Patent Application
20200395393
Photodetectors may be used to detect optical signals and convert the optical signals to electrical signals that may be further processed by another circuitry. Photodetectors may be used in consumer electronics products, image sensors, data communications, time-of-flight (TOF) ranging or imaging sensors, medical devices, and many other suitable applications. However, when photodetectors are applied to these applications in a single or array configuration, the leakage current, dark current, electrical/optical cross-talk, and power consumption can degrade performance.
This specification relates to detecting light using a photodiode.
According to an embodiment of the present disclosure, a photo-detecting apparatus is provided. The photo-detecting apparatus includes a semiconductor substrate. A first germanium-based light absorption material is supported by the semiconductor substrate and configured to absorb a first optical signal having a first wavelength greater than 800 nm. A first metal line is electrically coupled to a first region of the first germanium-based light absorption material. A second metal line is electrically coupled to a second region of the first germanium-based light absorption material. The first region is un-doped or doped with a first type of dopants. The second region is doped with a second type of dopants. The first metal line is configured to control an amount of a first type of photo-generated carriers generated inside the first germanium-based light absorption material to be collected by the second region.
According to an embodiment of the present disclosure, a photo-detecting method is provided. The photo-detecting method includes transmitting an optical signal modulated by a first modulation signal, wherein the optical signal is modulated by the first modulation signal with one or multiple predetermined phase(s) for multiple time frames. The reflected optical signal is received by a photodetector. The reflected optical signal is demodulated by one or multiple demodulation signal(s), wherein the one or multiple demodulation signal(s) is/are the signal(s) with one or multiple predetermined phase(s) for multiple time frames. At least one voltage signal is output on a capacitor.
According to an embodiment of the present disclosure, a photo-detecting apparatus is provided. The photo-detecting apparatus includes at least one pixel, and each pixel includes N subpixels, wherein each of the subpixels includes a detection region and two first conductive contacts, wherein the detection region is between the two first conductive contacts, wherein N is a positive integer and is ≥2.
According to an embodiment of the present disclosure, a photo-detecting apparatus is provided. The photo-detecting apparatus includes a first pixel and a second pixel adjacent to the first pixel, wherein each of the first pixel and a second pixel includes N detection regions, 2N first conductive contacts each coupled to one of the detection regions, 2N second conductive contacts each coupled to one of the detection regions, wherein N is a positive integer and is ≥2, and an isolation region between the first pixel and the second pixel.
According to an embodiment of the present disclosure, a photo-detecting apparatus is provided. The photo-detecting apparatus includes a photo-detecting apparatus, the photo-detecting apparatus includes a pixel, and the pixel includes N subpixels, wherein each of the subpixels includes a detection region and two switches, wherein the detection region is between the two switches, wherein N is a positive integer and is ≥2.
According to an embodiment of the present disclosure, an imaging system is provided. The imaging system includes a transmitter unit capable of emitting light; and a receiver unit including an image sensor including: a photo-detecting apparatus, including: a plurality of pixels, wherein each of the pixels includes: N subpixels, wherein each of the subpixels includes a detection region and two first conductive contacts, wherein the detection region is between the two first conductive contacts and the detection region is configured to absorb photons having a wavelength, and to generate photo-carriers from the absorbed photons; wherein N is a positive integer and is ≥2.
Among other advantages and benefits of the embodiments disclosed herein, the embodiments provide a photo-detecting apparatus capable of absorbing a least but limited to a near-infrared (NIR) light or a short-wave infrared (SWIR) light efficiently. In some embodiments, a photo-detecting apparatus provides a high demodulation contrast, low leakage current, low dark current, low power consumption, low electrical/optical cross-talk and/or architecture for chip size miniaturization. In some embodiments, a photo-detecting apparatus is capable of processing the incident optical signal with multiple wavelengths, including different modulation schemes and/or time-division functions. Moreover, the photo-detecting apparatus can be used in time-of-flight (ToF) applications, which may operate at longer wavelengths compared to visible wavelengths (e.g., NIR and SWIR ranges) compared to visible wavelengths. A device/material implementer can design/fabricate a 100% germanium or an alloy (e.g., GeSi) with a predetermined percentage (e.g., more than 80% Ge) of germanium, either intrinsic or extrinsic, as a light absorption material to absorb the light at the aforementioned wavelengths.
These and other objectives of the present disclosure will become obvious to those of ordinary skill in the art after reading the following detailed description of the alternative embodiments that are illustrated in the various figures and drawings.
These and other objectives of the present disclosure will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
The foregoing aspects and many of the attendant advantages of this application will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
The photo-detecting apparatus 100a includes a control metal line 106a and a readout metal line 108a. The control metal line 106a and the readout metal line 108a are both electrically coupled to the surface 102s of the germanium-based light absorption material 102. In this embodiment, the control metal line 106a is electrically coupled to an un-doped region 105a on the surface 102s, where the un-doped region 105a has no dopants. The readout metal line 108a is electrically coupled to a doped region 101a on the surface 102s, where the doped region 101a has dopants.
It is noted that the germanium-based light absorption material 102 can be formed as intrinsic or extrinsic (e.g., lightly P-type or lightly N-type). Due to the defect characteristics of the germanium material, even if there is no additional doping process introduced, the germanium-based light absorption material 102 may still be lightly P-type. Thus, the un-doped region 105a may also be lightly P-type. The doped region 101a may be doped with P-type dopants or N-type dopants, depending on the type of photo-carries (i.e. holes or electrons) to be collected. In some implementations, the doped region 101a could be doped by thermal-diffusion, ion-implantation, or any other doping process.
The control metal line 106a is controlled by a control signal cs1 for controlling the moving direction of the electrons or holes generated by the absorbed photons. Assume that the doped region 101a is N-type and the control signal cs1 is at logic 1. An electric field is generated from the control metal line 106a to the germanium-based light absorption material 102. The electrons will move toward the control metal line 106a and be collected by the doped region 101a. On the contrary, if the doped region 101a is P-type, the holes will be collected instead. Alternatively, assume that the doped region 101a is N-type when the control signal cs1 is at logic 0, a different electric field is generated from the control metal line 106a to the germanium-based light absorption material 102. The electrons will not move toward the control metal line 106a and so cannot be collected by the doped region 101a. On the contrary, if the doped region 101a is P-type, the holes will not be collected instead.
Using the structure illustrated in
The embodiments of
The control metal lines 106a, 106b are respectively controlled by the control signals cs1, cs2 for controlling the moving direction of the electrons or holes generated by the absorbed photons. In some implementations, the control signals cs1 and cs2 are differential voltage signals. In some implementations, one of the control signals cs1 and cs2 is a constant voltage signal (e.g., 0.5v) and the other control signal is a time-varying voltage signal (e.g., sinusoid signal, clock signal or pulse signal operated between 0V and 1V).
Assume that the doped regions 101a, 101b are N-type and the control signals cs1, cs2 are clock signals with 180-degree phase different to each other. When the control signal cs1 is at logic 1 and the control signal cs2 is at logic 0, the photo-detecting apparatus 100b generates an electric field from the control metal line 106a to the germanium-based light absorption material 102, and the electrons will move toward the control metal line 106a and then be collected by the doped regions 101a. Similarly, when the control signal cs1 is at logic 0 and the control signal cs2 is at logic 1, the photo-detecting apparatus 100b generates an electric field from the control metal line 106b to the germanium-based light absorption material 102, and the electrons will move toward the control metal line 106b and then be collected by the doped region 101b. On the contrary, if the doped regions 101a and 101b are P-type, the holes will be collected instead.
