In some aspects of the present description, a connector assembly is provided, including a housing, a circuit board, and a plurality of cables, each including a plurality of conductors. The housing includes top and bottom housing portions assembled to each other and defining a housing cavity therebetween. The housing includes a mating end for mating with a mating connector and an opposing cable end for receiving one or more cables.
The circuit board is disposed in the housing cavity and includes an upper major surface, an opposing lower major surface, a front edge proximate the mating end, and a rear edge opposite the front edge and proximate the cable end. The circuit board includes a plurality of conductive front pads disposed on the upper and lower major surfaces proximate the front edge, and a plurality of conductive rear pads disposed on the upper and lower major surfaces proximate the rear edge and electrically connected to the front pads. The rear pads form first and second rows of rear pads on each of the upper and lower major surfaces, with the first row disposed proximate the rear edge and the second row disposed between the first row and the front pads.
The plurality of conductors of the plurality of cables include uninsulated front ends terminated at the rear pads of the first and second rows of the rear pads on the upper and lower major surfaces. For one of the first rows, at least a portion of each uninsulated front end is disposed between upper and lower planes defined by the respective upper and lower major surfaces.
In some aspects of the present description, a connector assembly is provided, including a housing, a circuit board, and a cable. The circuit board is at least partially disposed inside the housing and includes a plurality of conductive pads disposed on a first major surface thereof, opposite a second major surface. The cable includes a plurality of conductors. The uninsulated front ends of the conductors are terminated at the conductive pads, such that at least a portion of each uninsulated front end is disposed between first and second planes defined by the first and second major surfaces.
In some aspects of the present description, a circuit board assembly is provided, including a circuit board including opposing first and second major surfaces. Uninsulated portions of first and second insulated conductors are terminated at conductive pads disposed on the respective first and second major surfaces, such that, in a side plan view, the uninsulated portion of only one of the first and second conductors extends beyond an edge of the circuit board.
In the following description, reference is made to the accompanying drawings that form a part hereof and in which various embodiments are shown by way of illustration. The drawings are not necessarily to scale. It is to be understood that other embodiments are contemplated and may be made without departing from the scope or spirit of the present description. The following detailed description, therefore, is not to be taken in a limiting sense.
For high speed cable assemblies, low input differential insertion loss (represented by differential scattering parameter, SDD21) in a connector assembly is a critical factor to minimize error as a signal propagates through the assembly. Multiple components contribute to insertion loss, including the interface with the mating connector, the structure of circuit traces, vias, and pads on the PCB, the quality of the solder connections, the size of the conductors inside the cable, the impedance design of the components, and several other factors.
Of these factors, the PCB can contribute significantly to the total loss of the assembly and mated connectors. For example, a PCB can contribute 6 decibels (dB) or more of loss to a 17.5 dB total assembly. This loss can be minimized with good PCB design practices, such as using PCB materials with lower dielectric constants, and shortening the lengths of circuit traces on the PCB. Shortening the trace lengths on a PCB can reduce insertion loss significantly.
Standard form factors for high-speed cable connector assemblies (such as the Octal Small Form Factor Pluggable Module, OSFP, or the Quad Small Form Factor Pluggable Double Density, QSFP-DD) have space limitations between the bottom of the PCB and the floor of the bottom connector backshell. This space limitation typically dictates that three of the incoming four cables are attached to the upper side of the PCB, and the fourth cable is attached on the bottom or lower side of the PCB. Placing three rows on the upper side requires a longer PCB with longer circuit traces, which contributes to the total insertion loss of the system. Moving the third cable and associated solder pads from the upper side of the PCB to the lower side of the PCB, near the edge of the PCB, may shorten the circuit traces required and reduce insertion loss. For example, such as in the case of standard OSFP and QSFP-DD form factor connectors, PCB traces may be shortened by 10 mm or more, resulting in an insertion loss improvement of approximately 0.3 dB.
