Patent Application
20150217319
1. Field
Aspects of embodiments according to the present invention relate to an organic layer deposition apparatus, a frame sheet assembly for the organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device by using the frame sheet assembly.
2. Description of Related Art
Organic light-emitting display devices have a larger viewing angle, better contrast characteristics, and a faster response rate than other display devices, and thus have drawn attention as a next-generation display device.
An organic light-emitting display device includes intermediate layers, including an emission layer disposed between a first electrode and a second electrode that are arranged opposite to (i.e., arranged to face) each other. The electrodes and the intermediate layers may be formed via various suitable methods, one of which is a deposition method. When an organic light-emitting display device is manufactured by using the deposition method, a fine metal mask (FMM) having the same pattern as an organic layer to be formed is disposed to closely contact a substrate, and an organic layer material is deposited over the FMM in order to form the organic layer having the desired pattern.
In order to address the drawback of a conventional deposition method using a fine metal mask (FMM), aspects of embodiments according to the present invention are directed toward an organic layer deposition apparatus that is suitable for producing large-sized display devices on a mass scale and that is capable of protecting or preventing a patterning slit sheet from sagging, a frame sheet assembly for the organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device by using the frame sheet assembly.
According to an embodiment of the present invention, there is provided an organic layer deposition apparatus for forming an organic layer on a substrate, the apparatus comprising: a deposition source configured to discharge a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet that is disposed to face (opposite to) the deposition source nozzle unit and has a plurality of patterning slits arranged in a second direction perpendicular to the first direction; and a correction sheet that is disposed between the deposition source nozzle unit and the patterning slit sheet so as to block at least some of the deposition material discharged from the deposition source, wherein the substrate or the organic layer deposition apparatus is moved relative to the other in the first direction to perform a deposition.
The deposition source and the deposition source nozzle unit, and the patterning slit sheet may be integrally connected as one body.
The deposition source and the deposition source nozzle unit, and the patterning slit sheet may be integrally connected as one body via a connection member for guiding movement of the deposition material.
The connection member may seal a space between the deposition source nozzle unit disposed at the side of the deposition source, and the patterning slit sheet.
The plurality of deposition source nozzles may be tilted at an angle.
The plurality of deposition source nozzles may include deposition source nozzles arranged in two rows formed in the first direction, and the deposition source nozzles in the two rows may be tilted to face each other.
The plurality of deposition source nozzles may include deposition source nozzles arranged in two rows formed in the first direction. The deposition source nozzles of one of the two rows in a first part of the deposition source nozzle unit are arranged to face a second side portion of the patterning slit sheet, and the deposition source nozzles of the second row in a second part of the deposition source nozzle unit are arranged to face a first side portion of the patterning slit sheet.
The correction sheet may allow an organic layer having a uniform thickness to be formed on the substrate.
The correction sheet may be formed so as to block more deposition material at a center portion of the patterning slit sheet, than the deposition material blocked at end portions of the patterning slit sheet.
The correction sheet may have an opening, and when going farther from the center of the patterning slit sheet, portions of the patterning slits exposed by the opening portion may lengthen.
The correction sheet may comprise a covering portion extending to be convex toward a center of the opening portion.
The covering portion may prevent the deposition material radiated from the deposition source from reaching the substrate.
The covering portion may comprise a first member and a second member that extend to be convex toward the center of the opening portion, and the first member and the second member may be symmetrical to each other about a virtual central point of the opening portion.
The covering portion may extend to be convex in the lengthwise direction of the patterning slits.
The organic layer deposition apparatus may further comprise a frame that supports the correction sheet and the patterning slit sheet.
The frame may further comprise a joining portion that extends from one side of the frame and is joined to the correction sheet.
The joining portion may be joined to the correction sheet by welding.
The correction sheet may be disposed on and joined to the frame, and the patterning slit sheet may be disposed on and joined to the correction sheet.
The patterning slit sheet may be joined to the correction sheet by welding.
The frame may further comprise a stepped portion extending from the joining portion; and the correction sheet may further comprise a coupling portion corresponding to the stepped portion and capable of being coupled to the stepped portion.
The coupling portion may be formed to penetrate the correction sheet so as to be coupled to the stepped portion.
According to another embodiment of the present invention, there is provided an organic layer deposition apparatus for forming an organic layer on a substrate, the apparatus comprising: a deposition source configured to discharge a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet that is disposed to face the deposition source nozzle unit and has a plurality of patterning slits arranged in the first direction; a correction sheet that is disposed between the deposition source nozzle unit and the patterning slit sheet so as to block at least some of the deposition material discharged from the deposition source; a barrier plate assembly that comprises a plurality of barrier plates that are disposed between the deposition source nozzle unit and the patterning slit sheet in the first direction and partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces, wherein the organic layer deposition apparatus and the substrate are separated from each other, and the organic layer deposition apparatus or the substrate is moved relative to the other.
Each of the plurality of barrier plates may extend in a second direction substantially perpendicular to the first direction.
The barrier plate assembly may comprise a first barrier plate assembly comprising a plurality of first barrier plates, and a second barrier plate assembly comprising a plurality of second barrier plates.
Each of the plurality of first barrier plates and each of the plurality of second barrier plates may extend in the second direction substantially perpendicular to the first direction.
The deposition source and the barrier plate assembly may be separated from each other.
The correction sheet may allow an organic layer having a uniform thickness to be formed on the substrate.
The correction sheet may be formed so as to block more deposition material at the center portion of the patterning slit sheet, than the deposition material blocked at end portions of the patterning slit sheet.
