Apparatus for connecting with bump connectors or layer connectors

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CPC
H01L24/75

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/75Apparatus for connecting with bump connectors or layer connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pick and placement of semiconductor chips based on nozzleless self-...
- Patent number 12,362,205
- Issue date Jul 15, 2025
- University of Southern California
- Eun Sok Kim
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Semiconductor die dipping structure
- Patent number 12,362,317
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chun Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,362,314
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting device and mounting method
- Patent number 12,347,803
- Issue date Jul 1, 2025
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump to package substrate solder joint
- Patent number 12,341,126
- Issue date Jun 24, 2025
- Texas Instruments Incorporated
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus
- Patent number 12,341,124
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Byungkeun Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus
- Patent number 12,334,468
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 12,330,228
- Issue date Jun 17, 2025
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus including a plurality of heads and a method of using the...
- Patent number 12,317,421
- Issue date May 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,308,294
- Issue date May 20, 2025
- Tokyo Electron Limited
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and molding press machine
- Patent number 12,308,260
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kiyohiro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression apparatus and method for bonding electrical compo...
- Patent number 12,308,340
- Issue date May 20, 2025
- MB AUTOMATION GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 12,297,538
- Issue date May 13, 2025
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating die attach systems
- Patent number 12,288,711
- Issue date Apr 29, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for forming a connection
- Patent number 12,272,669
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Arthur Unrau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for handling microelectronic devices
- Patent number 12,251,841
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Kuan Wei Tseng
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and method for BGA coplanarity and warpage control
- Patent number 12,249,589
- Issue date Mar 11, 2025
- NVIDIA Corporation
- Dongji Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,237,297
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Junga Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip laser bonding system
- Patent number 12,237,295
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Geunsik Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for laser bonding of flip chip
- Patent number 12,237,296
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having through parts of different shapes
- Patent number 12,230,600
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Narumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for actuating a bonding head
- Patent number 12,230,599
- Issue date Feb 18, 2025
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot-pressing member with improved focus of pressing and longevity a...
- Patent number 12,220,891
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Fei-Fan Yu
- B30 - PRESSES
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Establishing a Contact Connection
- Publication number 20250235961
- Publication date Jul 24, 2025
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...
- Publication number 20250239565
- Publication date Jul 24, 2025
- BOSCHMAN TECHNOLOGIES B.V.
- Franciscus Gerardus Johannes BOSCHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAKING SYSTEM FOR PROCESSING UNIT ASSEMBLY
- Publication number 20250239562
- Publication date Jul 24, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SOLDERING ELECTRONIC DEVICES
- Publication number 20250239563
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kyungdeuk MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20250233000
- Publication date Jul 17, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...
- Publication number 20250226357
- Publication date Jul 10, 2025
- FUJI CORPORATION
- Ryo SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...
- Publication number 20250219013
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- KAI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS FOR SEMICONDUCTOR PACKAGING AND SEMICONDUCTO...
- Publication number 20250219012
- Publication date Jul 3, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR REFLOW APPARATUS
- Publication number 20250219014
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Chaein MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR P...
- Publication number 20250210582
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Jaewoo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20250201757
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Taejae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20250201758
- Publication date Jun 19, 2025
- TORAY ENGINEERING CO., LTD.
- Shimpei AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED CHIP REWORK DEVICE AND REWORK METHOD USING TRANSFER METHOD
- Publication number 20250194319
- Publication date Jun 12, 2025
- LASERSSEL CO.,LTD
- Jae Joon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD
- Publication number 20250183223
- Publication date Jun 5, 2025
- Sato Holdings Kabushiki Kaisha
- Yoshimitsu MAEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...
- Publication number 20250174596
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250167166
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW FLIP CHIP BONDING TOOL APPARATUS AND OPERATING METHOD THEREOF
- Publication number 20250157979
- Publication date May 15, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Sang Jin KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP TRANSFER DEVICE, CHIP TRANSFER METHOD AND MAGNETIC DIE BONDING...
- Publication number 20250157978
- Publication date May 15, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...
- Publication number 20250149498
- Publication date May 8, 2025
- CANON MACHINERY INC.
- Shinya KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMI...
- Publication number 20250140738
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Takeru ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMIN...
- Publication number 20250132284
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Amram EITAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM
- Publication number 20250118701
- Publication date Apr 10, 2025
- SHINKAWA LTD.
- Shinsuke Fukumoto
- G05 - CONTROLLING REGULATING
Information Patent Application
BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...
- Publication number 20250112201
- Publication date Apr 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250105203
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Kyung Deuk MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL
- Publication number 20250096189
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chen Chao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20250087625
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Young WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Apparatus for connecting with bump connectors or layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pick and placement of semiconductor chips based on nozzleless self-...

Semiconductor die dipping structure

Bonding apparatus and bonding method

Mounting device and mounting method

Bump to package substrate solder joint

Resin shaping device

Solder reflow apparatus

Solder reflow apparatus

Method of using processing oven

Apparatus including a plurality of heads and a method of using the...

Bonding apparatus and bonding method

Method for manufacturing display device and apparatus for manufactu...

Semiconductor device manufacturing method and molding press machine

Thermocompression apparatus and method for bonding electrical compo...

High registration particles-transferring system

Method of forming a bonded semiconductor structure

Methods of operating die attach systems

Arrangement for forming a connection

Component mounting system and component mounting method

Apparatuses for handling microelectronic devices

Apparatus and method for BGA coplanarity and warpage control

Solder reflow apparatus and method of manufacturing an electronic d...

Flip chip laser bonding system

System for laser bonding of flip chip

Semiconductor device having through parts of different shapes

Method for actuating a bonding head

Hot-pressing member with improved focus of pressing and longevity a...

Method for transferring electronic device

Manufacturing method of semiconductor package using jig

Selective micro device transfer to receiver substrate

Patents Applicationslast 30 patents

Apparatus and Method for Establishing a Contact Connection

PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...

BAKING SYSTEM FOR PROCESSING UNIT ASSEMBLY

APPARATUS FOR SOLDERING ELECTRONIC DEVICES

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...

BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...

CHIP BONDING APPARATUS FOR SEMICONDUCTOR PACKAGING AND SEMICONDUCTO...

SEMICONDUCTOR REFLOW APPARATUS

DIE ATTACHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR P...

CHIP BONDING APPARATUS

MOUNTING DEVICE

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

MICRO-LED CHIP REWORK DEVICE AND REWORK METHOD USING TRANSFER METHOD

IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD

SELECTIVE TRANSFER OF MICRO DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

REFLOW FLIP CHIP BONDING TOOL APPARATUS AND OPERATING METHOD THEREOF

CHIP TRANSFER DEVICE, CHIP TRANSFER METHOD AND MAGNETIC DIE BONDING...

POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...

METHOD AND SYSTEM FOR DIE BONDING

SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMI...

DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMIN...

BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM

BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...

SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...

BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION