involving a dielectric removal step

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CPC
H01L21/31053

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/31053involving a dielectric removal step

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable chemical vapor deposition (FCVD) using multi-step anneal t...
- Patent number 12,266,574
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,258,460
- Issue date Mar 25, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
CMP safe alignment mark
- Patent number 12,255,150
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,255,164
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same and electron...
- Patent number 12,249,544
- Issue date Mar 11, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, method of manufacturing the same and electron...
- Patent number 12,245,442
- Issue date Mar 4, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fin end spacer dummy gate and method of m...
- Patent number 12,243,930
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure using nitrogen-...
- Patent number 12,243,769
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer bonding
- Patent number 12,234,145
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for increasing germanium concentration of surfaces of a sil...
- Patent number 12,237,404
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having STI region
- Patent number 12,238,924
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,237,402
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for FinFet fabrication and structure thereof
- Patent number 12,224,210
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside air gap dielectric
- Patent number 12,224,212
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure and manufacturing method thereof
- Patent number 12,205,822
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Cheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist and method
- Patent number 12,197,128
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Liang-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for copper doped hybrid metallization for line and via
- Patent number 12,183,631
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,183,698
- Issue date Dec 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device by driving hydrogen into a...
- Patent number 12,183,581
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hongfa Luan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NANOSTRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250112049
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP
- Publication number 20250105054
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE
- Publication number 20250105017
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Hsun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoresist and Method
- Publication number 20250102916
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Liang-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250096155
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chieh LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250096033
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20250084294
- Publication date Mar 13, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...
- Publication number 20250079336
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Opaque Thermal Layer for Silicon Carbide Substrates
- Publication number 20250079186
- Publication date Mar 6, 2025
- Yi ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SOLUTION AND USAGE METHOD THEREOF
- Publication number 20250059401
- Publication date Feb 20, 2025
- ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.
- Pengyu Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING
- Publication number 20250062163
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WAFER EDGE DEFECTS
- Publication number 20250054807
- Publication date Feb 13, 2025
- WINBOND ELECTRONICS CORP.
- Cheng-Hsiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
- Publication number 20250019569
- Publication date Jan 16, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Eric Turner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...
- Publication number 20250018526
- Publication date Jan 16, 2025
- SK enpulse Co., Ltd.
- Jae In AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING...
- Publication number 20250019567
- Publication date Jan 16, 2025
- Yi Guo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Surface Profile Control Of Passivation Layers In Integrated Circuit...
- Publication number 20250014943
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING T...
- Publication number 20250015098
- Publication date Jan 9, 2025
- SAMSUNG DISPLAY CO., LTD.
- Joon-Hwa BAE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...
- Publication number 20250014940
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING PROCESSED SUBSTRATE
- Publication number 20240429061
- Publication date Dec 26, 2024
- MASANOBU HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20240425737
- Publication date Dec 26, 2024
- Resonac Corporation
- Satoyuki NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CARBON PLUG FORMATION
- Publication number 20240420927
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Daniela ANJOS RIGSBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Polishing Composition For Silicon...
- Publication number 20240417594
- Publication date Dec 19, 2024
- VERSUM MATERIALS US, LLC
- Maitland Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...
- Publication number 20240400861
- Publication date Dec 5, 2024
- VERSUM MATERIALS US, LLC
- Gregor Larbig
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
- Publication number 20240392214
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Naotsugu MURO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

involving a dielectric removal step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and methods of manufacture

Flowable chemical vapor deposition (FCVD) using multi-step anneal t...

Polishing pad and method of fabricating semiconductor device using...

CMP safe alignment mark

Structure and method for isolation of bit-line drivers for a three-...

Semiconductor device, method of manufacturing the same and electron...

Semiconductor device, method of manufacturing the same and electron...

Hard mask removal without damaging top epitaxial layer

Semiconductor device with fin end spacer dummy gate and method of m...

Method for preparing semiconductor device structure using nitrogen-...

Methods for wafer bonding

Methods for increasing germanium concentration of surfaces of a sil...

Semiconductor device having STI region

Semiconductor structures including middle-of-line (MOL) capacitance...

Methods of forming semiconductor devices

Word line structure of three-dimensional memory device

Metal-insulator-metal structure

Method for FinFet fabrication and structure thereof

Semiconductor devices with backside air gap dielectric

Method of manufacturing semiconductor devices with multiple silicid...

Deep trench intersections

Integrated chip with graphene based interconnect

Semiconductor structure cutting process and structures formed thereby

Hybrid channel semiconductor device and method

Nanostructure and manufacturing method thereof

Photoresist and method

Semiconductor device and a manufacturing method thereof

Methods for copper doped hybrid metallization for line and via

Structure and method for isolation of bit-line drivers for a three-...

Method of forming a semiconductor device by driving hydrogen into a...

Patents Applicationslast 30 patents

NANOSTRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP

METHOD OF MANUFACTURING MEMORY DEVICE

Photoresist and Method

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SLURRY AND POLISHING METHOD

STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...

Opaque Thermal Layer for Silicon Carbide Substrates

CHEMICAL MECHANICAL POLISHING SOLUTION AND USAGE METHOD THEREOF

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

METHOD FOR REDUCING WAFER EDGE DEFECTS

POLISHING COMPOSITIONS AND METHODS OF USE THEREOF

POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING...

Surface Profile Control Of Passivation Layers In Integrated Circuit...

POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING T...

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...

SEMICONDUCTOR DEVICE AND METHOD

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

METHOD FOR MANUFACTURING PROCESSED SUBSTRATE

SLURRY, SCREENING METHOD, AND POLISHING METHOD

SYSTEM AND METHOD FOR CARBON PLUG FORMATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Chemical Mechanical Planarization Polishing Composition For Silicon...

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...

COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT