Patent Application
20230067595
This application claims priority of Taiwanese Invention Patent Application No. 110210356, filed on Sep. 2, 2021.
The disclosure relates to a package structure, and more particularly to a package structure with antenna circuit.
Antenna circuits are widely used in the wireless communication industry because they can be used to receive/transmit electromagnetic waves or to generate radiated electromagnetic fields by applying current.
Taking for example an antenna element for a vehicle, an antenna circuit pattern is attached to a surface of a carrier plate. The carrier plate is usually made by injection molding, and has different structural forms or surface appearances according to the different disposition requirements. Further, usually a plurality of bosses are formed on the carrier plate for supporting or connecting, thereby affecting the adhesion between the antenna circuit pattern and the surface of the carrier plate, resulting in the antenna circuit pattern being easily removed or damaged in the subsequent packaging process.
Therefore, an object of the present disclosure is to provide a package structure having an antenna circuit that can alleviate at least one of the drawbacks of the prior art.
According to one aspect of this disclosure, a package structure includes a carrier substrate that is insulating and flexible, a circuit unit, and a packaging unit. The circuit unit includes an antenna circuit, and a conducting circuit that is flexible and that is electrically connected to the antenna circuit. At least a portion of the antenna circuit is disposed on the carrier substrate. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that a portion of the circuit unit is exposed to permit the conducting circuit for electrical connection with the outside.
Another object of the present disclosure is to provide a package structure having an antenna circuit that can alleviate at least one of the drawbacks of the prior art.
According to another aspect of this disclosure, a package structure includes a carrier substrate that is insulating and flexible, a circuit unit, and a packaging unit. The circuit unit includes an antenna circuit, a conducting circuit that is flexible and that is electrically connected to the antenna circuit, a printed circuit board that is flexible, and a conductive adhesive member. The antenna circuit is disposed on the carrier substrate. The conducting circuit is formed on the printed circuit board. The conductive adhesive member is formed on a portion of a surface of the antenna circuit for connecting the antenna circuit to the conducting circuit. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that the conducting circuit is partially exposed for electrical connection with the outside.
Still another object of the present disclosure is to provide a package structure having an antenna circuit that can alleviate at least one of the drawbacks of the prior art.
According to another aspect of this disclosure, a packaging structure includes a carrier substrate that is insulating and flexible, a circuit unit, and a packaging unit. The circuit unit includes a printed circuit board that is flexible, an antenna circuit, and a conducting circuit electrically connected to the antenna circuit. The printed circuit board is partially connected to the carrier substrate and has one side that is bent. The antenna circuit is at least partially formed on the printed circuit board in a range where the printed circuit board is connected to the carrier substrate. The conducting circuit is formed on the printed circuit board at the one side that is bent. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that the one side of the printed circuit board that is bent and a portion of the circuit unit are exposed to permit the conducting circuit for electrical connection with the outside.
Other features and advantages of the disclosure will become apparent in the following detailed description of the embodiments with reference to the accompanying drawings, of which:
Before the present disclosure is described in greater detail with reference to the accompanying embodiments, it should be noted herein that like elements are denoted by the same reference numerals throughout the disclosure.
Referring to
The carrier substrate 21 is insulating and flexible, and can be used for connecting with electronic components configured in different structural forms. In this embodiment, the carrier substrate 21 is a thin film selected from the group consisting of plastic (e.g. PET) and rubber.
The circuit unit 22 includes an antenna circuit 221, a conducting circuit 222, a printed circuit board 223 that is flexible, and a conductive adhesive member 224. In this embodiment, the antenna circuit 221 is horizontally disposed on the carrier substrate 21, and is an antenna pattern made of a conductive material. Specifically, the antenna circuit 221 is made of conductive silver paste, and is formed on the carrier substrate 21 by printing. The conducting circuit 222 is flexible, and is formed on the printed circuit board 223. One side of the printed circuit board 223 is connected to the antenna circuit 221 through the conductive adhesive member 224 so as to electrically connect the conducting circuit 222 and the antenna circuit 221 to each other. Specifically, the conductive adhesive member 224 is formed on a portion of a surface of the antenna circuit 221 for connecting the conducting circuit 222 to the antenna circuit 221. In this embodiment, the conductive adhesive member 224 is made of an anisotropic conductive film (ACF).
