Patent Application
20230420407
The present invention relates to a pin arrangement device, a pin arrangement array body, and a pin arrangement method.
As a technique of laminated wiring, 3D wiring, and the like, there has been studied chiplet by which chips are integrated by a plurality of dies. In order to place and wire a die on another die, pins are required. The diameter and length of the pins are of the micro-order of 0.3 mm or less, for example.
Since the size of the pins is very small, it is difficult to erect the lying pins or erect and arrange one or a plurality of pins in the chip manufacturing process.
Therefore, an object of the present invention is to provide a pin arrangement device, a pin arrangement array body, and a pin arrangement method for arranging pins upright.
The concepts of the present invention are as follows.
According to the present invention, pins can be efficiently arranged upright.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The drawings illustrate one of preferred embodiments of the present invention. Modifications with partial deletions or additions of the components of the present invention are also included in the scope of the present invention without departing from the spirit of the present invention.
The pin arrangement array body 2 is provided with a plurality of holes 4 arranged in the vertical direction and the lateral direction. The pin arrangement array body 2 may have holes 4 of the same depth or holes 4 of different depths according to the positions of the holes 4. The holes 4 may be either penetrating or non-penetrating. The holes 4 have a hole diameter and a length of micro sizes corresponding to the diameter and length of pins 5 to be arranged. The micro size is assumed to be a size of 1 μm or more and 1000 μm or less. The pins 5 have a cylindrical shape and have a diameter of 1 μm or more and 1000 μm or less and a length of 1 μm or more and 1000 μm or less, for example. Therefore, the holes 4 have a diameter 1.02 to 1.3 times the diameter of the pins 5. The holes 4 have a depth of 0.1 times or more and 5 times or less the length of the pins 5. This is because if the holes 4 are in these ranges with respect to the dimensions of the pins 5, one pin 5 can be inserted into one hole 4, and the pin 5 is unlikely to come out of the hole 4. The holes 4 may be provided perpendicularly to the upper and lower surfaces of the pin arrangement array body 2 or may be inclined with respect to the upper and lower surfaces of the pin arrangement array body 2. It is not required to provide the holes 4 having the same or similar shape and dimensions (in particular, depth) in one pin arrangement array body 2. Holes different in shape and dimensions may be provided in each place.
According to the pin arrangement device 1A illustrated in
In this manner, the plurality of pins 5 having diameter and length of micro sizes are arranged on the pin arrangement array body 2 that has the holes 4 having diameter and length corresponding to the diameter and length of the pins 5. Then, the pin arrangement array body 2 is vibrated by the vibration application unit 3. As a result, the pins 5 are inserted into the holes 4 of the pin arrangement array body 2. Therefore, the plurality of pins 5 can be arranged in a predetermined positional relationship.
A pin arrangement device 1B according to the second embodiment of the present invention is structured by providing a magnetic body 6 on a lower surface of a pin arrangement array body 2 so as to be vertically movable. The pins 5 are formed such that a force acts by a magnetic field. For example, the pins 5 may be similar to those of the first embodiment as long as at least the surfaces thereof are made of a magnetic material. This is because the pins 5 behave due to the magnetic field of the magnetic body 6. The pin arrangement array body 2 is the same as that of the first embodiment. The magnetic body 6 is preferably provided with a plurality of protrusions 7 so as to overlap with the holes 4 provided in the pin arrangement array body 2 in plan view. This is because a magnetic field is generated along the holes 4 to guide the pins 5 to the holes 4. The direction of the magnetic field does not need to be along the penetrating direction of the holes 4, and may be a direction intersecting the penetrating direction of the holes 4 in the cross sections illustrated in
According to the pin arrangement device 1B, when the magnetic body 6 is disposed below the pin arrangement array body 2, the pins 5 lie down on the surface of the pin arrangement array body 2 as illustrated in
As long as a magnetic field can be generated along the holes 4 of the pin arrangement array body 2, a plurality of electromagnets, instead of the magnetic body 6, may be disposed vertically and laterally on the lower side of the pin arrangement array body 2. At the insertion of the pins 5 into the holes 4 by the magnetic field, it is preferable to provide a positioning means like an XY stage for positioning.