It should be noted that, although many of the examples and figures provided herein describe the use of four cables, these examples are not intended to be limiting. Typically, a cable is defined as a set of two or more electrical conductors presented in a single bundle or package (e.g., two or more conductors in a shared sleeve of insulating material). The example embodiments described herein with four cables (e.g., cables 60, 61, 62, and 63 of
According to some aspects of the present description, a connector assembly is provided, including a housing, a printed circuit board (also “circuit board” or “PCB”), and a plurality of cables, each including a plurality of conductors. In some embodiments, the housing includes top and bottom housing portions assembled to each other and defining a housing cavity therebetween. The housing includes a mating end for mating with a mating connector and an opposing cable end for receiving one or more cables.
In some embodiments, the circuit board is disposed in the housing cavity and includes an upper major surface, an opposing lower major surface, a front edge near the mating end, and a rear edge opposite the front edge and near the cable end. In some embodiments, the circuit board includes a plurality of conductive front pads disposed on the upper and lower major surfaces near the front edge (e.g., conductive pads corresponding to mating connection points in a mating connector assembly), and a plurality of conductive rear pads disposed on the upper and lower major surfaces near the rear edge and electrically connected to the front pads. In some embodiments, the front pads form a first row of front pads disposed on the upper major surface of the circuit board, and a second row of front pads disposed on the lower surface of the circuit board.
In some embodiments, the rear pads form first and second rows of rear pads on each of the upper and lower major surfaces, with the first row disposed near the rear edge and the second row disposed between the first row and the front pads. In other words, each of the upper and lower major surfaces of the circuit board include two rows of rear pads: a first row of rear pads proximate the rear edge of the circuit board, and a second row of rear pads farther away from the rear edge.
In some embodiments, the cable end of the housing receives and connects to a plurality of incoming cables (e.g., four incoming cables). In some embodiments, at least one of the plurality of cables may be substantially flat (i.e., the thickness or height of the cable is relatively small compared with the width and/or the length of the cable). The plurality of conductors of the cables include uninsulated front ends terminated at the rear pads of the first and second rows of the rear pads on the upper and lower major surfaces. In some embodiments, for one of the first rows, at least a portion of each uninsulated front end is disposed between upper and lower planes defined by the respective upper and lower major surfaces (i.e., by connecting to rear pads located near the rear edge of the circuit board, the bulk of the insulated portion of the cables can be positioned behind the edge of and substantially in-plane with the circuit board, rather than above or below the circuit board).
In some embodiments, the connector assembly may be an Octal Small Form Factor Pluggable Module (OSFP) connector assembly. In other embodiments, the connector assembly may be a Quad Small Form Factor Pluggable Double Density (QSFP-DD) small form factor.
According to some aspects of the present description, a connector assembly is provided, including a housing, a printed circuit board (“circuit board” or “PCB”), and at least one cable. In some embodiments, the circuit board is at least partially disposed inside the housing and includes a plurality of conductive pads disposed on a first major surface thereof, opposite a second major surface. The cable includes a plurality of conductors. In some embodiments, the uninsulated front ends of the conductors are terminated at the conductive pads on the circuit board, such that at least a portion of each uninsulated front end is disposed between first and second planes defined by the first and second major surfaces. In some embodiments, the conductive pads may be disposed near an edge of the circuit board, such that the bulk of the insulated portion of the cables can be positioned behind the edge of and substantially in-plane with the circuit board when the uninsulated front ends are terminated at the conductive pads.
In some embodiments, the cable may be substantially flat. In some embodiments, the cable may include a plurality of insulated conductors and a plurality of uninsulated conductors. For example, the uninsulated conductors may include uninsulated drain conductors.
In some embodiments, the housing may include a top housing portion and a bottom housing portion, the top and bottom housing portions assembled to each other and defining a housing cavity therebetween. In some embodiments, the circuit board may be disposed within the housing cavity. In some embodiments, the housing may be metal. In some embodiments, the connector assembly may further include a pull tab or a push-pull tab assembled to the housing (e.g., an extended tab of material for mating and/or de-mating a connector in a highly-congested application).
According to some aspects of the present description, a circuit board assembly is provided, including a circuit board including opposing first and second major surfaces. In some embodiments, uninsulated portions of first and second insulated conductors are terminated at conductive pads disposed on the respective first and second major surfaces, such that, in a side plan view, the uninsulated portion of only one of the first and second conductors extends beyond an edge of the circuit board. In some embodiments, the uninsulated portion of the conductors that extends beyond the edge of the circuit board may be disposed between upper and lower planes defined by the first and second major surfaces of the circuit board.
