1. Field of Invention
The invention relates to a piezoelectric vibrating segment, a supporting structure for a piezoelectric vibrating segment, a piezoelectric vibrator, and a piezoelectric vibrating gyroscope.
2. Description of Related Art
Piezoelectric vibrating gyroscopes that use piezoelectric vibrating segments or piezoelectric vibrators having the piezoelectric vibrating segments housed in containers have been used as angular velocity sensors for detecting rotational angular velocities in rotational systems. The piezoelectric vibrating gyroscopes are used for car navigation systems or for detecting camera vibration of VTRs or still cameras.
For the piezoelectric vibrating gyroscopes, there are used piezoelectric vibrating segments composed of vibrating arms extending in a single plane and base sections for connecting the vibrating arms. The piezoelectric vibrating gyroscopes drive the piezoelectric vibrating segments to vibrate using drive circuits (excited vibration) and detect sensing vibration caused in accordance with rotational angular velocities using detection circuits to output electric signals. The excited vibration is generated in all or some of a plurality of vibrating arms. When a rotational angular velocity is applied to the piezoelectric vibrating segment, the Coriolis force in a direction perpendicular to the direction of the excited vibration operates on the vibrating arms excitedly vibrating to cause the sensing vibration in the all or some of the plurality of vibrating arms.
As a piezoelectric vibrating segment composed of a plurality of vibrating arms and a base section connecting the vibrating arms, for example, a piezoelectric vibrating segment is known that includes a pair of excited vibration systems extending from the periphery of the base section in directions opposing to each other and a pair of sensing vibration systems extending in directions perpendicular to the extension directions of the excited vibration systems. The excited vibration system has a connecting section connected to the periphery of the base section and an excited vibration arm extending from the connecting section in a traverse direction with respect to the connecting section.
As a conventional supporting structure for the piezoelectric vibrating segment, a structure is adopted in which, with the piezoelectric vibrating segment opposite to a supporting stage, a portion of the base section of the piezoelectric vibrating segment having the smallest vibration amplitude is fixed to a supporting member on the supporting stage. And, the structure is known in which electrodes of the piezoelectric vibration segment are connected to a drive circuit and a detection circuit provided on the supporting stage via metal wires. See, for example, Japanese Unexamined Patent Publication No. 2001-12955.
However, according to the supporting structure described above, since the supporting point is only one, the piezoelectric vibrating segment is easy to be tilted when a vibration or an impact is applied from the outside. As a result, a problem arises that the piezoelectric vibrating segment abuts on the supporting stage to make it difficult to keep the stable excited vibration and the stable sensing vibration. Moreover, another problem arises that the excited vibration and the sensing vibration are easy to be suppressed by supporting the piezoelectric vibrating segment.
An aspect of the invention is to provide a piezoelectric vibrating segment, a supporting structure for a piezoelectric vibrating segment, a piezoelectric vibrator, and a piezoelectric vibrating gyroscope capable of keeping a stable excited vibration and a stable sensing vibration even against vibrations or impacts from the outside. Further, an object of the invention is to provide a piezoelectric vibrating segment, a supporting structure for a piezoelectric vibrating segment, a piezoelectric vibrator, and a piezoelectric vibrating gyroscope in which the excited vibration and the sensing vibration are hard to be suppressed if the piezoelectric vibrating segment is supported.
In a piezoelectric vibrating segment according to the invention, a base section, a plurality of vibration arms radially extending from the base section in a single plane, a plurality of first beams having elasticity and extending from the base section and between the vibration arms, and at least a first supporting section formed on a tip portion of the beams are formed. In the above, the vibration arms can include excited vibration arms and sensing vibration arms.
In the piezoelectric vibrating segment according to the invention, since, for example, the first supporting sections are formed on the tips of the respective beams radially extending in four directions from the periphery of the base section of the piezoelectric vibrating segment, the piezoelectric vibrating segment is kept in a balanced and stable posture. Further, since the elastic beams are provided between the base section and the supporting sections, even if vibrations or impacts are applied from the outside, the vibrations or the impacts can be absorbed by the beams to maintain the excited vibrations and the sensing vibrations stable.
Further, it is advantageous that the excited vibrations and the sensing vibrations are hardly be affected by thus supporting the piezoelectric vibrating segment.
In the above structure, the first supporting section, and further, a second supporting section provided on the center of the base section are preferably formed.
The piezoelectric vibrating segment thus structured is equipped with the second supporting section in the center portion of the base section. Therefore, since the periphery portion of the piezoelectric vibrating segment is supported by the first supporting sections and the center portion thereof is supported by the second supporting section, the piezoelectric vibrating segment can be more stably supported. Further, when a strong impact is applied from the outside, it is prevented by the second supporting section that the beams are deformed beyond elastic ranges to cause the piezoelectric vibrating segment be broken.
Further, in the above structure, the first supporting section formed on the tip portion of the beams, a pair of openings symmetrically provided with respect to the center of the base section, a second beam having elasticity and formed between the openings, a second supporting section provided on the center of this beam, and the first beams are preferably formed.
According to the above structure, since the second supporting section also equipped with the elastic beam that absorbs vibrations in the periphery of the base section is provided on the base section in addition to the first sections described above, propagation of the vibrations to the second supporting section can be reduced, and accordingly, negative effects to the excited vibrations or the sensing vibrations derived from providing the second supporting section are also reduced.
Further, the structure of the piezoelectric vibrating segment of the above preferably includes an exciting electrode formed on a surface of the vibration arm for exciting the piezoelectric vibrating segment to vibrate, and conduction electrodes formed on a surface of the first supporting section and a surface of the second supporting section, wherein the exciting electrode is preferably connected to the conduction electrode.
Here, the conduction electrodes denote electrodes for connecting the exciting electrodes with a semiconductor device or an external circuit described below. Thus, the exciting signals for exciting the piezoelectric vibrating segment to vibrate can be sent through the conduction electrodes formed on the surfaces of the first supporting sections and the surface of the second supporting section.
Further, the structure described above preferably comprises the exciting electrode formed on the surface of the vibration arm, and a sensing electrode formed on a different position from the exciting electrode for detecting a sensing vibration generated in the piezoelectric vibrating segment in accordance with the excited vibration and a rotational angular velocity applied from the outside. The sensing electrode and the exciting electrode are preferably connected to different ones of the conduction electrodes.
