Patent Application
20160147142
This invention relates to a photomask blank having a chemically amplified positive resist film, a process for forming a resist pattern, and a method for preparing a photomask from the photomask blank.
The recent trend toward higher integration in the integrated circuit technology poses a demand for finer feature size patterns. In processing of patterns with a size of less than 0.2 μm, acid-catalyzed chemically amplified resist compositions are used in most cases. The light source for exposure in the processing is high-energy radiation including UV, deep UV, electron beam (EB), X-ray, excimer laser, γ-ray, and synchrotron radiation. Among others, the EB lithography is utilized as the ultrafine processing technology and in particular, indispensable as the process for forming a pattern on a photomask which becomes an original image for pattern exposure.
The photomask resulting from EB writing offers an original image for the fabrication of semiconductor devices. For mask pattern formation, the accuracy of EB writing position and the accurate control of pattern line width are critical.
One of problems inherent to the EB lithography is the charge-up phenomenon that electric charges accumulate on or in the resist film during exposure. The charge causes the path of incident EB to be deflected, substantially detracting from the accuracy of mask pattern writing. The phenomenon may be avoided by coating an antistatic film on the resist film so that the charge may be released. The antistatic means is indispensable for writing fine size patterns.
However, another problem arises when an antistatic film is coated on a chemically amplified resist film. The acid in the antistatic film diffuses into the resist film, whereby noticeable changes of line width, shape and sensitivity occur after exposure. Also, the acid generated in the resist film by exposure is neutralized with a certain component in the antistatic film, whereby changes of line width and sensitivity similarly occur, failing in accurate writing.
Since the resist film is hydrophobic on its surface, it has no affinity to aqueous antistatic agents. It is thus difficult to coat the antistatic agent onto the resist film. As a solution to this problem, JP-A 2002-226721 proposes to add a surfactant to facilitate coating operation. This is still unsatisfactory in that some surfactants have detrimental impacts such as intermixing with the resist film surface.
On the other hand, JP-A 2006-048029, for example, discloses that a fluorinated polymer, when used in a resist composition subject to the immersion lithography, is effective for preventing any components in the resist film from being leached out from its surface. The immersion lithography intends to acquire high resolution performance by increasing the incident angle of light, and is a technique of repeatedly transferring the pattern of the photomask as the original to a resist film on a recipient such as wafer.
The immersion lithography is not applicable when a photomask is prepared from a photomask blank by scanning the resist film on the blank directly with a beam of high-energy radiation. Therefore, the fluorinated polymers are not used in the resist material for photomask blanks. JP-A 2008-304590 discloses that a polymer comprising recurring units having fluorine atoms is added to a resist material for photomask blanks to improve resist performance. Even when such a fluorinated polymer is used, the coating of an antistatic film is still inefficient. It is then difficult to meet all factors including resolution and age stability of a resist film and effective coating of an antistatic film.
Patent Document 1: JP-A 2002-226721
Patent Document 2: JP-A 2006-048029 (U.S. Pat. No. 7,531,287, EP 1621927)
Patent Document 3: JP-A 2008-304590 (U.S. Pat. No. 8,343,694, EP 2000851)
In conjunction with the process for forming a resist pattern by lithography, especially EB lithography, requiring high-accuracy formation of a fine size pattern, an object of the invention is to provide a photomask blank having a chemically amplified positive resist film which meets the requirements of resolution and age stability of the resist film and effective coating of an antistatic film thereon; a process for forming a resist pattern on the photomask blank; and a method for preparing a photomask from the photomask blank.
The inventors have found that when a polymer comprising recurring units having a specific substituent group on aromatic ring and recurring units having at least one fluorine atom is added to a resist film, the resist film is improved in age stability and antistatic film-receptivity without sacrificing resolution.
In one aspect, the invention provides a photomask blank comprising a chemically amplified positive resist film adapted for exposure to high-energy radiation, the resist film comprising
(A) a polymer comprising recurring units represented by the following formula (1) and recurring units having at least one fluorine atom,
(B) a base resin which is decomposed under the action of acid to increase its solubility in alkaline developer,
(C) an acid generator, and
(D) a basic compound.
Herein R1 is hydrogen or methyl. R2 is hydrogen or a straight or branched C1-C5 hydrocarbon group which may be separated by a heteroatom. R3 is a straight or branched C1-C5 hydrocarbon group which may be separated by a heteroatom, m is an integer of 1 to 3, n is an integer satisfying 0≦n≦5+21−m, wherein 1 is 0 or 1. X1 is a single bond, —C(═O)O— or —C(═O)NH—.
The photomask blank having the resist film has an advantage that an antistatic film is effectively coated on the resist film. When a photomask is prepared from the photomask blank by depositing an antistatic film on the resist film and directly scanning the resist film with a beam of high-energy radiation, the mask pattern can be formed at a high accuracy. As compared with a photomask blank having a resist film free of the polymer (A), the photomask blank of the invention is effective for preventing penetration of the acid and migration of any acid-neutralizing component from the antistatic film into the resist film. As a result, the age stability of the resist film after coating of the antistatic film is drastically improved.
In a preferred embodiment, the recurring units having at least one fluorine atom in the polymer (A) are units of at least one type selected from units having the formulae (2) to (5). Inclusion of these recurring units allows the polymer (A) to segregate on the resist film surface without sacrificing the resolution of the resist film.
Herein R4 is each independently hydrogen, fluorine, methyl or trifluoromethyl. R5a and R5b are each independently hydrogen or a straight, branched or cyclic C1-C10 alkyl group. R6 is each independently hydrogen, a straight, branched or cyclic C1-C15 monovalent hydrocarbon or fluorinated hydrocarbon group, or an acid labile group, with the proviso that in the monovalent hydrocarbon or fluorinated hydrocarbon group represented by R6, an ether bond (—O—) or carbonyl moiety (—C(═O)—) may intervene in a carbon-carbon bond. A is a straight, branched or cyclic C1-C20 (s+1)-valent hydrocarbon or fluorinated hydrocarbon group, and s is an integer of 1 to 3.
Preferably the photomask blank may further comprise an antistatic film on the resist film. The antistatic film prevents the charge-up phenomenon during EB writing, whereby the accuracy of writing position is drastically improved.
The antistatic film may comprise an amino acid. The preferred amino acid has the formula (6), but is not limited thereto. The addition of amino acid is effective for suppressing acid diffusion between the resist film and the antistatic film, further mitigating the impact of acid.
Herein R101 and 8102 are each independently hydrogen or a straight, branched or cyclic C1-C20 monovalent hydrocarbon group which may be separated by a heteroatom. 8103 and R104 are each independently hydrogen or a straight, branched or cyclic C1-C20 monovalent hydrocarbon group which may be separated by a heteroatom. A pair of R101 and R103 or a pair of R101 and R104 may bond together to form a ring with the carbon and nitrogen atoms to which they are attached. L1 is a straight, branched or cyclic C1-C20 divalent hydrocarbon group which may be separated by a heteroatom.
In a preferred embodiment, the base resin (B) comprises recurring units having an aromatic structure, specifically units of at least one type selected from units having the formulae (U-1) and (U-2).
Herein R7 is each independently hydrogen, fluorine, methyl or trifluoromethyl. R8 is each independently a C1-C6 alkyl group. B1 is each independently a single bond or a C1-C10 alkylene group which may contain an ether bond. The subscripts p and q each are 0 or 1, r and t each are an integer of 0 to 2, a is an integer satisfying 0 a 5+2r-b, b is an integer of 1 to 5, c is an integer satisflying 0 c 5+2t-e, d is 0 or 1, and e is an integer of 1 to 3. X is an acid labile group when e=1, and X is hydrogen or an acid labile group when e is 2 or 3, at least one X being an acid labile group.
When the base resin (B) contains the recurring units defined above, resolution is improved and a pattern with reduced line edge roughness (LER, the edge of a pattern becoming irregular) is obtainable. Under the action of these recurring units, the base resin (B) exhibits a good solubility in alkaline developer, and the resist film becomes more adherent to the underlying (processable) layer. Also since the acid labile group (i.e., protective group) in the recurring unit undergoes deprotection reaction under the action of acid, the base resin (B) is more soluble in alkaline developer.
In a more preferred embodiment, the base resin (B) further comprises recurring units of at least one type selected from units having the formulae (U-3) and (U-4). These recurring units contribute to an improvement in etch resistance.
Herein R9 and R10 are each independently hydrogen, hydroxyl, optionally halo-substituted C1-C6 alkyl or primary or secondary alkoxy group, or optionally halo-substituted C1-C7 alkylcarbonyloxy group, f is an integer of 0 to 6, and g is an integer of 0 to 4.
