Claims
- 1. An arrangement for forming a layer over a semiconductor substrate, comprising:
means for illuminating the substrate; means for adjusting the illumination on the substrate; and means for controlling the dispensation of a material over the substrate as a function of the adjusted illumination.
- 2. An arrangement for forming a layer over a semiconductor substrate, comprising:
a light source adapted to illuminate the semiconductor substrate; a controller coupled to the light source and adapted to adjust the illumination on the substrate, the controller further adapted to selectively control the dispensation of a material over the substrate as a function of the adjusted illumination.
- 3. The arrangement of claim 2, further including an enclosed area for forming the layer on the substrate, the enclosed area comprising walls having a non-reflective material coating thereon.
- 4. The arrangement of claim 2, wherein the controller includes a photodiode detector.
- 5. The arrangement of claim 2, further including an enclosed area for forming the layer on the substrate, the enclosed area comprising walls having a non-reflective material coating thereon, and wherein the controller includes a photodiode detector.
- 6. The arrangement of claim 2, wherein the controller includes a light source controller coupled to the photodiode.
RELATED PATENT DOCUMENTS
[0001] This is a divisional of patent application Ser. No. 09/452,341, filed on Nov. 30, 1999 (VLSI.273PA/PHA 51232), to which Applicant claims priority under 35 U.S.C. §120.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09452341 |
Nov 1999 |
US |
Child |
09990991 |
Nov 2001 |
US |