This invention relates to plasma sources.
Plasma sources are used in many different arrangements including ion beam sources and a variety of etch and deposition tools. Such sources typically include a chamber for containing the plasma and it is well known that the plasma density is reduced adjacent the walls of the chamber due to interactions between the plasma and the chamber wall. This lack of uniformity can result in processed non-uniformity on the work pieces which are processed by processes involving the plasma.
The almost universal solution to date has been to surround the chamber with magnets or electro-magnets to create a field, which tends to reduce the rate at which electrons can reach the chamber wall. This in turn reduces the rate of ion loss to the wall and improves overall uniformity at the process plane by virtue of increased plasma density at the edge. This solution is often only partially successful and the longitudinal magnetic field passing through the chamber can produce other effects, which may not always be desirable.
However, uniformity of process is highly desirable, because the manufacturers of semi conductors devices and the like demand that every device formed on a work piece has the same characteristics.
From one aspect the invention consists in a plasma source including a plasma generator, a chamber having a volume for the plasma and a body located in the volume for creating local losses and thereby reducing local plasma density to determine the gradient of the plasma density across the volume.
In a preferred arrangement the plasma density is made more uniform across the chamber.
The Applicants have realised that there is, surprisingly, a completely different approach to the problem of plasma uniformity or achieving a preferred plasma gradient, which is to reduce the higher plasma density, which typically occurs towards the centre of the plasma, so that the density across the whole plasma is significantly more uniform or graduated as required. This can be used in combination with the traditional magnetic approach or alternatively it can be used alone.
Conveniently the body is generally planar and may lie in a general lateral plane in the chamber. The body may have one or more cut-outs or openings and indeed there may be more than one body. The bodies may be co-planar or alternatively they may be spaced and generally parallel.
In an alternative arrangement the body may be arranged generally axially within the chamber and there may be a number of spaced parallel bodies.
Where the body is located in an RF field it should be formed from an insulator. Otherwise the body may be a conductor. The body may be any suitable shape, but for manufacturing reasons a regular geometrical shape such as triangular, circular, diamond shaped, square or rectangular bodies are particularly suitable. Three dimensional and/or irregular shapes may be used.
The plasma source may be part of an ion source. Equally it may be substituted for antennae configurations or other plasma sources. Any appropriate mode of generating plasma may be used.
From a further aspect the invention consists in an ion source for creating a low power ion beam of 100V or less including a plasma generator having an input power of above about 100 W, a plasma chamber and at least a body located in the plasma chamber for absorbing power from a plasma contained in the chamber.
In this arrangement, the problems associated with running ion sources with very low input powers to created lower power beams can be overcome by running the source at higher powers and then using the body to absorb sufficient power to reduce the ion beam to the desired level.
Although the invention has been defined above it is to be understood that it includes any inventive combination of the features set out above or in the following description.
The invention may be performed in various ways and specific embodiments will now be described, by way of example, with reference to the accompanying drawings in which:
An ion source generally indicated at 10 includes an antenna 11 powered by an RF source 12 and surrounding a plasma generation chamber 13, plasma source or containment chamber 14 and an accelerator grid 15. Such an arrangement is more specifically described in the co-pending application Serial No. PCT/GB2007/002537 entitled Ion Deposition Apparatus filed on Jul. 6, 2007, which claims the benefit of U.S. Provisional Patent application Ser. No. 60/832,474 filed on Jul. 20, 2006, the entire disclosures of both of which are herein incorporated by reference. Broadly a plasma is struck in the plasma generator 13 using the antenna 11 and RF source 12. The plasma flows into the chamber 14 and ions are accelerated out of the chamber 14 by grid 15 to form a stream of ions indicated by the arrow A.
The Applicants have inserted a body 16 to extend laterally across a generally central portion of the chamber 14. The size, shape and location of the body 16 are selected to absorb sufficient power from the plasma struck in the chamber 14 so as to reduce locally the plasma density in such a way that the density of the plasma, as seen by the grid 15 is essentially uniform across the width of the chamber 14 or to achieve some desired profile of non-uniformity.