In this manner, the plurality of pins 5 having a diameter and length of micro sizes and configured to receive the force of a magnetic field are arranged on the pin arrangement array body 2 that has the holes 4 having diameter and length corresponding to the diameter and length of the pins 5. Then, a magnetic field is applied to a region where the holes 4 of the pin arrangement array body 2 are provided. As a result, the pins 5 are inserted into the holes 4 of the pin arrangement array body 2. Depending on the positions of the holes 4, the depth of the holes 4, and the interval between the holes 4, a magnetic field may be obliquely generated so as to have not only a component of the vertical direction but also a component of the horizontal direction in the pin arrangement array body 2. The magnetic body 6 may be disposed so as not to generate a magnetic field in the central portion of the pin arrangement array body 2, but so as to generate a magnetic field only in a region away from the center of the pin arrangement array body 2 by a certain distance, a band-like region, for example, or an annular region, for example. In these cases, a plurality of magnetic bodies may be disposed such that the direction of the magnetic field has any one or both of a vertical component and a horizontal component with respect to the pin arrangement array body 2, and further has a component orthogonal to these two components.
A pin arrangement device 1C according to the third embodiment of the present invention includes a storage portion 10, and a first mechanism 20 and a second mechanism 30 as mechanisms for inserting pins. In the storage portion 10, a pin arrangement array body 40 having a plurality of holes is disposed. Both the first mechanism 20 and the second mechanism 30 are mechanisms for inserting pins into the holes of the pin arrangement array body 40, and any one or both of the mechanisms are provided in the pin arrangement device 1C. Since the pin arrangement array body 40 is similar to the pin arrangement array body 2 illustrated in
The first mechanism 20 is intended to vibrate the storage portion 10. The “vibration” here includes not only any of vibration in the horizontal direction along the surface of the pin arrangement array body 40 (also referred to as “lateral vibration”) and vibration in a direction perpendicular to the surface of the pin arrangement array body 40 (also referred to as “vertical vibration”) but also both of them. The “vibration” further includes “swing” in which the time of one cycle including forward rotation, reverse rotation, and a stop therebetween constituting the “swing” is longer than the cycles of the lateral vibration and vertical vibration. Hereinafter, a configuration supporting all lateral vibration, vertical vibration, and swing will be described, and only a necessary mechanism may be selected.
The storage portion 10 has a recess formed so as to store the pin arrangement array body 40, and the longitudinal and lateral dimensions of the recess are slightly longer than the longitudinal and lateral dimensions of the pin arrangement array body 40. The storage portion 10 is supported on a support plate 11 by a shaft 21. The support plate 11 is supported substantially horizontally by a plurality of support columns 14 erected on a base 12 in a vertically movable manner, for example. A recess 11a is provided in a substantially central portion of the support plate 11 in plan view. The storage portion 10 having an open upper surface is disposed in the recess 11a. The storage portion 10 is provided with walls on the right, left, front, and rear.
The first mechanism 20 includes a swing mechanism 22 that is supported on the support plate 11 by the shaft 21 to swing the storage portion 10, a lateral shaking mechanism 23 that laterally shakes the storage portion 10, and a vertical shaking mechanism 24 that vertically shakes the storage portion 10. The lateral shaking mechanism 23 and the vertical shaking mechanism 24 are driven by electrostatic force resulting from electrodes 23a and 24a arranged in the storage portion 10 and electrodes 23b and 24b arranged on the support plate 11 so as to face the electrodes 23a and 24a. Instead of the electrostatic force, any one or a combination of a permanent magnet, a magnetic circuit, and an electromagnet may be driven by a magnetic force. The electrodes 23a and 23b are shown only in
Since the storage portion 10 is swung by the swing mechanism 22 and is laterally shaken and/or vertically shaken by either or both of the lateral shaking mechanism 23 and the vertical shaking mechanism 24, any one of the right, left, front, and rear walls of the storage portion 10 serves as a guide, and the pins are collected by the swing and are inserted into the holes by the vertical shaking and the lateral shaking. This will be described in detail with reference to
The second mechanism 30 is a mechanism that applies a magnetic field to the pin arrangement array body 40 disposed in the storage portion 10. As illustrated in
As far as the second mechanism 30 can generate a magnetic field in the pin arrangement array body 40, the second mechanism 30 is not only configured to bring the plate 31 on which the magnetic body 32 is placed close to the support plate 11 from the lower side as illustrated in
As a third mechanism, there is included a unit that communicates with the holes of the pin arrangement array body 40 arranged in the storage portion 10 and sucks the holes. This is implemented by sucking by a vacuum (not illustrated) serving as a suction unit coupled to the support plate 11. The holes of the pin arrangement array body 40 penetrate, and the diameter of the holes on the side opposite to the insertion side of the pins is shorter than the diameter of the holes on the insertion side. This is to prevent the pins from coming out of the holes 41. When the third mechanism is used in combination with the first mechanism, the pins are efficiently inserted into the holes of the pin arrangement array body 40.