The correction sheet may have an opening, and when going farther from the center of the patterning slit sheet, portions of the patterning slits exposed by the opening portion may lengthen.
The organic layer deposition apparatus may further comprise a frame that supports the correction sheet and the patterning slit sheet.
The frame may further comprise a joining portion that extends from one side of the frame and is joined to the correction sheet.
The joining portion may be joined to the correction sheet by welding.
The correction sheet may be disposed on and joined to the frame, and the patterning slit sheet may be disposed on and joined to the correction sheet.
The patterning slit sheet may be joined to the correction sheet by welding.
The frame may further comprise a stepped portion extending from the joining portion, and the correction sheet may further comprise a coupling portion corresponding to the stepped portion and capable of being coupled to the stepped portion.
The coupling portion may be formed to penetrate the correction sheet so as to be coupled to the stepped portion.
According to another embodiment of the present invention, there is provided a frame sheet assembly comprising: a patterning slit sheet that comprises a plurality of patterning slits; a correction sheet that exposes portions of the patterning slits; and a frame that supports the correction sheet and the patterning slit sheet.
The correction sheet may have an opening, and when going farther from the center of the patterning slit sheet, portions of the patterning slits exposed by the opening portion may lengthen.
The correction sheet may include a covering portion extending to be convex toward a center of the opening portion.
The covering portion may comprise a first member and a second member that extend to be convex toward the center of the opening portion, and the first member and the second member may be symmetrical to each other about a virtual central point of the opening portion.
The covering portions may be symmetrical to each other about the virtual center point of the opening portion.
The frame may further comprise a joining portion that extends from one side of the frame and is joined to the correction sheet.
The joining portion may be joined to the correction sheet by welding.
The correction sheet may be disposed on and joined to the frame, and the patterning slit sheet may be disposed on and joined to the correction sheet.
The patterning slit sheet may be joined to the correction sheet by welding.
The frame may further comprise a stepped portion extending from the joining portion, and the correction sheet may further comprise a coupling portion corresponding to the stepped portion and capable of being coupled to the stepped portion.
The coupling portion may be formed to penetrate the correction sheet so as to be coupled to the stepped portion.
According to another embodiment of the present invention, there is provided a method of manufacturing an organic layer deposition apparatus, the method comprising an operation of separating the organic layer deposition apparatus from a substrate on which deposition is to occur, by a distance, wherein the organic layer deposition apparatus comprises a deposition source that discharges a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet that is disposed opposite to the deposition source nozzle unit and includes a plurality of patterning slits arranged in a second direction perpendicular to the first direction; and a correction sheet that is disposed between the deposition source nozzle unit and the patterning slit sheet so as to block at least some of the deposition material discharged from the deposition source; and the method further including an operation of depositing a deposition material discharged from the organic layer deposition apparatus onto the substrate while the organic layer deposition apparatus or the substrate is moved relative to the other.
The correction sheet may be formed so as to block more deposition material at the center portion of the patterning slit sheet, than the deposition material blocked at end portions of the patterning slit sheet.
The correction sheet may have an opening, and when going farther from the center of the patterning slit sheet, portions of the patterning slits exposed by the opening portion may lengthen.
As described above, according to aspects of embodiments of the present invention, an organic light-emitting display device may be easily manufactured, may be simply applied to the manufacture of large-sized substrates on a mass scale, may improve manufacturing yield and deposition efficiency, may allow deposition materials to be reused, and may protect or prevent a patterning slit sheet from sagging.
The above and other features and aspects of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
One or more aspects of embodiments according to the present invention will now be described more fully with reference to the accompanying drawings in which exemplary embodiments of the invention are shown. In the drawings, the thicknesses of layers and regions may be exaggerated for clarity. Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
A conventional deposition method using a fine metal mask (FMM) generally is not suitable for manufacturing larger devices using a mother glass having a fifth-generation (5G) size or greater. In other words, when such a large mask is used, the mask may bend due to its own weight, thereby distorting a pattern. This is not conducive for the recent trend towards high-definition patterns.
Referring to
The loading unit 710 may include a first rack 712, a transport robot 714, a transport chamber 716, and a first inversion chamber 718.
A plurality of substrates 500 onto which a deposition material is not applied are stacked up on the first rack 712. The transport robot 714 picks up one of the substrates 500 from the first rack 712, disposes it on the electrostatic chuck 600 transferred by the second conveyor unit 620, and moves the electrostatic chuck 600 on which the substrate 500 is disposed, into the transport chamber 716.
The first inversion chamber 718 is disposed adjacent to the transport chamber 716. The first inversion chamber 718 includes a first inversion robot 719 that inverts the electrostatic chuck 600 and then loads it onto the first conveyer unit 610 of the deposition unit 730.
Referring to
Referring back to
The unloading unit 720 is constituted to operate in an opposite manner to the loading unit 710 described above. Specifically, a second inversion robot 729 in a second inversion chamber 728 inverts the electrostatic chuck 600, which has passed through the deposition unit 730 while the substrate 500 is disposed on the electrostatic chuck 600, and then moves the electrostatic chuck 600 on which the substrate 500 is disposed, into an ejection chamber 726. Then, an ejection robot 724 removes the electrostatic chuck 600 on which the substrate 500 is disposed from the ejection chamber 726, separates the substrate 500 from the electrostatic chuck 600, and then loads the substrate 500 onto the second rack 722. The electrostatic chuck 600 separated from the substrate 500 is returned back into the loading unit 710 via the second conveyer unit 620.