The size, shape and location can be determined empirically. The body 16 may be provided with openings or perforations 17 to allow for local fine tuning.
When a lateral body of this type is used, it will also affect the flow of ions through the chamber, as well the presence or absence of opening 17. This can be used to displace ion flow towards the chamber walls again enhancing uniformity. More than one body can be used and the addition of further bodies 16 will often persist in fine tuning.
As has already been mentioned, the ion source is only one example of a plasma generation device and the principals discussed above can equally well be applied to other plasma generation devices.
As well as being used to alter the level of non-uniformity within the plasma, a body or bodies 16 can be used to absorb power from the ion beam. This can be particularly effective for applications where low energy process beams are required (eg 100V or less). Typically applications requiring low energy process beams demand a plasma density in the region of 0.2 mAcm−2, with good uniformity. However this means that they tend to be operated at input powers in the region of 20 W where it is extremely difficult to control the device. In contrast, the Applicants have appreciated, that by utilising the arrangement shown in
If power absorption or control of plasma density is the sole requirement, then the body or bodies 16 may be aligned longitudinally with in the chamber 14 as illustrated in
The positioning requirements vary depending on the geometry of the apparatus, but in general the insert should not be place too close to the antenna region of primary plasma generation such that it affects the flow of plasma into the chamber 14. Equally if the body 16 is too close to the grid 15 or process plane, it may effectively block the grid 15. Within these limits the longitudinal position of the body may be selected in accordance with the effect that is desired. There is some suggestion from experiment, that the diffusion length of the expansion box is sensitive to changes of the insert axial location of the order of 5 mm. A diffusion length of half the radius of the insert, measured across the short axis of the chamber 14, has proved to be acceptable. In general it has been found that it is useful to have an insert which follows the symmetry of the chamber 14.
Number | Date | Country | Kind |
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0614500.7 | Jul 2006 | GB | national |
This application is a United States National Stage Application filed under 35 U.S.C. §371 of PCT Patent Application Serial No. PCT/GB2007/002550 filed on Jul. 6, 2007, which claims the benefit of and priority to Great Britain (GB) Patent Application Serial No. 0614500.7 filed on Jul. 21, 2006 and U.S. Provisional Patent Application Ser. No. 60/832,378 filed on Jul. 20, 2006, the disclosures of both of which are hereby incorporated by reference in their entirety.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/GB2007/002550 | 7/6/2007 | WO | 00 | 11/3/2009 |
Publishing Document | Publishing Date | Country | Kind |
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WO2008/009892 | 1/24/2008 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
3864797 | Banks | Feb 1975 | A |
3952228 | Reader et al. | Apr 1976 | A |
4232244 | Fink et al. | Nov 1980 | A |
4447773 | Aston | May 1984 | A |
4857800 | Ohkoshi et al. | Aug 1989 | A |
4987346 | Katzschner et al. | Jan 1991 | A |
4992665 | Mohl | Feb 1991 | A |
5036252 | Lob | Jul 1991 | A |