In the pin arrangement array body 40, as illustrated in
If the holes 41 are through holes 41 as illustrated in
The pin arrangement array body 40 has a size of 1 inch square, for example, and has a thickness of 0.5 mm, for example. The surface of the pin arrangement array body 40 is satin finish. The pin arrangement array body 40 preferably has surface roughness. The surface roughness is around Ra 4.5 μm, for example. This is to prevent the pins from lying on the surface of the pin arrangement array body 40 and adhering to the surface due to static electricity.
Next, a method for inserting and arranging pins into the holes 41 of the pin arrangement array body 40 using the pin arrangement device 1D will be described.
First, the pin arrangement array body 40 is disposed in the recess 42b of the housing case 42. An appropriate quantity of pins are placed on the upper surface of the pin arrangement array body 40. The appropriate quantity is larger than the number of holes 41 of the pin arrangement array body 40. A spoon is used to measure an appropriate quantity of pins. The appropriate quantity depends on the combination of swing constituting vibration, vertical vibration, and lateral vibration, and specific conditions thereof.
Next, the pin arrangement array body 40 is laterally shaken while being swung around the swing axis (θ axis) while the lower side of the pin arrangement array body 40 is brought under a negative pressure by the suction unit connected to the suction pipe 45.
At the starting stage (t=0), the pin arrangement array body 40 is horizontal, for example, and a large number of pins are placed on the upper surface of the pin arrangement array body 40. At that time, it is preferable that the pins are evenly placed across the surface. For the sake of explanation, at the start stage, the pin arrangement array body 40 is substantially horizontal, but may be inclined with a rotation at either a positive or negative rotation angle around the swing axis.
Then, in a time slot (0<t≤t1) in which the rotation angle around the swing axis increases from zero to a certain positive value (θ1), a large number of pins are sliding down the inclined surface while the inclination angle of the pin arrangement array body 40 increases from the horizontal. At that time, some of the large number of pins are inserted into the holes by the lateral vibration to the pin arrangement array body 40.
When the rotation angle around the swing axis reaches the certain positive value θ1, the rotation of the pin arrangement array body 40 is stopped while the pin arrangement array body 40 is inclined. In a time slot during which the rotation is stopped (t1≤t≤t2), as schematically illustrated in a cross-sectional view and a plan view in the upper and lower left parts of
Then, in a time slot (t2≤t≤t3) in which the rotation angle around the swing axis decreases from the certain positive value θ1 to a certain negative value (−θ1), the pin arrangement array body 40 is oriented in the opposite direction as if warping the palm and increases in the inclination angle, and the large number of pins are sliding down the inclined surface. In the middle, that is, in a state where the pin arrangement array body 40 is substantially horizontal, the large number of pins hardly move on the upper surface of the pin arrangement array body 40 as illustrated schematically in an upper cross-sectional view and a lower plan view in the middle of
When the rotation angle reaches −θ1, the rotation of the pin arrangement array body 40 is stopped while the pin arrangement array body 40 is inclined. A large force to move to the other end portion 42f of the recess 42b acts on the pins. In a time slot during which the rotation is stopped (t3≤t≤t4), as illustrated in a plan view and a cross-sectional view in the upper and lower right parts of
Then, in a time slot (t4≤t≤t5) in which the rotation angle increases from the certain negative value (−θ1) to a certain positive value (θ2), the pin arrangement array body 40 returns its inclination in the original direction, and the large number of pins tend to slide down the inclined surface. In the middle, that is, when the pin arrangement array body 40 becomes substantially horizontal, the large number of pins hardly move on the upper surface of the pin arrangement array body 40. This is because a large force to move to the one end portion 42e of the recess 42b does not act on the pins. At this time, the number of meshes is horizontally reversed from the case illustrated in the middle of
As described above, the time chart includes a plurality of terms such as a first term T1 during which the pin arrangement array body 40 is inclined as the rotation angle changes from zero to θ1 and then the rotation angle changes from θ1 through −θ1 to zero, and a subsequent second term T2 during which the pin arrangement array body 40 is inclined as the rotation angle increases from zero to θ2 and then the rotation angle changes from θ2 through −θ2 to zero. At the end of arrangement and insertion of the pins, the pin arrangement array body 40 may be horizontal or inclined.