However, the present invention is not limited to the above description. For example, when disposing the substrate 500 on the electrostatic chuck 600, the substrate 500 may be fixed onto a lower surface of the electrostatic chuck 600 and then moved into the deposition unit 730. In this case, for example, the first inversion chamber 718 and the first inversion robot 719, and the second inversion chamber 728 and the second inversion robot 729 are not used.
The deposition unit 730 may include at least one deposition chamber. As illustrated in
In the organic layer deposition apparatus illustrated in
In the embodiment illustrated in
Referring to
For example, in order to deposit a deposition material 115 emitted from the deposition source 110 and discharged through the deposition source nozzle unit 120 and the patterning slit sheet 151, onto a substrate 500 in a desired pattern, the first chamber 731 should be maintained in a high-vacuum state as in a deposition method using an FMM. In addition, the temperature of the patterning slit sheet 151 should be sufficiently lower than the temperature of the deposition source 110. In this regard, the temperature of the patterning slit sheet 151 may be about 100° C. or less. The temperature of the patterning slit sheet 151 should be sufficiently low so as to reduce thermal expansion of the patterning slit sheet 151.
The substrate 500, which constitutes a deposition target on which the deposition material 115 is to be deposited, is disposed in the first chamber 731. The substrate 500 may be a substrate for flat panel displays. A large substrate, such as a mother glass, for manufacturing a plurality of flat panel displays, may be used as the substrate 500. Other suitable substrates may also be employed.
In the current embodiment of the present invention, deposition may be performed while the substrate 500 or the organic layer deposition apparatus 100 is moved relative to the other.
In detail, in a typical FMM deposition method, the size of the FMM is generally equal to the size of a substrate. Thus, the size of the FMM is increased as the substrate becomes larger. However, it is neither straightforward to manufacture a large FMM nor to extend an FMM to be accurately aligned with a pattern.
In order to overcome this problem, in the organic layer deposition apparatus 100 according to the current embodiment of the present invention, deposition may be performed while the organic layer deposition apparatus 100 or the substrate 500 is moved relative to the other. In other words, deposition may be continuously performed while the substrate 500, which is disposed such as to face the organic layer deposition apparatus 100, is moved in a Y-axis direction. In other words, deposition may be performed in a scanning manner while the substrate 500 is moved in a direction of arrow A in
In the organic layer deposition apparatus 100 according to the current embodiment of the present invention, the patterning slit sheet 151 may be significantly smaller than an FMM used in a typical deposition method. In other words, in the organic layer deposition apparatus 100 according to the current embodiment of the present invention, deposition is continuously performed, i.e., in a scanning manner, while the substrate 500 is moved in the Y-axis direction. Thus, lengths of the patterning slit sheet 151 in the X-axis and Y-axis directions may be less (e.g., significantly less) than the lengths of the substrate 500 in the X-axis and Y-axis directions. As described above, since the patterning slit sheet 151 may be formed to be smaller (e.g., be significantly smaller) than an FMM used in a conventional deposition method, it is relatively easy to manufacture the patterning slit sheet 151 used in embodiments of the present invention. In other words, using the patterning slit sheet 151, which is smaller than an FMM used in a conventional deposition method, is more convenient in all processes, including etching and other subsequent processes, such as precise extension, welding, moving, and cleaning processes, compared to the conventional deposition method using the larger FMM. This is more advantageous for a relatively large display device.
The deposition source 110 that contains and heats the deposition material 115 is disposed at an opposite side of the chamber to a side at which the substrate 500 is disposed. While the deposition material 115 contained in the deposition source 110 is vaporized, the deposition material 115 is deposited on the substrate 500.
For example, the deposition source 110 includes a crucible 112 that is filled with the deposition material 115, and a cooling block 111 for heating the crucible 122 to vaporize the deposition material 115 which is contained in the crucible 112, towards a side of the crucible 112, and in particular, towards the deposition source nozzle unit 120. The cooling block 111 reduces or prevents radiation of heat from the crucible 112 to the outside, e.g., into the first chamber 731. The cooling block 111 may include a heater that heats the crucible 112.
The deposition source nozzle unit 120 is disposed at a side of the deposition source 110, and in particular, at the side of the deposition source 110 facing the substrate 500. The deposition source nozzle unit 120 includes a plurality of deposition source nozzles 121 arranged at equal intervals in the Y-axis direction, i.e., a scanning direction of the substrate 500. The deposition material 115 that is vaporized in the deposition source 110, passes through the deposition source nozzle unit 120 toward the substrate 500 on which the deposition material 115 is to be deposited. As described above, when the deposition source nozzle unit 120 includes the plurality of deposition source nozzles 121 arranged in the Y-axis direction, that is, the scanning direction of the substrate 500, the size of a pattern formed of the deposition material discharged through the patterning slits 151a of the patterning slit sheet 151 is affected by the size of one of the deposition source nozzles 121 (since there is only one deposition nozzle 121 (in the X-axis direction), and thus no shadow zone may be formed on the substrate 500. In addition, since the plurality of deposition source nozzles 121 are arranged in the scanning direction of the substrate 500, even through there is a difference in flux between the deposition source nozzles 121, the difference may be compensated for and deposition uniformity may be maintained constant.
