Claims
- 1. A heat reservoir device for managing a heat input subject to transient conditions, said heat reservoir device comprising:
a heat transfer subsystem having a thermal path thermally coupled to said heat input; a heat storage subsystem coupled to said thermal path of said heat transfer subsystem, said heat storage subsystem comprising a phase change material capable of changing phases in response to said transient conditions causing the temperature of said phase change material to rise above its phase change temperature.
- 2. The heat reservoir device of claim 1, further comprising:
a heat collector thermally coupled to said heat transfer subsystem and said heat input; a heat rejection subsystem thermally coupled to said heat collector.
- 3. The heat reservoir device of claim 1, wherein said heat transfer subsystem comprises a component selected from the group consisting of a heat pipe, a thermosyphon, and a liquid-cooling pump.
- 4. The heat reservoir device of claim 1, wherein said phase change material comprises a material selected from the group consisting of: a hydrated salt, sodium acetate, magnesium nitrate, paraffin, and water.
- 5. The heat reservoir device of claim 1, wherein said heat storage subsystem further comprises:
a sealed case; a plurality of fins thermally coupled to said heat transfer subsystem and encapsulated by said sealed case, wherein said phase change material is thermally coupled to said plurality of fins.
- 6. The heat reservoir device of claim 5, wherein said heat transfer subsystem comprises a heat pipe, and wherein said plurality of fins comprises a series of disc-shaped fins axially distributed along and connected to said heat transfer subsystem.
- 7. The heat reservoir device of claim 5, wherein said heat transfer subsystem comprises a heat pipe, and wherein said plurality of fins comprises a series of radial fins thermally coupled to said heat transfer system.
- 8. The heat reservoir device of claim 5, wherein said heat transfer subsystem comprises a heat pipe, and wherein said fins comprise a series of radial pin fins thermally coupled to said heat transfer subsystem.
- 9. The heat reservoir device of claim 5, wherein said fins are rectilinear, and wherein said sealed case includes a base coupled to said heat transfer subsystem.
- 10. The heat reservoir device of claim 5, wherein said fins are pin fins, and wherein said sealed case includes a base coupled to said heat transfer subsystem.
- 11. The heat reservoir device of claim 5, wherein said plurality of fins protrude from a base coupled to said heat transfer subsystem.
- 12. A heat transfer system for cooling a component subject to thermal transients, said heat transfer system comprising:
a heat collector coupled to said component; a heat sink coupled to said heat collector; a heat pipe having a first end and a second end, said first end coupled to said heat collector, and said second end coupled to a heat storage subsystem, wherein said heat storage subsystem comprises: a phase change material capable of changing phases in response to said transient conditions causing the temperature of said phase change material to rise above its phase change temperature;
- 13. The heat transfer system of claim 12, further comprising:
a sealed case; and a plurality of fins thermally coupled to said heat pipe and encapsulated by said sealed case, wherein said phase change material is thermally coupled to said plurality of fins.
- 14. A heat transfer system for managing a heat input subject to transient conditions, said heat transfer system comprising:
a heat storage subsystem comprising a phase change material capable of changing phases in response to said transient conditions causing the temperature of said phase change material to rise above its phase-change temperature; a heat transfer subsystem thermally coupled to said heat input and said heat storage subsystem; a heat rejection subsystem coupled to said heat transfer subsystem, said heat rejection subsystem configured to transfer heat to an ambient environment.
- 15. A method of cooling a component subject transient heat generation, said method comprising the steps of:
determining the steady-state operating temperature of said component; determining the maximum operating temperature of said component during said transient heat generation; thermally coupling a heat sink to said component, wherein said heat sink is configured to dissipate heat at said steady state operating temperature; thermally coupling a heat reservoir device to said component, wherein said heat reservoir device includes a phase change material having a phase change temperature which is less than said maximum operating temperature and greater than said steady state operating temperature.
- 16. The method of claim 15, wherein said component is contained within a housing, wherein said housing is capable of accommodating a heat-sink of predetermined dimensions, and wherein a heat sink configured to dissipate heat at said maximum operating temperature would include one or more dimensions exceeding said predetermined dimensions.
- 17. The method of claim 15, wherein said component is contained within a housing, wherein said component within said housing experiences a predetermined airflow, and wherein a heat sink configured to dissipate heat at said maximum operating temperature would require an airflow higher than said predetermined airflow.
- 18. The method of claim 15, wherein said component is contained within a housing, wherein said housing experiences predetermined ambient temperature, and wherein a heat sink configured to dissipate heat at said maximum operating temperature would require an ambient temperature lower than said predetermined ambient temperature.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This invention claims priority from U.S. Provisional Patent Application Ser. No. 60/261,551, filed Jan. 26, 2001, which is hereby incorporated by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60261551 |
Jan 2001 |
US |