Claims
- 1. A thermoplastic molding composition comprising:
- (A) at least one polyetherimide ester resin; and
- (B) a modifier consisting essentially of:
- a combination of at least one olefin acrylate copolymer and at least one ethylene vinyl acetate copolymer, wherein the modifier comprises from about 5 to 60 percent by weight of the total weight of (A) and (B), said composition having reduced Shore D hardness than unmodified polyetherimideester resin.
- 2. The composition of claim 1 wherein the olefin acrylate copolymer is an ethylene ethyl acrylate copolymer.
- 3. The composition of claim 1 wherein the thermoplastic molding composition contains an add-on amount of an oxidative and/or thermal stabilizer.
- 4. The composition of claim 1 wherein said polyetherimide ester resin is comprised of the reaction products of:
- (a) at least one diol;
- (b) at least one dicarboxylic acid or an ester forming reactive derivative thereof; and
- (c) a set of reactants selected from
- (1) (i) at least one high molecular weight poly(oxy alkylene)diamine, and (ii) at least one tricarboxylic acid or a derivative thereof, or
- (2) at least one high molecular weight polyoxyalkylene diimide diacid.
- 5. The composition of claim 4 wherein said diol is a low molecular weight diol.
- 6. The composition of claim 4 wherein said dicarboxylic acid or its derivative is an aromatic dicarboxylic acid or its derivative.
- 7. The composition of claim 4 wherein (c) is (1).
- 8. The composition of claim 7 wherein said high molecular weight poly(oxy alkylene)diamine is represented by the formula
- H.sub.2 N--G--NH.sub.2
- 9. The composition of claim 7 wherein said tricarboxylic acid or its derivative (c) (1) (ii) is represented by the formula ##STR5## wherein R is a C.sub.1 to C.sub.20 trivalent aliphatic, cycloaliphatic or aromatic radical, and R' is hydrogen or a C.sub.1 -C.sub.12 aliphatic monovalent radical.
- 10. The composition of claim 4 wherein (c) is (2).
- 11. The composition of claim 10 wherein said high molecular weight polyoxyalkylene diimide diacid is represented by the formula ##STR6## wherein: each R is independently selected from C.sub.1 -C.sub.20 aliphatic, cycloaliphatic or aromatic trivalent organic radicals;
- each R' is independently selected from hydrogen, C.sub.1 -C.sub.6 aliphatic or cycloaliphatic organic radicals, or C.sub.6 -C.sub.12 aromatic monovalent organic radicals; and
- G is the radical remaining after the removal of the amino groups of a long chain alkylene ether diamine.
- 12. The composition of claim 11 wherein said long chain alkylene ether diamine has an average molecular weight of from about 600 to about 12,000.
- 13. The composition of claim 12 wherein said long chain alkylene ether diamine has an average molecular weight of from about 900 to about 4,000.
- 14. The composition of claim 11 wherein each R is a C.sub.6 trivalent aromatic hydrocarbon radical and each R' is hydrogen.
- 15. The composition of claim 1 wherein said polyetherimide ester resin is comprised of at least the following recurring structural units: ##STR7## wherein: R.sup.1 is the residue of a diol absent the two hydroxyl groups;
- R.sup.2 is the residue of a dicarboxylic acid absent the two carboxyl groups;
- R is a trivalent organic radical; and
- G is the radical remaining after the removal of the amino groups of a long chain poly(oxy alkylene) diamine.
Parent Case Info
This is a continuation-in-part of co-pending application Ser. No. 07/600,268 filed on Oct. 22, 1990 now abandoned which is a continuation of co-pending application Ser. No. 139,928 filed on Dec. 31, 1987 now abandoned.
US Referenced Citations (2)
Continuations (1)
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Number |
Date |
Country |
Parent |
139928 |
Dec 1987 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
600268 |
Oct 1990 |
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