A frame sheet assembly 150 may be disposed between the deposition source 110 and the substrate 500. The frame sheet assembly 150 may include the patterning slit sheet 151, the correction sheet 152, and a frame 155. The frame 155 may be formed to have a lattice shape, similar to a window frame. The correction sheet 152 and the patterning slit sheet 151 may be stacked on the frame 155 and bound thereto. The patterning slit sheet 151 includes a plurality of patterning slits 151a arranged in the X-axis direction. The deposition material 115 that is vaporized in the deposition source 110, passes through the deposition source nozzle unit 120 and the patterning slit sheet 151 towards the substrate 500 on which the deposition material 115 is to be deposited. The correction sheet 152 may be disposed on a lower surface of the patterning slit sheet 151. The correction sheet 152 may be joined to the frame 155 by welding. The correction sheet 152 protects or prevents the deposition material 115 discharged from the deposition source 110 from passing through the patterning slits 151a, thereby allowing an organic layer having a uniform thickness to be formed on the substrate 500. The frame sheet assembly 150 will be described later.
In addition, the deposition source 110 and the deposition source nozzle unit 120 coupled to the deposition source 110 may be disposed to be separated from the patterning slit sheet 151 by a set or predetermined distance. Alternatively, the deposition source 110 and the deposition source nozzle unit 120 coupled to the deposition source 110 may be connected to the patterning slit sheet 151 by a connection member 135. That is, the deposition source 110, the deposition source nozzle unit 120, and the patterning slit sheet 151 may be integrally formed as one body by being connected to each other via the connection member 135. The connection member 135 may guide the deposition material 115, which is discharged through the deposition source nozzles 121, to move straight and not to flow in the X-axis direction. In
As described above, the organic layer deposition apparatus 100 according to the current embodiment of the present invention performs deposition while being moved relative to the substrate 500. In order to move the organic layer deposition apparatus 100 relative to the substrate 500, the patterning slit sheet 151 is separated from the substrate 500 by a distance (e.g., a predetermined distance).
In particular, in a conventional deposition method using an FMM, deposition is performed with the FMM in close contact with a substrate in order to reduce or prevent formation of a shadow zone on the substrate. However, when the FMM is used in close contact with the substrate, the contact may cause defects. In addition, in the conventional deposition method, the size of the mask is the same as the size of the substrate since the mask cannot be moved relative to the substrate. Thus, the size of the mask is increased as display devices become larger. However, it is not easy to manufacture such a large mask.
In order to overcome this problem, in the organic layer deposition apparatus 100 according to the current embodiment of the present invention, the patterning slit sheet 151 is disposed to be separated from the substrate 500 by a distance (e.g., a predetermined distance).
As described above, according to embodiments of the present invention, a mask is formed to be smaller than a substrate, and deposition is performed while the mask is moved relative to the substrate. Thus, the mask can be easily manufactured. In addition, defects caused due to the contact between a substrate and an FMM, which may occur in the conventional deposition method, may be reduced or prevented. Furthermore, since it is unnecessary to dispose the FMM in close contact with the substrate during a deposition process, the manufacturing time may be reduced.
Referring to
The patterning slit sheet 151 may include patterning slits 151a and patterning bars 151b. The patterning slits 151a penetrate the patterning slit sheet 151 from an upper surface of the patterning slit sheet 151 to a lower surface thereof, and the patterning bars 151b are arranged between adjacent patterning slits 151a. The deposition material 115 that is vaporized in the deposition source 110, may pass through the patterning slits 151a and be deposited on the substrate 500.
The correction sheet 152 may be coupled to the frame 155, and the patterning slit sheet 151 may be disposed on and coupled to the correction sheet 152. The frame 155 may include a body portion 155a and a joining portion 155b. The joining portion 155b may protrude from the body portion 155a. The joining portion 155b of the frame 155 may be joined to the correction sheet 152. For example, the correction sheet 152 may be joined to the frame 155 by being welded to the joining portion 155b. After the correction sheet 152 is joined to the frame 155, the patterning slit sheet 151 may be joined to the correction sheet 152. The correction sheet 152 may be joined to the patterning slit sheet 151 by welding.
Since the patterning slit sheet 151 is disposed on the correction sheet 152, the upper and lower portions of the patterning slits 151a are partially covered by the covering portions 152b and 152c of the correction sheet 152. Accordingly, as shown in
Here, since the deposition source nozzles 121 are arranged in the lengthwise direction of the patterning slits 151a, the largest amount of deposition material is deposited on the center portion of the substrate 500 when no correction sheets 152 exist, and thus deposition uniformity of the substrate 500 may be lowered.
However, in the organic layer deposition apparatus 100 according to the current embodiment of the present invention, the patterning slits 151a located at the center portion of the patterning slit sheet 151 are covered by the covering portions 152b and 152c of the correction sheet 152 more than the patterning slits 151a located at both end portions of the patterning slit sheet 151, and thus an amount of a deposition material passing through the patterning slits 151a located at the center portion of the patterning slit sheet 151 decreases. Accordingly, a deposition layer which is formed on the substrate 500 has a uniform thickness.
That is, since the deposition layer formed by the organic layer deposition apparatus has a bulgy center portion, some of the deposition material discharged towards the center portion of the patterning slit sheet 150 is blocked in order to form the deposition layer of a uniform thickness. Therefore, the correction sheet 152 is disposed below the patterning slit sheet 151 in order to block some of the deposition material. Here, since the covering portions 152b and 152c of the correction sheet 152 protrude convexly toward the center portion C of the opening portion 152a, the deposition material discharged towards the center portion of the patterning slit sheet 150 is blocked more than the deposition material discharged towards the left and right side portions of the patterning slit sheet 150. Then, the correction sheet 152 may be disposed so that the thinnest part of the deposition layer, that is, parts of the deposition layer formed by the deposition material discharged through the both end portions (the left and right side portions) of the patterning slit sheet 151, receives more deposition material the entire thickness of the deposition layer in the lengthwise direction becomes more uniform.