The photomask blank is useful when the resist film is exposed patternwise by the EB lithography. In order that the resist film exhibit a high sensitivity upon patternwise exposure to EB, the contents of acid generator (C) and basic compound (D) in the resist film should preferably be adjusted optimum for the EB lithography.
In another aspect, the invention provides a pattern forming process comprising the steps of exposing the resist film of the photomask blank to high-energy radiation without any intervening liquid, and developing the resist film in an alkaline developer to form a resist pattern.
The resist pattern forming process enables to form a resist pattern at a high accuracy even when EB lithography, SCALPEL (scattering with angular limitation projection electron-beam lithography), or lithography with high-energy radiation such as X-ray, γ-ray or synchrotron radiation is applied. As compared with a photomask blank having a resist film free of the polymer (A), the photomask blank of the invention is effective for preventing penetration of the acid and migration of any acid-neutralizing component from the antistatic film into the resist film. As a result, the age stability of the resist film is drastically improved.
The resist pattern forming process of the invention is applicable to any lithography of exposing the resist film to high-energy radiation without any intervening liquid. An example of exposure to high-energy radiation without any intervening liquid is beam irradiation, especially EB irradiation. Since EB irradiation is effective when a small number of patterns of wide variety are formed as in photomasks, EB irradiation is effectively applicable to the resist pattern forming process of the invention.
The resist pattern forming process is adequate to form a resist pattern from the resist film on the photomask blank. A photomask is prepared from the photomask blank at a high accuracy via the steps of forming a resist pattern on the photomask blank by the above process, and etching the photomask blank using the resist pattern as etch mask.
Since the polymer (A) is present in the resist film, an antistatic film may be coated onto the resist film at a drastically improved efficiency, and the resist film may be patterned at a high accuracy. The polymer (A) segregates on the resist film surface, while the aromatic structure and hydrophilic group (e.g., hydroxyl) in the recurring unit having formula (1) exert the effects of preventing penetration of acid and migration of acid-neutralizing component from the antistatic film to the resist film. As a result, the age stability of the resist film after coating of the antistatic film is drastically improved. From the photomask blank having a resist film comprising the polymer (A), a photomask may be prepared at a high accuracy using the resist pattern formed in the resist film.
In the specification, the singular forms “a,” “an” and “the” include plural referents unless the context clearly dictates otherwise. The notation (Cn-Cm) means a group containing from n to m carbon atoms per group. It is understood that for some structures represented by chemical formulae, there can exist enantiomers and diastereomers because of the presence of asymmetric carbon atoms. In such a case, a single formula collectively represents all such isomers. The isomers may be used alone or in admixture. EB stands for electron beam, PAG for photoacid generator, LER for line edge roughness, PEB for post-exposure bake, and Mw for weight average molecular weight.
According to the invention, a photomask blank has a chemically amplified positive resist film adapted for exposure to high-energy radiation. The resist film is defined as comprising
(A) a polymer comprising recurring units represented by the formula (1) and recurring units having at least one fluorine atom,
(B) a base resin which is decomposed under the action of acid to increase its solubility in alkaline developer,
(C) an acid generator, and
(D) a basic compound.
Component (A) is a polymer comprising recurring units represented by the formula (1) and recurring units having at least one fluorine atom.
Herein R1 is hydrogen or methyl. R2 is hydrogen or a straight or branched C1-C5 hydrocarbon group which may be separated by a heteroatom. R3 is a straight or branched C1-C5 hydrocarbon group which may be separated by a heteroatom. The subscript m is an integer of 1 to 3, n is an integer satisfying 0 n 5+21−m, wherein 1 is 0 or 1. X1 is a single bond, —C(═O)O— or —C(═O)NH—.
Exemplary of the hydrocarbon groups are alkyl, alkenyl and alkynyl groups, with alkyl groups being preferred. Suitable alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and n-pentyl. A heteroatom such as oxygen, sulfur or nitrogen may intervene in a carbon-carbon bond in the group.
In formula (1), —OR2 is preferably a hydrophilic group. In this sense, R2 is preferably hydrogen or a C1-C5 alkyl group having an oxygen atom intervening in a carbon-carbon bond.
Illustrative, non-limiting examples of the recurring units having formula (1) are given below.
Herein R1 is as defined above.
In formula (1), X1 is preferably —C(═O)O— or —C(═O)NH— rather than a single bond. Also preferably R1 is methyl. The inclusion of carbonyl in X1 serves to improve the resist film's capability of trapping the acid originating from the antistatic film. The polymer of formula (1) wherein R1 is methyl is a rigid polymer having a higher glass transition temperature (Tg), which is more effective for suppressing acid diffusion. As a result, the age stability of the resist film is improved, and the resolution and pattern profile are not degraded.
The recurring units having at least one fluorine atom are preferably units of at least one type selected from units having the formulae (2) to (5).
Herein R4 is each independently hydrogen, fluorine, methyl or trifluoromethyl. R5a and R5b are each independently hydrogen or a straight, branched or cyclic C1-C10 alkyl group. R6 is each independently hydrogen, a straight, branched or cyclic C1-C15 monovalent hydrocarbon or fluorinated hydrocarbon group, or an acid labile group, with the proviso that in the monovalent hydrocarbon or fluorinated hydrocarbon group represented by R6, an ether bond (—O—) or carbonyl moiety (—C(═O)—) may intervene in a carbon-carbon bond. “A” is a straight, branched or cyclic C1-C20 (s+1)-valent hydrocarbon or fluorinated hydrocarbon group, and s is an integer of 1 to 3.
Examples of the straight, branched or cyclic C1-C10 alkyl group include methyl, ethyl, n-propyl, isopropyl, cyclopropyl, n-butyl, isobutyl, sec-butyl, t-butyl, cyclobutyl, n-pentyl, cyclopentyl, n-hexyl, cyclohexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, adamantyl, and norbornyl. Inter alia, straight, branched or cyclic C1-C6 alkyl groups are preferred.
Examples of the straight, branched or cyclic C1-C15 monovalent hydrocarbon group include alkyl, alkenyl and alkynyl groups, with alkyl groups being preferred. Examples of the alkyl group include n-undecyl, n-dodecyl, tridecyl, tetradecyl, and pentadecyl as well as those mentioned above. Examples of the straight, branched or cyclic C1-C15 monovalent fluorinated hydrocarbon group include the foregoing monovalent hydrocarbon groups in which some or all carbon-bonded hydrogen atoms are substituted by fluorine atoms.
Examples of the straight, branched or cyclic C1-C20 (s+1)-valent hydrocarbon or fluorinated hydrocarbon group include the foregoing exemplary monovalent hydrocarbon and fluorinated hydrocarbon groups, with a number “s” of hydrogen atoms being eliminated.
Suitable acid labile groups include tertiary alkyl groups and acetal groups of the formula (U-2-1) as will be described later.
Examples of the recurring units having formulae (2) to (5) are given below, but not limited thereto.
Herein R4 is as defined above.
In the polymer (A), the recurring units of formulae (2) to (5) may be of a single type or a combination of two or more types, and are preferably included in an amount of 20 to 95 mol % based on the entire recurring units. Besides the foregoing recurring units, the polymer (A) may comprise other recurring units. Other recurring units include those described in JP-A 2014-177407, paragraphs to [0078] (U.S. Pat. No. 9,091,918). The other recurring units are preferably included in an amount of up to 50 mol % based on the entire recurring units.
The polymer (A) may be obtained by combining suitable monomers and copolymerizing them in the standard way while protection and deprotection reactions are combined if necessary. The copolymerization reaction is preferably radical polymerization or anionic polymerization though not limited thereto. For the polymerization reaction, reference may be made to JP-A 2004-115630.
The polymer (A) should preferably have a weight average molecular weight (Mw) of 2,000 to 50,000, and more preferably 3,000 to 20,000, as measured versus polystyrene standards by gel permeation chromatography (GPC) using tetrahydrofuran (THF) solvent. If Mw is less than 2,000, the polymer may help acid diffusion, detracting from resolution and age stability. With too much Mw, the polymer may have a low solubility in solvents and can generate coating defects.
The polymer (A) preferably has a molecular weight distribution or dispersity (Mw/Mn) of 1.0 to 2.2, more preferably 1.0 to 1.7.
The polymer (A) is preferably added in an amount of 0.1 to 50 parts by weight, and more preferably 0.5 to 20 parts by weight per 100 parts by weight of the base resin (B).
Component (B) is a base resin, preferably comprising recurring units having an aromatic structure, and more preferably recurring units of at least one type selected from units having the formulae (U-1) and (U-2). Notably, the recurring units of formula (U-2) are units having an acidic functional group protected with an acid labile group, i.e., units adapted to turn alkali soluble under the action of acid.
