The present disclosure relates to a physical quantity sensor, a physical quantity sensor device, an inertial measurement unit, and the like.
In the related art, a physical quantity sensor that detects a physical quantity such as acceleration is known. As such a physical quantity sensor, for example, a seesaw type acceleration sensor that detects acceleration in a Z-axis direction is known. For example, JP-T-2008-529001 discloses an acceleration sensor that implements high sensitivity by forming a plurality of inter-electrode gaps by providing a step on a back surface side of a movable body. JP-A-2013-040856 discloses an acceleration sensor that implements high sensitivity by forming a plurality of inter-electrode gaps by providing a step in a detector on a substrate. JP-A-2019-045172 discloses an acceleration sensor in which sticking of a movable body to a substrate is prevented by providing a stopper on a substrate side.
In JP-T-2008-529001, since stoppers are provided on both the movable body and the substrate, an inter-electrode gap distance is conversely increased, and it is difficult to achieve the high sensitivity. In JP-A-2013-040856, an electrode or a wiring provided on a surface of the substrate may be disconnected at a step of the substrate. In JP-A-2019-045172, since the stopper is provided on the substrate, the inter-electrode gap distance between the movable body and a fixed electrode of the substrate increases, and thus it is difficult to achieve the high sensitivity. As described above, the structures in JP-T-2008-529001, JP-A-2013-040856, and JP-A-2019-045172 have a problem in that it is difficult to implement both high sensitivity and prevention of sticking.
An aspect of the present disclosure relates to a physical quantity sensor including: a substrate on which a first fixed electrode is provided, the first fixed electrode being orthogonal to a Z axis when three axes orthogonal to one another are an X axis, a Y axis, and a Z axis; and a movable body including a first mass portion facing the first fixed electrode in a Z-axis direction along the Z axis, and provided to be swingable with respect to the substrate about a rotation axis along the Y axis. The movable body includes a first surface that is a surface on a substrate side, and a second surface that is a surface on a back side with respect to the first surface. On the first surface of the first mass portion, a first region to an n-th region, n being an integer equal to or greater than 2, are provided so as to face the first fixed electrode with a gap therebetween, a step is provided between adjacent regions, and the first region to the n-th region are disposed in order from a closest region to the rotation axis. Ends of the first region to the n-th region on a side far from the rotation axis are set as a first end to an n-th end. In a cross-sectional view from the Y-axis direction along the Y axis, in a state where the movable body is maximally displaced around the rotation axis, when a virtual straight line having a smallest angle with the X axis among virtual straight lines passing through two ends of the first end to the n-th end is set as a first virtual straight line, a straight line along a main surface of the first fixed electrode is set as a second virtual straight line, a straight line intersecting with an end of the first fixed electrode closest to the rotation axis and extending along the Z axis is set as a first normal line, and a straight line intersecting with an end of the first fixed electrode farthest from the rotation axis and extending along the Z axis is set as a second normal line, the first virtual straight line and the second virtual straight line do not intersect with each other in a region between the first normal line and the second normal line.
Another aspect of the present disclosure relates to a physical quantity sensor device including the physical quantity sensor described above and an electronic component electrically coupled to the physical quantity sensor.
Another aspect of the present disclosure relates to an inertial measurement unit including the physical quantity sensor described above and a controller that performs control based on a detection signal output from the physical quantity sensor.
Hereinafter, the present embodiment will be described. Embodiments described below do not unduly limit the scope of the claims. All of the configurations described in the present embodiment are not necessarily essential constituent elements. In the following drawings, some components may be omitted for convenience of description. In each of the drawings, for ease of understanding, a dimensional ratio of each component is different from the actual dimensional ratio.
First, a physical quantity sensor 1 according to a first embodiment will be described with reference to
The physical quantity sensor 1 shown in
As shown in
As the substrate 2, for example, a glass substrate made of a glass material containing alkali metal ions, for example, borosilicate glass such as glass of Pyrex (registered trademark) or Tempax (registered trademark) can be used. However, a constituent material of the substrate 2 is not particularly limited. For example, a silicon substrate, a quartz substrate, and a silicon on insulator (SOI) substrate may be used.
As shown in
As the lid 5, for example, a silicon substrate can be used. However, the present disclosure is not particularly limited thereto. For example, a glass substrate or a quartz substrate may be used as the lid 5. As a method of bonding the substrate 2 and the lid 5, for example, anodic bonding, activation bonding, bonding using a bonding material such as glass frit, or the like can be used. However, the method is not particularly limited thereto, and may be appropriately selected depending on the material of the substrate 2 or the lid 5. The glass frit is also referred to as powder glass or low-melting glass.
The movable body 3 can be formed, for example, by etching a conductive silicon substrate doped with an impurity such as phosphorus (P), boron (B), or arsenic (As), particularly by a Bosch process which is a deep etching technique.
The movable body 3 is swingable around a rotation axis AY along the Y-axis direction. The movable body 3 includes fixing portions 32a and 32b, a support beam 33, a first mass portion 34, a second mass portion 35, and a torque generator 36. The torque generator 36 can also be referred to as a third mass portion. The fixing portions 32a and 32b, which are H-shaped central anchors, are bonded to the upper surfaces of the mount portions 22a and 22b of the substrate 2 by the anodic bonding or the like. The support beam 33 extends in the Y-axis direction, forms a rotation axis AY, and is used as a torsion spring. That is, when acceleration az acts on the physical quantity sensor 1, the movable body 3 swings about the rotation axis AY while twisting and deforming the support beam 33 with the support beam 33 as the rotation axis AY. The rotation axis AY can also be called a swing axis. The rotation of the movable body 3 about the rotation axis AY is a swing of the movable body 3 about the swing axis.
The movable body 3, which is a movable electrode, has a rectangular shape whose longitudinal direction is the X-axis direction in a plan view from the Z-axis direction. Then, the first mass portion 34 and the second mass portion 35 of the movable body 3 are disposed with the rotation axis AY along the Y-axis direction sandwiched therebetween in the plan view from the Z-axis direction. Specifically, in the movable body 3, the first mass portion 34 and the second mass portion 35 are connected by a first connector 41, and first openings 45a and 45b are provided between the first mass portion 34 and the second mass portion 35. The fixing portions 32a and 32b and the support beam 33 are disposed in the first openings 45a and 45b. In this way, by disposing the fixing portions 32a and 32b and the support beam 33 inside the movable body 3, it is possible to reduce the size of the movable body 3. The torque generator 36 is connected to the first mass portion 34 at both ends in the Y axis direction by a second connector 42. A second opening 46 is provided between the first mass portion 34 and the torque generator 36 in order to make the area of the first mass portion 34 equal to the area of the second mass portion 35. The first mass portion 34 and the torque generator 36 are located on the positive side in the X-axis direction with respect to the rotation axis AY. The second mass portion 35 is located on the negative side in the X-axis direction with respect to the rotation axis AY. The first mass portion 34 and the torque generator 36 are longer in the X-axis direction than the second mass portion 35, and a rotational moment around the rotation axis AY when the acceleration az in the Z-axis direction is applied is larger than that of the second mass portion 35.