As described above, since the correction sheet 152 is disposed on the flowing path of the deposition material, the deposition layer formed by the organic layer deposition apparatus may be corrected. That is, heights of the covering portions 152b and 152c of the correction sheet 152 are increased in order to block a lot of deposition material at the portion where a lot of deposition material is deposited, and the heights of the covering portions 152b and 152c of the correction sheet 152 are reduced in order to block less deposition material at portions where less deposition material is deposited. Thus, the deposition amount of the deposition material may be adjusted so that the thickness of the deposition layer may be uniform.
In the organic layer deposition apparatus according to the current embodiment of the present invention, the uniformity of an organic layer formed on the substrate 500 is within an error range of about 1 to about 2%, and thus, quality and reliability of an organic layer deposition apparatus may be improved.
The patterning slit sheet 151 may sag toward the deposition source 110 due to gravity as the size of the patterning slit sheet 151 increases. However, according to the current embodiment of the present invention, the correction sheet 152 is disposed on the lower surface of the patterning slit sheet 151 to further support the patterning slit sheet 151, thereby suppressing sagging of the patterning slit sheet 151.
Referring to
The patterning slit sheet 151 may include the patterning slits 151a and the patterning bars 151b. The patterning slits 151a penetrate the patterning slit sheet 151 from an upper surface of the patterning slit sheet 151 to a lower surface thereof, and the patterning bars 151b are arranged between adjacent patterning slits 151a. The deposition material 115 that is vaporized in the deposition source 110, may pass through the patterning slits 151a and be deposited on the substrate 500.
The correction sheet 252 may be coupled to the frame 255, and the patterning slit sheet 151 may be disposed on and coupled to the correction sheet 252. The correction sheet 252 may include coupling portions 252c that can be coupled to a stepped portion 255c of the frame 255. The stepped portion 255c of the frame 255 extends from a joining portion 255b of the frame 255. The coupling portions 252c of the correction sheet 252 may be formed concavely so as to be combined with the stepped portion 255c or formed to penetrate the correction sheet 252 as shown in
Referring to
Referring to
Referring to
In the current embodiment, the plurality of deposition source nozzles 121′ formed on the deposition source nozzle unit 120 are tilted at a predetermined angle, unlike the organic layer deposition apparatus 100 described with reference to
In the current embodiment of the present invention, the deposition source nozzles 121′a and 121′b are arranged to tilt at a set or predetermined angle to each other. The deposition source nozzles 121′a in a first row and the deposition source nozzles 121′b in a second row may tilt to face each other. That is, the deposition source nozzles 121′a of the first row in a left part of the deposition source nozzle unit 120 are arranged to face a right side portion of the patterning slit sheet 151, and the deposition source nozzles 121′b of the second row in a right part of the deposition source nozzle unit 120 are arranged to face a right side portion of the patterning slit sheet 151.
Due to the structure of the organic layer deposition apparatus 100′ according to the current embodiment, the deposition of the deposition material 115 may be adjusted to lessen a thickness variation between the center and the end portions of the substrate 500 and improve thickness uniformity of the deposition layer. Moreover, utilization efficiency of the deposition material 115 may also be improved.
For example, the organic layer deposition apparatus according to the current embodiment of the present invention includes the first organic layer deposition apparatus 100, the second organic layer deposition apparatus 200, and the third organic layer deposition apparatus 300. Since each of the first organic layer deposition apparatus 100, the second organic layer deposition apparatus 200, and the third organic layer deposition apparatus 300 has the same structure as the organic layer deposition apparatus described with reference to
The deposition sources 110 of the first, second, and third organic layer deposition apparatuses 100, 200, and 300 may contain different deposition materials, respectively. The first organic layer deposition apparatus 100 may contain a deposition material used to form the R emission layer, the second organic layer deposition apparatus 200 may contain a deposition material used to form the G emission layer, and the third organic layer deposition apparatus 300 may contain a deposition material used to form the B emission layer.
In other words, in a conventional method of manufacturing an organic light-emitting display device, a separate chamber and a separate mask are used to form each color emission layer. However, when the organic layer deposition apparatus according to the current embodiment of the present invention is used, the R emission layer, the G emission layer, and the B emission layer may be formed concurrently (e.g., at the same time) with a single multi-deposition source. Thus, the time it takes to manufacture the organic light-emitting display device is sharply reduced. In addition, the organic light-emitting display device may be manufactured with a reduced number of chambers, so that equipment costs may also be reduced (e.g., markedly reduced).
Although not illustrated, a patterning slit sheet of the first organic layer deposition apparatus 100, a patterning slit sheet of the second organic layer deposition apparatus 200, and a patterning slit sheet of the third organic layer deposition apparatus 300 may be arranged to be offset by a constant or identical distance with respect to each other, in order for deposition regions corresponding to the patterning slit sheets to not overlap on the substrate 500. In other words, when the first organic layer deposition apparatus 100, the second organic layer deposition apparatus 200, and the third organic layer deposition apparatus 300 are used to deposit the R emission layer, the G emission layer, and the B emission layer, respectively, patterning slits 151 of the first organic layer deposition apparatus 100, patterning slits 251 of the second organic layer deposition apparatus 200, and patterning slits 351 of the third organic layer deposition apparatus 300 are arranged to not be aligned or overlapped with respect to each other, in order to form the R emission layer, the G emission layer and the B emission layer in different regions of the substrate 500.
