The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:
Korean Patent Application No. 10-2006-0101947, filed on Oct. 19, 2006, in the Korean Intellectual Property Office, and entitled: “Plasma Display Device,” is incorporated by reference herein in its entirety.
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are illustrated. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. For clear understanding, irrelevant descriptions will be omitted.
In the figures, the dimensions of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when a layer or element is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers or elements may also be present. Further, it will be understood that when a layer or element is referred to as being “under” another layer, it can be directly under, or one or more intervening layers or elements may also be present. In addition, it will also be understood that when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or one or more intervening layers or elements may also be present. Like reference numerals refer to like elements throughout.
An exemplary embodiment of a plasma display device according to the present invention will be described in more detail below with reference to
The PDP 11 of the plasma display device may include front and rear substrates integrally bonded to each other by means of a sealant. Discharge cells (not shown) filled with discharge gas may be formed between the front and rear substrates to facilitate visible light emission upon plasma generation. The PDP 11 may use the gas discharge to display images. The PDP 11 may be any suitable PDP.
The chassis base 17 of the plasma display device may be a thin metal plate formed by, e.g., die-casting or press process, and may be attached to the rear substrate of the PDP 11. A central portion of the chassis base 17 may be curved, e.g., convex along the z-axis with respect to the PDP 11, to increase mechanical rigidity thereof, i.e., facilitate absorption of strain and bending force. Alternatively, at least one reinforcement member 29 may be provided on a rear surface of the chassis base 17, e.g., a thin longitudinal member along the x-axis in upper and/or lower horizontal portions of the chassis base 17, and adjacent to the PBAs 15, as illustrated in
The PBAs 15 of the plasma display device may be arranged on the rear surface of the chassis base 17, and may be electrically connected to the PDP 11. The PBAs 15 may include an image board 15a, an address buffer board 15b, a scan electrode driving board 15c, a sustain electrode driving board 15d, and a power supply board 15e. The image board 15a may generate control signals for driving address, sustain, and scan electrodes (not shown), and supply the generated control signals to the address buffer board 15b, the sustain electrode driving board 15d, and the scan electrode driving board 15c. The address buffer board 15b may control the address electrodes. The scan electrode driving board 15c may control the scan electrodes. The sustain electrode driving board 15d may control the sustain electrodes. The power supply board 15e may supply power for driving the PBAs 15.
The PBAs 15 may include at least one single-sided circuit board (not shown). In this respect, it should be noted that a “single-sided board” may refer to all or a part of either of the PBAs 15 having a conductive pattern, e.g., a copper foil pattern, of an electrical circuit only on one surface of a respective PBA 15. As illustrated in
The circuit element 40 may be a relatively heavy element or an insertion component, e.g., a heat-generating component. For example, the circuit element 40 may be a switching element with a plurality of leads 42 or an insulated gate bipolar transistor (IGBT) having three leads 42 on the sustain electrode driving board 15d. Each circuit element 40 may include a heat sink 45, as illustrated in
The circuit element 40 may generate heat upon application of a sustain pulse to the sustain electrodes of the sustain electrode driving board 15d. The generated heat may be dissipated by the heat sink 45 attached to a lateral portion of the circuit element 40, thereby avoiding erroneous operations. Ends of the heat sink 45 may have no contact with the sustain electrode driving board 15d, as illustrated in
The ground 52 may be formed on the sustain electrode driving board 15d around the insert-holes 50 by, e.g., a plating method, to facilitate electrical connection of circuit wires, i.e., the pattern, to the circuit element 40. The ground 52 may be formed on a same surface as the pattern, and may have a shape corresponding to a shape of the insert-holes 50, e.g., a circular or a polygonal structure surrounding the insert-holes 50. For example, a planar cross section of the ground 52, i.e., in the xy-plane, may have a circular or a polygonal ring structure, so that the ground 52 may have inner and outer widths, as illustrated in
The slots 54 may be formed between the insert-holes 50. More specifically, one slot 54 may be positioned between every two insert-holes 50, as illustrated in
As illustrated in
The fixing member 60 may have a shape corresponding to a shape of the insert-hole 50. For example, the fixing member 60 may be an eyelet having a cylindrical shape and a rim 62, as illustrated in
The rim 62 may surround one end of the fixing member 60, and may protrude outwardly therefrom. For example, the rim 62 may be perpendicular to the fixing member 60, and may have a ring structure surrounding the insert-hole 50, as illustrated in
Upon insertion of the fixing member 60 into the insert-hole 50, a first gap may be formed between an outer circumferential surface of the fixing member 60 and the insert-hole 50. Further, a second gap may be formed between an inner circumferential surface of the fixing member 60 and the lead 42 of the circuit element 40. The bonding material 70, e.g., a solder paste, may be deposited into the first and second gaps to increase connection therebetween. More specifically, the bonding material 70 may be deposited in the insert-hole 50 after insertion of the lead 42, followed by a reflow process. The bonding material 70 may increase mechanical and electrical bonding between the circuit element 40 and the single-sided board.
A method of fixing the lead 42 of the circuit element 40 to the single-sided board according to an embodiment of the present invention will now be described with reference to
First, the fixing member 60 may be inserted into the insert-hole 50 of the single-sided board, so the rim 62 may be positioned on an upper surface of the single-sided board. Thereafter, the lead 42 of the circuit element 40 may be inserted into the insert-hole 50, so the fixing member 60 may be positioned between the lead 42 and the inner surfaces of the insert-hole 50. For example, the lead 42 may be centered in the insert-hole 50. In this respect, it is noted that the sustain electrode driving board 15d may be positioned between the rim 62 of the fixing member 60 and the ground 52, as illustrated in
Next, a solder paste may be deposited in the insert-hole 50. More specifically, the solder paste may be deposited between the fixing member 60 and the lead 42 of the circuit element 40. Thereafter, the single-sided board may be subject to the reflow process to convert the solder paste into the bonding material 70. In the reflow process, the solder paste may flow into the first gap between the outer circumferential surface of the fixing member 60 and the insert-hole 50 to bond therebetween. Furthermore, the solder paste may bond the second gap between the inner circumferential surface of the fixing member 60 and the lead 42 of the circuit element 40 to increase the bonding state of the circuit element 40.
Formation of the PBAs 15 of the plasma display device according to embodiments of the present invention may be advantageous in providing improved electrical and structural stability of the circuit element 40 in the PBA 15 via the fixing member 60 and the bonding material 70 in the insert-hole 50. Further, the structure of the PBA 15 provides wider grounds 52 and minimized electrical shorts between adjacent leads 42 of the circuit element 40 due to slots 54 therebetween.
Exemplary embodiments of the present invention have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.
Number | Date | Country | Kind |
---|---|---|---|
10-2006-0101947 | Oct 2006 | KR | national |