When the acceleration az in the Z-axis direction is applied, the movable body 3 seesaw swings around the rotation axis AY due to a difference in the rotational moment. The seesaw swinging means that when the first mass portion 34 is displaced to the positive side in the Z-axis direction, the second mass portion 35 is displaced to the negative side in the Z-axis direction. Conversely, when the first mass portion 34 is displaced to the negative side in the Z-axis direction, the second mass portion 35 is displaced to the positive side in the Z-axis direction.
In the movable body 3, the first connector 41 and the fixing portions 32a and 32b arranged in the Y-axis direction are coupled to each other by the support beam 33 extending in the Y-axis direction. Therefore, the movable body 3 can be displaced by the seesaw swinging around the rotation axis AY with the support beam 33 as the rotation axis AY.
The movable body 3 has a through hole group 70 in the entire region thereof. By the through hole group, damping of air at the time of seesaw swinging of the movable body 3 is reduced, and the physical quantity sensor 1 can be appropriately operated in a wider frequency range.
Next, the first fixed electrode 24, the second fixed electrode 25, and the dummy electrodes 26a, 26b, and 26c disposed on the bottom surface of the recess 21 of the substrate 2 will be described.
As shown in
The first fixed electrode 24 and the second fixed electrode 25 are electrically coupled to a differential QV amplifier, which is not shown. When the physical quantity sensor 1 is driven, a drive signal is applied to the movable body 3. The electrostatic capacitance Ca is formed between the first mass portion 34 and the first fixed electrode 24. The electrostatic capacitance Cb is formed between the second mass portion 35 and the second fixed electrode 25. In the natural state in which the acceleration az in the Z-axis direction is not applied, the electrostatic capacitances Ca and Cb are substantially equal to each other.
When the acceleration az is applied to the physical quantity sensor 1, the movable body 3 seesaw swings about the rotation axis AY. By the seesaw swinging of the movable body 3, a separation distance between the first mass portion 34 and the first fixed electrode 24 and a separation distance between the second mass portion 35 and the second fixed electrode 25 change in opposite phases. Accordingly, the electrostatic capacitances Ca and Cb change in opposite phases. Accordingly, the physical quantity sensor 1 can detect the acceleration az based on the difference between capacitance values of the electrostatic capacitances Ca and Cb.
In order to prevent electrification drift due to substrate surface exposure and adhesion at the time of anodic bonding after forming the movable body, the dummy electrodes 26a, 26b, and 26c are provided on a glass exposed surface of the substrate 2 other than the first fixed electrode 24 and the second fixed electrode 25. The dummy electrode 26a is located on the positive side in the X-axis direction with respect to the first fixed electrode 24, and is provided below the torque generator 36 so as to overlap the torque generator 36 in the plan view from the Z-axis direction. The dummy electrode 26b is provided below the support beam 33. The dummy electrode 26c is provided on a lower left side of the second mass portion 35. The dummy electrodes 26a, 26b, and 26c are electrically coupled by wiring, which is not shown. Accordingly, the dummy electrodes 26a, 26b, and 26c are set to the same potential. The dummy electrode 26b below the support beam 33 is electrically coupled to the movable body 3 which is a movable electrode. For example, a protrusion, which is not shown, is provided on the substrate 2, an electrode extending from the dummy electrode 26b is formed so as to cover a top of the protrusion, and the dummy electrode 26b is electrically coupled to the movable body 3 by the electrode coming into contact with the movable body 3. Accordingly, the dummy electrodes 26a, 26b, and 26c are set to the same potential as the movable body 3 which is the movable electrode.
As shown in
As described above, the physical quantity sensor 1 according to the present embodiment includes the substrate 2 which is orthogonal to the Z axis and on which the first fixed electrode 24 is provided when three axes orthogonal to one another are the X axis, the Y axis, and the Z axis, and the movable body 3 which includes the first mass portion 34 facing the first fixed electrode 24 in the Z axis direction and is provided to be swingable with respect to the substrate 2 about the rotation axis AY along the Y axis. The movable body 3 includes a first surface 6 which is a surface on the substrate 2 side and a second surface 7 which is a surface on the back side with respect to the first surface 6. For example, when the positive side in the Z-axis direction is an upward direction and the negative side in the Z-axis direction is the downward direction, the first surface 6 is the lower surface of the movable body 3 and the second surface 7 is the upper surface of the movable body 3.
Further, as shown in
Similarly, the first surface 6 of the second mass portion 35 is provided with regions RB1 to RB3 which face the second fixed electrode 25 with a gap therebetween, are provided with a step between adjacent regions, and are disposed from the region RB1 to the region RB3 in the order of closeness to the rotation axis AY. Specifically, a step is provided between the regions on the first surface 6 such that the gap distance between the second mass portion 35 and the second fixed electrode 25 in each region increases from the region RB1 toward the region RB3. For example, as shown in
Although the number of regions is three in
As described above, in the physical quantity sensor 1 according to the present embodiment, a plurality of inter-electrode gaps are formed by providing ends EA1 to EA3 and EB1 to EB3 which are steps on the first surface 6 which is the lower surface side of the movable body 3. In this way, it is possible to reduce the gap distances ha1 and hb1 in the regions RA1 and RB1 close to the rotation axis AY. Accordingly, it is possible to implement a narrow gap of the gap in the regions RA1 and RB1 close to the rotation axis AY, and thus it is possible to implement high sensitivity of the physical quantity sensor 1.
As described above, in the present embodiment, the high sensitivity is implemented by providing the step on the first surface 6 which is the lower surface side of the movable body 3. However, when the arrangement of the step or the like is not appropriate, a problem such as sticking in which the movable body 3 which is the movable electrode and the first fixed electrode 24 or the second fixed electrode 25 are stuck to each other occurs. Therefore, in the present embodiment, in order to prevent the occurrence of such a problem such as sticking, a method as described below is adopted.