In accordance with this two-tap structure, the optical signal IL reflected from a target object (not shown in
The control metal line 106a in
The operation of photo-detecting apparatus 100c is similar to the embodiment of
The operation of photo-detecting apparatus 100d is similar to the embodiment of
In some implementations, as the embodiments illustrated in
As the embodiments illustrated in
The photo-detecting apparatuses illustrated in the present disclosure can be used in time-of-flight (ToF) applications, which may operate at longer wavelengths (e.g., NIR or SWIR range) compared to visible wavelengths. The wavelength could be more than 800 nm, such as 850 nm, 940 nm, 1050 nm, 1064 nm, 1310 nm, 1350 nm, or 1550 nm. On the other hand, the device/material implementer can design/fabricate a 100% germanium or an alloy (e.g., GeSi) with a predetermined percentage (e.g., more than 80% Ge) of germanium, either intrinsic or extrinsic, as a light absorption material to absorb the light at the aforementioned wavelengths.
Although the embodiments herein illustrate that the photo-detecting apparatus absorbs the optical signal IL from a back side, however, in some implementations, the photo-detecting apparatus can be designed to absorb the optical signal IL from a front side, e.g., by creating an optical window WD between the two control metal lines 106a, 106b.
The embodiments illustrated in
In some embodiments, to fully deplete the body of the N-type germanium-based light absorption material 202, one can design through the N-type regions 201a, 201b and/or P-type regions 203a, 203b, either through its depths, widths or doping concentrations. Also, the thickness of the germanium-based light absorption material 202 should be designed accordingly.
In order to create even larger depletion regions inside the germanium-based light absorption material 202, the embodiment shown in
In some alternative embodiments, the dielectric layer 312 may not necessarily be continuous layer across the whole semiconductor substrate 304 but can be patterned into different regions located underneath N-type region 307. The dielectric layer 312 may be thin or with some predetermined thickness, including multiple kinds or layers of materials or alloy or compounds. For example, SiO2, SiNx, high-K dielectric material or a combination of thereof.
Either in
Further to the embodiments illustrated in
The embodiments illustrated in
In accordance with this embodiment, forming the passivation layer 514 over the germanium-based light absorption material 502 can terminate the dangling bonds on the surface 502s and so reduce the dark currents. On the other hand, adding the silicide (e.g., NiSi2, CoSi2) can also reduce the contact or junction resistance between the metal and semiconductor, which reduces the voltage drop and reduces power consumption accordingly.
The depletion region 712d can reduce the dark current between the P-type region 703a and the P-type region 703b. The depletion region 716ad can reduce the dark current between the P-type region 703a and the N-type region 701a. The depletion region 716bd can reduce the dark current between the P-type region 703b and the N-type region 701b. The depletion region 718a can reduce the dark current between N-type region 701a and another pixel (Not shown in
As mentioned, the metals 721, 716a, 716b, 718a, 718b can be biased to generate the depletion regions 721d, 716ad, 716bd, 718ad, and 718bd. In other applications, the metals 721, 716a, 716b, 718a, 718b can be biased to make the corresponding regions 721d, 716ad, 716bd, 718ad, 718bd into accumulation or inversion, other than depletion.
In addition to the leakage reduction, the metals 721, 716a, 716b, 718a, 718b can reflect the residual optical signal IL into the germanium-based light absorption material 702 so as to be converted into electron-hole pairs accordingly. These metals 721, 716a, 716b, 718a, 718b serve like a mirror reflecting the light not being completely absorbed and converted by the germanium-based light absorption material 702 back to the germanium-based light absorption material 702 for absorption again. This would increase the overall absorption efficiency and therefore increase the system performance.
Furthermore, an alternative embodiment of the present disclosure is illustrated in
In addition to detecting the distance, this photo-detecting apparatus 1000a includes a different depth design for N-type regions 1001a, 1001b and P-type regions 1003a, 1003b, and also adds N-well 1011a, 1011b, which may reduce the leakage current between the P-type region 1003a and the P-type region 1003b. Second, the photo-detecting apparatus 1000a includes a well-shape P-type region 1019 covering the germanium-based light absorption material 1002, which may collect and discharge the holes through the bias voltage ca2. Third, the photo-detecting apparatus 1000a includes the passivation layer 1014 and inter-layer dielectric ILD to process the surface 1002s to the defects existing on the surface 1002s. Fourth, the photo-detecting apparatus 1000a includes the metal 1021, which may or may not be biased to generate the accumulation, inversion, or depletion on the surface 1002s. Moreover, the metal 1021 can be used as a mirror to reflect the residual optical signal IL back into the germanium-based light absorption material 1002 to be converted to electron-hole pairs. Fifth, the photo-detecting apparatus 1000a adds silicides 1013a, 1013b, 1015a, 1015b to reduce the voltage drop. Sixth, the photo-detecting apparatus 1000a can add the isolation region 1024, either implemented by doping materials or insulating oxides. The isolation region 1024 may be electrically coupled to a bias voltage ca3. In some implementations, the isolation region 1024 and the P-type region 1019 may be electrically coupled together by a metal layer, and the metal layer is left floated or being electrically coupled to a voltage source.
Furthermore, although the above-mentioned embodiments use a germanium-based light absorption material 1002 to absorb the optical signal IL, one embodiment without germanium-based light absorption material 1002 may be implemented. As shown in
The photo-detecting apparatuses 1000a, 1000b, 1000c and 1000d are illustrated to show the possible combinations from embodiments (
It is noted that the doping concentrations for the doped regions shown in the embodiments can be properly designed. Take the embodiment of
On the other hands, the doping type for those doped regions can also be implemented in different ways. Take the embodiment of
Please refer to
The photo-detecting apparatuses described above use a single photodetector as an embodiment, which is for single-pixel applications. The photo-detecting apparatuses described below are the embodiments for multiple-pixel applications (e.g., image pixel array or image sensor).
In some implementations, the photo-detecting apparatus can be designed to receive the same or different optical signals, e.g., with the same or different wavelengths, with the same or multiple modulations, or being operated at different time frames.
Please refer to
In an alternative embodiment, optical wavelengths λ1 and λ2 are respectively modulated by fmod1 and fmod2, and then collected by pixel array 1200a. At time t1, the pixel array 1200a is operated at fmod1 to demodulate the optical signal in λ1; while at time t2, the pixel array 1200a is operated at fmod2 to demodulate the optical signal in λ2. In an alternative embodiment, an optical signal IL with optical wavelength λ1 and λ2 is modulated by fmod1 and fmod2, respectively, and the pixels 12021, 12024 are driven by fmod1 while the pixels 12022, 12023 are driven by fm0d2 to demodulate the incoming modulated optical signal IL simultaneously. Those of skills in the art will readily recognize that other combinations of optical wavelength, modulation scheme and time division may be implemented.
Please refer to
Please refer to
Please refer to
Please refer to
Although the embodiments illustrated in
In the embodiment of
In some embodiments, a pixel isolation region, pixel isolation region 924 described with reference to
As depicted in
Similarly, a Ψ2 light signal is incident on absorbing region 218, where the generated photocurrent will be collected by the N+ terminals 225, 235 and 205, 215. In some embodiments, the photo-generated electrons from the absorption region 218 are primarily collected by the N+ terminals 225, 235, and secondarily collected by the N+ terminals 205, 215.
In some embodiments, the N+ terminals 215, 225 are biased to provide a depletion region, thereby reducing a number of photo-generated electrons generated in the absorption region 208 due to the Ψ1 light signal that are collected by the N+ terminals 225, 235.
In some embodiments, the system described above with reference to
Additionally, a floating p doping region may be implanted to inhibit n-to-n type crosstalk, as described above with reference to
Similarly, as described above with reference to
In some embodiments, the detection region 1613 is between the two second conductive contacts 1632a,1632b. The two second conductive contacts 1632a,1632b are nearer to the detection region 1613 than the first conductive contacts 1631a, 1631b. In some embodiments, the two detection regions 1613 of the two subpixels 1600a, 1600b are in the same absorption region 1610. The first conductive contacts 1631a,1631b and the second conductive contact 1632a, 1632b are formed on the same absorption region 1610.