5107170 | Ishikawa et al. | Apr 1992 | A |
5296122 | Katsube et al. | Mar 1994 | A |
5393986 | Yoshinouchi et al. | Feb 1995 | A |
5786039 | Brouquet | Jul 1998 | A |
5871622 | Pinarbasi | Feb 1999 | A |
5874367 | Dobson | Feb 1999 | A |
5924277 | Beattie et al. | Jul 1999 | A |
6214698 | Liaw et al. | Apr 2001 | B1 |
6224718 | Meyer | May 2001 | B1 |
6246162 | Kahn et al. | Jun 2001 | B1 |
6339206 | Johnson | Jan 2002 | B1 |
6346768 | Proudfoot | Feb 2002 | B1 |
6387989 | Sulzbach et al. | May 2002 | B1 |
6395156 | Hsueh et al. | May 2002 | B1 |
6395647 | Li et al. | May 2002 | B1 |
6464891 | Druz et al. | Oct 2002 | B1 |
6544858 | Beekman et al. | Apr 2003 | B1 |
6724160 | Kaufman et al. | Apr 2004 | B2 |
6870164 | Baldwin et al. | Mar 2005 | B1 |
20020060201 | Yeom et al. | May 2002 | A1 |
20020175296 | Kimura et al. | Nov 2002 | A1 |
20020185226 | Lea et al. | Dec 2002 | A1 |
20030047536 | Johnson | Mar 2003 | A1 |
20030157781 | Macneil et al. | Aug 2003 | A1 |
20030227258 | Strang et al. | Dec 2003 | A1 |
20040023125 | Osamu et al. | Feb 2004 | A1 |
20040084299 | Slaughter | May 2004 | A1 |
20040163766 | Kanarov et al. | Aug 2004 | A1 |
20040212288 | Kanarov et al. | Oct 2004 | A1 |
20050159010 | Bhardwaj et al. | Jul 2005 | A1 |
20050194097 | Uchiyama | Sep 2005 | A1 |
20050241767 | Ferris et al. | Nov 2005 | A1 |
20060019039 | Hanawa et al. | Jan 2006 | A1 |
20060060795 | Takeuchi et al. | Mar 2006 | A1 |
Number | Date | Country |
---|---|---|
0 360 608 | Mar 1990 | EP |
0 496 564 | Jul 1992 | EP |
0 532 283 | Mar 1993 | EP |
1057119 | Feb 1967 | GB |
1138212 | Dec 1968 | GB |
1295465 | Nov 1972 | GB |
2 295 485 | May 1996 | GB |
2 327 909 | Feb 1999 | GB |
2 364 434 | Jan 2002 | GB |
58-189952 | Nov 1983 | JP |
4-194372 | Jul 1992 | JP |
5-74361 | Mar 1993 | JP |
7-169426 | Jul 1995 | JP |
7-230987 | Aug 1995 | JP |
8-139024 | May 1996 | JP |
08 335447 | Dec 1996 | JP |
9092490 | Apr 1997 | JP |
11135488 | May 1999 | JP |
2001 20068 | Jan 2001 | JP |
2003-17472 | Jan 2003 | JP |
2003017472 | Jan 2003 | JP |
2004079465 | Mar 2004 | JP |
WO 9814977 | Apr 1998 | WO |
WO 9818150 | Apr 1998 | WO |
WO 0036631 | Jun 2000 | WO |
WO 0122470 | Mar 2001 | WO |
WO 0233725 | Apr 2002 | WO |
WO 02097850 | Dec 2002 | WO |
WO 2005024881 | Mar 2005 | WO |
WO 2008009892 | Jan 2008 | WO |
Entry |
---|
Great Britain Search Report for GB0614499.2 dated Nov. 22, 2006, 1 pg. claims searched 1. |
Spaepen, F. et al., “Ion Beam Sputtering Apparatus for Fabrication of Compositionally Modulated Materials,” Review of Scientific Instruments, AIP, Melville, NY, US, vol. 56, No. 7, Jul. 1985, pp. 1340-1343. |
International Search Report and Written Opinion for PCT/GB2007/002550 dated Oct. 12, 2007, 13 pages. |
International Search Report and Written Opinion for PCT/GB2007/002614 dated Nov. 2, 2007, 13 pages. |
International Search Report for PCT/GB2007/002537 dated Dec. 14, 2007, 5 pages. |
Great Britain Search Report for GB0614500.7 dated Nov. 29, 2006, 1 pg. claims searched all. |
Great Britain Search Report for GB0614501.5 dated Nov. 29, 2006, claims searched 1-15. |
Great Britain Search Report for GB0614501.5 dated Jun. 1, 2007, 1 page, claims searched 16 to 18. |
Great Britain Search Report for GB0614501.5 dated Jun. 1, 2007, 1 page, claim searched 19. |
Great Britain Search Report for GB0614499.2 dated Jul. 2, 2007, 1 pg, claims searched 6-31. |
Number | Date | Country | |
---|---|---|---|
20100108905 A1 | May 2010 | US |
Number | Date | Country | |
---|---|---|---|
60832378 | Jul 2006 | US |