Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same

Abstract

A photosensitive resin composition comprises: a polybenzoxazole precursor (A); a naphthoquinone diazide photosensitizer (B); and a specific phenolic hydroxyl group-containing compound (C).

Description

Claims

1. A photosensitive resin composition comprising: a polybenzoxazole precursor (A);a naphthoquinone diazide photosensitizer (B); anda phenolic hydroxyl group-containing compound (C) represented by general formula (I):

2. The photosensitive resin composition according to claim 1, wherein the naphthoquinone diazide photosensitizer (B) comprises two or more kinds of naphthoquinone diazide photosensitizers.

3. A method for manufacturing a semiconductor apparatus, comprising: coating the photosensitive resin composition according to claim 1 on a semiconductor element;prebaking the coated photosensitive resin composition;exposing the prebaked photosensitive resin composition;developing the exposed photosensitive resin composition; andheating the developed photosensitive resin composition so as to obtain the semiconductor apparatus.