According to this structure, in addition to the exciting signals, the signals of sensing vibrations can be picked up from the conduction electrodes provided to the first supporting sections or the second supporting section.
Further, it is characterized in that the first supporting section is continuously formed to a frame section formed around the vibration arms.
The piezoelectric vibrating segment described above can be manufactured, for example, from a wafer by photolithography. In this case, the piezoelectric vibrating segment is formed with a situation where the periphery of the piezoelectric vibrating segment is surrounded by the frame section. Since the piezoelectric vibrating segment has the first supporting section integrated with this frame section, the structural strength of the supporting section increases to maintain more stable posture. Further, since the frame sections and the supporting sections are integrated, the piezoelectric vibrating segment is easy to be handled when encapsulated in the container, as described below, to advantageously improve the operating efficiency.
Further, the frame section is preferably formed so as to provide constant gaps with the base section, the vibration arms, and the beams. According to this, since substantially constant circumferential gaps of the piezoelectric vibrating segment with the surrounding frame section are provided, the resist film can be formed in a constant thickness in the resist deposition process of the photolithography process for shaping the piezoelectric vibrating segment by etching. Thus, the shape of each section of the piezoelectric vibrating segment can stably be formed, and, as a result, the excited vibrations and the sensing vibrations can be more stable.
Further, a part of the beam is preferably shaped to have smaller stiffness than the rest.
In this case, as a shape having a smaller stiffness than the rest, the structure in which a part of the beam in between the base section and the supporting sections is thinner than the rest can be adopted.
According to the above, vibrations or impacts caused by the circumferential condition become hard to be propagated from the supporting sections to the base section via the beams, thus the effects of vibrations or the impacts become hard to be applied to the vibration arms, and therefore, the excited vibrations and the sensing vibrations advantageously become hard to be suppressed by supporting the piezoelectric segment. Note that this effect can be enhanced by disposing the low stiffness portion adjacent to the base section.
Furthermore, in the piezoelectric vibrating segment, the exciting electrode and the sensing electrode formed on the vibration arms are preferably connected to the conduction electrodes formed on the frame section.
Note that, hereinafter, the exciting electrode can be referred to as a exciting signal electrode, and the sensing electrode can be referred to as a sensing signal electrode.
As described above, the supporting sections and the frame section can be integrally formed. Therefore, since the exciting electrode and the sensing electrode provided on the vibration arms are connected to the conduction electrode provided on the frame section, the electrode forming process can be simplified and the work efficiency in encapsulating the piezoelectric vibrating segment in a container described below can be enhanced.
Further, a supporting structure for a piezoelectric vibrating segment according to the invention can include a piezoelectric vibrating segment described above, a supporting stage for oppositely mounting the piezoelectric vibrating segment, and fixing members provided between the first supporting sections and the supporting stage and between the second supporting section and the supporting stage for fixing the piezoelectric vibrating segment.
In this case, as a supporting stage, a circuit board with a predetermined electrode pattern formed on a surface hereof can be adopted.
According to the invention, since the piezoelectric vibrating segment is fixed to the supporting stage by, for example, fixing members in five points of the first supporting sections and the second supporting section, the posture thereof can be kept stable even if vibrations or impacts are applied from the outside. Further, since the gaps with the supporting stage can stably be maintained, even if vibrations or impacts are applied from the outside, the piezoelectric vibrating segment can be prevented from abutting on the supporting stage by appropriately setting the height (thickness) of the fixing member, thus enabling to keep the excited vibrations and the sensing vibrations stable.
Further, the fixing members are preferably made of a conductive material. In this case, a conductive adhesive can be adopted as the fixing member. Thus, by using the conductive adhesive, fixing of the piezoelectric vibrating segment to the supporting stage and electrical connection of the exciting electrode or the sensing electrode formed on the piezoelectric vibrating segment with, for example, the electrode patterns formed on the supporting stage via the conduction electrode are easily achieved.
Further, the fixing members described above are preferably made of an elastic material.
According to the structure, since the fixing member having elasticity further absorbs vibrations and impacts from the outside to keep the excited vibrations and the sensing vibrations stable. Further, since the fixing member serves as a buffer member of vibrations leaking to the respective supporting sections, negative effects to the excited vibrations or the sensing vibrations derived from the fixing of the respective supporting sections can further be reduced.
Further, in the supporting structure described above, the fixing member provided between the second supporting section and the supporting stage is preferably thicker than the fixing member provided between the first supporting section and the supporting stage.
In the structure of the invention, it is realized, for example, by forming a portion of the supporting stage for mounting the piezoelectric vibrating segment on which the first supporting section is mounted higher than other portions. According to the structure, the piezoelectric vibrating segment is supported by the first supporting sections via a thin fixing member and has a thicker fixing member between the second supporting section and the supporting stage. The second supporting section is provided on the base section as described above. Accordingly, the fixing member of the second supporting section thicker than those of the first supporting sections and is easier to be deformed to reduce negative effects derived from fixing of the second supporting section.
Further, the exemplary supporting structure for a piezoelectric vibrating segment according to the invention can include a piezoelectric vibrating segment having the first supporting sections formed integrally with the frame section formed surrounding the vibration arms, a base member to which the piezoelectric vibrating segment is fixed wherein the frame section formed on the piezoelectric vibrating segment is fixed to the base member. Note that the base member functions as the supporting stage, and denotes a part of a container for encapsulating the piezoelectric vibrating segment.
According to the exemplary structure, since the frame section including support sections is fixed to and supported by the base member using, for example, the fixing member described above, the piezoelectric vibration segment can more stably be supported. Further, since the piezoelectric vibrating segment can directly be fixed to the base member without using the supporting stage described above, the structure can be simplified and miniaturized.
Further, in the supporting structure for a piezoelectric vibrating segment, a periphery portion of the frame section of the piezoelectric vibrating segment is preferably fixed to a periphery portion of the base member. Thus, since materials of the fixing member is not limited to the conductive adhesive, and the piezoelectric vibrating segment is directly fixed to the base member, fixing strength can be increased to reduce vibration leakage in the piezoelectric vibrator.
A piezoelectric vibrator according to the invention can include, a piezoelectric vibrating segment described above, a base member to which the piezoelectric vibrating segment is fixed, and a lid member for housing and hermetically sealing the piezoelectric vibrating segment in cooperation with the base member. Thus, since the piezoelectric vibrating segment is hermetically sealed by the base member and the lid member, the piezoelectric vibrator can be provided that keeps the excited vibrations and the sensing vibrations stable even if vibrations or impacts are applied from the outside. Further, since the inside of the piezoelectric vibrator according to the present invention is kept, for example, vacuum to avoid effects of environmental condition such as moisture or an impact, a predetermined performance can be maintained for a long period of time.
An exemplary piezoelectric vibrating gyroscope according to the invention can include a piezoelectric vibrating segment described above, a drive circuit for exciting the piezoelectric vibrating segment to vibrate, and a detection circuit for detecting the sensing vibration generated in the piezoelectric vibrating segment in response to application of rotational angular velocity from the outside to the piezoelectric vibrating segment.
According to the invention, since the piezoelectric vibrating segment comprises the elastic beams, the piezoelectric vibrating segment can be provided in which the excited vibrations and the sensing vibration are kept stable, and the excited vibrations and the sensing vibrations are hard to be affected by supporting the piezoelectric vibrating segment if vibrations or impacts are applied from the outside.
This invention will be described with reference to the accompanying drawings, wherein like numerals reference like elements, and wherein:
An embodiment of the invention is hereinafter described referring to the accompanying drawings.
The piezoelectric vibrating segment 10 is formed of the quartz substrate of a predetermined thickness. The planar figure of the piezoelectric vibrating segment 10 is spreading in the X-Y plane along the crystal axis of the quartz and is 180 degree symmetrical about the center point G. The center point G is the center of mass of the piezoelectric vibrating segment 10. Further, although not shown in
The piezoelectric vibrating segment 10 has a base section 12 having edge surfaces parallel to the X axis direction or the Y axis direction respectively, a pair of excited vibration systems 14-1, 14-2 each extending in a direction parallel to the X axis from the center of respective one of the pair of side surfaces of the base section 12 parallel to the Y axis, and a pair of sensing vibration arms 20-1, 20-2 each extending in a direction parallel to the Y axis from the center of respective one of the pair of side surfaces of the base section 12 parallel to the X axis. The excited vibration system 14-1 is composed of a connecting arm 18-1 connecting to the side surface of the base section 12 and a pair of excited vibration arms 16-1, 16-2 extending from the connecting arm 18-1 in a direction traversing the connecting arm 18-1. Similarly, the excited vibration arm 14-2 in the opposite side of the center point G is composed of a connecting arm 18-2 and a pair of excited vibration arms 16-3, 16-4.
On the tip of the excited vibration arms 16-1, 16-2, 16-3, and 16-4, there are respectively formed rectangular weight sections 22-1, 22-2, 22-3, and 22-4 that are wider than the other portions thereof. Further, on the tip of the sensing vibration arms 20-1 and 20-2, there are respectively formed rectangular weight sections 22-5 and 22-6 that are wider than the other portions thereof.
In the center in the width direction of the excited vibration arms 16-1, 16-2, 16-3, and 16-4, there are formed concave grooves 24-1, 24-2, 24-3, and 24-4 in the thickness direction. In a similar manner, grooves 24-5 and 24-6 are respectively formed on the sensing vibration arms 20-1 and 20-2.
The width and length of each section of the beams 32-1, 32-2, 32-3, and 32-4 described above are designed so as to provide appropriate elasticity in both the X axis and the Y axis directions.
The weight sections 22-1 through 22-6 and the grooves 24-1 through 24-6 are elements for forming the piezoelectric vibrating segment in a smaller size but not particularly limiting the scope of the present invention.
In the excited vibration arms 16-1, 16-2, 16-3, and 16-4, the width and the length of the excited vibration arms 16-1 through 16-4, the size of the weight sections 22-1 through 22-4, the size of the grooves 24-1 through 24-4 and so forth are designed so as to generate the excited vibration of a predetermined frequency. Similarly, in the sensing vibration arms 20-1 and 20-2 and the connecting arms 18-1 and 18-2, the width and the length of the sensing vibration arms 20-1 and 20-2, the size of the weight sections 22-5 and 22-6, the size of the grooves 24-5 and 24-6 and so forth are designed so as to generate a predetermined sensing vibration.
Further, in the piezoelectric vibrating segment 10 a second supporting section 40 is formed on the center of one surface of the base section 12, the second supporting section 40 including the center point G. The second supporting section 40 is a small region around the center of the base section 12 in the surface that faces a supporting stage when the piezoelectric vibrating segment 10 is mounted on a substrate 60 (See
In the tips of the beams 32-1, 32-2, 32-3, and 32-4 described above, there are respectively formed first supporting sections 30-1, 30-2, 30-3, and 30-4 each having a substantially rectangular shape. The piezoelectric vibrating segment 10 according to the exemplary embodiment 1 is formed having four of the first supporting sections 30-1 through 30-4 described above and the second supporting section 40 as five supporting sections, and is mounted on the substrate 60 described below.
Furthermore, the beams 32-1 through 32-4 described above are formed to have shapes elastic with respect to the vibration of the periphery of the base section 12 to absorb vibrations or impacts from the outside when the piezoelectric vibrating segment 10 is mounted on the substrate 60.
Note that since the piezoelectric vibrating segment 10 according to the exemplary embodiment can be formed as a single piece by etching using a photolithography technology, a plurality of piezoelectric vibrating segments can be formed simultaneously.
Hereinafter, the electrode pattern of the piezoelectric vibrating segment 10 according to the exemplary embodiment is described referring to
In both of the principal surfaces of the exited vibration arms 16-1 and 16-2 first exciting electrodes 52-1 elongated along the length direction of the arms are formed in the center of the arm width. In the both side surfaces thereof, second exciting electrodes 52-2 are formed. In contrast, in both of the principal surfaces of the excited vibration arms 16-3 and 16-4, the second exciting electrodes 52-2 elongated along the length direction of the arms are formed in the center of the arm width. And, in the both side surfaces thereof, the first exciting electrodes 52-1 are formed.
The exciting electrodes 52-1 are connected by connecting electrodes 58-1 formed on the connecting arms 18-1, 18-2 described above and the base section 12, and further connected to conduction electrodes 50-2 formed on the surfaces of the first supporting section 30-2. Similarly, the second exciting electrodes 52-2 are connected to conduction electrodes 50-3 formed on the surfaces of the first supporting section 30-3 via the connecting electrode 58-2.
In both of the principal surfaces of the sensing vibration arms 20-1, first sensing electrodes 54-1 elongated along the length direction of the arms are formed in the center of the arm width. Similarly, in both of the principal surfaces of the sensing vibration arms 20-2, second sensing electrodes 54-2 are formed. And, third sensing electrodes 54-3 are formed on both side surfaces of the sensing vibration arms 20-1 and 20-2.
The first sensing electrodes 54-1 can be connected to conduction electrodes 50-1 formed on both surfaces of the first supporting section 30-1 via connecting electrodes 58-3 formed on the base section 12 and the beam 32-1. Similarly, the second sensing electrodes 54-2 are electrically connected to conduction electrodes 50-4 formed on the surfaces of the first supporting section 30-4 via connecting electrodes 58-4. And, the third sensing electrodes 54-3 are connected by connecting electrodes 58-5 formed on the base section 12 to a conduction electrode 56 formed on the second supporting section 40.
As described above, in the piezoelectric vibrating segment 10, by applying exciting signals between the conduction electrodes 50-2 formed on the first supporting section 30-2 and the conduction electrodes 50-3 formed on the first supporting section 30-3, an electric field can be generated between the first exciting electrodes 52-1 and the second exciting electrodes 52-2 to make the excited vibration arms 16-1, 16-2, 16-3, and 16-4 excitedly vibrate.
Further, a sensing vibration generated in the sensing vibration arm 20-1 appears as an electric charge between the first sensing electrodes 54-1 and the third sensing electrodes 54-3 that can be obtained as an electric signal from the conduction electrodes 50-1 formed on the first supporting section 30-1 and the conduction electrode 56 formed on the second supporting section 40. Likewise, a sensing vibration generated in the sensing vibration arm 20-2 can be obtained as an electric signal from the conduction electrodes 50-4 formed on the first supporting section 30-4 and the conduction electrode 56 formed on the second supporting section 40.
Note that the electrode pattern of the piezoelectric vibrating segment of the present embodiment 1 as described above can be provided by forming a metal film on a surface of the piezoelectric vibrating segment 10 so shaped followed by etching using a photolithography technology.
Following the above, the supporting structure for the piezoelectric vibrating segment 10 according to the exemplary embodiment is described referring to
In
In the substrate 60, there are formed electrode patterns shown in
In
In
As described above, in the supporting structure for the piezoelectric vibrating segment 10 of the exemplary embodiment 1, the conductive adhesive 70 is used as the fixing member for supporting and fixing the five points including the four of the first supporting sections 30-1, 30-2, 30-3, and 30-4 and the second supporting section 40 provided on the piezoelectric vibrating segment 10. Further, the structure also providing electrical connection with the vibrating segment mounting electrode lands 61-1, 61-2, 61-3, 61-4, and 61-5 formed on the substrate 60.
Hereinafter, an operation of the piezoelectric vibrating segment 10 supported by the supporting structure according to the present embodiment 1. the piezoelectric vibrating segment 10 absorbs vibrations generated in the periphery of the base section 12 by distortion of the beams 32-1, 32-2, 32-3, and 32-4. Thus, if portions (specifically the first supporting sections 30-1, 30-2, 30-3, and 30-4) other than the center portion of the base section 12 where large vibrations are not generated are supported to be fixed, the excited vibrations and the sensing vibrations are hard to be suppressed.
According to the above, the excited vibration systems 14-1 and 14-2 vibrate as denoted with the arrow B. The vibration denoted with the arrow B is a vibration in a rotational direction around the center point G. At the same time, the sensing vibration arms 20-1 and 20-2 vibrate, as denoted with the arrow C, in the opposite rotational direction to the arrow B in response to the vibration of arrow B.
In this case, the periphery of the base section 12 vibrates, as denoted with the arrow D, in a rotational direction around the center point G. This is because the sensing vibration is not a balancing vibration of the sensing vibration arms 20-1, 20-2 with only the excited vibration systems 14-1, 14-2 but is rather a balancing vibration including the base section 12.
Although the vibration amplitude of the periphery of the base section 12 as denoted with the arrow D is small in comparison with the vibration amplitude of excited vibration systems 14-1, 14-2 as denoted with the arrow B or the vibration amplitude of the sensing vibration arms 20-1, 20-2 as denoted with the arrow C, if, for example, the periphery portion of the base section 12 is fixedly adhered to the substrate 60 by the conductive adhesive or the like, the vibration amplitude of the periphery of the base section 12 is suppressed and accordingly the whole sensing vibration is suppressed.
In
Since the beams 32-1, 32-2, 32-3, and 32-4 include beams 32-1B, 32-2B, 32-3B, and 32-4B that are parallel to the Y axis and easy to be bent in the X axis direction and beams 32-1A, 32-2A, 32-3A, and 32-4A that are parallel to the X axis and easy to be bent in the Y axis direction, the beams can deal with the vibration of the base section 12 in the rotational direction of the periphery.
Hereinafter, a structure of a piezoelectric vibrating gyroscope 90 using the piezoelectric vibrating segment 10 is described with reference to
The base member 82 is formed of laminated ceramics, and is provided with necessary electrode wiring. A metal film is formed on the upper surface of the periphery of the base member 82, and the lid member 84 made of metal is welded on the upper surface of the base member 82.
The semiconductor device 80 can include a drive circuit for exciting the piezoelectric vibrating segment 10 to vibrate and a detection circuit for detecting the sensing vibration generated at the piezoelectric vibrating segment 10 when a rotational angular velocity is externally applied to the piezoelectric vibrating segment 10 to output an electric signal in accordance the rotational angular velocity.
The semiconductor device 80 is fixed to a surface of the lowest step of the base member 82 and is connected to the electrode wiring (not shown in the drawings) formed on the base member 82 via gold wires 76. The piezoelectric vibrating segment 10 is fixedly adhered to the substrate 60 by the conductive adhesive 70, and the substrate 60 is fixedly adhered to the medium step of the base member 82 by a conductive adhesive 74.