In addition, the deposition materials used to form the R emission layer, the G emission layer, and the B emission layer may have different vaporization temperatures. Therefore, the temperatures of the deposition sources of the respective first, second, and third organic layer deposition assemblies 100, 200, and 300 may be set to be different.
Although
As described above, a plurality of organic layers may be formed concurrently (e.g., at the same time) with a plurality of organic layer deposition apparatuses, and thus manufacturing yield and deposition efficiency may be improved. In addition, the overall manufacturing process may be simplified, and the manufacturing costs may be reduced.
Referring to
Although a chamber is not illustrated in
In the chamber 731 of
In an embodiment, the substrate 500 or the organic layer deposition apparatus 100″ may be moved relative to the other. For example, as illustrated in
As described above, since the organic layer deposition apparatus 100″ includes the patterning slit sheet 151 significantly smaller than an FMM used in a conventional deposition method, it is relatively easy to manufacture the patterning slit sheet 151 used in the present invention. In other words, using the patterning slit sheet 151, which is smaller than an FMM used in a conventional deposition method, is more convenient in all processes, including etching and other subsequent processes, such as precise extension, welding, moving, and cleaning processes, compared to the conventional deposition method using the larger FMM. This is more advantageous for a relatively large display device.
The deposition source 110″ that contains and heats the deposition material 115 is disposed at an opposite side of the first chamber to a side at which the substrate 500 is disposed.
The deposition source 110″ includes a crucible 112 that is filled with the deposition material 115, and a cooling block 111 surrounding the crucible 112. The cooling block 111 reduces or prevents radiation of heat from the crucible 112 to the outside, e.g., into the first chamber. The cooling block 111 may include a heater that heats the crucible 112.
The deposition source nozzle unit 120″ is disposed at a side of the deposition source 110″, and in particular, at the side of the deposition source 110″ facing the substrate 500. The deposition source nozzle unit 120″ includes a plurality of deposition source nozzles 121″ arranged at equal intervals in the X-axis direction. The deposition material 115 that is vaporized in the deposition source 110″ passes through the deposition source nozzles 121″ of the deposition source nozzle unit 120″ towards the substrate 500, which constitutes a target on which the deposition material 115 is to be deposited.
The barrier plate assembly 130 is disposed at a side of the deposition source nozzle unit 120″. The barrier plate assembly 130 includes a plurality of barrier plates 131, and a barrier plate frame 132 that covers sides of the barrier plates 131. The plurality of barrier plates 131 may be arranged parallel to each other at equal intervals in the X-axis direction. In addition, each of the barrier plates 131 may be arranged parallel to an YZ plane in
The barrier plates 131 may be respectively disposed between adjacent deposition source nozzles 121″. In other words, each of the deposition source nozzles 121″ may be disposed between two adjacent barrier plates 131. The deposition source nozzles 121″ may be respectively located at the midpoint between two adjacent barrier plates 131. However, the present invention is not limited to this structure. For example, a plurality of deposition source nozzles 121″ may be disposed between two adjacent barrier plates 131. In this case, the deposition source nozzles 121″ may be also respectively located at the midpoint between two adjacent barrier plates 131.
As described above, since the barrier plates 131 partition the space between the deposition source nozzle unit 120″ and the patterning slit sheet 151 into the plurality of sub-deposition spaces S, the deposition material 115 discharged through each of the deposition source nozzles 121″ is not mixed with the deposition material 115 discharged through the other deposition source nozzles slits 121″, and passes through the patterning slits 151a so as to be deposited on the substrate 500. In other words, the barrier plates 131 guide the deposition material 115, which is discharged through the deposition source nozzles 121″, to move straight, i.e., to flow in the Z-axis direction.
As described above, the deposition material 115 is forced or guided to move straight by installing the barrier plates 131, so that a smaller shadow zone may be formed on the substrate 500, compared to a case where no barrier plates are installed. Thus, the organic layer deposition apparatus 100″ and the substrate 500 can be separated (or spaced) from each other by a set or predetermined distance. This will be described later in detail.
The barrier plate frame 132, which forms sides of the barrier plates 131, maintains the positions of the barrier plates 131, and guides the deposition material 115, which is discharged through the deposition source nozzles 121″, not to flow in the Y-axis direction. It should be noted that in
The deposition source nozzle unit 120″ and the barrier plate assembly 130 may be separated (or spaced) from each other (e.g., by a predetermined distance). This may reduce or prevent the heat radiated from the deposition source 110″ from being conducted to the barrier plate assembly 130. However, aspects of the present invention are not limited to this. For example, an appropriate heat insulator may be further disposed between the deposition source nozzle unit 120″ and the barrier plate assembly 130. In this case, the deposition source nozzle unit 120″ and the barrier plate assembly 130 may be bound together with the heat insulator therebetween.
In addition, the barrier plate assembly 130 may be constructed to be detachable from the organic layer deposition apparatus 100″. In the organic layer deposition apparatus 100″ according to the current embodiment of the present invention, the deposition space is enclosed by using the barrier plate assembly 130, so that the deposition material 115 that remains undeposited may be mostly deposited within the barrier plate assembly 130. Thus, since the barrier plate assembly 130 is constructed to be detachable from the organic layer deposition apparatus 100″, when a large amount of the deposition material 115 lies in the barrier plate assembly 130 after a long deposition process, the barrier plate assembly 130 may be detached from the organic layer deposition apparatus 100″ and then placed in a separate deposition material recycling apparatus in order to recover the deposition material 115. Due to the structure of the organic layer deposition apparatus 100″ according to the present embodiment, a reuse rate of the deposition material 115 may be increased, so that the deposition efficiency may be improved and the manufacturing costs may be reduced.