Herein R7 is each independently hydrogen, fluorine, methyl or trifluoromethyl. R8 is each independently a C1-C6 alkyl group. B1 is each independently a single bond or a C1-C10 alkylene group which may contain an ether bond. The subscripts p and q each are 0 or 1, r and t each are an integer of 0 to 2, a is an integer satisfying 0 a 5+2r-b, b is an integer of 1 to 5, c is an integer satisfying 0 c 5+2t-e, d is 0 or 1, and e is an integer of 1 to 3. X is an acid labile group when e=1, and X is hydrogen or an acid labile group when e is 2 or 3, at least one X being an acid labile group.
Of the recurring units of formula (U-1), linker-free recurring units corresponding to —(C(O)—O)p—B1— wherein p=0 and B1 is a single bond are units derived from monomers having a 1-substituted or unsubstituted vinyl group attached to a hydroxy-substituted aromatic ring, typically hydroxystyrene units. Suitable units include those derived from 3-hydroxystyrene, 4-hydroxystyrene, 5-hydroxy-2-vinylnaphthalene, and 6-hydroxy-2-vinylnaphthalene.
Of the recurring units of formula (U-1), linker-bearing recurring units are units derived from carbonyl-substituted vinyl monomers, typically (meth)acrylates.
Examples of the linker-bearing recurring units having formula (U-1) are shown below, but not limited thereto.
The recurring units of formula (U-2) are recurring units of formula (U-1) in which at least one phenolic hydroxyl group substituting on aromatic ring is protected with an acid labile group, or recurring units of formula (U-1) in which the phenolic hydroxyl group is substituted by a carboxyl group which is, in turn, protected with an acid labile group. The acid labile group is not particularly limited and any acid labile groups may be used as long as they are commonly used in many well-known chemically amplified resist compositions and can be eliminated with acid.
A choice of tertiary alkyl group as the acid labile group is preferred because a pattern with minimal LER can be printed when the resist composition is coated as a thin film having a thickness of 10 to 100 nm, for example, and a fine pattern having a line width of up to 45 nm, for example, is formed in the thin film. Of tertiary alkyl groups, those of 4 to 18 carbon atoms are preferred because a monomer subject to polymerization can be isolated by distillation. Examples of the alkyl substituent group on tertiary carbon atom in the tertiary alkyl group include straight, branched or cyclic C1-C15 alkyl groups which may partially contain an oxygen-containing functionality such as an ether bond or carbonyl moiety. The alkyl substituent groups on tertiary carbon atom may bond together to form a ring.
Examples of the alkyl substituent group include methyl, ethyl, propyl, adamantyl, norbornyl, tetrahydrofuran-2-yl, 7-oxanorbornan-2-yl, cyclopentyl, 2-tetrahydrofuryl, tricyclo[5.2.1.02, 6]decyl, tetracyclo[4.4.0.12, 5.1]dodecyl, and 3-oxo-1-cyclohexyl.
Examples of the tertiary alkyl group having any of the foregoing alkyl substituent groups on tertiary carbon atom include, but are not limited to, t-butyl, t-pentyl, 1-ethyl-1-methylpropyl, 1,1-diethylpropyl, 1,1,2-trimethylpropyl, 1-adamantyl-1-methylethyl, 1-methyl-1-(2-norbornyl)ethyl, 1-methyl-1-(tetrahydrofuran-2-yl)ethyl, 1-methyl-1-(7-oxanorbornan-2-yl)ethyl, 1-methylcyclopentyl, 1-ethylcyclopentyl, 1-propylcyclopentyl, 1-cyclopentylcyclopentyl, 1-cyclohexylcyclopentyl, 1-(2-tetrahydrofuryl)cyclopentyl, 1-(7-oxanorbornan-2-yl)cyclopentyl, 1-methylcyclohexyl, 1-ethylcyclohexyl, 1-cyclopentylcyclohexyl, 1-cyclohexylcyclohexyl, 2-methyl-2-norbornyl, 2-ethyl-2-norbornyl, 8-methyl-8-tricyclo[5.2.1.02, 5]decyl, 8-ethyl-8-tricyclo[5.2.1.02, 6]decyl, 3-methyl-3-tetracyclo[4.4.0.12,5.17, 10]dodecyl, 3-ethyl-3-tetracyclo[4.4.0.12, 5.17, 10]dodecyl, 2-methyl-2-adamantyl, 2-ethyl-2-adamantyl, 1-methyl-3-oxo-1-cyclohexyl, 1-methyl-1-(tetrahydrofuran-2-yl)ethyl, 5-hydroxy-2-methyl-2-adamantyl, and 5-hydroxy-2-ethyl-2-adamantyl.
An acetal group of the following formula (U-2-1), which is one of commonly used acid labile groups, is a good choice because this acid labile group is capable of consistently forming a pattern defining a substantially rectangular interface with the substrate.
In formula (U-2-1), R11 is selected from hydrogen and a straight, branched or cyclic C1-C10 alkyl group, depending on the design of sensitivity of a labile group to acid. For example, hydrogen is selected for the design of a labile group that has a relatively high stability and is decomposed with strong acid, whereas a straight alkyl group is selected for the design of a labile group that has a relatively high reactivity and provides a high sensitivity to pH changes. Although a choice depends on a combination of acid generator and basic compound in the resist composition, for the design of a labile group terminated with a relatively high alkyl group that provides a large change of solubility on decomposition, it is preferred that the carbon in R11 bonded to the acetal carbon be secondary carbon. Exemplary of such R11 are isopropyl, sec-butyl, cyclopentyl and cyclohexyl.
In formula (U-2-1), Y is a straight, branched or cyclic C1-C30 alkyl group, preferably a C7-C30 polycyclic alkyl group for higher resolution. When Y is a polycyclic alkyl group, it is preferred that secondary carbon constituting the polycyclic structure bond with the acetal oxygen. When the bond to secondary carbon of the cyclic structure is compared with the bond to tertiary carbon, the polymer becomes so stable that a resist composition comprising the same may be more shelf stable and experience no degradation of resolution. As compared with the polycyclic structure bonding on primary carbon via a straight alkyl group of at least one carbon atom, the polymer has such a glass transition temperature (Tg) that the resist pattern after development may not be deformed by bake.
Examples of the acetal group having formula (U-2-1) are shown below.
Herein R11 is as defined above.
A phenolic hydroxyl group bonded to —CH2COO— (tertiary alkyl group) may also be used as the acid labile group. The tertiary alkyl group included therein may be the same as the above-mentioned tertiary alkyl group for the protection of a phenolic hydroxyl group.
The units of formula (U-1) and/or (U-2) may be used alone or in admixture (i.e., of one type or two or more types) and preferably incorporated in a range of 40 to 90 mol % based on the entire recurring units of the base resin (B). It is noted that when units of at least one type selected from units of formulae (U-3) and (U-4) to be described later, which have a phenolic hydroxyl group as the substituent, are incorporated, a proportion of these units should be included in the above range.
In a more preferred embodiment, the base resin (B) further comprises recurring units of at least one type selected from units having the formulae (U-3) and (U-4).
Herein R9 and R10 are each independently hydrogen, hydroxyl, optionally halo-substituted C1-C6 alkyl or primary or secondary alkoxy group, or optionally halo-substituted C1-C7 alkylcarbonyloxy group, f is an integer of 0 to 6, and g is an integer of 0 to 4.
Where recurring units of at least one type selected from units of formulae (U-3) and (U-4) are incorporated, the base resin (B) may have another advantage that the binding of cyclic structure to the backbone enhances etch resistance and resistance to EB (to be irradiated during pattern inspection), in addition to the advantage of etch resistance inherent to aromatic ring.
The units of formula (U-3) and/or (U-4) may be used alone or in admixture (i.e., of one type or more than one type) and preferably incorporated in a range of at least 5 mol % based on the entire recurring units of the base resin (B) for acquiring the effect of improving etch resistance.
Also, when the unit of formula (U-3) or (U-4) is a unit having a functional group providing polarity so that it may provide adhesion to the substrate, or a unit having a substituent group protected with the acid labile group so that it may turn alkali soluble under the action of acid, a proportion of the relevant unit should be included in the above range. When the unit of formula (U-3) or (U-4) is a unit having no functional group or a functional group outside the above concepts, a proportion of this unit is preferably up to 30 mol %. As long as the proportion of the unit having no functional group or a functional group outside the above concepts is up to 30 mol, no development defects may form.
In the base resin (B), the units of formulae (U-1) to (U-4) are preferably incorporated in a range of at least 60 mol %, more preferably at least 70 mol %, and even more preferably at least 85 mol %, based on the entire recurring units. When the entire constituent units of the base resin are recurring units selected from formulae (U-1) to (U-4), high etch resistance and high resolution are available in a compatible manner.
In the base resin (B), recurring units other than the units (U-1) to (U-4) may be incorporated. For example, (meth)acrylate units protected with a conventional acid labile group and/or (meth)acrylate units having an adhesive group such as lactone structure may be used. Characteristics of a resin film may be finely adjusted by incorporating such additional recurring units although the additional recurring units are optional.