In some embodiments, the pixel 1600 includes multiple readout circuits and multiple control signals. For example, the pixel 1600 may include four readout circuits and four control signals. For example, the pixel 1600 includes two first readout circuits 1671a and two second readout circuits 1671b. The pixel 1600 includes two first control signal 1672a, and two second control signal 1672b. A group of the first control signal 1672a and the second control signal 1672b is electrically coupled to the two switches and for controlling the two switches in a single subpixel. A group of the first readout circuit 1671a and the second readout circuit 1671b is electrically coupled to the two switches and for processing the collected charges. In other words, the first control signal 1672a and the second control signal 1672b control the electrons or the holes generated by the absorbed photons in the detection region 1613 to be processed by the first readout circuit 1671a or the second readout circuit 1671b in a single subpixel 1600a or 1600b. In some embodiments, the first control signal 1672a may be fixed at a voltage value Vi, and the second control signal 1672b may alternate between voltage values Vi±ΔV. In some embodiments, the first control signal 1672a and the second control signal 1672b may be voltages that are differential to each other. In some embodiments, one of the control signals is a constant voltage signal (e.g., 0.5 v) and the other control signal is a time-varying voltage signal (e.g., sinusoid signal, clock signal or pulse signal operated between 0V and 1V). The direction of the bias value determines the drift direction of the charges generated from the absorption region 1610.
The two first readout circuits 1671a are electrically coupled to the two first conductive contacts 1631a of the subpixels 1600a, 1600b in a one-to-one correlation. The two second readout circuits 1671b are electrically coupled to the two first conductive contacts 1631b of the subpixels 1600a, 1600b in a one-to-one correlation. The first conductive contacts 1631a, 1631b may be readout contacts. The two first control signals 1672a are electrically coupled to the two second conductive contacts 1632a of the subpixels 1600a, 1600b in a one-to-one correlation. The two second control signals 1672b are electrically coupled to the two second conductive contacts 1632b of the subpixels 1600a, 1600b in a one-to-one correlation. The second conductive contacts 1632a, 1632b may be control contacts.
In some embodiments, the portions of the absorption region 1610 right under the second conductive contacts 1632a, 1632b may be intrinsic or include a dopant having a peak concentration below approximately 1×1015 cm−3. The term “intrinsic” means that the portions of the semiconductor material right under the second conductive contacts 1632a, 1632b are without intentionally added dopants. In some embodiments, the second conductive contacts 1632a, 1632b on the absorption region 1610 may lead to formation of a Schottky contact, an Ohmic contact, or a combination thereof having an intermediate characteristic between the two, depending on various factors including the material of the absorption region 1610, the second conductive contacts 1632a, 1632b, and the impurity or defect level of the absorption region 1610.
The first control signal 1672a and the second control signal 1672b are used to control the collection of electrons generated by the absorbed photons from the detection region 1613. For example, when voltages are used, if the first control signal 1672a is biased against the second control signal 1672b, an electric field is created between the two portions right under the second conductive contacts 1632a, 1632b, and free charges drift towards one of the two portions right under the second conductive contacts 1632a, 1632b depending on the direction of the electric field.
In some embodiments, each of the switches of the subpixels 1600a, 1600b includes two first doped regions 1611a,1611b under the first conductive contacts 1631a, 1631b respectively and formed in the same absorption region 1610. In other words, the four first doped regions 1611a,1611b of the two subpixels 1600a, 1600b are formed in the same absorption region 1610. In some embodiments, a minimum width w1 between the first conductive contacts of the two adjacent subpixels is less than a width of the absorption region 1610. For example, a minimum width between the first conductive contact 1631a of the subpixel 1600a and the first conductive contact 1631b of the subpixel 1600b is less than a width of the absorption region 1610.
In some embodiments, the first doped region 1611a,1611b are of a first conductivity type. In some embodiments, the first doped region 1611a,1611b include a dopant. The peak concentrations of the dopants of the first doped regions 1611a,1611b depend on the material of the first conductive contact 1631a, 1631b and the material of the absorption region 1610, for example, between 5×1018 cm−3 to 5×1020 cm−3. The first doped regions 1611a, 1611b are for collecting the carriers generated from the absorption region 1610, which are further processed by the first readout circuit 1671a and the second readout circuit 1671b respectively based on the control of the first control signal 1672a and the second control signal 1672b.
In the present disclosure, in a same photo-detecting apparatus, the type of the carriers collected by the first doped region 1611a and the type of the carriers collected by the first doped regions 1611b are the same. For example, when the photo-detecting apparatus is configured to collects electrons, when the first switch of a single subpixel is switched on and the second switch of the same subpixel is switched off, the first doped region 1611a collects electrons of the photo-carriers generated from the detection region 1613, and when the second switch is switched on and the first switch is switched off, the first doped region 1611b also collects electrons of the photo-carriers generated from the detection region 1613.
In some embodiments, the photo-detecting apparatus may include a light shield 1660 having multiple windows 1661 for defining the position of the detection region 1613 of each of the subpixels 1600a, 1600b. In other words, the window 1661 is for allowing the incident optical signal enter into the absorption region 1610 and defining the detection regions 1613. In some embodiments, the light shield is on a bottom surface of the substrate 1620 distant from the absorption region 1610 when an incident light enters the absorption region 1610 from the bottom surface of the substrate 1620. In some embodiments, a shape of the window 1661 can be ellipse, circle, rectangular, square, rhombus, octagon or any other suitable shape from a top view of the window 1661.
In some embodiments, the photo-detecting apparatus further includes multiple optical elements (not shown) over the multiple subpixels in a one-to-one correlation. The optical element converges an incoming optical signal to enter the detection regions 1613.
In some embodiments, since multiple subpixels 1600a, 1600b are integrated with a single absorption region 1610, the photo-detecting apparatus is downsized and the dark current from the generation current occurring at the interface of the substrate 1620 and the absorption region 1610 is reduced. Furthermore, the spatial resolution of the photo-detecting apparatus is improved and the size of a single photo-detecting apparatus unit 1600 is reduced.
In some embodiments, the pixel 1600 further includes a blocking layer 1640 surrounding the absorption region 1610, that is, the detection regions 1613 of the subpixels 1600a,1600b are surrounded by the same blocking layer 1640. In some embodiments, the blocking layer 1640 is of a conductivity type different from the first conductivity type of each of the first doped regions 1611a,1611b. The blocking layer 1640 may block photo-generated charges in the absorption region 1610 from reaching the substrate 1620, which increases the collection efficiency of photo-generated carriers of the subpixels 1600a,1600b. The blocking layer 1640 may also block photo-generated charges in the substrate 1620 from reaching the absorption region 1610, which increases the speed of photo-generated carriers of the subpixels. The blocking layer 1640 may include a material the same as the material of the absorption region 1610, the same as the material of the substrate 1620, or different from the material of the absorption region 1610 and the material of the substrate 1620. In some embodiments, the shape of the blocking layer 1640 can be, but is not limited to a ring.
In some embodiments, the blocking layer 1640 includes a dopant having a peak concentration ranging from 1015 cm−3 to 1020 cm−3. The blocking layer 1640 may reduce the cross talk between two adjacent pixels 1600.
In some embodiments, photo-detecting apparatus may further include a third conductive contact (not shown) electrically connected to the blocking layer 1640. The blocking layer 1640 may be biased through the third conductive contact by a bias voltage to discharge carriers not collected by the first doped regions 1611a,1611b of the subpixels 1600a,1600b.
