The present invention relates to a piezoceramic ultrasonic transducer for a vehicle.
Piezoceramic ultrasonic transducers are often used for distance measurements, for example in air springs, but also for distance measuring systems in vehicles. They usually use a disc-shaped piezoceramic oscillator. This piezoceramic oscillator, when excited by an electric field, produces mechanical vibrations which generate ultrasonic waves as known to a person skilled in the art. These ultrasonic waves are then used for distance measurements as known to a person skilled in the art.
Once the piezoceramic oscillator oscillates (for generating ultrasonic waves), the piezoceramic oscillator, however, also transmits mechanical vibrations to, for example, the printed circuit board (PCB) which provides the energy to the oscillator. In order to minimize a mechanical coupling between the (vibrating) piezoceramic oscillator and its environment, in particular the PCB, an elastomeric element which includes some viscoelasticity is mounted between the piezoceramic oscillator and the PCB for dampening and mechanically decoupling vibrations transmitted from the piezoceramic oscillator to the PCB. In addition, electrical connections between the piezoceramic oscillator and the PCB are often implemented as extremely thin wires to minimize any mechanical vibratory coupling between the piezoceramic oscillator and the PCB. These extremely thin wires usually also extend through elastomeric element.
One problem with these elastomeric elements is, however, that the quality of mechanical vibratory decoupling largely depends on the temperatures in which the piezoceramic oscillator works. If, for example, the temperature is very low, the elastomeric element may become hard and therefore the mechanical decoupling between the oscillator and the PCB gets worse. As a result, the PCP may start vibrating, and potentially emit noise signals that basically reduce the signal-to-noise ratio of the piezoceramic ultrasonic transducer. Moreover, in some extreme cases, a solid and long-lasting bonding between the piezoceramic oscillator and the PCB can no longer be guaranteed due to the increased hardness of the elastomeric element.
An object of the present invention, therefore, is to provide a piezoceramic ultrasonic transducer for a vehicle, which is capable of operating in a wide range of temperature ranges without a significant loss in performance and which provides for a long-lasting support of the oscillator on the PCB.
The object may be solved, according to an aspect of the present invention, by a piezoceramic ultrasonic transducer for a vehicle that includes a disc-shaped piezoceramic oscillator for generating ultrasonic waves, a printed circuit board (PCB) for providing electric power to the disc-shaped piezoceramic oscillator and a composite elastomeric element arranged between the disc-shaped piezoceramic oscillator and the printed circuit board for supporting the piezoceramic oscillator on the printed circuit board. According to an aspect of the invention, the composite elastomeric element includes a first elastomeric compound element and a second elastomeric compound element, wherein the first elastomeric compound element includes a first temperature dependent viscoelasticity and supports the piezoceramic oscillator on the printed circuit board in a first temperature range and the second elastomeric compound element includes a second temperature dependent viscoelasticity different from the first temperature dependent viscoelasticity and supports the piezoceramic oscillator on the printed circuit board in a second temperature range which is different from the first and temperature range.
The present invention is at least partially based on the idea that by using two different temperature-dependent elastomeric compound elements, at least one of the two elastomeric compound elements provides a solid and long-lasting support for the piezoceramic oscillator on the PCB as well as a good-enough mechanical vibratory decoupling between the oscillator and the PCB over the respective temperature range.
Within the meaning of this disclosure, the wording “support on the PCB” means that during the first temperature range predominantly the first elastomeric compound element provides the support to the PCB, whereas during the second temperature range, the second elastomeric compound element predominantly provides the support on the PCB.
So for example, during a low temperature range, for example, the first elastomeric compound element still has enough viscoelasticity such that a mechanical vibratory decoupling between the vibrating piezoceramic oscillator and the PCB is predominantly ensured by the first elastomeric compound element. Conversely, during a high-temperature range, for example, the second elastomeric compound element still has enough viscoelasticity such that a mechanical vibratory decoupling between the vibrating piezoceramic oscillator and the PCB is predominantly ensured by the second elastomeric compound element.
According to an embodiment of the present invention, the first elastomeric compound element and the second elastomeric compound element are arranged alternately within the composite elastomeric element. Thus, either during high temperature ranges or low temperature ranges alternately one of the two elastomeric compound elements can provide a good mechanical vibratory decoupling between the oscillator and the PCB as well as a long-lasting and solid support for the oscillator.