The base resin (B) may be prepared by any well-known techniques, by selecting suitable monomers and effecting copolymerization while optionally combining protection and deprotection reactions. The copolymerization reaction is preferably radical or anionic polymerization though not limited thereto. Reference may be made to JP-A 2004-115630.
The base resin (B) preferably has a weight average molecular weight (Mw) of 2,000 to 50,000, and more preferably 3,000 to 20,000, as measured by GPC versus polystyrene standards. A polymer with a Mw of less than 2,000 is liable for the phenomenon that a pattern is rounded at the top, reduced in resolution, and degraded in LER. If Mw exceeds 50,000, there is a tendency of increasing LER, depending on a particular pattern to be resolved. The polymer is more preferably controlled to a Mw of up to 20,000 particularly when a pattern with a line width of up to 100 nm is to be formed.
The base resin (B) should preferably have a dispersity (Mw/Mn) of 1.0 to 2.0, especially 1.0 to 1.8.
It is acceptable to use a blend of two or more inventive polymers which are different in compositional ratio, molecular weight or dispersity, a blend of the polymer comprising units of formulae (U-1) to (U-4) with a polymer free of units of formulae (U-1) to (U-4), or a blend of the polymer comprising units of formulae (U-1) to (U-4) with a polymer comprising recurring units of any one of sulfonium salts (a1) to (a3).
In the formulae, R12 is independently hydrogen or methyl. R13 is a single bond, phenylene, —O—R22—, or —C(═O)—Z2—R22—, wherein Z2 is oxygen or —NH—, and R22 is a straight, branched or cyclic C1-C6 alkylene or alkenylene group or phenylene group in which at least one hydrogen atom may be substituted by hydroxyl, or a carbonyl radical, ether bond or ester bond (—COO—) may intervene in a carbon-carbon bond. L2 is a single bond, or a straight, branched or cyclic C1-C20 divalent hydrocarbon group in which at least one hydrogen atom may be substituted by an oxygen, sulfur or nitrogen-containing substituent, or halogen atom, or a carbonyl radical, ether bond, ester bond, sulfonate bond or carbonate bond may intervene in a carbon-carbon bond. Examples of the divalent hydrocarbon group include straight alkanediyl groups such as methylene, ethylene, propane-1,3-diyl, butane-1,4-diyl, pentane-1,5-diyl, hexane-1,6-diyl, heptane-1,7-diyl, octane-1,8-diyl, nonane-1,9-diyl, decane-1,10-diyl, undecane-1,11-diyl, dodecane-1,12-diyl, tridecane-1,13-diyl, tetradecane-1,14-diyl, pentadecane-1,15-diyl, hexadecane-1,16-diyl, and heptadecane-1,17-diyl; branched alkanediyl groups obtained by adding a pendant such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl or t-butyl to the foregoing straight alkanediyl groups; cyclic saturated hydrocarbon groups such as cyclopentanediyl, cyclohexanediyl, norbornanediyl, and adamantanediyl; and unsaturated cyclic hydrocarbon groups such as phenylene and naphthylene. Z1 is a single bond, methylene, ethylene, phenylene, fluorophenylene, —O—R—, or —C(═O)—Z2—R22— wherein Z2 is oxygen atom or —NH—, and R23 is a straight, branched or cyclic C1-C6 alkylene or alkenylene group or phenylene group which may contain a carbonyl, ester, ether or hydroxyl radical. M− is a non-nucleophilic counter ion. R14, R15, R16, R17, R18, R19, R20, and R21 are each independently a substituted or unsubstituted, straight or branched C1-C10 alkyl or oxoalkyl group, substituted or unsubstituted C2-C10 alkenyl group, substituted or unsubstituted C6-C18 aryl group, or substituted or unsubstituted C7-C19 aralkyl or aryloxoalkyl group, or R14 and R15, any two or more of R16, R17 and R18, or any two or more of R19, R20 and R21 may bond together to form a ring with the sulfur atom.
It is also possible to blend any polymers of conventional type wherein the exposed region is dissolved on alkaline development, such as (meth)acrylate polymers, polynorbornene, cycloolefin-maleic anhydride copolymers, and ring-opening metathesis polymerization (ROMP) polymers.
Component (C) included in the resist film is an acid generator. Included in the acid generator are a compound (photoacid generator or PAG) which generates an acid in response to actinic ray or radiation and a compound (thermal acid generator) which generates an acid upon receipt of heat. While the PAG used herein is not particularly limited, suitable PAGs include sulfonium salts, iodonium salts, sulfonyldiazomethane, N-sulfonyloxyimide, and oxime-O-sulfonate acid generators, which may be used alone or in admixture.
Examples of the PAG include those described in JP-A 2008-111103, paragraphs [0122] to [0142], and JP-A 2005-326833 (U.S. Pat. No. 7,537,880 and 7,288,363). Of these PAGs, PAGs of arylsulfonate or alkanesulfonate type are preferred because they generate acids having an appropriate acidity to deprotect the acid labile group on the recurring unit of formula (U-2).
Instead of the PAG, a polymer comprising recurring units of any one of sulfonium salts (a1) to (a3) may be used. Using such a polymer as PAG, a pattern of good profile may be formed because acid diffusion is suppressed to a high degree.
The acid generator (C) is preferably used in an amount of 0.1 to 40 parts, more preferably 1 to 20 parts by weight per 100 parts by weight of the base resin (B).
Component (D) included in the resist film is a basic compound. The basic compound is effective for suppressing acid diffusion. Even when the resist film is applied to a substrate having an outermost surface layer made of a chromium-containing material, the basic compound is effective for minimizing the influence of the acid generated in the resist film on the chromium-containing material.
Numerous basic compounds are known useful including primary, secondary, and tertiary aliphatic amines, mixed amines, aromatic amines, heterocyclic amines, nitrogen-containing compounds with carboxyl group, nitrogen-containing compounds with sulfonyl group, nitrogen-containing compounds with hydroxyl group, nitrogen-containing compounds with hydroxyphenyl group, alcoholic nitrogen-containing compounds, amide derivatives, imide derivatives, carbamate derivatives, and ammonium salts. Examples are described in JP-A 2008-111103 (U.S. Pat. No. 7,537,880) and JP-A 2001-166476, for example, and any such compounds are useful. The basic compounds may be used alone or in admixture.
Of the foregoing basic compounds, preferred are tris[2-(methoxymethoxy)ethyl]amine, tris[2-(methoxymethoxy)ethyl]amine-N-oxide, morpholine derivatives and imidazole derivatives.
The basic compound (D) is preferably used in an amount of 0.01 to 5 parts, more preferably 0.05 to 3 parts by weight per 100 parts by weight of the base resin (B).
To enable formation of a resist film containing the aforementioned components, the components are dissolved in an organic solvent to form a resist composition. The organic solvent used to form a resist composition solution may be any organic solvent in which components (A) to (D) and additives are soluble. Illustrative, non-limiting, examples of the organic solvent include ketones such as cyclohexanone and methyl-2-n-amylketone; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, and 1-ethoxy-2-propanol; ethers such as propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, and diethylene glycol dimethyl ether; esters such as propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, and propylene glycol mono-tert-butyl ether acetate; and lactones such as γ-butyrolactone. These solvents may be used alone or in combinations of two or more thereof. Of the above organic solvents, it is recommended to use diethylene glycol dimethyl ether, 1-ethoxy-2-propanol, PGMEA, ethyl lactate, and mixtures thereof because the acid generator is most soluble therein.
An appropriate amount of the organic solvent used is 200 to 3,000 parts, especially 400 to 2,500 parts by weight per 100 parts by weight of the base resin (B).
In the resist composition, any of surfactants commonly used for improving coating characteristics may be added as an optional component. Numerous surfactants are known in the art including those described in JP-A 2004-115630, for example. A choice may be made with reference to such patent documents. An appropriate amount of the surfactant used is up to 2 parts, preferably up to 1 part, and at least 0.01 part by weight per 100 parts by weight of the base resin (B).
The above-described components are dissolved in an organic solvent to form a resist composition solution which is filtered and then applied to a workpiece to form a resist film thereon. Typical of the workpiece is a photomask blank in which a photomask substrate (e.g., transparent quartz substrate) is covered with a suitable film, typically a light-shielding film containing a metal (e.g., transition metal or silicon) and optionally at least one light element selected from oxygen, nitrogen and carbon. The resist composition solution is applied to the photomask blank so as to give a dry coating of 0.05 to 2.0 μm thick by any of well-known application techniques including spin coating, roll coating, flow coating, dip coating, spray coating, and doctor coating. The coating is prebaked on a hot plate at 60 to 150° C. for 30 seconds to 20 minutes, and preferably at 80 to 140° C. for 5 to 15 minutes in the case of photomask blanks, for removing the unnecessary solvent and yielding the resist film.
