Pixel isolation structures

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CPC
H01L27/1463

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/1463Pixel isolation structures

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Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus, method for controlling electronic apparatus,...
- Patent number 12,170,859
- Issue date Dec 17, 2024
- Nikon Corporation
- Takashi Shionoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 12,170,299
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensors and methods of forming the same
- Patent number 12,170,301
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased optical path for long wavelength light by grating structure
- Patent number 12,170,302
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic equipment
- Patent number 12,170,303
- Issue date Dec 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaaki Bairo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, stacked imaging element, and solid-state imaging d...
- Patent number 12,170,304
- Issue date Dec 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Fumihiko Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus and imaging system
- Patent number 12,170,855
- Issue date Dec 17, 2024
- Canon Kabushiki Kaisha
- Yukihiro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a photodiode
- Patent number 12,170,298
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jameyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, semiconductor apparatus, equipment, circuit subs...
- Patent number 12,167,156
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Hideo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 12,166,057
- Issue date Dec 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuka Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,166,059
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Min-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device, photoelectric conversion system, a...
- Patent number 12,166,144
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Ayman Tarek Abdelghafar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including time-of-flight sensors
- Patent number 12,164,034
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device
- Patent number 12,166,055
- Issue date Dec 10, 2024
- SK hynix Inc.
- Sung Wook Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup element, method of manufacturing image pickup element,...
- Patent number 12,166,058
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shuji Manda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device, imaging module, electronic device, and imaging system
- Patent number 12,165,049
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki Ikeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,166,048
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having a gate electrode on a semiconductor pattern sid...
- Patent number 12,166,049
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Younggu Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including spider routing
- Patent number 12,160,674
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Moo Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus including metal film containing...
- Patent number 12,159,946
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Yoshiei Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with microlens layer and camera including the...
- Patent number 12,159,891
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Kazuo Kokumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,894
- Issue date Dec 3, 2024
- Innolux Corporation
- Hsiao-Feng Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imaging device including signal line and unit pixel cell including...
- Patent number 12,160,673
- Issue date Dec 3, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unequal CMOS image sensor pixel size to boost quantum efficiency
- Patent number 12,159,886
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-receiving element, solid-state imaging device, and ranging de...
- Patent number 12,159,888
- Issue date Dec 3, 2024
- SONY SEMICONDCUTOR SOLUTIONS CORPORATION
- Takeshi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,159,890
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jung Hye Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic detection interface and electronic detection module usin...
- Patent number 12,154,932
- Issue date Nov 26, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20240421167
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240421170
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- HAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...
- Publication number 20240421176
- Publication date Dec 19, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240423001
- Publication date Dec 19, 2024
- Sony Semiconductor Solutions Corporation
- TADASHI IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, FOCUS ADJUSTMENT DEVICE, AND IMAGING DEVICE
- Publication number 20240421168
- Publication date Dec 19, 2024
- Nikon Corporation
- Sota NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD
- Publication number 20240421173
- Publication date Dec 19, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiyue SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240421174
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR ELEMENT
- Publication number 20240421175
- Publication date Dec 19, 2024
- Hamamatsu Photonics K.K.
- Takahide YANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240421171
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taesub JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGING SENSOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240413175
- Publication date Dec 12, 2024
- Shanghai IC R&D Center Co., Ltd.
- Xiaoxu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE CAPTURING APPARATUS
- Publication number 20240413180
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- IPPEI YOSHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240413176
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- NAOYUKI OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240413179
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- YUKA OHKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION DETECTOR FOR POSITION-RESOLVED DETECTION OF RADIATION
- Publication number 20240413184
- Publication date Dec 12, 2024
- Dectris AG
- Michael RISSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20240413188
- Publication date Dec 12, 2024
- Nikon Corporation
- Daiki OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240413177
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20240413185
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- TETSUO GOCHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240413182
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240413183
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- HAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240413187
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- Chihiro ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE
- Publication number 20240413181
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- TOSHIFUMI YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR SEMICONDUCTOR-BASED SINGLE PHOTON EMISSION COMPUTED...
- Publication number 20240413186
- Publication date Dec 12, 2024
- Siemens Medical Solutions USA, Inc.
- Patanit Sanpitak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT
- Publication number 20240405034
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- Ryoji SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS
- Publication number 20240405047
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND APPARATUS
- Publication number 20240407098
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240405048
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- JUNSEOK KIM
- H01 - BASIC ELECTRIC ELEMENTS

Pixel isolation structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic apparatus, method for controlling electronic apparatus,...

Image sensors

Pixel sensors and methods of forming the same

Increased optical path for long wavelength light by grating structure

Semiconductor device and electronic equipment

Imaging element, stacked imaging element, and solid-state imaging d...

Photoelectric conversion apparatus and imaging system

Image sensor including a photodiode

Circuit substrate, semiconductor apparatus, equipment, circuit subs...

Solid-state imaging device, manufacturing method thereof, and elect...

Image sensor

Photoelectric conversion device, photoelectric conversion system, a...

Reliable semiconductor packages

Semiconductor device and method of manufacturing the same, and elec...

Pixel array including time-of-flight sensors

Image sensing device

Image pickup element, method of manufacturing image pickup element,...

Image pickup device and electronic apparatus

Imaging device, imaging module, electronic device, and imaging system

Pixel array including octagon pixel sensors

Image sensor having a gate electrode on a semiconductor pattern sid...

Image sensor including spider routing

Photoelectric conversion apparatus including metal film containing...

Semiconductor device with microlens layer and camera including the...

Display device

Imaging device including signal line and unit pixel cell including...

Unequal CMOS image sensor pixel size to boost quantum efficiency

Light-receiving element, solid-state imaging device, and ranging de...

Image sensor

Electronic detection interface and electronic detection module usin...

Patents Applicationslast 30 patents

IMAGE SENSOR

IMAGE SENSOR

OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...

SOLID-STATE IMAGING DEVICE

IMAGE SENSOR, FOCUS ADJUSTMENT DEVICE, AND IMAGING DEVICE

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

OPTICAL SEMICONDUCTOR ELEMENT

IMAGE SENSOR

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

CMOS IMAGING SENSOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

SOLID-STATE IMAGE CAPTURING APPARATUS

IMAGING DEVICE

IMAGING DEVICE

RADIATION DETECTOR FOR POSITION-RESOLVED DETECTION OF RADIATION

IMAGING ELEMENT AND IMAGING DEVICE

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

IMAGE SENSOR

IMAGE SENSOR

SEMICONDUCTOR APPARATUS

LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE

INTERPOSER FOR SEMICONDUCTOR-BASED SINGLE PHOTON EMISSION COMPUTED...

SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

MODULE AND APPARATUS

IMAGE SENSOR