For example, ends of the regions RA1 to RAn on the side far from the rotation axis are referred to as ends EA1 to EAn. The regions RA1 to RAn are the first region to the n-th region. The ends EA1 to EAn are the first end to the n-th end. In the example of
In a cross-sectional 1 view from the Y-axis direction, in a state where the movable body 3 is maximally displaced around the rotation axis AY, among virtual straight lines passing through two ends among the ends EA1 to EAn, a virtual straight line having a smallest angle θ with respect to the X axis is set as a first virtual straight line VL1. Here, the virtual straight line passing through the two ends is, for example, a virtual straight line in contact with the two ends. For example, two ends are selected from among the ends EA1 to EAn, and the virtual straight line having the smallest angle θ with respect to the X axis among virtual straight lines passing through the selected two ends is set as the first virtual straight line VL1. In the example of
A straight line along a main surface of the first fixed electrode 24 is set as a second virtual straight line VL2. For example, in
In the present embodiment, as shown in
For example,
As described above, in the physical quantity sensor 1 according to the present embodiment, the ends EA1 to EA3 and EB1 to EB3 which are steps are provided on the first surface 6 which is the lower surface side of the movable body 3, thereby implementing the high sensitivity. Here, a reason why the gap distances ha1 and hb1 in the regions RA1 and RB1 close to the rotation axis AY are set to be small is that, compared with the regions RA3 and RB3 far from the rotation axis AY, the electrostatic capacitance can be increased by further narrowing the gap by utilizing the fact that the displacement in the Z-axis direction at the time of swinging of the movable body 3 is small and it is difficult for the movable body 3 to come into contact with the first fixed electrode 24 and the second fixed electrode 25, and the high sensitivity can be implemented. That is, the displacement of the movable body 3 in the Z-axis direction at the time of swinging is proportional to the distance from the rotation axis AY. Therefore, in the regions RA1 and RB1 close to the rotation axis AY, the displacement in the Z-axis direction with respect to the gap distances ha1 and hb1 at the time of swinging of the movable body 3 becomes small, and thus the movable body 3 hardly comes into contact with the first fixed electrode 24 and the second fixed electrode 25. Therefore, the gap between the first surface 6 of the region RA1 and the first fixed electrode 24 and the gap between the first surface 6 of the region RB1 and the second fixed electrode 25 can be narrowed. By narrowing the gap in the regions RA1 and RB1 in this way, the electrostatic capacitance can be increased, and the sensitivity of the physical quantity sensor 1 increases as the capacitance increases, so that high sensitivity can be implemented. By implementing high accuracy in this way, it is possible to implement low noise, and it is possible to provide the physical quantity sensor 1 with the high accuracy. On the other hand, by increasing the gap distances ha3 and hb3 in the regions RA3 and RB3 far from the rotation axis AY, the contact with the first fixed electrode 24 and the second fixed electrode 25 in the regions RA3 and RB3 can be prevented, and the movable range of the movable body 3 can be expanded.
For example, in JP-T-2008-529001 described above, a plurality of gaps having different gap distances are formed by providing the steps on the substrate side. However, since the electrodes and the wiring are provided on the steps on the substrate, disconnection or short circuit may be likely to occur as a process risk. In this regard, in the present embodiment, since the ends EA1 to EA3 and EB1 to EB3 serving as the steps are provided on the movable body 3 side to form the plurality of gaps having different gap distances, it is possible to prevent the occurrence of such problems such as the disconnection and the short circuit. Accordingly, a manufacturing process risk can be made very small, a yield can be improved, and cost of the physical quantity sensor 1 can be reduced.
Further, in the present embodiment, in the state where the movable body 3 is maximally displaced around the rotation axis AY, as shown in
In the present embodiment, the gap distance between the region RA1 to the region RAn of the first mass portion 34 and the first fixed electrode 24 increases in the order of the region RA1 which is the first region to the region RAn which is the n-th region. Similarly, the gap distance between the region RB1 to the region RBn of the second mass portion 35 and the second fixed electrode 25 increases in the order of the region RB1 to the region RBn. Taking
By reducing the gap distances ha1 and hb1 in the regions RA1 and RB1 close to the rotation axis AY in this manner, it is possible to narrow the gap in the regions RA1 and RB1. Further, by narrowing the gap in the regions RA1 and RB1 in this way, the electrostatic capacitance can be increased, and the sensitivity of the physical quantity sensor 1 increases as the capacitance increases, so that the high sensitivity can be implemented. On the other hand, by increasing the gap distances ha3 and hb3 in the regions RA3 and RB3 far from the rotation axis AY, the contact with the first fixed electrode 24 and the second fixed electrode 25 in the regions RA3 and RB3 can be prevented, and the movable range of the movable body 3 can be expanded.
In
The movable body 3 includes the torque generator 36 for generating rotational torque around the rotation axis AY. For example, the torque generator 36, which is the third mass portion, is provided on the positive side of the first mass portion 34 in the X-axis direction. A gap distance ht between the torque generator 36 and the substrate 2 is larger than the gap distance ha3 between the region RAn, which is the n-th region, and the first fixed electrode 24. Specifically, the gap distance ht is a separation distance between the torque generator 36 and the dummy electrode 26a formed on the substrate 2. For example, in
A thickness tt of the torque generator 36 in the Z-axis direction is larger than a thickness tn of the region RAn of the movable body 3 in the Z-axis direction. That is, as shown in
The thickness tt of the torque generator 36 may be larger than the thickness of the fixing portions 32a and 32b and the support beam 33. In this way, larger torque for rotating the movable body 3 can be generated, and higher sensitivity can be implemented.
In the physical quantity sensor 1 according to the present embodiment, the movable body 3 includes the second mass portion 35 which is provided to sandwich the rotation axis AY with respect to the first mass portion 34 in the plan view from the Z-axis direction. For example, the first mass portion 34 is disposed on the positive side in the X-axis direction from the rotation axis AY, and the second mass portion 35 is disposed on the negative side in the X-axis direction from the rotation axis AY. The first mass portion 34 and the second mass portion 35 are, for example, symmetrically disposed with respect to the rotation axis AY. The substrate 2 is provided with the second fixed electrode 25 facing the second mass portion 35. The first fixed electrode 24 and the second fixed electrode 25 are symmetrically disposed with respect to the rotation axis AY. The symmetry includes substantially symmetry.
In this manner, the first mass portion 34 and the second mass portion 35 are provided with the rotation axis AY sandwiched therebetween, and the first fixed electrode 24 facing the first mass portion 34 and the second fixed electrode 25 facing the second mass portion 35 are symmetrically disposed with respect to the rotation axis AY, so that the seesaw swing type physical quantity sensor 1 can be implemented. In a natural state in which the acceleration in the Z-axis direction is not applied, the electrostatic capacitances Ca and Cb in
In the present embodiment, the same relationship as in
As shown in
Since the movable body 3 and the first fixed electrode 24 and the second fixed electrode 25 have different potentials, as shown in
Modifications such as providing an insulating layer made of silicon oxide, silicon nitride, or the like for preventing the short circuit or providing an electrode having a different potential at the tops of the stoppers 11 and 12 are also possible. Although the stoppers 11 and 12 are provided on the substrate 2 in
The state in which the movable body 3 is maximally displaced about the rotation axis AY is, for example, a state in which the rotation of the movable body 3 is restricted by the stoppers 11 and 12. For example, in
It is also possible to restrict the rotation of the movable body 3 about the rotation axis AY by a member or a structure other than the stoppers 11 and 12 which are protrusions provided on the substrate 2. In this case, the state in which the movable body 3 is maximally displaced about the rotation axis AY is a state in which the rotation of the movable body 3 is restricted by the member or structure.
