Claims
- 1. A method for fabricating a microfluidic device, comprising:
heating a substrate composed of a glassy uncrystallized polyaryl-ether-ketone (PAEK) material to the glass transition temperature of the PAEK material; and embossing said heated PAEK substrate until the temperature of said heated PAEK substrate is at least a temperature sufficient to produce rapid crystallization of the PAEK material to form a patterned PAEK crystalline substrate.
- 2. The method of claim 1, further comprising:
applying an adhesion enhancement treatment to respective surfaces of said patterned PAEK substrate and an additional substrate.
- 3. The method of claim 2, further comprising:
applying a solvent-resistant adhesive to at least one of said adhesion enhancement-treated surfaces to bond said respective surfaces of said patterned PAEK substrate and said additional substrate together.
- 4. The method of claim 3, wherein said solvent-resistant adhesive is a polyimide-based adhesive.
- 5. The method of claim 4, wherein said polyimide-based adhesive comprises a N-methyl pyrrolidone (NMP)-based solution containing a mixture of one or more of the following: thermoplastic polyimides, polyamic acids and partially imidized polyamic acids.
- 6. The method of claim 3, wherein the layer of said solvent-resistant adhesive on said at least one of said adhesion enhancement-treated surfaces has a thickness substantially less than the thickness of said patterned PAEK substrate.
- 7. The method of claim 6, wherein the thickness of the layer of said solvent-resistant adhesive on said at least one of said adhesion enhancement-treated surfaces is between 0.1 microns and 1 micron.
- 8. The method of claim 3, wherein said step of applying said solvent-resistant adhesive further comprises:
pressing said respective surfaces of said patterned PAEK substrate and said additional substrate together under pressure vacuum and heat.
- 9. The method of claim 3, further comprising the step of
bonding a first surface of said patterned PAEK substrate having said solvent-resistant adhesive thereon and a first surface of a third PAEK substrate; and bonding a second surface of said third PAEK substrate and a first surface of said additional substrate having said solvent-resistant adhesive thereon.
- 10. The method of claim 2, wherein said step of applying further comprises:
plasma-treating said respective surfaces of said patterned PAEK substrate and said additional substrate.
- 11. The method of claim 2, wherein said step of applying further comprises:
sulfonating said respective surfaces of said patterned PAEK substrate and said additional substrate.
- 12. The method of claim 2, wherein said patterned PAEK substrate comprises first and second patterned PAEK substrates, said additional substrate being one of said first and second patterned PAEK substrates.
- 13. The method of claim 2, wherein said additional substrate is composed of a solvent-resistant material.
- 14. A method for bonding polyaryl-ether-ketone (PAEK), comprising:
applying an adhesion enhancement treatment to respective surfaces of a substrate composed of a PAEK material and an additional substrate; applying a solvent-resistant adhesive to at least one of said adhesion enhancement-treated surfaces to bond said respective surfaces of said PAEK substrate and said additional substrate together.
- 15. The method of claim 14, wherein said solvent-resistant adhesive is a polyimide-based adhesive.
- 16. The method of claim 15, wherein said polyimide-based adhesive comprises a N-methyl pyrrolidone (NMP)-based solution containing a mixture of one or more of the following: thermoplastic polyimides, polyamic acids and partially imidized polyamic acids.
- 17. The method of claim 14, wherein the layer of said solvent-resistant adhesive on said at least one of said adhesion enhancement-treated surfaces has a thickness substantially less than the thickness of said PAEK substrate.
- 18. The method of claim 17, wherein the thickness of the layer of said solvent-resistant adhesive on said at least one of said adhesion enhancement-treated surfaces is between 0.1 microns and 1 micron.
- 19. The method of claim 14, further comprising:
pressing said respective surfaces of said patterned PAEK substrate and said additional substrate together.
- 20. The method of claim 14, further comprising the step of:
annealing said at least one of said adhesion enhancement-treated surfaces having said solvent-resistant adhesive thereon.
- 21. The method of claim 14, wherein said step of applying said adhesion enhancement treatment further comprises:
plasma-treating said respective surfaces of said PAEK substrate and said additional substrate.
- 22. The method of claim 14, further comprising the steps of:
bonding a first surface of said PAEK substrate having said solvent-resistant adhesive thereon and a first surface of a third PAEK substrate; and bonding a second surface of said third PAEK substrate and a first surface of said additional substrate having said solvent-resistant adhesive thereon.
- 23. The method of claim 14, wherein said step of applying said adhesion enhancement treatment further comprises:
sulfonating said respective surfaces of said PAEK substrate and said additional substrate.
- 24. The method of claim 14, wherein said PAEK substrate comprises first and second PAEK substrates, said additional substrate being one of said first and second PAEK substrates.
- 25. The method of claim 14, wherein said additional substrate is composed of a solvent-resistant material.
- 26. A polyaryl-ether-ketone (PAEK) microfluidic device, comprising:
a substrate composed of a PAEK material; an additional substrate capable of being bonded to said PAEK substrate, said PAEK substrate and said additional substrate having adhesion enhancement-treated surfaces thereon, at least one of said PAEK substrate and said additional substrate having a cavity therein forming a part of a channel of the microfluidic device; and a layer of a solvent-resistant adhesive applied on at least one of said adhesion enhancement-treated surfaces to bond said respective surfaces of said PAEK substrate and said additional substrate together.
- 27. The device of claim 26, wherein said solvent-resistant adhesive is a polyimide-based adhesive.
- 28. The device of claim 27, wherein said polyimide-based adhesive comprises a N-methyl pyrrolidone (NMP)-based solution containing a mixture of one or more of the following: thermoplastic polyimides, polyamic acids and partially imidized polyamic acids.
- 29. The device of claim 26, wherein said layer of said solvent-resistant adhesive on said at least one of said adhesion enhancement-treated surfaces has a thickness substantially less than the thickness of said PAEK substrate.
- 30. The method of claim 29, wherein the thickness of said layer of said solvent-resistant adhesive on said at least one of said adhesion enhancement-treated surfaces is between 0.1 microns and 1 micron.
- 31. The device of claim 26, wherein said adhesion enhancement-treatment surfaces comprise plasma-treated surfaces.
- 32. The device of claim 26, wherein said adhesion enhancement-treatment surfaces comprise sulfonated surfaces.
- 33. The device of claim 26, wherein said PAEK substrate comprises first and second PAEK substrates, said additional substrate being one of said first and second PAEK substrates.
- 34. The device of claim 26, wherein said additional substrate is composed of a solvent-resistant material.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This U.S. Nonprovisional Application for Patent is a Continuation-in-Part of U.S. Nonprovisional application for patent Ser. No. 09/908,231, which was filed on Jul. 17, 2001. U.S. Nonprovisional application for patent Ser. No. 09/908,231 is also hereby incorporated by reference in its entirety herein.
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09908231 |
Jul 2001 |
US |
Child |
10114801 |
Apr 2002 |
US |