The present invention relates to a plasma generating device. More particularly, the present invention relates to a plasma generating device utilizing electromagnetic waves.
Plasmas are widely applied in industry and have become major equipments for etching, ashing and deposition in the fabrication process of semiconductors and TFT-LCD. Additionally, the plasma is used to enhance the chemical vapor deposition process of the silicon nitride layer, the amorphous silicon layer, the microcrystalline layer, the silicon dioxide layer, the diamond layer, the diamond-like layer and the carbon nanotube. Besides, plasmas are also used for the surface processing process, like the rainproof and moisture release cloth.
Plasmas can be excited by electrical powers with different frequencies, including the DC discharge, the low and medium radio frequency discharge, and microwave discharge technologies. The frequency used in the low and medium band is ranged from KHz to several MHz. The microwave discharge method uses the 2.45 GHz frequency. Since the required equipments are relatively simple and easy, the microwave discharge method is very promising.
In the microwave discharge method for generating the plasma, owing to the relative shorter wave length of the microwave, the dimensions of the operating chamber for accommodating large size substrates to be processed should be several times larger than the wave length of the microwave. Beside, the microwave penetration length into plasma is small. Consequently, it's difficult to make the plasma source with a large uniform area. In previous inventions, US20040011466 discloses a plasma processing apparatus which can generate a high-density plasma with a high efficiency. DE19503205C1 discloses a technical scheme where a high density plasma can be generated. Despite the advanced technologies provided in the prior art, it is found that the uniformity of the microwave plasma with the large area is still an issue.
In order to overcome the drawbacks in the prior art, a plasma generating device is proposed through arduous experiments and research.
It is a first aspect of the present invention to provide a plasma generating device for generating a plasma.
It is a second aspect of the present invention to provide a plasma generating device for generating a plasma with a uniform intensity.
It is a third aspect of the present invention to provide a plasma generating device to processing a substrate, wherein the plasma generating device comprises a first antenna to transmit the first electromagnetic wave and at least a second antenna to transmit the second electromagnetic wave, wherein the first electromagnetic wave and the second electromagnetic wave are transmitted in opposite directions, and the first electromagnetic wave is coupled with the second electromagnetic wave in an overlapping area between the first antenna and the second antenna.
It is a fourth aspect to provide a plasma generating device for generating a uniform plasma, wherein the plasma generating device comprises an electromagnetic wave shield with at least an opening and an antenna to transmit an electromagnetic wave, wherein the antenna is installed inside the electromagnetic wave shield.
It is a fifth aspect of the present invention to provide a plasma generating device for generating a plasma with a uniform intensity, the plasma generating device comprises a first antenna to transmit the first electromagnetic wave, and a second antenna to transmit the second electromagnetic wave, wherein the first electromagnetic wave and the second electromagnetic wave are transmitted in opposite directions. In addition, an insulator forms an isolated space for accommodating the first and the second antennas, wherein the first and the second electromagnetic waves are coupled with each other to produce a more uniform standing form pattern. Under this condition, a uniform plasma can be excited.
It is a sixth aspect of the present invention to provide a plasma generating device for generating a plasma with a uniform density to grow a film on a substrate in a processing chamber. The plasma generating device comprises a first antenna to transmit the first electromagnetic wave, and a second antenna to transmit the second electromagnetic wave, wherein the first electromagnetic wave and the second electromagnetic wave are transmitted in opposite directions. In addition, an insulator forms an isolated space for accommodating the first and the second antennas, wherein the first and the second electromagnetic waves are coupled with each other to produce a more uniform standing form pattern. Under this condition, a uniform plasma can be excited.
Other objects, advantages and efficacies of the present invention will be described in detail below taken from the preferred embodiments with reference to the accompanying drawings, in which:
Please refer to
According to the various necessities resulting from the applications for the plasma generating device 10, the first antenna 11 and the second antenna 12 of the antenna module 31 manage to be set up in different arrangements. As shown in
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According to the various necessities resulting from the applications for the plasma generating device 10, the first antenna 11 and the second antenna 12 of the antenna module 31 manage to be set up in different arrangements, wherein it is preferably that the first antenna 11 has an opposite orientation with respect to the second antenna 12, and there is another insulator 22 containing the second antenna 12 to be a third antenna adjacent to the first antenna 11, wherein the antennas adjacent to each other are orientated opposite mutually.
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Specifically, the first electromagnetic wave and the second electromagnetic waves are generated by an electromagnetic wave generator 16 and through an electromagnetic wave coupler 17 input into the first antenna 11 and the second antenna 12, respectively, wherein a frequency parameter, a power parameter and an ON/OFF state parameter of the electromagnetic wave generator 16 are adjustable, respectively, so as to adjust a magnitude of the respective electromagnetic wave. The present invention is also characterized in that the plasma generating device 10 further comprises an optic-electro sensor 23 controlling the electromagnetic wave generator 16 synchronously based on a development of the film 19 with respect to the substrate 18, wherein the development relates to one of a uniformity and a thickness of the film 19.
According to the various necessities resulting from the applications for the plasma generating device 10, the first antenna 11 and the second antenna 12 of the antenna module 31 manage to be set up in different arrangements. As shown in
To summarize, the present invention proposes a plasma generating device for processing a substrate, wherein a plasma with a uniform intensity is generated within an overlapping area between the first antenna and the second antenna, so that the drawbacks where electromagnetic waves are reflected by the previously formed plasma and the subsequent plasma is generated without a uniform intensity in the prior art are overcome.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Number | Date | Country | Kind |
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096115501 | May 2007 | TW | national |