The stoppers 11 and 12 have the same potential as the movable body 3. That is, as described above, the dummy electrode 26b provided below the support beam 33 is electrically coupled to the movable body 3 which is a movable electrode. The dummy electrodes 26a, 26b, and 26c are electrically coupled to each other by a wiring, which is not shown. Therefore, the dummy electrodes 26a, 26b, and 26c have the same potential as the movable body 3. On the other hand, as described with reference to
The physical quantity sensor 1 includes the dummy electrodes 26a, 26b, and 26c which are disposed in a region of the substrate 2 where the first fixed electrode 24 is not disposed and which faces the movable body 3 and have the same potential as the movable body 3. That is, as described above, since the dummy electrode 26b is electrically coupled to the movable body 3, and the dummy electrodes 26a, 26b, and 26c are electrically coupled by the wiring, which is not shown, the movable body 3 and the dummy electrodes 26a, 26b, and 26c have the same potential. As shown in
As shown in
The gap distances ha1, ha2, and ha3 between the first mass portion 34 and the first fixed electrode 24 are, for example, 4.5 μm or less. That is, the relationship of ha1<ha2<ha3≤4.5 μm is established. More preferably, the gap distances ha1 and ha2 between the first mass portion 34 and the first fixed electrode 24 are preferably 4.1 μm or less. Similarly, the gap distances hb1, hb2, and hb3 between the second mass portion 35 and the second fixed electrode 25 are also, for example, 4.5 μm or less, and more preferably 4.1 μm or less. When the gap distance becomes sufficiently small in this way, the electrostatic capacitances Ca and Cb become sufficiently large, and the detection sensitivity of the physical quantity sensor 1 can be sufficiently increased. Further, even when the gap distance is made sufficiently small in this way, in the present embodiment, as described with reference to
The angle θ between the first virtual straight line VL1 and the X axis is, for example, 0.7° or less. More preferably, the angle θ between the first virtual straight line VL1 and the X axis is, for example, 0.3° or less. For example, the second virtual straight line VL2 is a straight line along the X-axis direction, and the angle θ formed by the first virtual straight line VL1 and the X axis can also be referred to as an angle formed by the first virtual straight line VL1 and the second virtual straight line VL2.
For example, in the present embodiment, in a state where the movable body 3 is maximally displaced around the rotation axis AY, a virtual straight line having the smallest angle θ with respect to the X axis among virtual straight lines passing through two ends among the ends EA1 to EAn is set as the first virtual straight line VL1. The first virtual straight line VL1 can be said to be a straight line along the slope when the lower surface of the movable body 3 is regarded as the slope. In order to increase the sensitivity to the maximum while preventing the sticking, it is desirable that the first virtual straight line VL1 corresponding to the slope and the second virtual straight line VL2 along the main surface of the first fixed electrode 24 of the substrate 2 are as parallel to each other as possible in the state where the movable body 3 is maximally displaced. This is because, for example, when the first virtual straight line VL1 and the second virtual straight line VL2 become parallel to each other or are brought as parallel to each other as possible, the sensitivity of the physical quantity sensor 1 can be maximized by bringing the movable body 3 and the first fixed electrode 24 close to each other to a limit at which the sticking does not occur. Therefore, by making the angle θ formed by the first virtual straight line VL1 and the X axis sufficiently small, for example, 0.7° or less and making the first virtual straight line VL1 and the second virtual straight line VL2 as parallel to each other as possible, it is possible to sufficiently increase the sensitivity of the physical quantity sensor 1 while preventing sticking.
Next, a method of manufacturing the physical quantity sensor 1 according to the present embodiment will be described. The physical quantity sensor 1 according to the present embodiment can be manufactured by a manufacturing method including a substrate forming step, a fixed electrode forming step, a substrate bonding step, a movable body forming step, and a sealing step. In the substrate forming step, for example, a glass substrate is patterned by a photolithography step and an etching step to form the substrate 2 on which the mount portions 22a and 22b, the stoppers 11 and 12, and the like for supporting the movable body 3 are formed. In the fixed electrode forming step, a conductive film is formed on the substrate 2, and the conductive film is patterned by the photolithography step and the etching step to form fixed electrodes such as the first fixed electrode 24 and the second fixed electrode 25. In the substrate bonding step, the substrate 2 and the silicon substrate are bonded by anodic bonding or the like. In the movable body forming step, the movable body 3 is formed by thinning the silicon substrate to a predetermined thickness and patterning the silicon substrate by the photolithography step and the etching step. In this case, a Bosch process or the like, which is a deep etching technique, is used. In the sealing step, the lid 5 is bonded to the substrate 2, and the movable body 3 is stored in a space formed by the substrate 2 and the lid 5.
The manufacturing method of the physical quantity sensor 1 in the present embodiment is not limited to the manufacturing method as described above, and various manufacturing methods such as a manufacturing method using a sacrificial layer, for example, can be adopted. In the manufacturing method using the sacrificial layer, the silicon substrate on which the sacrificial layer is formed and the substrate 2 which is a support substrate are bonded to each other via the sacrificial layer, and a cavity in which the movable body 3 is swingable is formed in the sacrificial layer. Specifically, after the movable body 3 is formed on the silicon substrate, a cavity is formed by etching and removing a sacrificial layer sandwiched between the silicon substrate and the substrate 2, and the movable body 3 is released from the substrate 2. In the present embodiment, the physical quantity sensor 1 including the substrate 2 and the movable body 3 may be formed by such a manufacturing method.
The step on the lower surface of the movable body 3 can be formed by, for example, the following manufacturing process. For example, a hard mask of SiO2 or the like is formed on the back surface side of a silicon substrate which is the back surface of the movable body 3 which is a structure. Then, a pattern in which a step forming portion is opened by the photolithography step is formed by the hard mask. Then, a step having a desired height is formed by a dry etching step or a wet etching step. In the case of forming the plurality of steps, the steps may be formed by repeating the above-described manufacturing step, or by performing the etching step a plurality of times instead of once so as to obtain a step having a desired height.
Alternatively, instead of forming the steps by processing the silicon substrate itself which is the movable body 3, as shown in
In this manner, in the region RN34 in
For example,
The stopper 13 formed by the protrusion on the side surface of the end of the movable body 3 can be formed at the same time as patterning of the movable body 3. Therefore, as compared with the stoppers 11 and 12 formed by the protrusions provided on the substrate 2 as in the first embodiment, the manufacturing process can be simplified, and cost reduction and the like can be implemented.
Although not shown, in the case where a length of the movable body 3 in the X-axis direction, which is a longitudinal direction of the movable body 3, is symmetrical with respect to the rotation axis AY, or the like, stoppers serving as the protrusions may be provided on the side surfaces of the ends on both sides of the movable body 3. For example, the protrusion protruding to the negative side in the X-axis direction may be provided on the side surface of the end of the movable body 3 on the negative side in the X-axis direction, and the protrusion protruding to the positive side in the X-axis direction may be provided on the side surface of the end of the movable body 3 on the positive side in the X-axis direction. In
In the fourth embodiment, a first through hole group 71 is provided in the region RA1 that is a first region. A second through hole group 72 is provided in an i-th region among the regions RA1 to RAn which are a first region to the n-th region. Here, i is an integer satisfying 1<i≤ n.
