involving a dielectric removal step

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CPC
H01L21/31053

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/31053involving a dielectric removal step

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad and method for preparing semiconductor device using t...
- Patent number 12,362,232
- Issue date Jul 15, 2025
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,347,776
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising steps
- Patent number 12,341,112
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a surface for direct-bonding
- Patent number 12,341,018
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-oxidation layer to prevent dielectric loss from planarization...
- Patent number 12,341,019
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride inhibitors for high selectivity of TiN—SiN CMP applications
- Patent number 12,338,369
- Issue date Jun 24, 2025
- CMC MATERIALS LLC
- Chih-Hsien Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,342,615
- Issue date Jun 24, 2025
- Sony Group Corporation
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including graphite and method forming same
- Patent number 12,334,397
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating Fin-type field-effect transistor device havin...
- Patent number 12,324,224
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method, method for producing semiconductor substr...
- Patent number 12,312,499
- Issue date May 27, 2025
- FUJIMI INCORPORATED
- Tsutomu Yoshino
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing wafer
- Patent number 12,308,293
- Issue date May 20, 2025
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry composition for polishing silicon oxide film, and polishing...
- Patent number 12,305,080
- Issue date May 20, 2025
- YOUNG CHANG CHEMICAL CO., LTD
- Seung Hun Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
- Patent number 12,300,543
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method
- Patent number 12,300,508
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with devices having different top layer thickne...
- Patent number 12,302,637
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition and method of polishing a substrate having en...
- Patent number 12,291,655
- Issue date May 6, 2025
- DuPont Electronic Materials Holding, Inc.
- Yi Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 12,293,923
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Yangsoo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dimensional metal first device layout and circuit design
- Patent number 12,288,747
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,516
- Issue date Apr 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Gongyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with helmet structure between two semiconducto...
- Patent number 12,278,236
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,272,693
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Chun-Ya Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable chemical vapor deposition (FCVD) using multi-step anneal t...
- Patent number 12,266,574
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,258,460
- Issue date Mar 25, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
- Publication number 20250240981
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyun-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVELY CHARGED SILICA PARTICLES, METHOD OF PRODUCING SUCH PARTI...
- Publication number 20250215296
- Publication date Jul 3, 2025
- Merck Patent GmbH
- Eric JACQUINOT
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS AND METHODS FOR TUNGSTEN ETCHING INHIBITION
- Publication number 20250215266
- Publication date Jul 3, 2025
- BASF SE
- Ching Hsun CHAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...
- Publication number 20250212505
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES, RELATED SYSTEMS, AND METHODS OF FORMING
- Publication number 20250212413
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210559
- Publication date Jun 26, 2025
- Innolux Corporation
- Kuo-Shun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) USING MULTI-STEP ANNEAL T...
- Publication number 20250204019
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250204039
- Publication date Jun 19, 2025
- UNITED MICROELECTRONICS CORP.
- Chun-Ya Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENT, AND POLISHI...
- Publication number 20250197676
- Publication date Jun 19, 2025
- AGC Inc.
- Hideki NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STI REGION
- Publication number 20250194085
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR IN-SITU CHEMICAL SEPARATION AND RECIRCULAT...
- Publication number 20250187141
- Publication date Jun 12, 2025
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20250192026
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices With Backside Air Gap Dielectric
- Publication number 20250185348
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For FinFET Fabrication And Structure Thereof
- Publication number 20250185346
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stable Chemical Mechanical Planarization Polishing Compositions And...
- Publication number 20250171658
- Publication date May 29, 2025
- VERSUM MATERIALS US, LLC
- Maitland Graham
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...
- Publication number 20250176240
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Tai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WAFER BONDING
- Publication number 20250154000
- Publication date May 15, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Wei CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...
- Publication number 20250159965
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING STEPS AND RELATED METHODS
- Publication number 20250157950
- Publication date May 15, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD AND PROCESS FOR PREPARING THE SAME
- Publication number 20250144763
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Younghwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE US...
- Publication number 20250144766
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250142875
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20250129279
- Publication date Apr 24, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
- Publication number 20250133786
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH INTERSECTIONS
- Publication number 20250133780
- Publication date Apr 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20250126883
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...
- Publication number 20250122408
- Publication date Apr 17, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Yuta SHIMADA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...
- Publication number 20250115787
- Publication date Apr 10, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- B24 - GRINDING POLISHING

involving a dielectric removal step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming semiconductor device

Methods of packaging semiconductor devices and packaged semiconduct...

Polishing pad and method for preparing semiconductor device using t...

Integrated chip with graphene based interconnect

Semiconductor devices comprising steps

Method for preparing a surface for direct-bonding

Anti-oxidation layer to prevent dielectric loss from planarization...

Nitride inhibitors for high selectivity of TiN—SiN CMP applications

Semiconductor device and method of manufacturing the same

Interconnect structure including graphite and method forming same

Package with tilted interface between device die and encapsulating...

Contact with a silicide region

Method of fabricating Fin-type field-effect transistor device havin...

Surface treatment method, method for producing semiconductor substr...

Method of processing wafer

Slurry composition for polishing silicon oxide film, and polishing...

Method for manufacturing a semiconductor device having a dummy section

Chemical mechanical polishing method

Semiconductor wafer with devices having different top layer thickne...

Polishing composition and method of polishing a substrate having en...

Method of fabricating semiconductor device

Multi-dimensional metal first device layout and circuit design

Semiconductor device and method for manufacturing the same

Method for manufacturing semiconductor device

Semiconductor device with helmet structure between two semiconducto...

Low warpage high density trench capacitor

Semiconductor device and method for fabricating the same

Semiconductor device and methods of manufacture

Flowable chemical vapor deposition (FCVD) using multi-step anneal t...

Polishing pad and method of fabricating semiconductor device using...

Patents Applicationslast 30 patents

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

NEGATIVELY CHARGED SILICA PARTICLES, METHOD OF PRODUCING SUCH PARTI...

COMPOSITIONS AND METHODS FOR TUNGSTEN ETCHING INHIBITION

SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...

ELECTRONIC DEVICES, RELATED SYSTEMS, AND METHODS OF FORMING

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) USING MULTI-STEP ANNEAL T...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENT, AND POLISHI...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE HAVING STI REGION

APPARATUS AND METHOD FOR IN-SITU CHEMICAL SEPARATION AND RECIRCULAT...

Metal-Insulator-Metal Structure

Semiconductor Devices With Backside Air Gap Dielectric

Method For FinFET Fabrication And Structure Thereof

Stable Chemical Mechanical Planarization Polishing Compositions And...

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...

METHODS FOR WAFER BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...

SEMICONDUCTOR DEVICES COMPRISING STEPS AND RELATED METHODS

POLISHING PAD AND PROCESS FOR PREPARING THE SAME

POLISHING PAD AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE US...

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

SLURRY, SCREENING METHOD, AND POLISHING METHOD

ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY

DEEP TRENCH INTERSECTIONS

Semiconductor Structure Cutting Process and Structures Formed Thereby

SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...