The maximum rotation angle θ2 in the second term T2 may be the same as or different from the maximum rotation angle θ1 in the first term T1. The positive maximum inclination angle (for example, θ1 in the first term) at each term does not necessarily need to coincide with the magnitude of the negative maximum inclination angle. However, it is preferable that the positive maximum inclination angle coincide with the negative maximum inclination angle for the sake of system control.
In the case illustrated in
The period during which the inclination angle of the pin arrangement array body 40 is increased or decreased, that is, the period during which the inclination changes is shorter than the period during which the inclination is maintained and the rotation is temporarily stopped. The period during which the rotation of the pin arrangement array body 40 is temporarily stopped with an inclination differs for each term. The period of temporary stop of the rotation with a large inclination is shorter than the period of temporary stop of the rotation with a small inclination. This is because, during the period of temporary stop of the rotation with a large inclination, a large number of pins on the pin arrangement array body 40 are spread across the full width D in the specific regions A1 and A2, as illustrated in the left and right upper and lower parts of
This series of description is about a phenomenon due to swinging and lateral vibration. A similar phenomenon occurs in swinging and vertical vibration. Furthermore, if the lower side of the pin arrangement array body 40 is brought under a negative pressure by the suction unit connected to the suction pipe 45, the pins are more easily inserted into the holes.
In this manner, the large number of pins are placed on the pin arrangement array body 40, preferably, so as to spread evenly, and the pin arrangement array body 40 is inclined at less than 90° around the swing axis to collect the pins on the one end portion 42e side (region A1) of the pin arrangement array body 40. At this time, the large number of pins are widely present between both ends (that is, across the width D) with a substantially triangular cross section at the one end portion 42e of the pin arrangement array body 40. After such a state is maintained for a certain period of time, the pin arrangement array body 40 is reversely rotated around the swing axis to laterally vibrate or vertically vibrate. Accordingly, as the large number of pins slide on the upper surface of the pin arrangement array body 40, some of the pins are inserted into the holes, and the remaining pins move to the other end portion 42f (end portion opposite to the one end portion 42e, region A2) of the pin arrangement array body 40. In this manner, the swinging and the temporary stoppage of the rotation resulting from the forward rotation and reverse rotation at less than 90° mainly contribute to spreading the large number of pins in the width direction to the one end portion 42e and the other end portion 42f of the pin arrangement array body 40, and the vertical vibration and/or the lateral vibration mainly contribute to inserting one pin into one hole.
In this manner, according to the pin arrangement method, the plurality of pins having diameter and length of micro sizes are arranged on the pin arrangement array body 40 that has the holes having diameter and length corresponding to the diameter and length of the pins, and then the pin arrangement array body 40 is vibrated. Thus, the pins can be inserted into the corresponding holes of the pin arrangement array body 40.
The plurality of support columns 52 is supported and erected by a base portion (not illustrated), the magnetic body support portion 51 is vertically movably supported by the support columns 52, and the storage portion 50 is supported by the support columns 52. The recess of the storage portion 50 in plan view has a gap of a predetermined dimension between the storage portion 50 and the pin arrangement array body 40 as in the fourth embodiment. The pin arrangement array body 40 is arranged in the storage portion 50, and an appropriate quantity of pins are placed on the pin arrangement array body 40. At this time, the pins lie on the pin arrangement array body 40.
The magnetic body support portion 51 is brought close to the lower side of the pin arrangement array body 40 with the storage portion 50 interposed therebetween. The magnetic body 6 supported by the magnetic body support portion 51 forms a magnetic field along the vertical direction, and accordingly, the pins react and behave as if the pins follow the magnetic field. Specifically, as a magnetic body 6 approaches the pins, the pins are raised toward the holes, and the raised pins enter the holes, as described above with reference to
In this manner, according to the pin arrangement method, the plurality of pins having a diameter and length of micro sizes and responsive to a magnetic field are arranged on the pin arrangement array body that has the holes having diameter and length corresponding to the diameter and length of the pins. Next, a magnetic field is applied to the pin arrangement array body. Thus, the pins can be inserted into the holes of the pin arrangement array body.
The pin arrangement array body 40 in which pins are inserted into the holes 41 is removed by various methods.
Conforming whether the pins are inserted into the holes will be described. Each of the pin arrangement devices 1A to 1E includes an inspection unit, and can inspect the ratio of insertion of the pins into the holes of the pin arrangement array bodies 2 and 40. A plurality of inspection units is conceivable. A first inspection unit includes an imaging unit that captures an image of the surface of the pin arrangement array body in which the pins are inserted into the holes, and a calculation unit that processes the image data captured by the imaging unit and calculates the ratio. Specifically, the first inspection unit captures an image of the surface of the pin arrangement array body by the imaging unit, and acquires the state in which the pins are inserted into the holes as image data. The calculation unit performs image processing such as patterning on portions of the pins in the image data, counts the number of shapes with a predetermined size, and calculates the ratio of the count to the total number of holes. As a result, the insertion ratio of the pins into the holes can be calculated, and the pass/fail can be determined.
