Claims
- 1. A planarization method for planarizing a surface of a wafer comprising:
providing a wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on said deformable material on said surface of said wafer; hardening the deformable material while the object contacts the deformable material; and planarizing said wafer using a chemical mechanical planarization process.
- 2. A planarization method for planarizing a surface of a wafer comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface said deformable material on said surface of said wafer; solidifying the deformable material while the object contacts the deformable material; and planarizing said wafer using a chemical mechanical planarization process.
- 3. A planarization method for planarizing a surface of a wafer comprising:
providing a wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on said deformable material on said surface of said wafer; performing one of a group of curing, hardening, and solidifying the deformable material while the object is contacting the deformable material; and planarizing said wafer using a chemical mechanical planarization process.
- 4. The method of claim 3, further comprising:
applying pressure to the object contacting the deformable material while the object contacts the deformable material.
- 5. The method of claim 3, further comprising:
applying pressure to the deformable material on the surface of the wafer while the object contacts the deformable material.
- 6. The method of claim 3, wherein the object includes a substantially flat planar surface thereon contacting the deformable material.
- 7. The method of claim 3, wherein the object comprises a substantially inflexible object having a flat surface thereon.
- 8. The method of claim 3, further comprising:
contacting the wafer with a resilient member.
- 9. The method of claim 8, wherein a back of the wafer is contacted with a resilient member.
- 10. The method of claim 8, further comprising:
applying pressure to the flexible resilient member to form a substantially flat planar surface on the deformable material.
- 11. The method of claim 10, further comprising:
contacting the flexible resilient member with a substrate; and applying pressure to the substrate for applying pressure to the flexible resilient member.
- 12. The method of claim 10, further comprising:
applying pressure to the wafer through the flexible resilient member for applying pressure to the object for deforming the deformable material on the wafer.
- 13. The method of claim 3, wherein said wafer comprises a wafer having electrical circuit components on a surface thereof.
- 14. The method of claim 3, wherein said wafer comprises a wafer having a plurality of electrical circuit components on a surface thereof and a coating substantially covering the electrical circuit components.
- 15. The method of claim 3, wherein said wafer comprises a wafer having a plurality of electrical components on a surface thereof and a coating substantially covering the electrical components and said wafer.
- 16. The method of claim 3, further comprising:
applying a substantially uniform pressure to the object while the object is in contact with the deformable material.
- 17. The method of claim 3, further comprising:
applying a substantially uniform pressure to the deformable material on the surface of the wafer for forming a substantially flat planar surface on the deformable material.
- 18. A planarization method for planarizing a surface of a wafer comprising:
providing a wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a convex surface portion; forming a substantially flat planar surface on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 19. A planarization method for planarizing a surface of a wafer comprising:
providing a wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a concave surface portion; forming a substantially flat planar surface on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 20. A planarization method for planarizing a surface of a wafer comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a convex surface portion and a concave surface portion; forming a substantially flat planar surface on said non-planar surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 21. A planarization method for planarizing a surface of a wafer comprising: providing said wafer having a surface;
coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the object including a flat optical glass object; forming a substantially flat planar surface on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 22. A planarization method for planarizing a surface of a wafer comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material; coating the object with a release agent prior to contacting the deformable material; forming a substantially flat planar surface on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 23. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface thereon; coating said surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on said surface of said wafer; curing the deformable material while the object contacts the deformable material; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 24. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on said surface of said wafer; hardening the deformable material while the object contacts the deformable material; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 25. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on said surface of said wafer; solidifying the deformable material while the object contacts the deformable material; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 26. The method of claim 25, further comprising:
applying pressure to the object contacting the deformable material while the object contacts the deformable material.
- 27. The method of claim 25, further comprising:
applying pressure to the deformable material on the surface of the wafer while the object contacts the deformable material.
- 28. The method of claim 25, wherein the object includes a substantially flat planar surface thereon for contacting the deformable material.
- 29. The method of claim 25, wherein the object includes a shaped surface thereon for contacting the deformable material.