According to the structure described above, the excitation electrodes and the sensing electrodes formed on the piezoelectric vibrating segment 10 are connected to the semiconductor device 80 via the electrode patterns formed on the substrate 60, the electrode wiring provided on the base member 82, and the gold wires 76. Thus, the piezoelectric vibrating segment 10 is excited to vibrate by the drive circuit of the semiconductor device 80 and output a signal caused by the sensing vibration corresponding to the rotational angular velocity to the detection circuit of the semiconductor device 80. And then the semiconductor device 80 outputs the electric signal corresponding to the rotational angular velocity.
Therefore, according to the first exemplary embodiment as described above, since the piezoelectric vibrating segment 10 is fixed to the substrate 60 by the five supporting sections including the first supporting sections 30-1, 30-2, 30-3, and 30-4 provided on the tips of the beams 32-1 through 32-4 extending radially from the base section 12 and the second supporting section 40 provided on the center portion of the base section 12, the piezoelectric vibrating segment can be supported on the substrate 60 with a stable posture.
Furthermore, since the beams 32-1 through 32-4 are formed to have shapes elastic with respect to the vibration of the periphery of the base section 12, negative effects to the excited vibrations or the sensing vibrations derived from fixing the piezoelectric vibrating segment 10 to the substrate 60 can be reduced, and further, negative effects to a drive signal or the sensing vibrations derived from externally applied vibrations or impacts can also be reduced by absorbing them by the beams 32-1 through 32-4.
Still further, since the exciting electrodes 52-1, 52-2 and the sensing electrodes 54-1 through 54-3 formed on the surface of the respective vibration arms of the piezoelectric vibrating segment 10 are connected to the conduction electrodes 50-1 through 50-4, and 56 formed on the surface of the respective supporting sections, predetermined electrical connections can be provided by the conduction electrodes 50-1 through 50-4, and 56 simplifying the structures of the electrode patterns.
Further, according to the supporting structure for the piezoelectric vibrating segment 10 of the first exemplary embodiment, since the piezoelectric vibrating segment 10 is supported by the five supporting sections, the stable posture thereof with respect to the substrate 60 can be maintained if external vibrations or impacts are applied thereto. Further, since the gap between the piezoelectric vibrating segment 10 and substrate 60 can be stably maintained to prevent the excited vibration arms 16-1 through 16-4 and the sensing vibration arms 20-1, 20-2 from abutting on the substrate even if vibrations or impacts are externally applied, the excited vibrations and the sensing vibrations can be stably maintained.
Further, since the conductive adhesive 70 as the fixing member, the electrical connection can be provided in a reduced space without using other electrical connection means such as a metal wire. Still further, since the conductive adhesive 70 has elasticity, vibrations and impacts applied from the outside can be absorbed to maintain the excited vibrations and the sensing vibrations more stably. Further, since the fixing member serves as a buffer member of vibrations leaking to the respective supporting sections, negative effects to the excited vibrations or the sensing vibrations derived from the fixing of the respective supporting sections can further be reduced.
Since the piezoelectric vibrating gyroscope 90 according to the first exemplary embodiment is composed of the piezoelectric vibrating segment 10 maintained in a stable posture or the supporting structure for the piezoelectric vibrating segment, the piezoelectric vibrating gyroscope 90 can stably operate without any disturbance in the vibrations even if external vibrations or impacts are applied. Further, since the vacuum condition is maintained in the container of the piezoelectric vibrator to avoid any effects from the environmental condition such as moisture or an impact, a predetermined performance can be maintained for a long period of time.
Hereinafter, a configuration of a second exemplary embodiment according to the invention is described referring to
Firstly, the shape of the piezoelectric vibrating segment 110 according to the present embodiment 2 is described.
According to
Further, a centerline of the second beams 102-1, 102-2 in the extending direction is identical to a Y axis line passing over the center point G of the piezoelectric vibrating segment. Note that the width and the length of each portion of the second beams 102-1, 102-2 is arranged to provide appropriate elasticity in the Y axis direction.
In
Hereinafter, a supporting structure for the piezoelectric vibrating segment 110 according to the exemplary embodiment is described.
Hereinafter, an operation of the piezoelectric vibrating segment 110 according to the exemplary embodiment is described.
According to
Therefore, according to the structure of the second exemplary embodiment described above, since the second supporting section 140 formed on the base section 112 is provided in addition to the first supporting sections 30-1 through 30-4 described above, the second supporting section 140 also including the beams 102-1, 102-2 having elasticity, vibrations around base section 112 are absorbed by the beams to reduce propagation of the vibrations to the second supporting section 140. Thus, negative effects to the excited vibrations or the sensing vibrations derived from providing the second supporting section 140 can be reduced.
Hereinafter, a configuration of a third exemplary embodiment of the supporting structure for the piezoelectric vibrating segment according to the invention is described referring to
In
The base member 282 is formed of a laminated ceramics material. The supporting electrodes 260 and the electrode land 262 are respectively connected to external connecting electrodes 264 formed on the outer surface of the base member 282. The supporting electrodes 260 are formed to be higher than the electrode land 262 by, for example, printing only the supporting electrodes 260 a number of times when depositing a material of the electrode land 262 on the ceramics material by screen printing.
Further, the lid member 284 is made of metal and welded to a metal layer formed on the upper surface of the base member 282. The inside of the container composed of the base member 282 and the lid member 284 is maintained vacuum.
The piezoelectric vibrator 200 according to the exemplary embodiment is mounted on a circuit board (not shown in the drawings) forming the piezoelectric vibrating gyroscope. By connecting the external connecting electrodes 264 to a drive circuit or a detection circuit, the piezoelectric vibrating gyroscope can be composed.
Therefore, according to the supporting structure for the piezoelectric vibrating segment 10 of the present embodiment 3 described above, since the conductive adhesive 271 for the second supporting section 40 is thicker than the conductive adhesive 270 for the first supporting section 30-1 through 30-4, and accordingly easy to be deformed in response to the movement of the second supporting section 40, especially to the vibrations of the base section 12 in rotational directions in its plane, negative effects to the excited vibrations or the sensing vibrations derived from fixing the second supporting section 40 can be reduced.
Although in the embodiment, the piezoelectric vibrating segment 10 shown in the first embodiment described above is used as the piezoelectric vibrating segment, the piezoelectric vibrating segment 110 described as the second embodiment can also be used to reduce negative effects to the excited vibrations or the sensing vibrations derived from fixing the second supporting section 140.