In some embodiments, the photo-detecting apparatus further includes an isolation region 1650 disposed at two opposite sides of the absorption region 1610 from a cross-sectional view of the photo-detecting apparatus. The isolation region 1650 is outside of the absorption region 1610 and physically separated from the absorption region 1610. In some embodiments, the detection regions 1613 of the subpixels 1600a,1600b are surrounded by the same isolation region 1650. In some embodiments, a minimum width w1 between the first conductive contacts of the two adjacent subpixels is less than a width of the isolation region 1650. For example, a minimum width between the first conductive contact 1631a of the subpixel 1600a and the first conductive contact 1631b of the subpixel 1600b is less than a width w2 of the isolation region 1650. In some embodiments, the isolation region 1650 is a trench filled with a dielectric material or an insulating material to serve as a region of electrical resistance between the two adjacent pixels, impeding a flow of current across the isolation region 1650 and improving electrical isolation between the adjacent pixels 1600. The dielectric material or an insulating material may include, but is not limited to oxide material including SiO2 or nitride material including Si3N4. In some embodiments, the trench is filled with Si.
In some embodiments, the isolation region 1650 extends from an upper surface 1621 of the substrate 1620 and extends into a predetermined depth from the upper surface 1621. In some embodiments, the isolation region 1650 extends from a bottom surface 1622 of the substrate 1620 and extends into a predetermined depth from the bottom surface 1622. In some embodiments, the isolation region 1650 penetrates though the substrate 1620 from the upper surface 1621 and the bottom surface 1622.
In some embodiments, the isolation region 1650 is a doped region having a conductivity type. The conductivity type of the isolation region 1650 can be different from or the same as the first conductivity type of the first doped regions 1611a, 1611b. The peak concentration of the isolation region 1650 may range from 1015 cm−3 to 1020 cm−3.
The doping of the isolation region 1650 may create a bandgap offset-induced potential energy barrier that impedes a flow of current across the isolation region 1650 and improving electrical isolation between the adjacent pixels 1600. In some embodiments, the isolation region 1650 includes a semiconductor material that is different from the material of the substrate 1620. An interface between two different semiconductor materials formed between the substrate 1620 and the isolation region 1650 may create a bandgap offset-induced energy barrier that impedes a flow of current across the isolation region 1650 and improving electrical isolation between the adjacent pixels 1600. In some embodiments, the shape of the isolation region 1650 may be a ring. In some embodiments, the isolation region 1650 may include two discrete regions disposed at the at two opposite sides of the absorption region 1610.
In some embodiments, the photo-detecting apparatus includes both the blocking layer 1640 in
In some embodiments, each of the switches of the subpixels 1600a, 1600b includes two second doped regions 1612a,1612b under the second conductive contacts 1632a,1632b respectively and formed in the same absorption region 1610. In other words, the four second doped regions 1612a,1612b of the two subpixels 1600a, 1600b are formed in the same absorption region 1610.
In some embodiments, the second doped regions 1612a,1612b are of a second conductivity type different from the first conductivity type. In some embodiments, each of the second doped regions 1612a,1612b is doped with a dopant. The peak concentrations of the dopants of the second doped regions 1612a,1612b depend on the material of the second conductive contact 1632a, 1632b and the material of the absorption region 1610, for example, between 1×1017 cm−3 to 5×1020 cm−3. The second doped regions 1612a,1612b forms a Schottky or an Ohmic contact with the second conductive contacts 1632a,1632b. The second doped regions 1612a,1612b are for modulating the carriers generated from the absorption region 1610 based on the control of the first control signal 1672a and the second control signal 1672b.
In some embodiments, the photo-detecting apparatus includes both the blocking layer 1640 in
In some embodiments, each of the subpixel may further include a first dielectric layer 1633a between the absorption region 1610 and the second conductive contacts 1632a of the two subpixels 1600a, 1600b. Each of the subpixel may further include a second dielectric layer 1633b between the absorption region 1610 and the second conductive contacts 1632b f the two subpixels 1600a, 1600b.
The first dielectric layer 1633a prevents direct current conduction from the second conductive contacts 1632a to the absorption region 1610, but allows an electric field to be established within the absorption region 1610 in response to an application of a voltage to the second conductive contacts 1632a. The second dielectric layer 1633b prevents direct current conduction from the second conductive contacts 1632b to the absorption region 1610 but allows an electric field to be established within the absorption region 1610 in response to an application of a voltage to the second conductive contacts 1632b. The established electric field may attract or repel charge carriers within the absorption region 1610.
The first conductivity type of each of the first doped regions 1611a, 1611b and the second conductivity type of each of the second doped regions 1612a, 1612b are the same.
In some embodiment, the second conductive contact 1632a is between the first doped region 1611a and the second doped region 1612a of a switch in a single subpixel. In some embodiments, the second conductive contact 1632b is between the first doped region 1611b and the second doped region 1612b of another switch in a single subpixel.
In some embodiments, when the second conductive contact 1632a is Schottky contacting to the absorption region 1610, the first doped region 1611a, the second doped region 1612a and the second conductive contact 1632a are referred as a first MESFET (metal semiconductor field effect transistor). In some embodiments, when the second conductive contact 1632b is Schottky contacting to the absorption region 1610, the first doped region 1611b, the second doped region 1612b and the second conductive contact 1632b are referred as a second MESFET (metal semiconductor field effect transistor).
The first conductivity type of each of the first doped regions 1611a, 1611b and the second conductivity type of each of the second doped regions 1612a, 1612b are the same.
In some embodiments, the first dielectric layer 1633a is between the absorption region 1610 and the second conductive contact 1632a. The second dielectric layer 1633b is between the absorption region 1610 and the second conductive contact 1632b.
The first dielectric layer 1633a and the second dielectric layer 1633b prevent direct current conduction from the second conductive contact 1632a to the absorption region 1610 and from the second conductive contact 1632b to the absorption region 1610 respectively, but allows an electric field to be established within the absorption region 1610 in response to an application of a voltage to the second conductive contact 1632a and the second conductive contact 1632b respectively. The established electric field attracts or repels charge carriers within the absorption region 1610. In some embodiments, the second conductive contact 1632a, the first dielectric layer 1633a, the first doped region 1611a, and the second doped region 1612a are referred to as a first MOSFET (metal oxide semiconductor field-effect transistor). In some embodiments, the second conductive contact 1632b, the second dielectric layer 1633b, the first doped region 1611b, and the second doped region 1612b are referred to as a second MOSFET. In some embodiments, the first MOSFET and the second MOSFET can be enhancement mode. In some embodiments, the first MOSFET and the second MOSFET can be depletion mode.
In some embodiments, each of the subpixel 1600a, 1600b further includes two counter-doped regions 1613a, 1613b. Each of the counter-doped regions 1613a, 1613b has a conductivity type different from the first conductivity type of the first doped region 1611a, 1611b. For example, if the photo-detecting apparatus is configured to process the collected electrons for further application, the first doped region 1611a, 1611b are of n-type, the second doped regions 1612a,1612b are of p-type, and the counter-doped regions 1613a, 1613b are of p-type. In some embodiments, the counter-doped regions 1613a, 1613b surround or overlapped with a portion of the first doped region 1611a, 1611b father from the second doped region 1612a,1612b respectively, and the other portion of the first doped region 1611a, 1611b is not surrounded or not overlapped with the counter-doped region 1613a, 1613b. In some embodiments, the first doped region 1611a, 1611b are entirely overlapped with or surrounded by the counter-doped region 1613a, 1613b respectively. In some embodiments, the counter-doped regions 1613a, 1613b serve as dark-current reduction regions for reducing the dark current of the subpixels 1600a, 1600b. Compared to a photo-detecting apparatus devoid of counter-doped region 1613a, 1613b overlapped with the first doped region 1611a, 1611b respectively, the photo-detecting apparatus including counter-doped region 1613a, 1613b overlapped with the first doped region 1611a, 1611b has a thinner depletion, which reduces the dark current of the photo-detecting apparatus.
