Reinforcing conductive paste, ink or powder patterns by other methods

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CPC
H05K3/246

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of producing a sensing substrate
- Patent number 11,787,311
- Issue date Oct 17, 2023
- Joyson Safety Systems Acquisition LLC
- David Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,535,947
- Issue date Dec 27, 2022
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,523,517
- Issue date Dec 6, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 11,399,426
- Issue date Jul 26, 2022
- NGK Spark Plug Co., Ltd.
- Toshio Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid metal fusion with conductive inks and pastes
- Patent number 11,395,413
- Issue date Jul 19, 2022
- Carnegie Mellon University
- Mahmoud Tavakoli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,214,884
- Issue date Jan 4, 2022
- University of South Florida
- Arash Takshi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,032,916
- Issue date Jun 8, 2021
- Hon Hai Precision Industry Co., Ltd.
- Ren-Yi Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of producing a sensing substrate
- Patent number 11,001,167
- Issue date May 11, 2021
- Joyson Safety Systems Acquisition LLC
- David Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Substrate with functional fine line and method for forming function...
- Patent number 11,001,687
- Issue date May 11, 2021
- Konica Minolta, Inc.
- Masayoshi Yamauchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite member and method of manufacturing the same, and aliphati...
- Patent number 10,634,996
- Issue date Apr 28, 2020
- Japan Advanced Institute of Science and Technology
- Satoshi Inoue
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lighting system
- Patent number 10,619,834
- Issue date Apr 14, 2020
- ANTARES ILUMINACION, S.A.U.
- Federico Martinez Weber
- F21 - LIGHTING
Information Patent Grant
Hybrid printed circuit assembly with low density main core and embe...
- Patent number 10,609,819
- Issue date Mar 31, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and method of manufacturing the same
- Patent number 10,573,770
- Issue date Feb 25, 2020
- LG Electronics Inc.
- Sunho Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,020
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for preparing an energy saving anti-burst heat dissipation...
- Patent number 10,470,291
- Issue date Nov 5, 2019
- Chintung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,418,165
- Issue date Sep 17, 2019
- Murata Manufacturing Co., Ltd.
- Shinichiro Banba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing planar coil
- Patent number 10,354,796
- Issue date Jul 16, 2019
- TDK Corporation
- Yuhei Horikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Board and electronic device
- Patent number 10,264,673
- Issue date Apr 16, 2019
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,237,976
- Issue date Mar 19, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an LED module and module made thereof
- Patent number 10,211,188
- Issue date Feb 19, 2019
- Cheng Chang TransFlexDisplay Corp.
- Wen-Chang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and manufacturing method thereof
- Patent number 10,178,774
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Kunio Iwakoshi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
PDMS-based stretchable multi-electrode and chemotrode array for epi...
- Patent number 10,130,274
- Issue date Nov 20, 2018
- Ecole Polytechnique Federale de Lausanne (EPFL)
- Janos Voros
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Transparent electrode, method for manufacturing same, and organic e...
- Patent number 10,103,347
- Issue date Oct 16, 2018
- Konica Minolta, Inc.
- Shigeru Kojima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method of double sided printed circuit board
- Patent number 10,080,299
- Issue date Sep 18, 2018
- INKTEC CO., LTD.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable circuit board and method of manufacturing the same
- Patent number 10,057,981
- Issue date Aug 21, 2018
- Industry Foundation of Chonnam National University
- Dong-Weon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a flexible and/or stretchable electronic de...
- Patent number 10,034,382
- Issue date Jul 24, 2018
- Nanyang Technology University
- Chaoyi Yan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic article and process of producing an electronic article
- Patent number 9,985,344
- Issue date May 29, 2018
- TE Connectivity Corporation
- Bruce Foster Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component incorporating substrate and method for manufacturing comp...
- Patent number 9,854,682
- Issue date Dec 26, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick print copper pastes for aluminum nitride substrates
- Patent number 9,799,421
- Issue date Oct 24, 2017
- Heraeus Precious Metals North America Conshohocken LLC
- Virginia C. Garcia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE
- Publication number 20240042898
- Publication date Feb 8, 2024
- Joyson Safety Systems Acquisition LLC
- David Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
- Publication number 20230129434
- Publication date Apr 27, 2023
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20230119828
- Publication date Apr 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Hirofumi OIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS
- Publication number 20230074639
- Publication date Mar 9, 2023
- CREATIVE IC3D LTD.
- Yacov MAZUZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230047768
- Publication date Feb 16, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES
- Publication number 20220346238
- Publication date Oct 27, 2022
- Carnegie Mellon University
- Mahmoud TAVAKOLI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220046802
- Publication date Feb 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE
- Publication number 20210261019
- Publication date Aug 26, 2021
- Joyson Safety Systems Acquisition LLC
- David Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRINTING CONDUCTIVE TRACES
- Publication number 20210185827
- Publication date Jun 17, 2021
- Hewlett-Packard Development Company, L.P.
- Jarrid Wittkopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE
- Publication number 20200391616
- Publication date Dec 17, 2020
- Joyson Safety Systems Acquisition LLC
- David Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20200236794
- Publication date Jul 23, 2020
- HON HAI PRECISION INDUSTRY CO., LTD.
- REN-YI HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES
- Publication number 20200221580
- Publication date Jul 9, 2020
- Carnegie Mellon University
- Mahmoud TAVAKOLI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE INK FOR FORMING SIGNAL CONNECTION, SIGNAL REFERENCING, A...
- Publication number 20200107453
- Publication date Apr 2, 2020
- International Business Machines Corporation
- MICHAEL CHRISTO
- G05 - CONTROLLING REGULATING
Information Patent Application
COPPER POWER METAL PLATING LAYER, METAL SUBSTRATE, ENERGY-SAVING AN...
- Publication number 20190029106
- Publication date Jan 24, 2019
- Chintung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20190008037
- Publication date Jan 3, 2019
- Sumitomo Electric Industries, Ltd.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...
- Publication number 20180206368
- Publication date Jul 19, 2018
- DIC CORPORATION
- Akira Murakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170099732
- Publication date Apr 6, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT INCORPORATING SUBSTRATE AND METHOD FOR MANUFACTURING COMP...
- Publication number 20170094798
- Publication date Mar 30, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING ASSEMBLY OF A POWER OPERATED DEVICE AND METHOD OF MANUFACTU...
- Publication number 20170027070
- Publication date Jan 26, 2017
- Magna Closures Inc.
- Abdullah Siddiqui
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...
- Publication number 20160198594
- Publication date Jul 7, 2016
- DIC CORPORATION
- Akira Murakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, CONDUCTIVE PATTERN, ELECTRICAL CIRCUIT, AND METHOD FOR PR...
- Publication number 20150359095
- Publication date Dec 10, 2015
- DIC CORPORATION
- Akira Murakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE AND CERAMIC SUBSTRATE MANUFACTURED USING THE SAME
- Publication number 20150282309
- Publication date Oct 1, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Minoru Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THICK PRINT COPPER PASTES FOR ALUMINUM NITRIDE SUBSTRATES
- Publication number 20140363681
- Publication date Dec 11, 2014
- Heraeus Precious Metals North America Conshohocken, LLC
- Virginia C. Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA AND COMMUNICATION APPARATUS AS WELL AS MANUFACTURING METHOD...
- Publication number 20140333484
- Publication date Nov 13, 2014
- SHUHOU CO., LTD.
- Kouji Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF METALIZING SURFACE AND ARTICLE OBTAINABLE
- Publication number 20140308450
- Publication date Oct 16, 2014
- SHENZHEN BYD AUTO R&D COMPANY LIMITED
- Weifeng MIAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INK COMPOSITION, METHOD OF METALIZING SURFACE AND ARTICLE OBTAINABLE
- Publication number 20140308531
- Publication date Oct 16, 2014
- SHENZHEN BYD AUTO R&D COMPANY LIMITED
- Weifeng MIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES
- Publication number 20140284087
- Publication date Sep 25, 2014
- CERAMTEC GMBH
- Alexander Dohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND C...
- Publication number 20140216799
- Publication date Aug 7, 2014
- APPLIED NANOTECH HOLDINGS, INC.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION
- Publication number 20140201993
- Publication date Jul 24, 2014
- Asahi Glass Company, Limited
- Katsuyoshi NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20140196934
- Publication date Jul 17, 2014
- KYOCERA CORPORATION
- Hiroshi Kawagoe
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing conductive paste, ink or powder patterns by other methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and method for manufacturing the same