Subsequently, another embodiment of the piezoelectric vibrating segment is described referring to the accompanying drawings.
A piezoelectric vibrating segment 10A shown in
Further,
Therefore, according to the fourth exemplary embodiment described above, since the length of the elastic portion can be adjusted to make the beams easier to be bent by variously modifying the length or the shape of the beams of the piezoelectric vibrating segments 10A, 10B, and 10C, the vibrations of the base section 12 can be prevented from propagating to the supporting sections without changing the size of the piezoelectric vibrating segment to provide stable excited vibrations or sensing vibrations. Note that, although the second supporting section 40 is the same as that of the second embodiment, the second beams with elasticity can also be used in the base section 12 as is the case with the second embodiment to provide the further stable exited vibrations or sensing vibrations.
Consequently, a fifth exemplary embodiment of the invention is described referring to the accompanying drawings.
Further, the sensing vibration arms 20-1 and 20-2 extends form a pair of edges of the base section 12 opposing to each other in the Y axis direction, and the weight sections 22-5 and 22-6 shaped substantially rectangle are formed on the tips thereof. The shapes of the base section, excited vibration arms, and the sensing vibration arms described above are the same as those of the piezoelectric vibrating segment 10 of the first exemplary embodiment (shown in
Out of the first supporting sections described above, the supporting section 30-1 and the supporting section 30-3 extending in the same direction along the Y axis are connected to a frame section 130, and the other supporting sections 30-2 and 30-4 are connected to a frame section 131, each forming a single body.
Note that piezoelectric vibrating segment 10 is symmetric around the center point G of the base section 12 in both the X direction and the Y direction.
Consequently, a modified example of the piezoelectric vibrating segment 10 according to the fifth embodiment is described referring to the accompanying drawings.
Note that piezoelectric vibrating segment 10 is symmetric around the center point G of the base section 12 in both the X direction and the Y direction.
Hereinafter, another modified example of the piezoelectric vibrating segment 10 according to the fifth embodiment is described referring to the accompanying drawings.
The gaps between the frame section 132 and the excited vibration arms 16-1 through 16-4, the sensing vibration arms 20-1, 20-2, the beams 32-1 through 32-4 are arranged to be substantially constant. In other words, the gaps between the adjacent sections of the piezoelectric vibrating segment 10 inside the frame section 132 including the frame section 132 are arranged substantially the same. Note that, in the piezoelectric vibrating segment 10 according to the fifth embodiment (See
Note that piezoelectric vibrating segment 10 is symmetric around the center point G of the base section 12 in both the X direction and the Y direction.
Further, another modified example of the piezoelectric vibrating segment 10 according to the fifth exemplary embodiment is described referring to the accompanying drawings.
According to FIGS. 26(a) and 26(b), the beams 32-1 through 32-4 extend from the four corners of the base section 12 shaped substantially rectangle and provided in the center portion of the piezoelectric vibrating segment 10. In the connection sections of the beams 32-1 through 32-4 with the base section 12, there are provided hollow sections 33 and 34 on both of the principal surfaces of the piezoelectric vibrating segment 10. The hollow sections 33 and 34 are formed from the edges of the base section 12 with a same width as the width of the beams 32-1 through 32-4 and with the remaining thickness of a third of the beams to have lower stiffness.
According to
Note that, the hollow sections 33 and 34 can be applied to the piezoelectric vibrating segments shown in the first embodiment through the fourth embodiment.
Hereinafter, electrode patterns formed on the piezoelectric vibrating segment 10 according to the fifth embodiment described above are described referring to the accompanying drawings.
The exciting signal electrode can include an electrode pattern 150-1 formed continuously on the front surface of the excited vibration arms 16-3 and 16-4, an electrode pattern 150-3 formed continuously on the reverse surface of the connecting arm 18-1 and the base section 12 and connected to an electrode pattern 150-2 formed continuously on the reverse surface of the excited vibration arms 16-1 and 16-2, and an electrode pattern 150-4 formed on the side surface of the beam 32-1, sequentially connected to a conduction electrode section 150 for the exciting signal formed on the frame section 130.
The exciting signal GND electrode can include an electrode pattern 151-1 formed on the front surface of the excited vibration arms 16-1 and 16-2, an electrode pattern 151-2 formed on the reverse surface of the excited vibration arms 16-3 and 16-4, an electrode pattern 151-3 formed on the side surface of the connecting arm 18-1, an electrode pattern 151-4 formed front surface of the base section 12, and an electrode pattern 151-5 formed on the side surface of the beam 32-3, sequentially connected to a conduction electrode section 151 for the exciting signal GND formed on the frame section 130. Further, the first sensing signal electrode can include an electrode pattern 152-1 formed on the front surface of an arm section of the sensing vibration arm 20-1 and the base section 12 and an electrode pattern 152-2 formed on the side surface of the beam 32-1, sequentially connected to a conduction electrode section 152 of the first sensing signal electrode.
Further, the first sensing signal GND electrode can include an electrode pattern 153-1 formed on the front surface of the base section 12 and the beam 32-1 and continuously connected to a conduction electrode section 153 of the first sensing signal GND electrode.
Further, the second sensing signal electrode can include of an electrode pattern 154-1 formed on the front surface of an arm section of the sensing vibration arm 20-2, an electrode pattern 154-2 formed on the side surface of the beam 32-2, and an electrode pattern 154-3 formed on the front surface of the beam 32-2, sequentially connected to a conduction electrode section 154 of the second sensing signal electrode formed on the front surface of the frame section 131.
Further, the second sensing signal GND electrode is composed of an electrode pattern 155-1 formed on the side surface of an arm section of the sensing vibration arm 20-2, an electrode pattern 155-2 formed on the front-surface of the base section 12, and an electrode pattern 155-3 formed on the side surface of the beam 32-4, sequentially connected to a conduction electrode section 155 of the second sensing signal GND electrode formed on the front surface of the frame section 131.
The piezoelectric vibrating segment 10 having the shape and the electrode pattern structure as described above is encapsulated in the container.
Hereinafter, a supporting structure of the piezoelectric vibrating segment 10 according to the exemplary embodiment and a structure of the piezoelectric vibrating gyroscope 90 using the piezoelectric vibrating segment 10 are described referring to the accompanying drawings.