In some embodiments, the counter-doped regions 1613a, 1613b may reduce the crosstalk between the two subpixels 1600a, 1600b. For example, the counter-doped region 1613b of the subpixel 1600a, which is nearer to the subpixel 1600b than the counter-doped region 1613a of the subpixel 1600a, and the counter-doped region 1613a of the subpixel 1600b, which is nearer to the subpixel 1600a than the counter-doped region 1613b of the subpixel 1600b, may enhance the resistance between the first doped regions 1611b of the subpixel 1600a and the first doped regions 1611a of the subpixel 1600b, which reduces the crosstalk between the two subpixels 1600a, 1600b.
In some embodiments, each of the counter-doped regions 1613a, 1613b is doped with a dopant having a peak concentration. The peak concentration is not less than 1×1016 cm−3. In some embodiment, the peak concentrations of the dopants of the counter-doped regions 1613a, 1613b are lower than the peak concentrations of the dopants of the first doped regions 331. In some embodiments, the peak concentration of the dopants of the counter-doped regions 1613a, 1613b is between 1×1016 cm−3 and 1×1018 cm−3.
In some embodiments, the pixel further includes a third doped region 1614 in the absorption region 1610 and between two adjacent subpixels 1600a,1600b, and the third doped region 1614 is physically separated from the first doped region 1611b of the subpixel 1600a and the first doped region 1611a of the subpixel 1600b. The third doped region 1614 has a conductivity type different from the first conductivity type of each of the first doped regions 1611a,1611b. In some embodiments, the third doped region 1614 include a dopant having a peak concentration. The peak concentration is not less than 1×1016 cm−3. In some embodiment, the peak concentrations of the dopants of the third doped region 1614 is lower than the peak concentrations of the dopants of the first doped regions 331. In some embodiments, the peak concentration of the dopants of the third doped region 1614 is between 1×1018 cm−3 and 5×1020 cm−3.
In some embodiments, the third doped region 1614 may reduce the crosstalk between the two subpixels 1600a, 1600b.
In some embodiments, the photo-detecting apparatus may include both the third doped region 1614 and the counter-doped regions 1613a, 1613b as described in
In some embodiments, the pixel 1600 includes two common readout circuits and two common control signals. For example, the pixel 1600 includes a first common readout circuit 1673a, a second common readout circuits 1673b, a first common control signal 1674a, and a second common control signal 1674b. The first common readout circuit 1673a is electrically coupled to both of the first conductive contact 1631a of the subpixel 1600a and the first conductive contact 1631b of the subpixel 1600b. As a result, the charges collected by the first doped region 1611a of the subpixel 1600a and the first doped region 1611b of the subpixel 1600b can be processed by the same first common readout circuit 1673a. The second common readout circuit 1673b is electrically coupled to both of the first conductive contact 1631b of the subpixel 1600a and the first conductive contact 1631a of the subpixel 1600b. As a result, the charges collected by the first doped region 1611b of the subpixel 1600a and the first doped region 1611a of the subpixel 1600b can be processed by the same second common readout circuits 1673b.
The first common control signal 1674a is electrically coupled to both of the second conductive contact 1632a of the subpixel 1600a and the second conductive contact 1632b of the subpixel 1600b. As a result, the first switch of the subpixel 1600a and the second switch of the subpixel 1600b can be controlled simultaneously by the same first common control signal 1674a. The second common control signal 1674b is electrically coupled to both of the second conductive contact 1632b of the subpixel 1600a and the second conductive contact 1632a of the subpixel 1600b. As a result, the second switch of the subpixel 1600a and the first switch of the subpixel 1600b can be controlled simultaneously by the same second common control signal 1674b.
The first common control signal 1674a may be fixed at a voltage value Vi, and the second common control signal 1674b may alternate between voltage values Vi±ΔV. In some embodiments, the first common control signal 1674a and the second common control signal 1674b may be voltages that are differential to each other. In some embodiments, one of the control signals is a constant voltage signal (e.g., 0.5v) and the other control signal is a time-varying voltage signal (e.g., sinusoid signal, clock signal or pulse signal operated between 0V and 1V).
In some embodiments, the pixel 1600 includes a common control signal 1674 electrically coupled to both of the second conductive contact 1632b of the subpixel 1600a and the second conductive contact 1632a of the subpixel 1600b. As a result, the second switch of the subpixel 1600a and the first switch of the subpixel 1600b can be controlled simultaneously by the same second common control signal 1674a. The first switch of the subpixel 1600a is independently controlled by the first control signal 1672a. The second switch of the subpixel 1600b is independently controlled by the first control signal 1672b.
In some embodiments, the first conductive contacts 1631a,1631b, the second conductive contacts 1632a,1632b are formed on the upper surface of the substrate 1620. The first doped regions 1611a, 1611b and the second doped regions 1612a,1612b are formed in the substrate 1620. Each of the subpixel 1600a, 1600b includes an absorption region 1610 separated from each other. The detection regions 1613 defined by the windows 1661 corresponds to the absorption regions 1610 respectively. In some embodiments, a minimum width w1 between the first conductive contacts of the two adjacent subpixels is less than a width of the isolation region 1650. For example, a minimum width w1 between the first conductive contact 1631a of the subpixel 1600a and the first conductive contact 1631b of the subpixel 1600b is less than a width w2 of the isolation region 1650.
The photo-detecting apparatus in
The photo-detecting apparatus is with lower dark current since the two switches of each of the subpixels are formed outside of the absorption region 1610.
The first conductive contacts 1631a of the subpixels 1600a,1600b, 1600c and 1600d are electrically coupled to a first common readout circuit, as described in
In some embodiments, one of the subpixels may further include a fourth doped region 1615 between the two second doped regions 1612a,1612b. The fourth doped region 1615 has a conductivity type different from the conductivity type of the blocking layer 1640. The fourth doped region 1615 and the blocking layer 1640 can be a PN-junction and thus a vertical electrical field is established between the fourth doped region 1615 and the blocking layer 1640. The holes and the electrons of the photo-carriers generated from the absorption region 1610 can be separated by the vertical electrical field between the fourth doped region 1615 and the blocking layer 1640, and the carriers to be collected can be gathered toward the fourth doped region 1615, and then move toward the first doped region 1611a or the first doped region 1611b based on the control of the first common control signal or the second common control signal. As a result, the photo-detecting apparatus is with improved demodulation contrast.
In some embodiments, the pixel 1700 includes two readout circuits and two control signals. For example, the pixel 1700 includes a first readout circuit 1771a and a second readout circuit 1771b. The pixel 1700 includes a first control signal 1772a, and a second control signal 1772b. The first control signal 1772a and the second control signal 1772b are electrically coupled to the two control regions 1791 of the two switches 1790 and for controlling the two switches in the pixel. The first readout circuit 1771a and the second readout circuit 1771b are electrically coupled to the readout regions 1792 of the two switches and for processing the collected charges. In other words, the first control signal 1772a and the second control signal 1772b control the electrons or the holes generated by the absorbed photons in the detection region 1713 to be processed by the first readout circuit 1771a or the second readout circuit 1771b in the pixel 1700. In some embodiments, the first control signal 1772a may be fixed at a voltage value Vi, and the second control signal 1772b may alternate between voltage values Vi±ΔV. In some embodiments, the first control signal 1772a and the second control signal 1772b may be voltages that are differential to each other. In some embodiments, one of the control signals is a constant voltage signal (e.g., 0.5v) and the other control signal is a time-varying voltage signal (e.g., sinusoid signal, clock signal or pulse signal operated between 0V and 1V). The direction of the bias value determines the drift direction of the charges generated from the absorption region 1710.
In some embodiments, the detection region 1713 is between the second conductive contacts 1732a,1732b. The two second conductive contacts 1732a,1732b are nearer to the detection region 1713 than the first conductive contacts 1731a,1731b. The first conductive contacts 1731a,1731b and the second conductive contact 1732a, 1732b are formed on the same absorption region 1710.