The patterning slit sheet 151 and the frame 155 in which the patterning slit sheet 150 is bound are disposed between the deposition source 110″ and the substrate 500. The frame 155 may be formed to have a lattice shape, similar to a window frame. The patterning slit sheet 151 is bound inside the frame 155. The patterning slit sheet 151 includes a plurality of patterning slits 151a arranged in the X-axis direction. The patterning slits 151a extend in the Y-axis direction. The deposition material 115 that has been vaporized in the deposition source 110″ and passed through the deposition source nozzles 121″, passes through the patterning slits 151a towards the substrate 500.
The patterning slit sheet 151 may be formed of a metal thin film. The patterning slit sheet 151 is extended to be fixed to the frame 155. The patterning slits 151a may be formed by etching the patterning slit sheet 151 to have a stripe pattern.
In the organic layer deposition apparatus 100″ according to the current embodiment of the present invention, the total number of patterning slits 151a may be greater than the total number of deposition source nozzles 121″. In addition, there may be a greater number of patterning slits 151a than deposition source nozzles 121″ disposed between two adjacent barrier plates 131. The number of patterning slits 151a may be equal to the number of deposition patterns to be formed on the substrate 500.
In addition, the barrier plate assembly 130 and the patterning slit sheet 151 may be disposed to be separated (e.g., spaced) from each other (e.g., by a predetermined distance). Alternatively, the barrier plate assembly 130 and the patterning slit sheet 151 may be connected by the connection member 133. The temperature of the barrier plate assembly 130 may increase to 100° C. or higher due to the deposition source 110″ whose temperature is high. Thus, in order to prevent the heat of the barrier plate assembly 130 from being conducted to the patterning slit sheet 151, the barrier plate assembly 130 and the patterning slit sheet 151 are separated (or spaced) from each other (e.g., by a predetermined distance).
As described above, the organic layer deposition apparatus 100″ according to the current embodiment of the present invention performs deposition while being moved relative to the substrate 500. In order to move the organic layer deposition apparatus 100″ relative to the substrate 500, the patterning slit sheet 151 is separated (or spaced) from the substrate 500 (e.g., by a predetermined distance). In addition, in order to reduce or prevent the formation of a relatively large shadow zone on the substrate 500 when the patterning slit sheet 151 and the substrate 500 are separated from each other, the barrier plates 131 are arranged between the deposition source nozzle unit 120″ and the patterning slit sheet 151 to force the deposition material 115 to move in a straight direction. Thus, the size of the shadow zone that may be formed on the substrate 500 may be reduced (e.g., sharply reduced).
In order to overcome this problem, in the organic layer deposition apparatus 100″ according to the current embodiment of the present invention, the patterning slit sheet 151 is disposed to be separated (or spaced) from the substrate 500 (e.g., by a predetermined distance). This may be facilitated by installing the barrier plates 131 to reduce the size of the shadow zone formed on the substrate 500.
As described above, when the patterning slit sheet 151 is manufactured to be smaller than the substrate 500, the patterning slit sheet 151 may be moved relative to the substrate 500 during deposition. Thus, it is no longer necessary to manufacture a large FMM as used in the conventional deposition method. In addition, since the substrate 500 and the patterning slit sheet 151 are separated from each other, defects caused due to contact therebetween may be prevented. In addition, since it is unnecessary to contact the substrate 500 with the patterning slit sheet 151 during a deposition process, the manufacturing speed may be improved.
Referring to
Although a chamber is not illustrated in
The substrate 500, on which the deposition material 115 is to be deposited, is disposed in the chamber. The deposition source 110″ that contains and heats the deposition material 115 is disposed at an opposite side of the chamber to that at which the substrate 500 is disposed.
Structures of the deposition source 110″ and the patterning slit sheet 151 are the same as those in the embodiment described with reference to
The second barrier plate assembly 140 is disposed at a side of the first barrier plate assembly 130. The second barrier plate assembly 140 includes a plurality of second barrier plates 141, and a second barrier plate frame 142 that covers sides of the second barrier plates 141. While a cutaway view of the second barrier plate assembly 140 is shown in
The plurality of second barrier plates 141 may be arranged parallel to each other at equal intervals in the X-axis direction. In addition, each of the second barrier plates 141 may be formed to extend in the YZ plane in
The plurality of first barrier plates 131 and second barrier plates 141 arranged as described above, partition the space between the deposition source nozzle unit 120″ and the patterning slit sheet 151. The deposition space is divided by the first barrier plates 131 and the second barrier plates 141 into sub-deposition spaces that respectively correspond to deposition source nozzles 121″ through which the deposition material 115 is discharged.
The second barrier plates 141 may be disposed to correspond respectively to the first barrier plates 131. The second barrier plates 141 may be respectively disposed to be parallel to and to be on the same plane as the first barrier plates 131. Each pair of the corresponding first and second barrier plates 131 and 141 may be located on the same plane. Although the first barrier plates 131 and the second barrier plates 141 are respectively illustrated as having the same thickness in the X-axis direction, aspects of the present invention are not limited thereto. For example, the second barrier plates 141, which are accurately aligned with the patterning slits 151, may be formed to be relatively thin, whereas the first barrier plates 131, which do not need to be precisely aligned with the patterning slits 151, may be formed to be relatively thick. This makes it easier to manufacture the organic layer deposition apparatus.