In another aspect of the inspection unit, electrical measurement is performed on the pin arrangement array body in which the pins are inserted into the holes, so that the insertion ratio of the pins into the holes can be calculated from electrical parameters including the conductivity and the dielectric constant, and the pass/fail can be determined.
The embodiments of the present invention are not limited to the above-described embodiments and also include various modifications. For example, as illustrated in
The holes of the pin arrangement array body may be either through holes or non-through holes. In particular, if the pin arrangement array body constitutes a substrate (for example, a die) itself on which a plurality of electronic devices is mounted, the holes of the pin arrangement array body are preferably through holes. This is because wiring connection can be performed by vertically superposing such substrates and coupling the upper substrate and the lower substrate with pins.
In the embodiment of the present invention, the pin arrangement array is not only processed by a semiconductor process such as photolithography and etching on silicon wafer, but also used for preparing a TSV process. That is, the pin arrangement array is also used to insert pins serving as pillars into through holes of a DRAM chip.
In the embodiment of the present invention, the magnetic body 6 is preferably made of a ferromagnetic material. This is because the pins can be easily inserted into the holes by a magnetic field.
In the embodiment of the present invention, the surfaces of the pin arrangement array bodies 2 and 40 are preferably provided with hydrophilic and hydrophobic patterns. This is because the adhesive force of the pins to the pin arrangement array bodies 2 and 40 is controlled to separate a region where the pins are easily gathered and a region where the pins are not easily gathered. For example, in the case of pins having hydrophobicity, the pins are difficult to attach in a region having hydrophobicity, whereas the pins are easy to attach in a region having hydrophilicity. Therefore, it is possible to provide a function similar to that of the guides described above. In addition, the surfaces of the pin arrangement array bodies 2 and 40 are preferably conductive.
As an embodiment of the present invention, a pin arrangement system 60 will be described.
The swing control unit 63a can adjust the swing pattern by changing the rotation angle of the swing shaft and the speed of the rotation angle, and the temporary stop time of the rotation for each term. In the vibration control unit 63b, the vibration pattern can be adjusted by changing the type of vertical shaking and lateral shaking, and the frequency of shaking. The magnetic field control unit 63c can change the magnetic field pattern by controlling the temporal position of the magnetic body and the temporal position of the permanent magnet, and electrically controlling the electromagnet. These parameters can be input to the control unit 63 by the input unit 64, or can be input to the control unit 63 as a parameter change command by the inspection unit 62. The worker may partially change the parameters without depending on such a system as described above.
Examples will be described. As Example 1, lateral vibration and swing were applied to a pin arrangement array body to insert pins into holes as described above in relation to the fourth embodiment. The first test by a detection unit has revealed that 1597 pins were inserted into 1600 holes. It took 36 seconds for the pins to be inserted into most of the holes. The hole diameter was 0.27 mm and the hole depth was 0.4 mm.
As Example 2, a permanent magnet was arranged at about 2 mm to 10 mm from a pin arrangement array body. At that time, the magnetic force was 4600 gauss to 4900 gauss. The orientation of the magnetic field was perpendicular and inclined with respect to the pin arrangement array body. The number of holes was 1600, the hole diameter was 0.27 mm, and the hole depth was 0.4 mm. As a result, it took 20 seconds for the pins to be inserted into most of the holes. It has been confirmed that the pins can be inserted into holes having a small diameter as compared with the case of using swing and vibration. The pins can be inserted with the gap (clearance) of 0.03 mm to 0.05 mm.
As Example 3, swing and vibration were applied to a pin arrangement array body under the same conditions as in Example 1, and a magnetic field was further applied to the pin arrangement array body under the same conditions as in Example 2. As a result, it took 10 seconds for the pins to be inserted into most of the holes. The time required was shorter than those in Examples 1 and 2. Accordingly, it has been confirmed that the influence of the magnetic field strongly acts, and the effect of superimposition of swing and vibration with the magnetic field can be obtained.
The distance between the pin arrangement array body and the magnet and the strength of the magnet (strength of the magnetic field) are set by the wire diameter and the length of the pin.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2020-169456 | Oct 2020 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2021/036133 | 9/30/2021 | WO |