In a preferred embodiment, the photomask blank includes an antistatic film on the resist film. An electroconductive polymer is typically used in the antistatic film. Examples thereof include, but are not limited to, composites composed of a π-conjugated electroconductive polymer and a polyanion containing polyacid, and π-conjugated electroconductive polymers having an acidic group and/or salt on side chain of recurring units. p Examples of the π-conjugated electroconductive polymer used herein include polyaniline, polypyrrole, polythiophene, polyacetylene, polyphenylene, polyphenylene vinylene, polyacene, and polythiophene vinylene derivatives, as well as copolymers of constituent monomers thereof.
Of these, polyanilines are preferred because of their advantages including dispersion in water, filtration of dispersion, stripping of the resulting film with water or alkaline developer, low defectiveness in lithography, ease of polymerization, low re-agglomeration during storage, and stability in air. The aniline based electroconductive polymers are organic polymers whose backbone is composed of aniline or aniline derivatives excluding para-substituted ones.
Although the aniline based electroconductive polymers are fully conductive in unsubstituted form, it is preferred to introduce a substituent group therein, from the aspects including dispersion in water, low re-agglomeration, filtration of dispersion, stripping of the resulting film with water or alkaline developer, and low defectiveness in lithography. Suitable substituent groups include straight or branched C1-C20 monovalent hydrocarbon groups, in which some or all carbon-bonded hydrogen atoms may be substituted by functional groups such as halogen atoms, alkyl, carboxyl, alkoxy, hydroxy, cyano, and acidic groups or salts thereof, or a heteroatom such as oxygen, sulfur or nitrogen may intervene in a carbon-carbon bond.
Examples of the aniline monomers used to form the aniline based electroconductive polymers include aniline, 2-methylaniline, 3-methylaniline, 2-ethylaniline, 3-ethylaniline, 2-isopropylaniline, 2-t-butylaniline, 2,3-dimethylaniline, 2,5-dimethylaniline, 2,6-dimethylaniline, 3,5-dimethylaniline, 2,6-diethylaniline, 2,6-diisopropylaniline, 2,3,5,6-tetramethylaniline, 2-methoxyaniline, 3-methoxyaniline, 2-ethoxyaniline, 3-ethoxyaniline, 3-isopropoxyaniline, 3-hydroxyaniline, 2,5-dimethoxyaniline, 2,6-dimethoxyaniline, 3,5-dimethoxyaniline, 2,5-diethoxyaniline, 2-methoxy-5-methylaniline, 5-t-butyl-2-methoxyaniline, 2-chloro-5-methylaniline, 2-chloro-6-methylaniline, 3-chloro-2-methylaniline, and 5-chloro-2-methylaniline.
When composites of polyaniline with polyanion are evaluated with respect to dispersion in water, electroconductivity, reactivity, and thermal stability, preference is given to (co)polymers obtained from such monomers as 2-methylaniline, 3-methylaniline, 2-ethylaniline, 3-ethylaniline, 2-isopropylaniline, 2-methoxyaniline, 3-methoxyaniline, 2-ethoxyaniline, 3-ethoxyaniline, 3-isopropoxyaniline, and 3-hydroxyaniline.
Examples of the polythiophene include polythiophene, poly(3-methylthiophene), poly(3-ethylthiophene), poly(3-propylthiophene), poly(3-butylthiophene), poly(3-hexylthiophene), poly(3-heptylthiophene), poly(3-octylthiophene), poly(3-decylthiophene), poly(3-dodecylthiophene), poly(3-octadecylthiophene), poly(3-bromothiophene), poly(3-chlorothiophene), poly(3-iodothiophene), poly(3-cyanothiophene), poly(3-phenylthiophene), poly(3,4-dimethylthiophene), poly(3,4-dibutylthiophene), poly(3-hydroxythiophene), poly(3-methoxythiophene), poly(3-ethoxythiophene), poly(3-butoxythiophene), poly(3-hexyloxythiophene), poly(3-heptyloxythiophene), poly(3-octyloxythiophene), poly(3-decyloxythiophene), poly(3-dodecyloxythiophene), poly(3-octadecyloxythiophene), poly(3,4-dihydroxythiophene), poly(3,4-dimethoxythiophene), poly(3,4-diethoxythiophene), poly(3,4-dipropoxythiophene), poly(3,4-dibutoxythiophene), poly(3,4-dihexyloxythiophene), poly(3,4-diheptyloxythiophene), poly(3,4-dioctyloxythiophene), poly(3,4-didecyloxythiophene), poly(3,4-didodecyloxythiophene), poly(3,4-ethylenedioxythiophene), poly(3,4-propylenedioxythiophene), poly(3,4-butenedioxythiophene), poly(3-methyl-4-methoxythiophene), poly(3-methyl-4-ethoxythiophene), poly(3-carboxythiophene), poly(3-methyl-4-carboxythiophene), poly(3-methyl-4-carboxyethylthiophene), and poly(3-methyl-4-carboxybutylthiophene).
Examples of the polypyrrole include polypyrrole, poly(N-methylpyrrole), poly(3-methylpyrrole), poly(3-ethylpyrrole), poly(3-n-propylpyrrole), poly(3-butylpyrrole), poly(3-octylpyrrole), poly(3-decylpyrrole), poly(3-dodecylpyrrole), poly(3,4-dimethylpyrrole), poly(3,4-dibutylpyrrole), poly(3-carboxypyrrole), poly(3-methyl-4-carboxypyrrole), poly(3-methyl-4-carboxyethylpyrrole), poly(3-methyl-4-carboxybutylpyrrole), poly(3-hydroxypyrrole), poly(3-methoxypyrrole), poly(3-ethoxypyrrole), poly(3-butoxypyrrole), poly(3-hexyloxypyrrole), poly(3-methyl-4-hexyloxypyrrole), and poly(3-methyl-4-hexyloxypyrrole).
Examples of the aniline monomer having an acidic group and/or salt on side chain of recurring unit are described in JP-A 2014-015550, paragraphs [0019] to [0024].
Examples of the thiophene monomer having an acidic group and/or salt on side chain of recurring unit are described in JP-A 2014-028759, paragraphs [0055] to [0067] and JP-A 2014-028760, paragraphs [0049] to [0054] (WO 2014/007299).
The foregoing monomers may be used alone or in admixture.
The polyanion used herein is a polymer having a plurality of anion groups in the molecule, which may be obtained by polymerizing an anion group-bearing monomer, or by copolymerizing an anion group-bearing monomer with an anion group-free monomer. The monomers may be used alone or in admixture. A polyanion may also be obtained by once forming an anion group-free polymer and sulfonating it with a sulfonating agent such as sulfuric acid, fuming sulfuric acid or sulfamic acid. Further, by once forming an anion group-bearing polymer and sulfonating it, there may be obtained a polyanion having more anion groups.
Examples of the monomer from which the polyanion is constituted include monomers having a strong acid group such as —O—SO3 H′, —SO3H′, —CH(CF3) —CF2—SO3H′, —CF2—SO3H′, —COO H′, —O—PO4−H+, or —PO4−H+. Of these, —SO3−H−, —CH(CF3)—CF2—SO3−H−, —CF2—SO3−H′, and —COO−H+ are preferred for doping of the n-conjugated electroconductive polymer therewith. Also preferably, the anion group is positioned contiguous to or spaced apart from the main chain of polyanion.
Examples of the monomer having a sulfonic acid group include styrenesulfonic acid, allyloxybenzenesulfonic acid, methallyloxybenzenesulfonic acid, vinylsulfonic acid, allylsulfonic acid, methallylsulfonic acid, 2-(methacryloxy)ethanesulfonic acid, 4-(methacryloxy)butanesulfonic acid, isoprenesulfonic acid, 2-acrylamide-2-methylpropanesulfonic acid, 1,1,3,3,3-pentafluoro-2-methacryloyloxypropane-1-sulfonic acid, 1,1-difluoro-2-methacryloyloxyethanesulfonic acid, 1,1,3,3,3-pentafluoro-2-(4-vinylbenzoyloxy)propane-1-sulfonic acid, 1,1-difluoro-2-(4-vinylbenzoyloxy)ethanesulfonic acid, and benzyltrimethylammonium difluorosulfoacetic acid 2-methacryloyloxyethyl ester. The monomers may be used alone or in admixture.