In some embodiments, the uninsulated portions of the first and second insulated conductors may be soldered to the conductive pads on the first and second major surfaces of the circuit board. In some embodiments, the conductors of the insulated conductors may have diameters not greater than 22 American Wire Gauge (AWG).
Turning now to the figures,
A connector assembly 200 includes a housing 10, including a mating end 14 and a cable end 15. In some embodiments, the housing 10 includes a top housing 11 and a bottom housing 12, which are assembled together to form housing 10 and to define a housing cavity (not shown in
Conductors from one or more cables enter the cable end 15 of housing 10 and are terminated at conductive pads on PCB 30 (not shown). In some embodiments, four cables 60, 61, 62, and 63 are terminated at PCB 30. For example, a connector assembly 200 designed to standards such as OSFP or QSFP-DD, may have four cables 60-63 as shown in
A PCB 30 includes an upper major surface 31 and a lower major surface 32. PCB 30 also includes a front edge 33 proximate the mating end 14 (mating end 14 of connector assembly 200, see at least
In some embodiments, PCB 30 may further include a plurality of conductive rear pads 50 disposed on the upper major surface 31 and the lower major surface 32. Rear pads 50 may form first row of rear pads 51 and second row of rear pads 52 on the upper major surface 31, and first row of rear pads 53 and second row or rear pads 54 on the lower major surface 32.
In some embodiments, first row of rear pads 51 may be disposed on upper major surface 31 proximate the rear edge 34 of PCB 30, and first row of rear pads 53 may be disposed on lower major surface 32 proximate the rear edge 34 of PCB 30. In some embodiments, second row of rear pads 52 may be disposed on the upper major surface 31 between first row of rear pads 51 and first row of front pads 41, and second row of rear pads 54 may be disposed on lower major surface 32 between first row of rear pads 53 and second row of front pads 42.
In the embodiment shown in
Finally,
Terms such as “about” will be understood in the context in which they are used and described in the present description by one of ordinary skill in the art. If the use of “about” as applied to quantities expressing feature sizes, amounts, and physical properties is not otherwise clear to one of ordinary skill in the art in the context in which it is used and described in the present description, “about” will be understood to mean within 10 percent of the specified value. A quantity given as about a specified value can be precisely the specified value. For example, if it is not otherwise clear to one of ordinary skill in the art in the context in which it is used and described in the present description, a quantity having a value of about 1, means that the quantity has a value between 0.9 and 1.1, and that the value could be 1.
Terms such as “substantially” will be understood in the context in which they are used and described in the present description by one of ordinary skill in the art. If the use of “substantially equal” is not otherwise clear to one of ordinary skill in the art in the context in which it is used and described in the present description, “substantially equal” will mean about equal where about is as described above. If the use of “substantially parallel” is not otherwise clear to one of ordinary skill in the art in the context in which it is used and described in the present description, “substantially parallel” will mean within 30 degrees of parallel. Directions or surfaces described as substantially parallel to one another may, in some embodiments, be within 20 degrees, or within 10 degrees of parallel, or may be parallel or nominally parallel. If the use of “substantially aligned” is not otherwise clear to one of ordinary skill in the art in the context in which it is used and described in the present description, “substantially aligned” will mean aligned to within 20% of a width of the objects being aligned. Objects described as substantially aligned may, in some embodiments, be aligned to within 10% or to within 5% of a width of the objects being aligned.
All references, patents, and patent applications referenced in the foregoing are hereby incorporated herein by reference in their entirety in a consistent manner. In the event of inconsistencies or contradictions between portions of the incorporated references and this application, the information in the preceding description shall control.
Descriptions for elements in figures should be understood to apply equally to corresponding elements in other figures, unless indicated otherwise. Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations can be substituted for the specific embodiments shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this disclosure be limited only by the claims and the equivalents thereof.
Filing Document | Filing Date | Country | Kind |
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PCT/IB2020/052821 | 3/25/2020 | WO | 00 |
Number | Date | Country | |
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62826277 | Mar 2019 | US |