Another side of the printed circuit board 223 opposite to the antenna circuit 221 is bent at an angle relative to the carrier substrate 21 so as to be conducive to electrical connection with the outside after subsequent encapsulation. It should be noted herein that the printed circuit board 223 may be extended or bent in different forms depending on the structural requirements of subsequent packaging components, as long as the conducting circuit 222 can be partially exposed from the packaging unit 23.
The packaging unit 23 is disposed on the carrier substrate 21 by molding, and encapsulates the circuit unit 22 such that a portion of the circuit unit 22 is exposed to permit the conducting circuit 222 for electrical connection with the outside. The packaging unit 23 is made of an insulating material selected from the group consisting of resin, primer and silicone, and can have a single layer structure or a multilayer structure. In this embodiment, the packaging unit 23 is exemplified as including an interface layer 231 and an encapsulating layer 232.
The interface layer 231 is made from primer, is formed on the carrier substrate 21, and encapsulates at least the antenna circuit 221. The encapsulating layer 232 is made from resin, is formed on the interface layer 231, and covers the conducting circuit 222 and the printed circuit board 223 such that one end of the conducting circuit 222 opposite to the antenna circuit 221 is exposed to the outside. The interlace layer 231 is made of a material different from that of the encapsulating layer 232 to increase connection between the carrier substrate 21 and the encapsulating layer 232.
With the packaging unit 23 encapsulating the circuit unit 22, the antenna circuit 221 can be tightly adhered to the carrier substrate 21 so as to stabilize the conducting circuit 222 and prevent the same from being damaged or removed, and the adhesion between the carrier substrate 21 and the encapsulating layer 232 can be increased through the interface layer 231. It should be noted herein that the packaging unit 23 may only be composed of a single or multiple layers of insulating material depending on the requirements or the material of the carrier substrate 21, so that the number of layers thereof does not need to be particularly limited.
Referring to
In this embodiment, the circuit unit 32 includes an antenna circuit 321, a conducting circuit 322 that is flexible, a printed circuit board 323 that is flexible, and an adhesive member 324. As shown in
In this embodiment, the printed circuit board 323 has a main portion 3230 connected to the carrier substrate 31 through the adhesive member 324, a first bent portion 3231 bent at an angle relative to the main portion 3230, and a second bent portion 3232 that is bent at an angle relative to the first bent portion 3231, that is opposite to the carrier substrate 31, and that is exposed from the packaging unit 33 for electrical connection with the outside. It should be noted herein that the printed circuit board 323 may be extended or bent in different forms depending on the requirements or the relative positions of electronic components to be disposed thereto, as long as the second bent portion 3232 of the printed circuit board 323 can be exposed from the packaging unit 33.
The antenna circuit 321 is formed on the main portion 3230 of the printed circuit board 323 at a side opposite to the carrier substrate 31 and in a range where the printed circuit board 323 is adhered to the carrier substrate 31. The conducting circuit 322 is formed on the first and second bent portions 3231, 3232 of the printed circuit board 323, and is electrically connected to the antenna circuit 321. Preferably, the antenna circuit 321 is horizontally disposed on the carrier substrate 31 to prevent bending thereof and to have a long radiation length.
In summary, in the package structure 2, 3 of this disclosure, the antenna circuit 221, 321 is formed on the flexible carrier substrate 21 or the flexible printed circuit board 323, and is electrically connected with the outside only through a portion of the conducting circuit 222 or the second bent portion 3232 of the printed circuit board 323, which is beneficial for the disclosure to be disposed on components with different forms in subsequent applications. Furthermore, the packaging unit 23, 33 formed by molding is used to encapsulate the circuit unit 22, 32 so as to prevent the antenna circuit 221, 321 and the conducting circuit 222, 322 from being damaged or removed. Therefore, the object of this disclosure can indeed be achieved.
In the description above, for the purposes of explanation, numerous specific details have been set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art, that one or more other embodiments may be practiced without some of these specific details. It should also be appreciated that reference throughout this specification to “one embodiment,” “an embodiment,” an embodiment with an indication of an ordinal number and so forth means that a particular feature, structure, or characteristic may be included in the practice of the disclosure. It should be further appreciated that in the description, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of various inventive aspects, and that one or more features or specific details from one embodiment may be practiced together with one or more features or specific details from another embodiment, where appropriate, in the practice of the disclosure.
While the disclosure has been described in connection with what are considered the exemplary embodiments, it is understood that this disclosure is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 110210356 | Sep 2021 | TW | national |