Examples of the monomer having a phosphoric acid group include 3-chloro-2-acid phosphoxypropyl (meth)acrylate, acid phosphoxypolyoxyethylene glycol mono(meth)acrylate, mono(2-hydroxyethyl acrylate)acid phosphate, mono(2-hydroxyethyl methacrylate) acid phosphate, mono(2-hydroxypropyl acrylate)acid phosphate, mono(2-hydroxypropyl methacrylate) acid phosphate, mono(3-hydroxypropyl acrylate)acid phosphate, mono(3-hydroxypropyl methacrylate) acid phosphate, diphenyl-2-acryloyloxyethyl phosphate, and diphenyl-2-methacryloyloxyethyl phosphate.
Examples of the monomer having a carboxyl group include ethylenically unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid, ethylenically unsaturated polycarboxylic acids and acid anhydrides such as maleic acid, fumaric acid, and itaconic acid, and partially esterified products of ethylenically unsaturated polycarboxylic acids such as methyl maleate and methyl itaconate.
The anion group-free monomer which is copolymerizable with the anion group-bearing monomer may be any of well-known compounds. Examples include conjugated diene monomers such as 1,3-butadiene, isoprene, 2-chloro-1,3-butadiene, and 2-methyl-1,3-butadiene; aromatic vinyl monomers such as styrene, a-methylstyrene and p-methylstyrene; ethylenically unsaturated carboxylic acid alkyl ester monomers such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl(meth)acrylate, and 2-ethylhexyl (meth)acrylate; ethylenically unsaturated carboxylic acid amide monomers such as acrylamide, methacrylamide, N,N-dimethylacrylamide, and N-methylolacrylamide; ethylenically unsaturated carboxylic acid hydroxyalkyl ester monomers such as hydroxyalkyl(meth)acrylates and glycerol di(meth)acrylate; carboxylic acid vinyl ester monomers such as vinyl acetate; (meth)acrylonitrile, N-vinylpyrrolidone, (meth)acryloylmorpholine, cyclohexylmaleimide, isopropylmaleimide, and glycidyl (meth)acrylate.
The polyanion used herein may be obtained by adding an initiator to the above monomer(s) and letting them polymerize. The monomers may be used alone or in admixture.
JP-A 2008-133448 and JP-A 2010-077404 propose an acid generator in the form of a polymeric sulfonium salt capable of generating a sulfonic acid which is fluorinated at a-position. While a sulfonium salt of a-fluorinated sulfonic acid bound to a polymer backbone is decomposed via photolysis to generate a sulfonic acid which is a super-strong acid with minimal diffusion, the polyanion may be obtained by homo- or co-polymerizing recurring units containing the sulfonium salt. When the polymeric sulfonium salt is an alkali metal salt, ammonium salt or amine salt, its solution is preferably made acidic by previously adding an inorganic or organic acid such as sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid or perchloric acid or using a cation exchange resin.
Further, the polyanion may be obtained by polymerizing styrene, methylstyrene or the like, and sulfonating the polymer with a sulfonating agent such as sulfuric acid, fuming sulfuric acid or sulfamic acid. The polyanions may also be obtained from sulfonation of polyether ketone (EP 0041780), sulfonation of polyether ether ketone (JP-A 2008-108535), sulfonation of polyether sulfone (JP-A H10-309449), sulfonation of polyphenylene, polyfluorene or polyvinylcarbazole (JP-A 2010-514161), sulfonation of polyphenylene oxide, and sulfonation of polyphenylene sulfide.
Of the foregoing polyanions, preferred from the aspects of solvent solubility and electroconductivity are polyisoprenesulfonic acid, copolymers containing polyisoprenesulfonic acid, polysulfoethyl methacrylate, copolymers containing polysulfoethyl methacrylate, poly(4-sulfobutyl methacrylate), copolymers containing poly(4-sulfobutyl methacrylate), polymethallyloxybenzene sulfonic acid, copolymers containing polymethallyloxybenzene sulfonic acid, polystyrene sulfonic acid, copolymers containing polystyrene sulfonic acid, copolymers containing poly(1,1,3,3,3-pentafluoro-2-methacryloyloxypropane-1-sulfonic acid), copolymers containing poly(1,1-difluoro-2-methacryloyl-oxyethanesulfonic acid, copolymers containing poly(1,1,3,3,3-pentafluoro-2-(4-vinylbenzoyloxy)propane-1-sulfonic acid), copolymers containing poly(1,1-difluoro-2-(4-vinylbenzoyl-oxy)ethanesulfonic acid), and copolymers containing polydifluorosulfoacetic acid 2-methacryloyloxyethyl ester. More preferred are polystyrene sulfonic acid, poly(1,1,3,3,3-pentafluoro-2-methacryloyloxypropane-1-sulfonic acid), copolymers containing poly(1,1-difluoro-2-methacryloyloxy-ethanesulfonic acid), copolymers containing poly(1,1,3,3,3-pentafluoro-2-(4-vinyl-benzoyloxy)propane-1-sulfonic acid), copolymers containing poly(1,1-difluoro-2-(4-vinylbenzoyl-oxy)ethanesulfonic acid), polydifluorosulfoacetic acid 2-methacryloyloxyethyl ester, polysulfoethyl methacrylate, and poly(4-sulfobutyl methacrylate).
With respect to degree of polymerization, the polyanion preferably contains 10 to 100,000 monomeric units, and it is more preferred from the aspects of solvent solubility and electroconductivity that the polyanion contain 50 to 10,000 monomeric units. The polyanion preferably has a Mw of 5,000 to 1,000,000. If Mw is below the lower limit, the π-conjugated electroconductive polymer is sometimes unlikely to form a uniform solution. If Mw is above the upper limit, electroconductivity may be worsened.
The antistatic film may contain an amino acid. The amino acid used herein preferably has the formula (6).
Herein R101 and 8102 are each independently hydrogen or a straight, branched or cyclic C1-C20 monovalent hydrocarbon group which may be separated by a heteroatom. R103 and R104 are each independently hydrogen or a straight, branched or cyclic C1-C20 monovalent hydrocarbon group which may be separated by a heteroatom. A pair of R101 and R103 or R101 and R104 may bond together to form a ring with the carbon and nitrogen atoms to which they are attached. L1 is a straight, branched or cyclic C1-C20 divalent hydrocarbon group which may be separated by a heteroatom.
Examples of the amino acid having formula (6) are given below, but not limited thereto.
When the antistatic film contains an amino acid, the amount of the amino acid is preferably 1 to 50 parts, more preferably 3 to 10 parts by weight per 100 parts by weight of the electroconductive polymer.
To enable formation of an antistatic film, the aforementioned component is dissolved in a solvent to form an antistatic film-forming composition.
The solvent used herein may be water or a mixture of water and an organic solvent. The organic solvent is preferably a water-miscible solvent in which the electroconductive polymer may be dissolved or dispersed. Exemplary of the organic solvent are polar solvents such as N-methyl-2-pyrrolidone, N,N′-dimethylformamide, N,N′-dimethylacetamide, dimethyl sulfoxide, and hexamethylphosphortriamide; alcohols such as methanol, ethanol, propanol, and butanol; polyhydric aliphatic alcohols such as ethylene glycol, propylene glycol, dipropylene glycol, 1,3-butylene glycol, 1,4-butylene glycol, D-glucose, D-glucitol, isoprene glycol, butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol, and neopentyl glycol; carbonates such as ethylene carbonate and propylene carbonate; cyclic ethers such as dioxane and tetrahydrofuran; linear ethers such as dialkyl ethers, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, polyethylene glycol dialkyl ethers, and polypropylene glycol dialkyl ethers; heterocyclic compounds such as 3-methyl-2-oxazolidinone; and nitrile compounds such as acetonitrile, glutaronitrile, methoxyacetonitrile, propionitrile, and benzonitrile. These solvents may be used alone or in admixture. The water-miscible solvent is mixed with water in an amount of up to 50% by weight of the mixture.
An appropriate amount of the electroconductive polymer in the antistatic film-forming composition is 0.05 to 10.0% by weight. At least 0.05 wt % of the conductive polymer provides the composition with sufficient conductivity. A uniform conductive film is readily formed when the amount of the conductive polymer is up to 10.0 wt %, especially up to 5.0 wt %.
A surfactant may be added to the antistatic film-forming composition to make the composition more wettable to a workpiece or substrate. The preferred surfactants are nonionic ones. Examples include polyoxyethylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyoxyethylene carboxylic acid esters, sorbitan esters, polyoxyethylene sorbitan esters, and acetylene glycol.
An appropriate amount of the surfactant used is 1 to 50 parts, more preferably 2 to 20 parts by weight per 100 parts by weight of the composite of polyaniline based electroconductive polymer and polyanion. If the amount of the surfactant is at or above the lower limit, the composition is wettable to the resist surface. If the amount of the surfactant is at or below the upper limit, the antistatic effect is not affected.
The antistatic film-forming composition may be prepared, for example, by mixing the composite of n-conjugated electroconductive polymer and polyanion, additive, solvent, and optionally surfactant, adjusting pH and optionally filtering through a filter.
