
An organic device in which the adhesiveness between the substrate and the polymer layer can be enhanced thus can be realized.
Specific embodiments and examples described in above are provided merely to clarify the technical contents of the present invention and should not be interpreted in a narrow sense limiting only to such specific examples, and it should be recognized that embodiments obtained by appropriately combining the technical means disclosed in the different embodiments within the spirit of the invention and the scope of the accompanied Claims are also encompassed in the technical scope of the invention.
The organic module according to one or more embodiments of the present invention can enhance the adhesiveness of the substrate and the polymer layer, and thus is applicable to a flexible optical wiring serving as an in-device wiring mounted in a small and thin commercial-off-the-shelf device.
While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2007-231990 | Sep 2007 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2008/065323 | 8/27/2008 | WO | 00 | 2/22/2010 |