Apparatus and method of producing a sensing substrate

Electrochemical three-dimensional printing and soldering

Circuit board and method for manufacturing the same

Wiring board and method for manufacturing same

Liquid metal fusion with conductive inks and pastes

Electrochemical three-dimensional printing and soldering

Method for manufacturing circuit board

Apparatus and method of producing a sensing substrate

Substrate with functional fine line and method for forming function...

Composite member and method of manufacturing the same, and aliphati...

Lighting system

Hybrid printed circuit assembly with low density main core and embe...

Solar cell and method of manufacturing the same

Printed circuit board and electronic component

Process for preparing an energy saving anti-burst heat dissipation...

Electronic device

Method for manufacturing planar coil

Board and electronic device

Substrate for printed circuit board, printed circuit board, and met...

Method for making an LED module and module made thereof

Ceramic electronic component and manufacturing method thereof

PDMS-based stretchable multi-electrode and chemotrode array for epi...

Transparent electrode, method for manufacturing same, and organic e...

Manufacturing method of double sided printed circuit board

Stretchable circuit board and method of manufacturing the same

Method of manufacturing a flexible and/or stretchable electronic de...

Electronic article and process of producing an electronic article

Component incorporating substrate and method for manufacturing comp...

Thick print copper pastes for aluminum nitride substrates

Patents Applicationslast 30 patents

APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE

PRINTING CONDUCTIVE TRACES

APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES

CONDUCTIVE INK FOR FORMING SIGNAL CONNECTION, SIGNAL REFERENCING, A...

COPPER POWER METAL PLATING LAYER, METAL SUBSTRATE, ENERGY-SAVING AN...

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

COMPONENT INCORPORATING SUBSTRATE AND METHOD FOR MANUFACTURING COMP...

HOUSING ASSEMBLY OF A POWER OPERATED DEVICE AND METHOD OF MANUFACTU...

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...

LAMINATE, CONDUCTIVE PATTERN, ELECTRICAL CIRCUIT, AND METHOD FOR PR...

CONDUCTIVE PASTE AND CERAMIC SUBSTRATE MANUFACTURED USING THE SAME

THICK PRINT COPPER PASTES FOR ALUMINUM NITRIDE SUBSTRATES

ANTENNA AND COMMUNICATION APPARATUS AS WELL AS MANUFACTURING METHOD...

METHOD OF METALIZING SURFACE AND ARTICLE OBTAINABLE

INK COMPOSITION, METHOD OF METALIZING SURFACE AND ARTICLE OBTAINABLE

CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES

CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND C...

SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION

WIRING SUBSTRATE AND ELECTRONIC DEVICE