- 30. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface; coating said film surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon for contacting the deformable material, the shaped surface including a convex surface portion; forming a substantially flat planar surface on said surface of said wafer; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 31. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a concave surface portion; forming a substantially flat planar surface on said surface of said wafer; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 32. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a convex surface portion and a concave surface portion; forming a substantially flat planar surface on said surface of said wafer; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 33. The method of claim 32, wherein the shaped surface comprises a desired shaped surface.
- 34. A planarization method for planarizing a film on a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface; coating said surface of said wafer using a deformable material; contacting the deformable material with an object, the object including a flat optical glass object; forming a substantially flat planar surface on said surface of said wafer; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 35. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising:
providing said wafer having a surface; providing an object; coating said surface of said wafer with a deformable material; coating the object with a release agent contacting the deformable material with an object; forming a substantially flat planar surface on said surface of said wafer; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
- 36. A planarization method for planarizing a non-planar film surface of a wafer comprising:
providing an object having a flat surface thereon; applying a deformable material to said surface of said wafer; contacting the deformable material with the object; forming a substantially flat planar surface on said deformable material on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 37. A planarization method for planarizing a non-planar film surface of a wafer, said method comprising:
providing an object having a flat planar surface thereon; providing a flexible resilient member at a back of the wafer; applying a deformable material to said surface of said wafer; contacting the deformable material; forming a substantially flat planar surface on said deformable material on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 38. The method of claim 37, wherein the deformable material is contacted by the object.
- 39. A planarization method for planarizing a non-planar surface of a wafer comprising:
providing an object having a flat planar surface thereon; applying a deformable material to said surface of said wafer; contacting the deformable material with the object; forming a substantially flat planar surface on said deformable material on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 40. A planarization method for planarizing a non-planar surface of a wafer comprising:
providing an object having a flat planar surface thereon; providing a flexible resilient member to at least a portion of said wafer; applying a deformable material to said non-planar surface of said wafer; contacting the deformable material with said object; forming a substantially flat planar surface on said deformable material on said surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 41. A planarization method for planarizing a non-planar surface of a wafer comprising:
providing an object having a flat planar surface thereon; providing a flexible resilient member; applying a deformable material to said surface of said wafer; contacting another surface of said wafer with the flexible resilient member; applying pressure to the deformable material with said object; forming a substantially flat planar surface on said deformable material on said non-planar surface of said wafer; and planarizing said wafer using a chemical mechanical planarization process.
- 42. A planarization method for planarizing a non-planar surface of a wafer comprising:
providing an object having a flat planar surface thereon; providing a flexible resilient member on at least a portion of another surface of said wafer; applying a deformable material to said surface of said wafer; contacting the deformable material; forming a substantially flat planar surface on said deformable material on said surface of said wafer; and planarizing said substantially flat planar source on said deformable material on said surface of said wafer using a chemical mechanical planarization process.
- 43. A planarization method for planarizing a non-planar surface of a wafer comprising:
providing an object having a flat planar surface thereon; providing a flexible resilient member; applying a deformable material to said surface of said wafer; contacting at least a portion of another surface of said wafer with the flexible resilient member; applying pressure to the deformable material; forming a substantially flat planar surface on said deformable material on said surface of said wafer; and planarizing said substantially flat planar surface on said deformable material on said surface of said wafer using a chemical mechanical planarization process.
- 44. A planarizaiton method for planarizing a non-planar film surface of a wafer comprising:
coating said film surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on said surface of said wafer; performing one of a group of curing, hardening, and solidifying the deformable material while the object is contacting the deformable material; and planarizing said wafer using a chemical mechanical planarization process.
- 45. A planarization method for planarizing a non-planar surface of a wafer having at least one electrical circuit formed thereon comprising:
coating said non-planar surface of said wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on said non-planar surface of said wafer by performing one of a group of curing, hardening, and solidifying the deformable material while the object contacts the deformable material; and planarizing said substantially flat planar surface on said wafer using a chemical mechanical planarization process.
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of application Ser. No. 08/862,752, filed May 23, 1997, pending.
Continuations (1)
|
Number |
Date |
Country |
Parent |
08862752 |
May 1997 |
US |
Child |
09832560 |
Apr 2001 |
US |