As shown in
Here, the through hole of the first through hole group 71 is a through hole constituting the first through hole group 71. The through hole of the second through hole group 72 is a through hole constituting the second through hole group 72. The depth of the through hole in the Z-axis direction is the length of the through hole in the Z-axis direction, and can also be referred to as the thickness of the through hole. The maximum thickness of the movable body 3 is the thickness of the movable body 3 at a position where the thickness in the Z-axis direction is the largest in the movable body 3. For example, when the movable body 3 is formed by patterning a silicon substrate by etching or the like, the maximum thickness of the movable body 3 can be said to be, for example, the thickness of the silicon substrate before patterning. Specifically, the maximum thickness of the movable body 3 is the thickness in the Z-axis direction of at least one of the fixing portions 32a and 32b and the support beam 33. For example, the maximum thickness of the movable body 3 is the thickness of the fixing portions 32a and 32b in the Z-axis direction or the thickness of the support beam 33 in the Z-axis direction. Alternatively, when the thicknesses of the fixing portions 32a and 32b and the support beam 33 are equal to each other, the maximum thickness of the movable body 3 is the thickness of the fixing portions 32a and 32b and the support beam 33 in the Z-axis direction. In this way, the depth in the Z-axis direction of the through holes of the first through hole group 71 and the second through hole group 72 can be made smaller than the thickness in the Z-axis direction of at least one of the fixing portions 32a and 32b and the support beam 33. Accordingly, the in-hole damping or the like of the through hole can be reduced, and the physical quantity sensor 1 can be appropriately operated in a wider frequency range.
In
In the fourth embodiment, similarly to the first embodiment, a step 8 for making the gap distance ha1 smaller than the gap distance ha2 is provided on the first surface 6 which is the lower surface of the first mass portion 34. The step 8 corresponds to the end EA1 in
Similarly, the first surface 6, which is the lower surface of the second mass portion 35, is provided with a step 9 for making the gap distance hb1 smaller than the gap distance hb2. The step 9 corresponds to the end EB1 in FIG. 2. That is, the second mass portion 35 faces the second fixed electrode 25 provided on the substrate 2, whereas the step 9 is provided on the first surface 6 which is the surface of the second mass portion 35 on the substrate 2 side so that the gap distance hb1 in the region RB1 is smaller than the gap distance hb2 in the region RB2. By providing the step 9 and reducing the gap distance hb1 in this manner, it is possible to implement a narrow gap of the region RB1 which is a region on the side close to the rotation axis AY among the plurality of regions of the second mass portion 35, and thus it is possible to implement high sensitivity of the physical quantity sensor 1.
As described above, in the physical quantity sensor 1 according to the fourth embodiment, a plurality of inter-electrode gaps are formed by providing the steps 8 and 9 which are ends with respect to the first surface 6 which is the lower surface side of the movable body 3, and the depth of the through hole of the movable body 3 is reduced, thereby implementing both high sensitivity and low damping.
In order to implement the high sensitivity, it is desirable to make the width in the X-axis direction of the support beam 33, which is a torsion spring, as small as possible. However, when the width of the support beam 33 is reduced as described above, a problem such as damage to the support beam may occur. In this regard, in the present embodiment, the fixing portions 32a and 32b disposed on both sides of the support beam are provided over the width direction of the movable body 3 in the Y-axis direction. The fixing portion 32a is a first fixing portion. The fixing portion 32b is a second fixing portion. The fixing portions 32a and 32b are fixed to the mount portions 22a and 22b of the substrate 2. For example, the width of the movable body 3 in the Y-axis direction is represented by WM. In this case, the fixing portions 32a and 32b are provided on both sides of the support beam 33 so that a width WF in the Y-axis direction, which is a long-side direction of the fixing portions 32a and 32b, is longer than, for example, WM/2. By providing the fixing portions 32a and 32b over a wide distance on both sides of the support beam 33 in this way, even when the physical quantity sensor 1 receives an impact, it is possible to prevent damage or the like to the support beam 33 due to the impact. For example, in a position immediately close to the rotation axis AY, displacement hardly occurs when the acceleration is applied. Therefore, even if an electrode is formed in the position immediately close to the rotation axis AY, the electrode hardly contributes to sensitivity. Therefore, in the present embodiment, the fixing portions 32a and 32b are provided at positions close to the rotation axis AY which does not contribute to the sensitivity in this way to prevent the support beam 33 from being damaged or the like, thereby achieving effective use of a dead space.
As shown in
Further, the opening area of the through holes of the fifth through hole group 75 provided in the region of the torque generator 36 is larger than the opening area of the through holes of the first through hole group 71 and the second through hole group 72. Similarly, the opening area of the through holes of the fifth through hole group 75 is larger than the opening areas of the through holes of the third through hole group 73 and the fourth through hole group 74. In this way, by increasing the opening area of the through hole in the torque generator 36 which is farther from the rotation axis AY than the first mass portion 34 and the second mass portion 35, it is possible to satisfy the dimension condition of the through hole which can implement the low damping of the movable body 3, and it is possible to implement further low damping of the physical quantity sensor 1.
As the dimension of the through hole, a value in the vicinity of a minimum condition of damping determined by parameters of the gap distance, the depth of the through hole, and a ratio of dimension of the through hole/distance between hole ends can be adopted. Specifically, square through holes having different sizes are provided in each region. For example, the opening area of the through holes in the region RA1 and the region RB1 close to the rotation axis AY is about 5 μm×5 μm as an example. The opening area of the through holes in the region RA2 and the region RB2 far from the rotation axis AY is about 8 μm×8 μm as an example. The opening area of the through hole in the torque generator 36 further away from the rotation axis AY is, for example, about 20 μm×20 μm.
The depth of the through holes of the first through hole group 71 and the second through hole group 72 is less than 50% of the maximum thickness of the movable body 3 in the Z-axis direction. For example, the depth of the through holes is less than 50% of the thickness of the fixing portions 32a and 32b or the support beam 33, which is the maximum thickness of the movable body 3. Similarly, the depths of the through holes of the third through hole group 73 and the fourth through hole group 74 are also less than 50% of the maximum thickness of the movable body 3 in the Z-axis direction. By setting the depth of the through hole to be less than a half of the maximum thickness of the movable body 3 in this way, the in-hole damping of the through hole can be made sufficiently small compared to the case where the depth of the through hole is equal to the maximum thickness of the movable body 3, and low damping can be implemented. More preferably, the depth of the through holes such as the first through hole group 71 and the second through hole group 72 is less than 17% of the maximum thickness of the movable body 3. Accordingly, further low damping can be implemented.
As shown in
Similarly, in the second surface 7 of the movable body 3, a third recess 83 in which the third through hole group 73 is disposed on the bottom surface is provided in the region RB1. As shown in
As shown in
The depths of the second recess 82 and the fourth recess 84 are shallower than the depths of the first recess 81 and the third recess 83. In this way, the first recess 81, the second recess 82, the third recess 83, and the fourth recess 84 can be formed in the second surface 7 of the movable body 3 while the gap distances ha1 and hb1 in the regions RA1 and RB1 are made smaller than the gap distances ha2 and hb2 in the regions RA2 and RB2.
Further, in the present embodiment, the thickness of the through hole, which is the depth of the through hole, is reduced by forming the first recess 81 to the fourth recess 84 in the movable body 3. At the same time, the thickness of the region between the ends of the through holes, that is, between the adjacent through holes is also reduced. Then, considering that, for example, the lower stoppers 11 and 12 are in contact with the region, it is disadvantageous in terms of the strength of the structure. Therefore, it is desirable to increase the thickness of the movable body 3 in the region where the stoppers 11 and 12 are in contact with each other. For example, when the stopper 11 is provided in the region RA1 in the plan view in the Z-axis direction, the thickness of the movable body 3 is increased at least in a region in contact with the stopper 11 in the region RA1. When the stopper 12 is provided in the region RB1 in the plan view in the Z-axis direction, the thickness of the movable body 3 is increased at least in a region in contact with the stopper 12 in the region RB1.
Next, the design of the through hole will be specifically described. The through hole is provided to control the damping of the gas when the movable body 3 swings. The damping is constituted by in-hole damping of the gas passing through the through hole and squeeze film damping between the movable body 3 and the substrate 2.
The larger the through hole is, the more easily the gas passes through the through hole, so that the in-hole damping can be reduced. As occupancy rate of the through holes is increased, facing area between the movable body 3 and the substrate 2 is reduced, and thus the squeeze film damping can be reduced. However, when the occupancy rate of the through hole is increased, the facing area between the movable body 3 and the first fixed electrode 24 and the second fixed electrode 25 is reduced, and the mass of the torque generator 36 is reduced. Therefore, the sensitivity of acceleration detection is reduced. On the contrary, as the through hole is made smaller, that is, as the occupancy rate is made lower, the facing area between the movable body 3 and the first fixed electrode 24 and the second fixed electrode 25 is increased, and the mass of the torque generator 36 is increased. Therefore, the sensitivity of acceleration detection is improved, whereas the damping is increased. As described above, since the detection sensitivity and the damping are in a trade-off relationship, it is extremely difficult to achieve both of the detection sensitivity and the damping.
In order to solve such a problem, in the present embodiment, the design of the through hole is devised to achieve both high sensitivity and low damping. The sensitivity of the detection of the physical quantity sensor 1 is proportional to (A) 1/h2 when a gap distance which is a separation distance between the movable body 3 and the first fixed electrode 24 and the second fixed electrode 25 is h, (B) a facing area between the movable body 3 and the first fixed electrode 24 and the second fixed electrode 25, (C) a spring rigidity of the support beam 33, and (D) a mass of the torque generator 36. In the physical quantity sensor 1, first, in a state where the damping is ignored, the facing area, the gap distance, and the like with respect to the first fixed electrode 24 and the second fixed electrode 25, which are necessary for obtaining target sensitivity, are determined. In other words, the occupancy rate of the through holes is determined. Accordingly, the electrostatic capacitances Ca and Cb of necessary sizes are formed, and the physical quantity sensor 1 can obtain sufficient sensitivity.
The occupancy rate of the plurality of through holes in the first mass portion 34 and the second mass portion 35 is not particularly limited. For example, the occupancy rate is preferably 75% or more, more preferably 78% or more, and still more preferably 82% or more. Accordingly, it is easy to achieve both high sensitivity and low damping.
As described above, after the occupancy rate of the through holes is determined, for example, the damping is designed for each of the regions RA1 and RA2. As a new technical idea of minimizing the damping without changing the sensitivity, in the physical quantity sensor 1, a plurality of through holes are designed so that a difference between the in-hole damping and the squeeze film damping is as small as possible, preferably so that the in-hole damping and the squeeze film damping are equal to each other. In this way, by making the difference between the in-hole damping and the squeeze film damping as small as possible, it is possible to reduce the damping. When the in-hole damping and the squeeze film damping are equal to each other, the damping is minimized. Accordingly, it is possible to effectively reduce the damping while maintaining the sensitivity at a sufficiently high level.
Since the method of the damping design in each region is the same as each other, the damping design in the region RA1 will be representatively described below, and the description of the damping design in other regions will be omitted.
The length in the Z-axis direction of the through hole disposed in the region RA1 is set as H (μm). A half of the length in the Y-axis direction of the region RA1 of the first mass portion 34 is set as a (μm). The length in the X-axis direction of the region RA1 of the first mass portion 34 is set as L (μm). The length in the Z-axis direction, which is the gap distance in the gap of the region RA1, is set as h (μm). The length of one side of the through hole disposed in the region RA1 is set as S0 (μm). A distance between the ends of the adjacent through holes is set as S1 (μm). Viscosity resistance, which is a viscosity coefficient of the gas in the gap of the region RA1, that is, the gas filled in the storage space SA, is set as u (kg/ms). In this case, when the damping occurring in the region RA1 is set as C, C is expressed by the following Formula (1). When an interval between the through holes adjacent to each other in the X-axis direction and an interval between the through holes adjacent to each other in the Y-axis direction are different from each other, S1 can be an average value thereof.
Parameters used in the above Formula (1) is expressed by the following Formulas (2) to (8).
Here, an in-hole damping component included in the above Formula (1) is expressed by the following Formula (9). A squeeze film damping component is expressed by the following Formula (10).
Therefore, the damping C is minimized by using the dimensions of H, h, S0, and S1 in which the above Formula (9) and the above Formula (10) are equal to each other, that is, the following Formula (11) is satisfied. That is, the following Formula (11) is a conditional expression that minimizes the damping.
Here, the length S0 on one side of the through hole satisfying the above Formula (11) is set as S0min. The interval S1 between the adjacent through holes is set as S1min. A minimum value of the damping C, which is the damping C when the S0min and S1min are substituted into the above Formula (1), is set as Cmin. Depending on the accuracy required for the physical quantity sensor 1, when the ranges of S0 and S1 when H and h are constant satisfy the following Formula (12), the damping can be sufficiently reduced. That is, if the damping is within the minimum value Cmin+50% of the damping, the damping can be sufficiently reduced. Therefore, the sensitivity of detection in a desired frequency band can be maintained, and noise can be reduced.
It is preferable that the following Formula (13) is satisfied, it is more preferable that the following Formula (14) is satisfied, and it is still more preferable that the following Formula (15) is satisfied. Accordingly, the above-described effects can be more remarkably exhibited.