The first readout circuit 1771a is electrically coupled to the first conductive contact 1731a of the pixel 1700 in a one-to-one correlation. The second readout circuit 1771b is electrically coupled to the first conductive contact 1731b of the pixel 1700 in a one-to-one correlation. The first conductive contact 1731a, 1731b may function as readout contacts. The first control signal 1772a is electrically coupled to the second conductive contact 1732a of the pixel 1700 in a one-to-one correlation. The second control signal 1772b is electrically coupled to the second conductive contact 1732b of the pixels 1700 in a one-to-one correlation. The second conductive contacts 1732a, 1732b may function as control contacts.
In some embodiments, the portions of the absorption region 1710 right under the second conductive contacts 1732a, 1732b may be intrinsic or include a dopant having a peak concentration below approximately 1×1015 cm−3. The term “intrinsic” means that the portions of the semiconductor material right under the second conductive contacts 1732a, 1732b are without intentionally added dopants. In some embodiments, the second conductive contacts 1732a, 1732b on the absorption region 1710 may lead to formation of a Schottky contact, an Ohmic contact, or a combination thereof having an intermediate characteristic between the two, depending on various factors including the material of the absorption region 1710, the second conductive contacts 1732a, 1732b, and the impurity or defect level of the absorption region 1710.
The first control signal 1772a and the second control signal 1772b are used to control the collection of electrons generated by the absorbed photons from the detection region 1713. For example, when voltages are used, if the first control signal 1772a is biased against the second control signal 1772b, an electric field is created between the two portions right under the second conductive contacts 1732a, 1732b, and free charges drift towards one of the two portions right under the second conductive contacts 1732a, 1732b depending on the direction of the electric field.
In some embodiments, the photo-detecting apparatus may include a light shield (not shown) having multiple windows (not shown) for defining the position of the detection region 1713 of each of the pixel 1700. In other words, the window is for allowing the incident optical signal enter into the absorption region 1710 and defining the detection region 1713. In some embodiments, the light shield is on a bottom surface of the substrate 1720 distant from the absorption region 1710 when an incident light enters the absorption region 1710 from the bottom surface of the substrate 1720. In some embodiments, a shape of the window can be ellipse, circle, rectangular, square, rhombus, octagon or any other suitable shape from a top view of the window.
In some embodiments, the photo-detecting apparatus further includes multiple optical elements (not shown) over the multiple pixels in a one-to-one correlation. The optical element converges an incoming optical signal to enter the detection regions 1713.
In this embodiment, the conductive contact 1731a and the conductive contact 1732a are similar to the first conductive contacts 1631a and the second conductive contact 1632a mentioned in
In some embodiments, the pixel 1700 further includes an first well region 1765 and a second well region 1766 in the substrate 1720 and disposed beside the absorption region 1710. The first well region 1765 is of a conductivity type different from a conductivity type of the second well region 1766. A conductive contact 1767 is formed and disposed on the first well region 1765 and electrically connected to the first well region 1765, a conductive contact 1768 is formed and disposed on the second well region 1766 and electrically connected to the second well region 1766. In addition, the conductive contact 1767 and the conductive contact 1768 are electrically connected to each other (that means the first well region 1765 and the second well region 1766 are electrically connected to each other too). In some implementations, the doping level of the first well region 1765 may range from 1016 cm−3 to 1020 cm−3. The doping level of the second well region 1766 may range from 1016 cm−3 to 1020 cm−3.
In some implementation, the absorption region 1710 may not completely absorb the incoming photons in the optical signal. For example, if the absorption region 1710 does not completely absorb the incoming photons in the NIR optical signal (not shown), the NIR optical signal may penetrate into the substrate 1720, where the substrate 1720 may absorb the penetrated photons and generate photo-carriers deeply in the substrate 1720 that are slow to recombine. These slow photo-carriers negatively affect the operation speed of the photo-detecting apparatus.
To further remove the slow photo-carriers, the pixel 1700 may include connections that short the first well region 1765 with the second well region 1766. For example, the connections may be formed by a silicide process or a deposited metal pad, such as the conductive contact 1767 and the conductive contact 1768, that connects the first well region 1765 with the second well region 1766. The shorting between the first well region 1765 and the second well region 1766 allows the photo-carriers generated in the substrate 1720 to be recombined at the shorted node, and therefore improves the operation speed of the pixel.
In this embodiment, the structure in which an first well region 1765 and a second well region 1766 are connected together can be simply referred to as a “shorting structure” 1760, in the subsequent embodiments, if the “shorting structure” is mentioned, it means that such a structure exists (at least including one first well region and one second well region with different conductivity types that are electrically connected to each other).
Besides, in this embodiment, only one shorting structure 1760 is disclosed, but in other embodiments, the pixel may include two or more shorting structures disposed on two sides of the absorption region 1710 respectively. The two shorting structures 1760 can be arranged along the long axis symmetry of the absorption region 1710, or the two shorting structures 1760 can be arranged along the short axis symmetry of the absorption region 1710, it should also be within the scope of the present disclosure.
In some embodiments, the photo-detecting apparatus further includes an isolation region 1725 disposed at two opposite sides of the absorption region 1710 from a cross-sectional view of the photo-detecting apparatus. The isolation region 1725 is outside of the absorption region 1710 and physically separated from the absorption region 1710. In some embodiments, the shorting structure 1760 is between the isolation region 1725 and the absorption region 1710. In some embodiments, the isolation region 1725 is a trench filled with a dielectric material or an insulating material to serve as a region of high electrical resistance between the two adjacent pixels, impeding a flow of current across the isolation region 1725 and improving electrical isolation between the pixel 1700 and other adjacent pixels (not shown). The dielectric material or an insulating material may include, but is not limited to oxide material including SiO2 or nitride material including Si3N4. In some embodiments, the trench is filled with Si.
In some embodiments, the isolation region 1725 extends from an upper surface of the substrate 1720 and extends into a predetermined depth from the upper surface. In some embodiments, the isolation region 1725 extends from a bottom surface of the substrate 1720 and extends into a predetermined depth from the bottom surface. In some embodiments, the isolation region 1725 penetrates though the substrate 1720 from the upper surface and the bottom surface.
In some embodiments, the isolation region 1725 is a doped region having a conductivity type. The peak concentration of the isolation region 1650 may range from 1015 cm−3 to 1020 cm−3 In some embodiment, a narrow and shallow isolation region 1735 is formed inside the isolation region 1725. The peak concentration of the shallow isolation region 1735 and the peak concentration of the isolation region 1725 are different. This may be applied to inhibit the crosstalk through surface conduction paths.
The doping of the isolation region 1725 may create a bandgap offset-induced potential energy barrier that impedes a flow of current across the isolation region 1725 and improving electrical isolation between the pixel 1700 and other adjacent pixels (not shown). In some embodiments, the isolation region 1725 includes a semiconductor material that is different from the material of the substrate 1720. An interface between two different semiconductor materials formed between the substrate 1720 and the isolation region 1725 may create a bandgap offset-induced energy barrier that impedes a flow of current across the isolation region 1725 and improving electrical isolation between the pixel 1700 and other adjacent pixels (not shown). In some embodiments, the shape of the isolation region 1725 may be a ring. In some embodiments, the isolation region 1725 may include two discrete regions disposed at the at two opposite sides of the absorption region 1710. In some embodiments, the two discrete regions may both extend from the upper surface of the substrate 1720 and extends into a predetermined depth from the upper surface. In some embodiments, the two discrete regions may both extend from a bottom surface of the substrate 1720 and extends into a predetermined depth from the bottom surface.
In some embodiments, each of the switches 1790 of the pixel 1700 includes two first doped regions 1711a,1711b under the first conductive contacts 1731a,1731b respectively and formed in the absorption region 1710. In other words, the two first doped regions 1711a,1711b of the pixel 1700 are formed in the absorption region 1710.