The resist film containing component (A) has the advantage that it is amenable to the lithography of irradiating high-energy radiation to a resist film in the absence of liquid. Examples of the high-energy radiation include EB, x-ray, excimer laser light, γ-ray, and synchrotron radiation. Of course, advantages are obtained in the lithography using a photomask. The resist film is particularly advantageous when combined with such lithography processes as irradiation in vacuum and irradiation of high-energy beam, but excluding the immersion lithography. A typical lithography process is EB lithography.
The process of forming a resist pattern by exposing the resist film to a pattern of radiation, followed by post treatment and development is known from numerous publications including the patent documents cited herein. The process of the invention may be carried out in accordance with these teachings.
For example, in the processing of a photomask blank using EB, a resist film and optionally an antistatic film are formed on a photomask blank by the above-mentioned procedure. Thereafter, using an EB exposure system, EB is irradiated to the region of the resist film where the underlying film such as a light-shielding film is to be removed. While the exposure dose may be adjusted as appropriate by controlling the amounts of photoacid generator and basic compound added, an exposure dose of about 0.1 to 20 μC/cm2 is generally preferred, with an exposure dose of about 3 to 10 μC/cm2 being more preferred.
After the pattern exposure, the photomask blank is baked (PEB) on a hot plate at 60 to 150° C. for 1 to 20 minutes, and preferably at 80 to 120° C. for 1 to 10 minutes.
This is followed by development in an aqueous alkaline developer. Development is typically carried out in an aqueous solution of 0.1 to 5 wt %, preferably 2 to 3 wt % tetramethylammonium hydroxide (TMAH) for 0.1 to 3 minutes, preferably 0.5 to 2 minutes by a conventional technique such as dip, puddle or spray technique. In this way, a desired resist pattern is formed.
In processing the photomask blank having a resist pattern formed thereon to form a photomask, either wet etching or dry etching may be used, with dry etching being preferred because a photomask with a higher accuracy is obtained. With respect to the dry etching of photomask blanks, a number of techniques are already known as disclosed in JP-A 2006-078807 and JP-A 2006-140635, for example. For a film of a chromium compound, for example, oxygen-containing chlorine dry etching is generally used. For a film of a silicon compound, transition metal-containing silicon compound or tantalum compound, fluorine dry etching is generally used.
Synthesis Examples, Preparation Examples, Examples, Reference Examples, and Comparative Examples are given below for further illustrating the invention although the invention is not limited thereto. Mw is a weight average molecular weight as measured versus polystyrene standards by GPC using tetrahydrofuran solvent. The compositional ratio of a polymer was analyzed by 1H-NMR.
Polymerizable monomers (Monomers 1 to 6) used in Synthesis Examples have the following structural formulae.
Monomers 1, 2, 4 and 5 were synthesized according to the teaching of JP-A 2007-204385, JP-A 2007-204448, JP-A 2012-032762, and JP-A 2008-111103. Monomers 3 and 6 are commercially available from Tokyo Chemical Industry Co., Ltd.
Synthesis of Polymer A1
In a nitrogen atmosphere, 87 g of Monomer 1, 13 g of Monomer 2, and 4.3 g of dimethyl 2,2′-azobisisobutyrate were dissolved in 155 g of a 7/3 mixture of methyl ethyl ketone and toluene. With stirring at 80° C. in a nitrogen atmosphere, the solution was added dropwise to 78 g of a 7/3 mixture of methyl ethyl ketone and toluene over 4 hours. At the end of dropwise addition, the solution was aged at 80° C. for 2 hours. The polymerization solution was cooled to room temperature and added dropwise to 1,500 g of hexane. The solid precipitate was filtered, washed with 600 g of hexane, and vacuum dried at 60° C. for 20 hours, obtaining a polymer in white powder solid form. The polymer having the following formula is designated Polymer A1. Amount 70 g, yield 70%.
Synthesis of Polymers A2, A3 and Comparative Polymers A4, A5
Polymers A2, A3 and Comparative Polymers A4, A5 were synthesized by the same procedure as in Synthesis Example 1 aside from changing the type and ratio of monomers and the ratio of solvent mixture.
Synthesis of Polymer P1
In a nitrogen atmosphere flask, 44.3 g of 5-phenyldibenzothiophenium 1,1,3,3,3-pentafluoro-2-(3-methacryloyloxy-adamantane-1-carbonyloxy)propane-1-sulfonate, 24.8 g of 4-ethyltetracyclo [6 .2.1.13,7. 02,6] dodecane-4-yl methacrylate, 20.2 g of 2-oxo-4-oxahexahydro-3,5-methano-2H-cyclopenta[b]furan-6-yl methacrylate, 10.7 g of 4-hydroxyphenyl methacrylate, 3.5 g of methyl 2,2′-azobisisobutyrate, and 0.7 g of mercaptoethanol were dissolved in 175 g of methyl ethyl ketone to form a monomer solution. A reactor with a nitrogen atmosphere was charged with 58 g of methyl ethyl ketone, which was heated at 80° C. with stirring. With stirring, the monomer solution was added to the reactor over 4 hours. At the end of dropwise addition, the polymerization solution was continuously stirred for 2 hours while maintaining the temperature at 80° C. The solution was cooled to room temperature and added dropwise to 1,000 g of hexane, with stirring. The precipitate was filtered, washed twice with a mixture of 162 g of methyl ethyl ketone and 437 g of hexane, and vacuum dried at 50° C. for 20 hours, obtaining 93 g of a polymer in white powder form. The polymer having the following formula is designated Polymer P1.
Synthesis of Polymer B1
A flask was charged with 407.5 g of acetoxystyrene, 42.5 g of acenaphthylene, and 1,275 g of toluene as solvent. The reactor was cooled at -70° C. in a nitrogen atmosphere, after which vacuum pumping and nitrogen flow were repeated three times. The reactor was warmed up to room temperature, whereupon 34.7 g of 2,2′-azobis(2,4-dimethylvaleronitrile) (V-65 by Wako Pure Chemical Industries, Ltd.) was added as polymerization initiator. The reactor was heated at 55° C., whereupon reaction ran for 40 hours. With stirring, a mixture of 970 g of methanol and 180 g of water was added dropwise to the reaction solution. After 30 minutes of standing, the lower layer (polymer layer) was concentrated under reduced pressure. The polymer layer concentrate was dissolved again in 0.45 L of methanol and 0.54 L of tetrahydrofuran (THF), to which 160 g of triethylamine and 30 g of water were added. The reaction mixture was heated at 60° C. for 40 hours for deprotection reaction. The reaction solution was concentrated under reduced pressure. To the concentrate, 548 g of methanol and 112 g of acetone were added for dissolution. With stirring, 990 g of hexane was added dropwise to the solution. After 30 minutes of standing, 300 g of THF was added to the lower layer (polymer layer). With stirring, 1,030 g of hexane was added dropwise thereto. After 30 minutes of standing, the lower layer (polymer layer) was concentrated under reduced pressure. The polymer solution was neutralized with 82 g of acetic acid. The reaction solution was concentrated, dissolved in 0.3 L of acetone, and poured into 10 L of water for precipitation. The precipitate was filtered and vacuum dried at 50° C. for 20 hours, yielding 280 g of a polymer in white powder form. Under acidic conditions, 100 g of the polymer was reacted with 2-methyl-1-propenyl 8-tricyclo[5.2.1.02′6]decanyl ether. This was followed by neutralization, phase separation, and crystallization, obtaining 120 g of a polymer, designated Polymer B1.
Synthesis of Polymer B2
Polymer B2 was synthesized by the same procedure as in Synthesis Example 5 aside from using 2-methyl-1-propenyl 2-adamantyl ether instead of 2-methyl-1-propenyl 8-tricyclo[5.2.1.02, 6]decanyl ether.
Synthesis of Polymer B3
In nitrogen atmosphere, 66.0 g of 4-acetoxystyrene, 8.9 g of acenaphthylene, 25.2 g of 4-(1-methyl-1-cyclohexyloxy)-styrene, 10.7 g of dimethyl 2,2′-azobis(2-methylpropionate) (V-601 by Wako Pure Chemical Industries, Ltd.), and 150 g of methyl ethyl ketone were fed into a dropping cylinder to form a monomer solution. A flask in nitrogen atmosphere was charged with 75 g of methyl ethyl ketone, which was heated at 80° C. with stirring. With stirring, the monomer solution was added dropwise to the flask over 4 hours. After the completion of dropwise addition, the polymerization solution was continuously stirred for 18 hours while maintaining its temperature at 80° C. The polymerization solution was cooled to room temperature, whereupon it was added dropwise to 1,500 g of hexane. The precipitate was collected by filtration and washed twice with 300 g of hexane. The copolymer was dissolved in a mixture of 180 g of THF and 60 g of methanol, to which 24.9 g of ethanol amine was added. Under reflux, the solution was stirred for 3 hours. The reaction solution was concentrated under reduced pressure and dissolved in ethyl acetate. This was followed by neutralization, phase separation, and crystallization, obtaining 71 g of Polymer B3 having the following formula.