As illustrated in
Referring to
A thin film transistor (TFT) 40, a capacitor 50, and an organic light-emitting diode (OLED) 60 are disposed on the insulating layer 31, as illustrated in
A semiconductor active layer 41 is formed on an upper surface of the insulating layer 31 (e.g., formed in a predetermined pattern). A gate insulating layer 32 is formed to cover the semiconductor active layer 41. The semiconductor active layer 41 may include a p-type or n-type semiconductor material.
A first capacitor electrode 51 of the capacitor 50 is formed on an upper surface of the gate insulating layer 32, and a gate electrode 42 of the TFT 40 is formed in a region on the upper surface of the gate insulating layer 32 corresponding to the semiconductor active layer 41. An interlayer insulating layer 33 is formed to cover the first capacitor electrode 51 and the gate electrode 42. The interlayer insulating layer 33 and the gate insulating layer 32 are etched by, for example, dry etching, to form a contact hole exposing parts of the semiconductor active layer 41.
Then, a second capacitor electrode 52 and a source/drain electrode 43 are formed on the interlayer insulating layer 33. The source/drain electrode 43 is formed on the interlayer insulating layer 33 to contact the semiconductor active layer 41 through the contact hole. A passivation layer 34 is formed to cover the second capacitor electrode 52 and the source/drain electrode 43, and is etched to expose a part of the drain electrode 43. An insulating layer may be further formed on the passivation layer 34 so as to planarize the passivation layer 34.
In addition, the OLED 60 displays image information (e.g., predetermined image information) by emitting red, green, or blue light as current flows. The OLED 60 includes a first electrode 61 disposed on the passivation layer 34. The first electrode 61 is electrically connected to the drain electrode 43 of the TFT 40.
A pixel defining layer 35 is formed to cover the first electrode 61. An opening 64 is formed in the pixel defining layer 35, and then an organic emission layer 63 is formed in a region defined by the opening 64. A second electrode 62 is formed on the organic emission layer 63.
The pixel defining layer 35, which defines individual pixels, is formed of an organic material. The pixel defining layer 35 also planarizes the surface of a region of the substrate 30 where the first electrode 61 is formed, and in particular, the surface of the passivation layer 34.
The first electrode 61 and the second electrode 62 are insulated from each other, and respectively apply voltages of opposite polarities to the organic emission layer 63 to accomplish light emission.
The organic emission layer 63 may be formed of a low-molecular weight organic material or a high-molecular weight organic material. When a low-molecular weight organic material is used, the organic emission layer 63 may have a single or multi-layer structure including at least one selected from the group consisting of a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). Examples of available organic materials may include copper phthalocyanine (CuPc), N,N′-di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB), tris-8-hydroxyquinoline aluminum (Alq3), and the like. Such a low-molecular weight organic material may be deposited using vacuum deposition by using a suitable one of the organic layer deposition apparatuses illustrated in the drawings.
After the opening 64 is formed in the pixel defining layer 35, the substrate 30 is transferred to a chamber. Target organic materials are loaded into a first deposition source unit 11 and a second deposition source unit 12 for deposition. For example, when a host and a dopant are concurrently or simultaneously deposited, a host material and a dopant material may be loaded into the first deposition source unit 11 and the second deposition source unit 12, respectively. After the organic emission layer 63 is formed, the second electrode 62 may be formed by the same deposition method as used to form the organic emission layer 63.
The first electrode 61 may function as an anode, and the second electrode 62 may function as a cathode. Alternatively, the first electrode 61 may function as a cathode, and the second electrode 62 may function as an anode. The first electrode 61 may be patterned to correspond to individual pixel regions, and the second electrode 62 may be formed to cover all the pixels.
The first electrode 61 may be formed as a transparent electrode or a reflective electrode. The transparent electrode may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and/or indium oxide (In2O3). The reflective electrode may be formed by forming a reflective layer from silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a compound thereof and forming a layer of ITO, IZO, ZnO, and/or In2O3 on the reflective layer. The first electrode 61 may be formed by forming a layer by, for example, sputtering, and then patterning the layer by, for example, photolithography.
The second electrode 62 may also be formed as a transparent electrode or a reflective electrode. When the second electrode 62 is formed as a transparent electrode, the second electrode 62 functions as a cathode. To this end, such a transparent electrode may be formed by depositing a metal having a low work function, such as lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminum (LiF/Al), aluminum (Al), silver (Ag), magnesium (Mg), or a compound thereof on a surface of the organic emission layer 63 and forming an auxiliary electrode layer or a bus electrode line thereon from ITO, IZO, ZnO, In2O3, or the like. When the second electrode 62 is formed as a reflective electrode, the reflective electrode may be formed by depositing Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg, or a compound thereof on the entire surface of the organic emission layer 63. The second electrode 62 may be formed by using the same deposition method as used to form the organic emission layer 63 described above.
The organic layer deposition apparatuses according to the embodiments of the present invention described above may be applied to form an organic layer or an inorganic layer of an organic TFT, and to form layers from various materials.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2011-0049790 | May 2011 | KR | national |
This application is a divisional of U.S. patent application Ser. No. 13/475,835, filed on May 18, 2012, which claims priority to and the benefit of Korean Patent Application No. 10-2011-0049790, filed on May 25, 2011, in the Korean Intellectual Property Office, the entire disclosures of both of which are incorporated herein in its entirety by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13475835 | May 2012 | US |
| Child | 14691490 | US |