In some embodiments, the first doped regions 1711a,1711b are of a first conductivity type. In some embodiments, each of the first doped regions 1711a,1711b is doped with a dopant. The peak concentration of the dopant of each of the first doped regions 1711a,1711b depends on the material of the first conductive contacts 1731a, 1731b respectively and the material of the absorption region 1710, for example, between 5×1018 cm−3 to 5×1020 cm−3. The first doped regions 1711a, 1711b are for collecting the carriers generated from the absorption region 1710, which are further processed by the first readout circuit 1771a and the second readout circuit 1771b respectively based on the control of the first control signal 1772a and the second control signal 1772b.
In the present disclosure, in a same photo-detecting apparatus, the type of the carriers collected by the first doped region 1711a and the type of the carriers collected by the first doped region 1711b are the same. For example, when the photo-detecting apparatus is configured to collects electrons, when the first switch of one pixel is switched on and the second switch of the same pixel is switched off, the first doped region 1711a collects electrons of the photo-carriers generated from the detection region 1713, and when the second switch is switched on and the first switch is switched off, the first doped region 1711b also collects electrons of the photo-carriers generated from the detection region 1713.
In some embodiments, each of the switches 1790 of the pixel 1700 includes two second doped regions 1712a,1712b under the second conductive contacts 1732a,1732b respectively and formed in the absorption region 1710.
In some embodiments, the second doped regions 1712a,1712b are of a second conductivity type different from the first conductivity type of the first doped region 1711a,1711b. In some embodiments, the second doped regions 1712a,1712b include a dopant. The peak concentration of the dopant of each of the second doped regions 1712a,1712b depends on the material of the second conductive contact 1732a, 1732b respectively and the material of the absorption region 1710, for example, between 1×1017 cm−3 to 5×1020 cm−3. The second doped regions 1712a,1712b forms a Schottky or an Ohmic contact with the second conductive contacts 1732a,1732b. The second doped regions 1712a,1712b are for modulating the carriers generated from the absorption region 1710 based on the control of the first control signal 1772a and the second control signal 1772b.
In some embodiments, if the isolation region 1725 is a doped region having a conductivity type (such as n-type), the isolation region 1725 can be used to replace the first well region 1765 mentioned in
In some embodiments, the positions of the isolation region 1725 (with or without the shallow isolation region 1735), the first well region 1765 and the second well region 1766 can be adjusted. For example, as shown in
In some embodiments, as shown in
The photo-detecting apparatus in
In some embodiments, the pixel 1700 further includes a blocking layer 1740 surrounding the absorption region 1710, wherein the blocking layer is of a conductivity type (such as p-type) different from the first conductivity type of each of the first doped regions 1711a,1711b (such as n-type). The blocking layer 1740 may block photo-generated charges in the absorption region 1710 from reaching the substrate 1720, which increases the collection efficiency of photo-generated carriers of the pixel. The blocking layer 1740 may also block photo-generated charges in the substrate 1720 from reaching the absorption region 1710, which increases the speed of photo-generated carriers of the pixel. The blocking layer 1740 may include a material the same as the material of the absorption region 1710, the same as the material of the substrate 1720, or different from the material of the absorption region 1710 and the material of the substrate 1720. In some embodiments, the shape of the blocking layer 1740 is, but is not limited to a ring. In some embodiment, as shown in
In some embodiments, the blocking layer 1740 is doped with a dopant having a peak concentration ranging from 1015 cm−3 to 1020 cm−3. The blocking layer 1740 may reduce the cross talk between a pixel 1700 and the adjacent other pixels (not shown).
In some embodiments, photo-detecting apparatus may further include a third conductive contact (not shown) electrically connected to the blocking layer 1740. The blocking layer 1740 may be biased through the third conductive contact by a bias voltage to discharge carriers not collected by the first doped regions 1711a,1711b.
Please refer to
Besides, in some embodiments mentioned above (such as the embodiments mentioned in
Besides, as mentioned above, in some embodiments, each pixel 1700 may include more than one shorting structure 1760, as shown in
In
In
In
In some embodiments mentioned above, each of the switches 1790 includes a control region 1791 and a readout region 1792, and the control region 1791 may include different components disposed therein. In this disclosure, the control region 1791 can include different elements or components to form different embodiments.
In some embodiments, please refer to the middle part of
In some embodiments, please refer to the right part of
In some embodiments, the photo-detecting apparatus described in
In some embodiments, the photo-detecting apparatus described in
The imaging module includes a transmitter unit, a receiver unit, and a controller. During operation, the transmitter unit may emit an emitted light toward a target object. The receiver unit may receive reflected light reflected from the target object. The controller may drive at least the transmitter unit and the receiver unit. In some implementations, the receiver unit and the controller are implemented on one semiconductor chip, such as a system-on-a-chip (SoC). In some cases, the transmitter unit is implemented by two different semiconductor chips, such a laser emitter chip on III-V substrate and a Si laser driver chip on Si substrate.
The transmitter unit may include one or more light sources, control circuitry controlling the one or more light sources, and/or optical structures for manipulating the light emitted from the one or more light sources. In some embodiments, the light source may include one or more LEDs or VCSELs emitting light that can be absorbed by the absorption region in the photo-detecting apparatus. For example, the one or more LEDs or VCSEL may emit light with a peak wavelength within a visible wavelength range (e.g., a wavelength that is visible to the human eye), such as 570 nm, 670 nm, or any other applicable wavelengths. For another example, the one or more LEDs or VCSEL may emit light with a peak wavelength above the visible wavelength range, such as 850 nm, 940 nm, 1050 nm, 1064 nm, 1310 nm, 1350 nm, 1550 nm, or any other applicable wavelengths.
In some embodiments, the emitted light from the light sources may be collimated by the one or more optical structure. For example, the optical structure may include one or more collimating lens.
The receiver unit may include one or more photo-detecting apparatus according to any embodiments as mentioned above. The receiver unit may further include a control circuitry for controlling the control circuitry and/or optical structures for manipulating the light reflected from the target object toward the one or more photo-detecting apparatus. In some implementations, the optical structure includes one or more lens that receives a collimated light and focuses the collimated light towards the one or more photo-detecting apparatus.
In some embodiments, the controller includes a timing generator and a processing unit. The timing generator receives a reference clock signal and provides timing signals to the transmitter unit for modulating the emitted light. The timing signals are also provided to the receiver unit for controlling the collection of the photo-carriers. The processing unit processes the photo-carriers generated and collected by the receiver unit and determines raw data of the target object. The processing unit may include control circuitry, one or more signal processors for processing the information output from the photo-detecting apparatus, and/or computer storage medium that may store instructions for determining the raw data of the target object or store the raw data of the target object. As an example, the controller in an i-ToF sensor determines a distance between two points by using the phase difference between light emitted by the transmitter unit and light received by the receiver unit.
The software module may be implemented to perform in applications such as facial recognition, eye-tracking, gesture recognition, 3-dimensional model scanning/video recording, motion tracking, autonomous vehicles, and/or augmented/virtual reality.
A voltage regulator may be used to control an operating voltage of the image sensor. For example, multiple voltage domains may be used for an image sensor. A temperature sensor may be implemented for the possible use of depth calibration and power control.
The readout circuit of the photo-detecting apparatus bridges each of the photo-detecting devices of the image sensor array to a column analog-to-digital converter (ADC), where the ADC outputs may be further processed and integrated in the digital domain by a signal processor before reaching the output interface. A memory may be used to store the outputs by the signal processor. In some implementations, the output interface may be implemented using a 2-lane, 1.2 Gb/s D-PHY MIPI transmitter, or using CMOS outputs for low-speed/low-cost systems.
An inter-integrated circuit (I2C) interface may be used to access all of the functional blocks described here.
In the present disclosure, if not specifically mention, the absorption region is entirely embedded in the substrate, partially embedded in the substrate or entirely on the first surface of the substrate. Similarly, if not specifically mention, the germanium-based light absorption material is entirely embedded in the semiconductor substrate, partially embedded in the semiconductor substrate or entirely over the first surface of the semiconductor substrate.