The base member 82 is formed of laminated ceramics, and is provided with necessary electrode wiring. A metal film can be formed on the upper surface of the periphery of the base member 82, and the lid member 84 made of metal can be welded on the periphery of the upper surface of the base member 82.
The semiconductor device 80 can include a drive circuit for exciting the piezoelectric vibrating segment 10 to vibrate and a detection circuit for detecting the sensing vibration generated at the piezoelectric vibrating segment 10 when a rotational angular velocity is externally applied to the piezoelectric vibrating segment 10 to output an electric signal in accordance the rotational angular velocity.
The semiconductor device 80 is fixed to a surface of the lowest step of the base member 82 and is connected to the electrode wiring 85 formed on the base member 82 via gold wires 76. The electrode wiring is provided at least corresponding to the conduction electrode sections 150 through 155 provided on the piezoelectric vibrating segment 10. The piezoelectric vibrating segment 10 is fixedly adhered to the medium step of the base member 82 at the conduction electrodes 150 through 155 by a conductive adhesive 74. The conductive adhesive 74 has a thickness enough to prevent the piezoelectric vibrating segment form contacting to the base member 82, and the excited vibration arms 16-1 through 16-4, the base section 12, and the sensing vibration arms 20-1, 20-2 are kept floating from the base member.
According to the above structure, the conduction electrode section 150 of the excited vibration electrode formed on the frame section 130 of the piezoelectric vibrating segment 10 described above, the conduction electrode section 151 of the exciting signal GND electrode, the conduction electrode section 152 of the first sensing signal electrode, the conduction electrode section 153 of the first sensing signal GND electrode, the conduction electrode section 154 of the second sensing signal electrode formed on the frame section 131, and the conduction electrode section 155 of the second sensing signal GND electrode are electrically connected to the semiconductor device 80 via electrical wiring of the base member 82 and the gold wires 76. Thus, the piezoelectric vibrating segment 10 is excited to vibrate by the drive circuit of the semiconductor device 80 and outputs the signal of the sensing vibration corresponding to the rotational angular velocity to the detection circuit of the semiconductor device 80. And, the semiconductor device 80 then outputs the electrical signal corresponding to the rotational angular velocity.
Note that, in another modified example of the piezoelectric vibrating segment shown in
Further, since the operation of the piezoelectric vibrating segment 10 is the same as that of the first exemplary embodiment (shown in
Therefore, according to the fifth exemplary embodiment described above, since the supporting sections 30-1, 30-3 and the frame section 130 described above are integrally formed, and the supporting sections 30-2, 30-4 and the frame section 131 are also integrally formed, structural strength of the supporting sections is increased to maintain a more stable posture. Further, since the frame sections and the supporting sections are integrated, the piezoelectric vibrating segment is easy to be handled when encapsulated in the container, as described below, to advantageously improve the operating efficiency.
Further, since the frame sections 130, 131 or the frame section 132 are arranged to have substantially constant gaps with the base section 12, excited vibration arms 16-1 through 16-4, the sensing vibration arms 20-1, 20-2, and the beams 32-1 through 32-4 to provide constant circumferential gaps of the piezoelectric vibrating segment 10 with the surrounding frame sections 130, 131 or the frame section 132, the resist film can be formed in a constant thickness in the resist deposition process of the photolithography process for shaping the piezoelectric vibrating segment 10 by etching. Thus, the shape of each section of the piezoelectric vibrating segment can stably be formed, and, as a result, the excited vibrations and the sensing vibrations can be more stable.
Further, since the hollow sections 33, 34 shaped so as to have smaller stiffness are provided on the part of the beams, vibrations or impacts caused by the environmental condition are hard to propagate from the supporting sections to the base section 12 via beams, and on the contrary, the vibrations of the base section 12 are hard to propagate to the frame sections, to advantageously reduce negative effects applied to the excited vibrations or the sensing vibrations.
Further, as described above, equivalent portions of the supporting sections 30-1 through 30-4 shown in the first embodiment and the frame sections 130, 131 or the frame section 132 are formed integrally. Accordingly, since the exciting signal electrodes and sensing signal electrodes are connected to the conduction electrode sections provided on the frame sections, the electrode forming process can be simplified, and also the operational efficiency in encapsulating the piezoelectric vibrating segment 10 in the container described below can be improved.
Further, since the frame sections 130, 131, and 132 including the supporting sections are fixed to and supported by the base member 82, the piezoelectric vibrating segment can more stably be supported. Further, the piezoelectric vibrating segment 10 can be directly fixed to the base member 82 without the substrate 60 as a supporting stage shown in the first exemplary embodiment, the structure can be simplified to reduce the cost and the size.
Hereinafter, a piezoelectric vibrating gyroscope according to the sixth embodiment of the invention is described referring to the accompanying drawings. In the exemplary embodiment, the fixing structure of the piezoelectric vibrating segment 10 is different from that of the piezoelectric vibrating gyroscope 90 (See
The base member 82 is formed of laminated ceramics, and is provided with necessary electrode wiring. A metal film is formed on the upper surface of the periphery of the base member 82, the piezoelectric vibrating segment 10 provided with a metal film for fixing on the both surface of the frame 132 in the portion where no conduction electrodes are formed is stacked thereon, the lid member 84 is further stacked thereon, and then the base member 82, the piezoelectric vibrating segment 10, and the lid member 84 are fixed in a stacked form by welding or adhesive bonding. The lid member is made of metal, and is provided with a hollow section not to contact with the piezoelectric vibrating segment except the fixing section on the periphery thereof.
The semiconductor device 80 comprises a drive circuit for exciting the piezoelectric vibrating segment 10 to vibrate and a detection circuit for detecting the sensing vibration generated at the piezoelectric vibrating segment 10 when a rotational angular velocity is externally applied to the piezoelectric vibrating segment 10 to output an electric signal in accordance the rotational angular velocity.
The semiconductor device 80 is fixed to a surface of the lowest step of the base member 82 and is connected to the electrode wiring 85 formed on the base member 82 via gold wires 76. The electrode wiring is provided at least corresponding to the conduction electrode sections 150 through 155 provided on the piezoelectric vibrating segment 10. The piezoelectric vibrating segment 10 is fixedly adhered to the medium step of the base member 82 at the conduction electrodes 150 through 155 by a conductive adhesive 74. The conductive adhesive 74 has a thickness enough to prevent the piezoelectric vibrating segment form contacting to the base member 82, and the excited vibration arms 16-1 through 16-4, the base section 12, and the sensing vibration arms 20-1, 20-2 are kept floating from the base member.
Therefore, according to the sixth embodiment described above, since the piezoelectric vibrating segment is pinched to be more firmly fixed by the periphery of the base member 82 and the lid member 84, so called vibration leakage that the vibrations of the excited vibration arms 16-1 through 116-4 or the sensing vibration arms 20-1, 20-2 leak to the base member 82 or the lid member 84 can be reduced to provide more stable excited vibrations or sensing vibrations.
Further, since the height level of the piezoelectric vibrating segment 10 in the cross-sectional view is defined by the step of the base member 82, the gap between the piezoelectric segment 10 and the base member 82 can suitably be arranged to prevent abutting on each other.
Consequently, a seventh exemplary embodiment of the invention is described referring to the accompanying drawings. The seventh embodiment is a partial cross-sectional view showing a structure of the essential part of the piezoelectric vibrator 190 based on the technical idea of the sixth embodiment described above. According to
In the piezoelectric vibrating segment 10, although not shown in the drawings, cut-in sections are formed from the periphery of the frame section 132 to the inside the periphery sections 182A and 184 of the base member 182 and the lid member 184, and the conduction electrode sections 150 through 155 are formed on the side surfaces of the cut-in sections and continue to the edge surface 132A. Therefore, no electrodes exist in an area of the frame section 132 where the periphery sections 182A and 184A of the base member 182 and the lid member 184 contact, and the both surfaces of the area are kept flat. Further, a metal layer of a constant thickness is formed in the area of the frame section 132 where the periphery sections 182A and 184A of the base member 182 and the lid member 184 contact.
The base member 182, the piezoelectric vibrating segment 10, and the lid member 184 thus formed are stacked and fixed in a appressed condition by welding or adhesive bonding with vacuum kept inside.
The piezoelectric vibrator 190 thus structured is mounted on a circuit board (not shown in the drawings) forming the piezoelectric vibrating gyroscope. By connecting the conduction electrodes 150 through 155 formed on the edge surface 132A of the piezoelectric vibrating segment 10 to an external drive circuit or an external detection circuit, piezoelectric vibrating gyroscope can be composed.
Therefore, since the piezoelectric-vibrator described in the seventh exemplary embodiment is composed of the piezoelectric vibrating segment 10 stacked with the base member 182 and the lid member 184, a thinner piezoelectric vibrator can be provided. Further, since the conduction electrode sections 150 through 155 are formed on the edge surface of the piezoelectric vibrating segment 10, the external drive circuit or the external detection circuit described above can be connected easily and with a reduced space.
It should be understood that the invention is not limited to the exemplary embodiments described above, and modifications or even improvements that can achieve the object of the invention are included in the invention.
For example, in the piezoelectric vibrating segment of each of the above embodiments, the number of the beams is four and the number of the first supporting sections is four, but different numbers can be applied. Taking the amplitude or directions of the base section of the piezoelectric vibrating segment into consideration, the width, the length, the thickness, the number, or the shape of the first beams can be arranged to provide appropriate elasticity.
Further, the width, the thickness, the length, the number, the extending directions of the beams described in the above embodiments can be properly arranged or selected in accordance with the amplitude or the direction of the vibration of the base section of the piezoelectric vibrating segment.
Further, although the piezoelectric vibration segment 10 of the first exemplary embodiment shown in
Further, although in the supporting structure for the piezoelectric vibration segment shown in the first exemplary embodiment of above, the piezoelectric vibrating segment 10 is fixed to the substrate 60 with the conductive adhesive 70, the piezoelectric vibrating segment according to the present invention can adopt different supporting structure. For example, the first supporting sections 30-1 through 30-4 and the second supporting section 40 can be supported by properly shaped metal lead wires. Regarding the supporting section not necessary to be electrically connected, non-conductive adhesive can be used as well.
Further, although the conductive adhesive is used in the supporting structure for the piezoelectric vibrating segment according to the above embodiment, other materials can be used. For example, the thermo compression bonding with gold balls is applicable. Since the gold balls are used for electrical connections and fixing at the same time and have elasticity, the same effects as the elastic conductive adhesive can be obtained. Further, combinations such that the first supporting sections 30-1 through 30-4 are fixed by the gold balls and the second supporting section 40 or 140 is fixed with a conductive adhesive having a low elastic module.
Further, although in the above embodiments, the piezoelectric vibrating segment having a pair of excited vibration systems extending from the periphery of the base section in opposing directions, and a pair of sensing vibration arms extending in directions perpendicular to the directions in which the excited vibration systems extends are described, it should be understood that the invention is not limited to the piezoelectric vibrating segment thus structured.
For example, the invention is applicable to the tuning fork piezoelectric vibrating segment, or the H piezoelectric vibrating segment having a pair of excited vibration arms extending from the base section in one direction and a pair of sensing vibration arms extending from the base section in the other direction.
Further, although in the above embodiments, the piezoelectric vibrating segment or the piezoelectric vibrator for the piezoelectric vibrating gyroscope are described, the invention can also be applied to the piezoelectric vibrating segment or the piezoelectric vibrator without the function of detecting rotational angular velocity. For example, the invention can be applied to the piezoelectric vibrating segment or the piezoelectric vibrator for a reference clock generator or an acceleration sensor.
Therefore, according to the above first through seven exemplary embodiments, the piezoelectric vibrating segment, the supporting structure for the piezoelectric vibrating segment, the piezoelectric vibrator, and the piezoelectric vibrating gyroscope by which the excited vibrations and the sensing vibrations are kept stable even if vibrations or impacts are applied from the outside, and the excited vibrations and the sensing vibrations are hard to be suppressed even if the piezoelectric vibrating segment is supported can be provided.
While this invention has been described in conjunction with the specific embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, preferred embodiments of the invention as set forth herein are intended to be illustrative, not limiting. There are changes that may be made without departing from the spirit and scope of the invention.
Number | Date | Country | Kind |
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2003-201892 | Jul 2003 | JP | national |
2004-122906 | Apr 2004 | JP | national |