Synthesis of Polymer B4
Polymer B4 was synthesized by the same procedure as in Synthesis Example 5 aside from using 8-tricyclo[5.2.1.021decanyl vinyl ether instead of 2-methyl-1-propenyl 8-tricyclo[5.2.1.02, 6]decanyl ether.
Synthesis of Polymer B5
In nitrogen atmosphere, 12.7 g of 4-ethyltetracyclo[6.2.1.13, 7.02,6]dodecan-4-yl methacrylate, 29.5 g of 1-ethylcyclopentan-1-yl methacrylate, 16.4 g of 3-hydroxyadamantan-1-yl methacrylate, 41.5 g of 2-oxo-4-oxahexahydro-3,5-methano-2H-cyclopenta[b]furan-6-yl methacrylate, and 5.3 g of dimethyl 2,2′-azobisisobutyrate were dissolved in 175 g of methyl ethyl ketone to form a monomer solution. To 60 g of methyl ethyl ketone which was stirred at 80° C. in nitrogen atmosphere, the monomer solution was added dropwise over 4 hours. After the completion of dropwise addition, the polymerization solution was continuously stirred for 2 hours while maintaining its temperature at 80° C. The polymerization solution was cooled to room temperature, whereupon it was added dropwise to 1,000 g of hexane. The solid precipitate was collected by filtration, washed with 600 g of hexane, and vacuum dried at 50° C. for 20 hours, obtaining 86 g of Polymer B5 in white powder form, having the following formula.
Preparation of Resist Compositions
Positive resist compositions in solution form were prepared by dissolving Polymers A1 to A3, Comparative Polymers A4, A5, Polymer P1, Polymers B1 to B5, a photoacid generator, and a basic compound in an organic solvent in accordance with the formulation shown in Table 1, and filtering through a filter with a pore size of 0.2 μm or a nylon or UPE filter with a pore size of 0.02 μm. The photoacid generators used are PAG-1 and 2. The basic compounds are Base-1 to 3. The organic solvents are PGMEA (propylene glycol monomethyl ether acetate), CyHo (cyclohexanone), and EL (ethyl lactate). Each composition contained 0.075 parts by weight of surfactant PF-636 (Omnova Solutions).
Photoacid generator: PAG-1, 2
Using a coater/developer system ACT-M (Tokyo Electron Ltd.), each of the positive resist compositions (Preparation Examples 1 to 11 and Reference Preparation Examples 1 to 5) was spin coated on a photomask blank of 152 mm squares having a chromium oxynitride film at the outermost surface and prebaked on a hot plate at 90° C. for 600 seconds to form a resist film of 80 nm thick. The thickness of the resist film was measured by an optical film thickness measurement system Nanospec (Nanometrics Inc.). Measurement was made at 81 points in the plane of the blank substrate excluding a peripheral band extending 10 mm inward from the blank periphery, and an average film thickness and a film thickness range were computed therefrom.
The coated mask blanks were exposed to electron beam using an EB writer system EBM-5000Plus (NuFlare Technology Inc., accelerating voltage 50 keV), then baked (PEB) at 90° C. for 600 seconds, and developed in a 2.38 wt % tetramethylammonium hydroxide (TMAH) aqueous solution, thereby yielding positive patterns.
The patterned photomask blank was observed under a top-down scanning electron microscope (TDSEM). The optimum exposure (Eop) was defined as the exposure dose (μC/cm2) which provided a 1:1 resolution at the top and bottom of a 400-nm 1:1 line-and-space pattern. The maximum resolution of the resist was defined as the minimum line width of a line-and-space pattern that could be resolved at the optimum exposure.
The results are shown in Table 2. No substantial difference in resolution was found between Examples 1 to 11 using the resist compositions containing the fluorine-containing resin (Preparation Examples 1 to 11) and Reference Examples 1 to 5 using the resist compositions not containing the fluorine-containing resin (Reference Preparation Examples 1 to 5). It is demonstrated that the fluorine-containing resin does not adversely affect resolution.
Each of the positive resist compositions (Preparation Examples 12 to 22 and Comparative Preparation Examples 1 to 6) was coated on a photomask blank to form a resist film under the same conditions as above. Using a coater/developer system ACT-M (Tokyo Electron Ltd.), an electroconductive polymer composition was spin coated over the resist film and baked on a hot plate at 90° C. for 600 seconds to form an antistatic film of 60 nm thick. The electroconductive polymer composition used was a water dispersion of polystyrene-doped polyaniline as described in Proc. SPIE Vol. 8522, 852200-1. It was examined whether or not the antistatic film was effectively formed, with the results shown in Table 3. The sample was rated good (0) when the antistatic film was effectively formed and NG (x) when the antistatic film could not be formed.
The resist films containing Polymers A1 to A3 (Examples) are fully receptive to formation of an antistatic film thereon. On the other hand, the resist films containing Comparative Polymers A4 and A5 (Comparative Examples 1, 2, 4, 5) are not receptive to formation of an antistatic film. In these Comparative Examples, the aqueous antistatic film-forming composition could not be effectively coated because fluorine atoms in the fluorine-containing polymer exerted water repellency. In contrast, the resist films of Examples use the polymers which contain not only fluorine atoms, but also phenolic hydroxyl group-bearing units, and therefore have improved affinity to the aqueous antistatic film-forming composition, allowing a satisfactory antistatic film to be formed.
The photomask blanks having an antistatic film formed on a resist film as prepared in the evaluation of antistatic film receptivity (Examples 12 to 22 and Comparative Examples 3, 6) were exposed to electron beam using an EB writer system EBM-5000Plus (NuFlare Technology Inc., accelerating voltage 50 keV), then baked (PEB) at 90° C. for 600 seconds, and developed in a 2.38 wt % TMAH aqueous solution, thereby yielding positive patterns. The resist patterns were evaluated by the following tests.
Optimum Dose and Maximum Resolution
These items were evaluated as in Examples 1 to 11.
Surface Resistivity
The surface resistivity of resist film and antistatic film was measured by a resistivity meter Hiresta-UP MCP-HT450 (Mitsubishi Chemical Analytech Co., Ltd.).
Sensitivity Chancre
The sensitivity of Examples 1 to 11 and the sensitivity of Examples 12 to 22 (corresponding to Examples 1 to 5 plus antistatic film) were compared, from which a deviation (%) was computed.
Film Thickness Loss Chancre
A percent change of film thickness loss is computed according to the equation:
Change of film thickness loss (%)=(T3−T2)/T1×100
wherein T1 is the thickness of a resist film prior to exposure, T2 is the thickness of a resist film having no conductive polymer film formed thereon (Examples 1 to 5) in the unexposed region after exposure and development, and T3 is the thickness of a resist film having a conductive polymer film formed thereon (Examples 6 to 10) in the unexposed region after exposure and development.
Pattern Profile
The resist pattern was cut before a SEM image of the section was visually observed.
PCD
The photomask blank was aged for 2 weeks after formation of an antistatic film before it was exposed in the same dose as the dose of exposure provided immediately after formation of an antistatic film so as to resolve a 400-nm line-and-space pattern. A line width was measured, and a difference from the initial line width was computed. A change of line width per day is expressed as post-coating delay (PCD). The results are shown in Table 4. A smaller value of PCD indicates that the resist film is more stable against changes with time after formation of antistatic film.
In the resist films of Examples 12 to 22 having antistatic film formed thereon, patterns could be formed at a high accuracy of writing position due to their low surface resistivity. In the resist films of Examples 1 and 6 on which no antistatic film had been formed, resolution and pattern profile were satisfactory, but the accuracy of writing position was inferior to that of Examples 12 to 22 due to their high surface resistivity.
The resist compositions not containing fluorine-containing resin (Comparative Examples 3 and 6) showed inferior pattern profile and PCD. The degradation of performance observed in these Comparative Examples was not observed in Examples 12 to 22. It is believed that disadvantages of Comparative Examples are the result of the acid penetrating from the antistatic film into the resist film whereas advantages of Examples are the result of the fluorine-containing resin preventing the acid from penetrating from the antistatic film into the resist film.
Japanese Patent Application No. 2014-237282 is incorporated herein by reference.
Although some preferred embodiments have been described, many modifications and variations may be made thereto in light of the above teachings. It is therefore to be understood that the invention may be practiced otherwise than as specifically described without departing from the scope of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014-237282 | Nov 2014 | JP | national |
This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No. 2014-237282 filed in Japan on Nov. 25, 2014, the entire contents of which are hereby incorporated by reference.