From the graph in
In the present embodiment, as shown in
For example, in the above Formula (11) which is a conditional expression for minimizing the damping, the numerator has a term of r04=(0.547×S0)4, and the denominator has a term of h3. Therefore, when the gap distance h between the electrodes increases, the minimum condition of the damping can be satisfied by increasing the length S0 on one side of the through hole accordingly. That is, as the gap distance h increases, S0, which is the length on one side of the through hole, is increased to increase the opening area of the through hole, thereby making it possible to bring the damping close to the minimum value.
In the present embodiment, the gap distance ha2 in the region RA2 is larger than the gap distance ha1 in the region RA1. Therefore, by making the opening area of the second through hole group 72 in the region RA2 larger than the opening area of the first through hole group 71 in the region RA1, the damping in each of the regions RA1 and RA2 can be brought close to the minimum value expressed by the above Formula (11). Similarly, the gap distance hb2 in the region RB2 is larger than the gap distance hb1 in the region RB1. Therefore, by making the opening area of the fourth through hole group 74 in the region RB2 larger than the opening area of the third through hole group 73 in the region RB1, the damping in each of the regions RB1 and RB2 can be made close to the minimum value expressed by the above Formula (11).
The gap distance ht in the region of the torque generator 36 is larger than the gap distances ha1, ha2, and the like. Therefore, by making the opening area of the fifth through hole group 75 in the region of the torque generator 36 larger than the opening areas of the first through hole group 71, the second through hole group 72, and the like, the damping in the region of the torque generator 36 can be made close to the minimum value expressed by the above Formula (11).
In
Next, a physical quantity sensor device 100 according to the present embodiment will be described with reference to
The physical quantity sensor device 100 may include a package 120 that is a container in which the physical quantity sensor 1 and the IC chip 110 are stored. The package 120 includes a base 122 and a lid 124. The physical quantity sensor 1 and the IC chip 110 are stored in a storage space SB hermetically sealed by bonding the lid 124 to the base 122. By providing such a package 120, it is possible to suitably protect the physical quantity sensor 1 and the IC chip 110 from impact, dust, heat, moisture, and the like.
The base 122 includes a plurality of internal terminals 130 disposed in the storage space SB and external terminals 132 and 134 disposed on the bottom surface. The physical quantity sensor 1 and the IC chip 110 are electrically coupled to each other via the bonding wire BW1.
The IC chip 110 and the internal terminal 130 are electrically coupled to each other via a bonding wire BW2. Further, the internal terminal 130 is electrically coupled to the external terminals 132 and 134 via an internal wiring, which is not shown, provided in the base 122. Accordingly, a sensor output signal based on the physical quantity detected by the physical quantity sensor 1 can be output to the outside.
Although the case where the electronic component provided in the physical quantity sensor device 100 is the IC chip 110 has been described above as an example, the electronic component may be a circuit element other than the IC chip 110, may be a sensor element different from the physical quantity sensor 1, or may be a display element implemented by a liquid crystal display (LCD), a light emitting diode (LED), or the like. Examples of the circuit element include passive elements such as a capacitor and a resistor, and active elements such as a transistor. The sensor element is, for example, an element that senses a physical quantity different from the physical quantity detected by the physical quantity sensor 1. Instead of providing the package 120, mold mounting may be performed.
Next, an inertial measurement unit 2000 according to the present embodiment will be described with reference to
The inertial measurement unit 2000 is a rectangular parallelepiped having a substantially square planar shape. Screw holes 2110 as mount portions are formed in the vicinity of two vertexes located in a diagonal direction of the square. Two screws can be inserted into the screw holes 2110 at two locations to fix the inertial measurement unit 2000 to a mounted surface of a mounted body such as an automobile. It is also possible to reduce a size to a size that can be mounted on a smartphone or a digital camera, for example, by selecting a component or changing a design.
The inertial measurement unit 2000 includes an outer case 2100, a bonding member 2200, and a sensor module 2300, and has a configuration in which the sensor module 2300 is inserted inside the outer case 2100 with the bonding member 2200 sandwiched therebetween. The sensor module 2300 includes an inner case 2310 and a circuit board 2320. The inner case 2310 is formed with a recess 2311 for preventing contact with the circuit board 2320 and an opening 2312 for exposing a connector 2330 to be described later. The circuit board 2320 is bonded to the lower surface of the inner case 2310 via an adhesive.
As shown in
The acceleration sensor unit 2350 includes at least the physical quantity sensor 1 for measuring the acceleration in the Z-axis direction described above, and can detect the acceleration in one axial direction or the acceleration in two axial directions or three axial directions as necessary. The angular velocity sensors 2340x, 2340y, and 2340z are not particularly limited. For example, a vibration gyro sensor using a Coriolis force can be used.
A control IC 2360 is mounted on the lower surface of the circuit board 2320. The control IC 2360 as a controller that performs control based on the detection signal output from the physical quantity sensor 1 is, for example, a micro controller unit (MCU), includes a storage including a nonvolatile memory, an A/D converter, and the like, and controls each unit of the inertial measurement unit 2000. A plurality of electronic components are mounted on the circuit board 2320.
As described above, the inertial measurement unit 2000 according to the present embodiment includes the physical quantity sensor 1 and the control IC 2360 as the controller that performs control based on the detection signal output from the physical quantity sensor 1. According to the inertial measurement unit 2000, since the acceleration sensor unit 2350 including the physical quantity sensor 1 is used, the effect of the physical quantity sensor 1 can be enjoyed, and the inertial measurement unit 2000 capable of implementing the high accuracy and the like can be provided.
As described above, the physical quantity sensor according to the present embodiment includes the substrate orthogonal to the Z axis and provided with the first fixed electrode when three axes orthogonal to one another are set as the X axis, the Y axis, and the Z axis, and the movable body including the first mass portion facing the first fixed electrode in the Z axis direction along the Z axis and provided to be swingable with respect to the substrate about the rotation axis along the Y axis. The movable body includes the first surface which is a surface on the substrate side and the second surface which is a surface on a back side with respect to the first surface, and on the first surface of the first mass portion, a step is provided between adjacent regions facing the first fixed electrode with a gap therebetween, and first to n-th regions, n being an integer of 2 or more, are provided which are disposed from the first region to the n-th region in an order close to the rotation axis. The ends of the first region to the n-th region on the side far from the rotation axis are referred to as a first end to an n-th end. In a cross-sectional view from the Y-axis direction along the Y axis, in a state where the movable body is maximally displaced around the rotation axis, among virtual straight lines passing through two ends among the first end to the n-th end, the virtual straight line having the smallest angle with respect to the X axis is set as the first virtual straight line, and the straight line along the main surface of the first fixed electrode is set as the second virtual straight line. The straight line intersecting with an end of the first fixed electrode closest to the rotation axis and extending along the Z axis is set as the first normal line. The straight line intersecting with an end of the first fixed electrode farthest from the rotation axis and extending along the Z axis is set as the second normal line. At this time, the first virtual straight line and the second virtual straight line do not intersect in a region between the first normal line and the second normal line.