In a preferred embodiment the composite elastomeric element has a disc-shaped main body and the first elastomeric element and the second elastomeric compound element—which are arranged alternately—are concentric annular elements with different diameters. In this preferred embodiment, at least one of the two elastomeric compound elements provides for an annular support surface for the disc-shaped piezoceramic oscillator. The advantage of providing an annular support surface is that vibrations of the piezoceramic oscillator are evenly distributed among the annular support surface and therefore any tilting of the oscillator can be minimized for any of the two temperature ranges.
For example, if the piezoceramic ultrasonic transducer is operated within a low-temperature range and the first elastomeric compound element is selected such that it has good viscoelasticity for supporting the piezoceramic oscillator within the low-temperature range, due to the annular support surface, any tilting of the oscillator can be minimized within the low-temperature range. Conversely, if the piezoceramic ultrasonic transducers is operated within a high-temperature range and the second elastomeric compound element is selected such that it has good viscoelasticity for supporting the piezoceramic oscillator within the high-temperature range, due to the annular support surface, any tilting of the oscillator can be minimized within the high-temperature range.
According to a further embodiment of the present invention, the first temperature range is in a range of about −40° C. to about +20° C. and the second temperature range is in a range of about +20° C. to about 90° C. In this further embodiment, the first elastomeric compound element is selected such that first elastomeric compound element includes a first temperature dependent viscoelasticity for predominantly supporting the piezoceramic oscillator within the first temperature range and the second elastomeric compound element of selected such that the second elastomeric compound element includes a second temperature dependent viscoelasticity for predominantly supporting the piezoceramic oscillator within the second temperature range.
Other objects and features of the present invention will become apparent from the following detailed description considered in conjunction with the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.
In the drawings:
Exemplary embodiments of the invention are described by the accompanying drawings, which are incorporated herein and constitute a part of the specification.
Within this disclosure, the same reference numbers refer to the same components.
The piezoceramic ultrasonic transducer 10 includes a disc-shaped piezoceramic oscillator 12 for generating ultrasonic waves and a printed circuit board (PCB) 14 for providing electric power to the piezoceramic oscillator 12. The piezoceramic ultrasonic transducer 10 further includes a composite elastomeric element 16 which is arranged between the oscillator 12 and the PCB 14 for supporting the oscillator 12 on the PCB 14. Electrical connections 18 are provided within composite elastomeric element 16 for electrical connecting the oscillator 12 with the PCB 14. These electrical connections 18 may be, for example, very thin wires.
As can be seen in
As can be further seen in
Referring now to
As can be seen, both first and second elastomeric compound elements 20, 22 are concentric annular elements with different diameters (measured in a radial direction of disc-shaped main body 23, i.e., in a direction perpendicular to axis 24). Thus, either the low-temperature elastomeric compound element 20 or the high-temperature elastomeric compound element 22 provides an annular support surface for supporting oscillator 12 on PCB 14 in the respective low- or high-temperature range.
Referring now to
As can be seen, in the piezoceramic ultrasonic transducer 10 according to
The piezoceramic ultrasonic transducer 10 according to the present invention ensures a reliable performance over low- and high-temperature ranges by having a composite elastomeric element with low- and high-temperature elastomeric compound elements. Moreover, as low- and high-temperature elastomeric compound elements are selected such that the respective temperature dependent viscoelasticities are best within either the low- or the high-temperature range, a long-lasting and reliable support of the oscillator 12 on the PCB 14 as well as a good mechanical vibratory decoupling between the oscillator 12 and the PCB 14 are ensured.
Although only two different (i.e., a low- and a high-temperature) elastomeric compound elements are shown in connection with
Thus, while there have been shown and described and pointed out fundamental novel features of the invention as applied to a preferred embodiment thereof, it will be understood that various omissions and substitutions and changes in the form and details of the devices illustrated, and in their operation, may be made by those skilled in the art without departing from the spirit of the invention. For example, it is expressly intended that all combinations of those elements and/or method steps which perform substantially the same function in substantially the same way to achieve the same results are within the scope of the invention. Moreover, it should be recognized that structures and/or elements and/or method steps shown and/or described in connection with any disclosed form or embodiment of the invention may be incorporated in any other disclosed or described or suggested form or embodiment as a general matter of design choice. It is the intention, therefore, to be limited only as indicated by the scope of the claims appended hereto.
| Number | Date | Country | Kind |
|---|---|---|---|
| 19465584.1 | Oct 2019 | EP | regional |