Claims
- 1. A method of plating a non-conductive product comprising the steps of:(a) forming a coating film on necessary portions of a surface of a non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight % by: (i) adjusting viscosity of the conductive paint with an organic solvent (ii) painting the conductive paint containing the conductive whisker onto the surface of the non-conductive product; (iii) drying the painted conductive paint at room temperature to form a dried coating film; and (iv) maintaining the dried coating film at a temperature from about 70° C. to about 90° C. wherein such temperature gasifies the solvent around the conductive whisker in the coating film thereby forming microvoids having a diameter of about 0.1 μm to about 50 μm on the surface of the coating film such that the microvoids improve adhesiveness of a subsequently plated electroless plating layer; and (b) executing electroless plating on the surface of the coating film thereby plating the non-conductive product.
- 2. The method of claim 1, further comprising the step of:executing electroplating on the electroless plating.
- 3. The method of claim 1, wherein the electroless plating is executed with a metal selected from the group consisting of nickel and copper.
- 4. The method of claim 1, wherein said resin vehicle is in a range of from 40 to 60 weight %, and said conductive whisker is in a range of from 60 to 40 weight %.
- 5. The method of claim 1, wherein said conductive whisker has a fiber diameter of from about 0.1 μm to about 100 μm, a fiber length of from about 0.5 μm to 200 μm, and a surface resistance value of from about 10° to 10−3 Ω/cm.
- 6. The method of claim 1, wherein said resin vehicle contains at least one compound selected from the group consisting of polyvinyl chloride, polyvinyl acetate, saturated polyester resin, acrylic resin, vinyl chloride-vinyl acetate copolymer resin, vinyl chloride-vinyl acetate-maleic acid anhydride copolymer resin, vinyl chloride-vinyl acetate-vinyl alcohol copolymer resin, styrene-butadiene copolymer resin, unsaturated polyester resin, alky resin, and epoxy resin.
- 7. The method of claim 6, wherein said resin vehicle further contains vinyl chloride-vinyl acetate-malaic acid anhydride copolymer resin, vinyl chloride-vinyl acetate-vinyl alcohol copolymer resin, or a saturated or unsaturated polyester resin.
- 8. A method of claim 1, wherein said non-conductive product is selected from the group consisting of resin, rubber, ceramics, wood, glass and cloth.
- 9. The method of claim 1, wherein the conductive whisker is selected from group consisting of a fibrous monocrystal of a metal, a fibrous monocrystal of a metal oxide, or a fibrous monocrystal of an inorganic salt; and a needle-shaped monocrystal of a metal, a needle-shaped monocrystal of a metal oxide, or a needle-shaped monocrystal of an inorganic salt.
- 10. The method of claim 9 wherein the fibrous monocrystal of a metal oxide, the fibrous monocrystal of an inorganic salt, the needle-shaped monocrystal of a metal oxide or the needle-shaped monocrystal of an inorganic salt is covered with a conductive material.
- 11. The method of claim 9 wherein said metal oxide is selected from the group consisting of sapphire, potassium titanate and aluminum borate.
- 12. The method of claim 9 wherein said inorganic salt is silicon carbide.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-326573 |
Nov 1997 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATION
This application claims benefit of Japanese patent application 9-326573, filed Nov. 27, 1997.
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