According to the present embodiment, the first surface of the first mass portion of the movable body facing the first fixed electrode of the substrate is provided with the first region to the n-th region in which the step is provided between adjacent regions. By providing such a first region to an n-th region, it is possible to implement the high sensitivity of the physical quantity sensor. In the present embodiment, the first virtual straight line passing through the two ends forming the step of the first surface of the movable body and the second virtual straight line along the main surface of the first fixed electrode do not intersect with each other in the region between the first normal line corresponding to the end closest to the rotation axis of the first fixed electrode and the second normal line corresponding to the end farthest from the rotation axis of the first fixed electrode in the state where the movable body is maximally displaced. Accordingly, sticking between the movable body and the first fixed electrode can be prevented. Therefore, it is possible to provide a physical quantity sensor or the like capable of implementing both high sensitivity and reduction of sticking.
In the present embodiment, in a cross-sectional view from the Y-axis direction, when a straight line intersecting with the rotation axis and along the Z axis is set as the third normal line and a straight line intersecting with the end of the movable body and along the Z axis is set as the fourth normal line, the first virtual straight line and the second virtual straight line may not intersect each other in a region between the third normal line and the fourth normal line.
In this way, in the region between the third normal line and the fourth normal line, which is wider than the region between the first normal line and the second normal line, the first virtual straight line and the second virtual straight line do not intersect with each other. Therefore, in the state where the movable body is maximally displaced, the distance between the first surface of the movable body and the first fixed electrode can be further increased, and the occurrence of sticking can be further prevented.
In the present embodiment, the gap distance between the first region to the n-th region of the first mass portion and the first fixed electrode may increase in the order of the first region to the n-th region.
By increasing the gap distance from the first fixed electrode in the order of the first region to the n-th region in this way, it is possible to narrow the gap in the first region or the like close to the rotation axis, and it is possible to implement high sensitivity of the physical quantity sensor.
In the present embodiment, the movable body may include the torque generator for generating the rotational torque around the rotation axis. The gap distance between the torque generator and the substrate may be larger than the gap distance between the n-th region and the first fixed electrode.
In this way, it is possible to implement the reduction in damping and the expansion of the movable range of the movable body.
In the present embodiment, the movable body may include the torque generator for generating the rotational torque around the rotation axis. The thickness of the torque generator in the Z-axis direction may be larger than the thickness of the n-th region of the movable body in the Z-axis direction.
In this way, since the rotational torque in the torque generator at the time of swinging of the movable body can be further increased, higher sensitivity can be implemented.
In the present embodiment, the movable body may include the second mass portion which is provided to sandwich the rotation axis with respect to the first mass portion in the plan view from the Z-axis direction, the substrate may be provided with the second fixed electrode which faces the second mass portion, and the first fixed electrode and the second fixed electrode may be symmetrically disposed with respect to the rotation axis.
In this way, the first fixed electrode facing the first mass portion and the second fixed electrode facing the second mass portion are symmetrically disposed with respect to the rotation axis, so that the seesaw swing type physical quantity sensor can be implemented.
In the present embodiment, a stopper that restricts the rotation of the movable body about the rotation axis may be included.
By providing such a stopper, it is possible to prevent excessive proximity between the movable body and the first fixed electrode or the like.
Further, in the present embodiment, the maximum displacement state may be a state in which the rotation of the movable body is restricted by the stopper.
In this way, when the rotation of the movable body is restricted by the stopper, the first virtual straight line and the second virtual straight line do not intersect with each other in the region between the first normal line and the second normal line, and thus the sticking can be prevented while achieving high sensitivity.
In the present embodiment, the stopper may have the same potential as the movable body.
Since the stopper and the movable body have the same potential in this manner, an unnecessary electrostatic force due to a different potential does not work, so that the sticking can be further prevented.
In the present embodiment, a dummy electrode which is disposed in a region of the substrate where the first fixed electrode is not disposed and which faces the movable body and has the same potential as the movable body may be included.
In this way, the exposure of the surface of the substrate can be prevented using the dummy electrode, and the occurrence of sticking can be prevented.
In the present embodiment, the movable body may be provided with a through hole group penetrating in the Z-axis direction.
By providing the through hole group in the movable body in this way, it is possible to reduce damping of air when the movable body swings around the rotation axis.
In the present embodiment, the gap distance between the first mass portion and the first fixed electrode may be 4.5 μm or less.
By making the gap distance sufficiently small in this way, it is possible to sufficiently increase the detection sensitivity of the physical quantity sensor.
In the present embodiment, the angle between the first virtual straight line and the X axis may be 0.7º or less.
In this way, the first virtual straight line and the second virtual straight line come closer to be parallel to each other, and the movable body and the first fixed electrode come closer to each other to the limit at which sticking does not occur, so that the high sensitivity of the physical quantity sensor can be implemented.
In the present embodiment, the first through hole group may be provided in the first region, the second through hole group may be provided in an i-th region, i being an integer satisfying 1<i≤n, among the first region to the n-th region, and depths of the through holes of the first through hole group and the second through hole group in the Z-axis direction may be smaller than the maximum thickness of the movable body in the Z-axis direction.
In this way, since the depths of the through holes of the first through hole group and the second through hole group are smaller than the maximum thickness of the movable body, in-hole damping or the like of the through holes can be reduced, and low damping can be implemented.
In the present embodiment, the opening area of the through holes of the second through hole group may be larger than the opening area of the through holes of the first through hole group.
In this way, by making the opening area of the through holes of the second through hole group far from the rotation axis larger than the opening area of the through holes of the first through hole group close to the rotation axis, it is possible to satisfy the dimension condition of the through holes that can implement the low damping, and it is possible to implement the low damping of the physical quantity sensor.
The present embodiment relates to a physical quantity sensor device including the physical quantity sensor described above and the electronic component electrically coupled to the physical quantity sensor.
The present embodiment relates to the inertial measurement unit including the physical quantity sensor described above and the controller that performs control based on the detection signal output from the physical quantity sensor.
Although the present embodiment has been described in detail above, it will be easily understood by those skilled in the art that many modifications can be made without substantially departing from the novel matters and effects of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure. For example, a term cited with a different term having a broader meaning or the same meaning at least once in the present disclosure or in the drawings can be replaced with the different term in any place in the present disclosure or in the drawings. All combinations of the present embodiment and the modifications are also included in the scope of the present disclosure. The configurations, operations, and the like of the physical quantity sensor, the physical quantity sensor device, and the inertial measurement unit are not limited to those described in the present embodiment, and various modifications can be made.
Number | Date | Country | Kind |
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2020-190614 | Nov 2020 | JP | national |
This application is a divisional application of U.S. patent application Ser. No. 17/455,071 filed Nov. 16, 2021, which is based on, and claims priority from JP Application Serial Number 2020-190614, filed Nov. 17, 2020, the disclosures of which are hereby incorporated by reference herein in their entireties.
Number | Date | Country | |
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Parent | 17455071 | Nov 2021 | US |
Child | 18910383 | US |