In the present disclosure, if not specifically mention, the absorption region is configured to absorb photons having a peak wavelength in an invisible wavelength range not less than 800 nm, such as 850 nm, 940 nm, 1050 nm, 1064 nm, 1310 nm, 1350 nm, or 1550 nm. In some embodiments, the invisible wavelength range is not more than 2000 nm. In some embodiments, the absorption region receives an optical signal and converts the optical signal into electrical signals.
In the present disclosure, if not specifically mention, the substrate is made by a first material or a first material-composite. The absorption region is made by a second material or a second material-composite. The second material or a second material-composite is different from the first material or a first material-composite. In some embodiments, the absorption region includes a semiconductor material. In some embodiments, the absorption region includes polycrystalline material. In some embodiments, the substrate includes a semiconductor material. In some embodiments, the absorption region includes a Group III-V semiconductor material. In some embodiments, the substrate includes a Group III-V semiconductor material. The Group III-V semiconductor material may include, but is not limited to, GaAs/AlAs, InP/InGaAs, GaSb/InAs, or InSb. In some embodiments, the absorption region includes a semiconductor material including a Group IV element. For example, Ge, Si or Sn. In some embodiments, the absorption region includes GexSi1-x, wherein 0<x<1. In some embodiments, the absorption region includes the SixGeySn1-x-y, wherein 0x1, 0 y 1. In some embodiments, the absorption region includes the Ge1-aSna, wherein 0 a 0.1. In some embodiments, the substrate includes Si. In some embodiments, the substrate is composed of Si. In some embodiments, the absorption region is composed of Ge, Si or GexSi1-x. In some embodiments, the absorption region composed of intrinsic germanium is of p-type due to material defects formed during formation of the absorption region, wherein the defect density is from 1×1014 cm−3 to 1×1016 cm−3.
In the present disclosure, if not specifically mention, the absorption region has a thickness depending on the wavelength of photons to be detected and the material of the absorption region. In some embodiments, when the absorption region includes germanium and is designed to absorb photons having a wavelength not less than 800 nm, the absorption region has a thickness not less than 0.1 um. In some embodiments, the absorption region includes germanium and is designed to absorb photons having a wavelength between 800 nm and 2000 nm, the absorption region has a thickness between 0.1 um and 2.5 um. In some embodiments, the absorption region has a thickness between 1 um and 2.5 um for higher quantum efficiency. In some embodiments, the absorption region may be grown using a blanket epitaxy, a selective epitaxy, or other applicable techniques.
In the present disclosure, if not specifically mention, the first readout circuit, the second readout circuit, the first common readout circuit or the second common readout circuit may be in a three-transistor configuration consisting of a reset gate, a source-follower, and a selection gate, a circuit including four or more transistors, or any suitable circuitry for processing charges. In some embodiments, the first readout circuits and the second readout circuits may be fabricated on the substrate. In some other embodiments, the first readout circuits and the second readout circuits may be fabricated on another substrate and integrated/co-packaged with the absorption region via die/wafer bonding or stacking. In some embodiments, the photo-detecting apparatus includes a bonding layer (not shown) between the readout circuit and the absorption region 10. The bonding layer may include any suitable material such as oxide or semiconductor or metal or alloy.
In the present disclosure, if not specifically mention, the first readout circuit includes a first capacitor. The first capacitor is configured to store the photo-carriers collected by one of the first doped regions. In some embodiments, the first capacitor is electrically coupled to the reset gate of the first readout circuit. In some embodiments, the first capacitor is between the source-follower of the first readout circuit and the reset gate of the first readout circuit. In some embodiments, the second readout circuit includes a second capacitor. In some embodiments, the second capacitor is configured to store the photo-carriers collected by the other one of the first doped regions. In some embodiments, the second capacitor is electrically coupled to the reset gate of the second readout circuit. In some embodiments, the second capacitor is between the source-follower of the second readout circuit and the reset gate of the second readout circuit. Examples of the first capacitor and the second capacitor include, but not limited to, floating-diffusion capacitors, metal-oxide-metal (MOM) capacitors, metal-insulator-metal (MIM) capacitors, and metal-oxide-semiconductor (MOS) capacitors.
In the present disclosure, if not specifically mention, in a same pixel, the type of the carriers collected by the first doped region of one of the switches and the type of the carriers collected by the first doped region of the other switch are the same. For example, when the photo-detecting apparatus is configured to collects electrons, when the first switch is switched on and the second switch is switched off, the first doped region in the first switch collects electrons of the photo-carriers generated from the absorption region, and when the second switch is switched on and the first switch is switched off, the first doped region in the second switch also collects electrons of the photo-carriers generated from the absorption region.
In some embodiments, the first dielectric layer, the second dielectric layer in the present disclosure include, but is not limited to SiO2. In some embodiments, the first dielectric layer, the second dielectric layer the third dielectric layer, the fourth dielectric layer and the fifth dielectric layer include a high-k material including, but is not limited to, Si3N4, SiON, SiNX, SiOx, GeOx, Al2O3, Y2O3, TiO2, HfO2 or ZrO2. In some embodiments, the first dielectric layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer and the fifth dielectric layer in the present disclosure include semiconductor material but, but is not limited to amorphous Si, polycrystalline Si, crystalline Si, or a combination thereof.
In the present disclosure, if not specifically mention, the first conductive contact, second conductive contact, third conductive contact include metals or alloys. For example, the first conductive contact, second conductive contact, third conductive contact include Al, Cu, W, Ti, Ta—TaN—Cu stack or Ti—TiN—W stack.
While the disclosure has been described by way of example and in terms of a preferred embodiment, it is to be understood that the disclosure is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the disclosure. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
This patent application is a continuation-in-part of and claims the priority to U.S. patent application Ser. No. 16/282,881, filed Feb. 22, 2019, which claims the benefit of U.S. Provisional Patent Application No. 62/634,741, filed Feb. 23, 2018, U.S. Provisional Patent Application No. 62/654,454, filed Apr. 8, 2018, U.S. Provisional Patent Application No. 62/660,252, filed Apr. 20, 2018, U.S. Provisional Patent Application No. 62/698,263, filed Jul. 15, 2018, U.S. Provisional Patent Application No. 62/682,254, filed Jun. 8, 2018, U.S. Provisional Patent Application No. 62/686,697, filed Jun. 19, 2018, U.S. Provisional Patent Application No. 62/695,060, filed Jul. 8, 2018, U.S. Provisional Patent Application No. 62/695,058, filed Jul. 8, 2018, U.S. Provisional Patent Application No. 62/752,285, filed Oct. 29, 2018, U.S. Provisional Patent Application No. 62/717,908, filed Aug. 13, 2018, U.S. Provisional Patent Application No. 62/755,581, filed Nov. 5, 2018, U.S. Provisional Patent Application No. 62/770,196, filed Nov. 21, 2018, U.S. Provisional Patent Application No. 62/776,995, filed Dec. 7, 2018, which are each incorporated by reference herein in its entirety. This application also claims the benefit of U.S. Provisional Patent Application No. 62/989,901, filed Mar. 16, 2020, which is incorporated by reference herein.
| Number | Date | Country | |
|---|---|---|---|
| 62634741 | Feb 2018 | US | |
| 62654454 | Apr 2018 | US | |
| 62660252 | Apr 2018 | US | |
| 62698263 | Jul 2018 | US | |
| 62682254 | Jun 2018 | US | |
| 62686697 | Jun 2018 | US | |
| 62695060 | Jul 2018 | US | |
| 62695058 | Jul 2018 | US | |
| 62752285 | Oct 2018 | US | |
| 62717908 | Aug 2018 | US | |
| 62755581 | Nov 2018 | US | |
| 62776995 | Dec 2018 | US | |
| 62770196 | Nov 2018 | US | |
| 62989901 | Mar 2020 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 16282881 | Feb 2019 | US |
| Child | 17005298 | US |
