Platen assembly, apparatus having the platen assembly and method of polishing a wafer using the platen assembly

Abstract

In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders extends in a first direction on an entire surface of the platen and is spaced apart by a uniform distance, and the first bladders apply pressure to the polishing belt. A plurality of second bladders extends in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and is positioned between the first bladders, and the second bladders apply pressure to the polishing belt. The pressures of the bladders are individually controlled by pressure controllers. Various pressures are individually applied different portions of the polishing belt by the bladders.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present invention will become more apparent by describing in example embodiments thereof with reference to the accompanying drawings, in which:

FIG. 1 is a view that schematically illustrates a structure of a conventional CMP apparatus;

FIG. 2 is a view that illustrates a structure of a platen assembly in accordance with a first example embodiment of the present invention;

FIG. 3 is a plan view illustrating the platen assembly shown in FIG. 2;

FIG. 4 is a view illustrating a structure of a platen assembly in accordance with a second example embodiment of the present invention;

FIG. 5 is a plan view illustrating the platen assembly shown in FIG. 4;

FIG. 6 is a view illustrating an apparatus for polishing a wafer according to an example embodiment of the present invention;

FIG. 7 is a view illustrating the relative positions of the wafer and the platen assembly in the polishing apparatus shown in FIG. 6; and

FIG. 8 is a flow chart illustrating a method of polishing a wafer according to an example embodiment of the present invention.

Claims

1. A platen assembly for a polishing apparatus, comprising: a platen supporting a polishing belt that makes contact with an object during a polishing process, the platen providing a pressure on the polishing belt during the polishing process;a plurality of first bladders extending in a first direction on an entire surface of the platen and spaced apart by a uniform distance, the first bladders applying pressure to the polishing belt; anda plurality of second bladders extending in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and positioned between the first bladders, the second bladders applying pressure to the polishing belt.

2. The platen assembly of claim 1, wherein the first bladders include central bladders positioned on the central portion of the platen, middle bladders positioned on the middle portion of the platen and peripheral bladders positioned on the peripheral portion of the platen.

3. The platen assembly of claim 1, wherein the first bladders are spaced apart from one another on the central and peripheral portions of the platen by a first distance and apply a first pressure to the polishing belt, and wherein the first and second bladders are spaced apart from one another on the middle portion of the platen by a second distance less than the first distance and apply a second pressure greater than the first pressure to the polishing belt.

4. The platen assembly of claim 1, further comprising a first pressure controller for controlling first pressures of the first bladders, and a second pressure controller for controlling second pressures of the second bladders.

5. The platen assembly of claim 1, further comprising an operation unit for rotating the platen.

6. An apparatus for polishing an object, comprising: a polishing belt in contact with the object;a roller for circulating the polishing belt;a polishing head to which the object is secured in such a structure that a surface of the object to be polished faces an upper surface of the polishing belt, the polishing head bringing the surface of the object to be polished into contact with the upper surface of the polishing belt when the polishing belt is circulated; anda platen assembly including a platen supporting the polishing belt to provide a pressure on the polishing belt when the polishing belt is circulated, a plurality of first bladders extending in a first direction on an entire surface of the platen and spaced apart by a uniform distance, and a plurality of second bladders extending in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and positioned between the first bladders, the first and second bladders applying pressure to the polishing belt.

7. The apparatus of claim 6, wherein a center of the surface of the object to be polished is positioned on the upper surface of the polishing belt corresponding to the middle portion of the platen when the polishing belt is circulated.

8. The apparatus of claim 6, wherein the first bladders include central bladders positioned on the central portion of the platen, middle bladders positioned on the middle portion of the platen and peripheral bladders positioned on the peripheral portion of the platen.

9. The apparatus of claim 6, wherein the first bladders are spaced apart from one another on the central and peripheral portions of the platen by a first distance and apply a first pressure to the polishing belt, and wherein the second bladders are spaced apart from one another on the middle portion of the platen by a second distance less than the first distance and apply a second pressure greater than the first pressure to the polishing belt.

10. The apparatus of claim 6, wherein the platen assembly further includes a first pressure controller for controlling first pressures of the first bladders, and a second pressure controller for controlling second pressures of the second bladders.

11. The apparatus of claim 6, wherein the platen assembly further includes an operation unit for rotating the platen.

12. A method of polishing an object, comprising: applying a first pressure to a lower surface of a circulating polishing belt by a plurality of first bladders extending in a first direction on a central portion and a peripheral portion of an upper surface of a platen and spaced apart from one another by a first distance;applying a second pressure to a lower surface of a circulating polishing belt by a plurality of second bladders extending in a first direction on a middle portion of the upper surface of the platen between the central portion and the peripheral portion of the upper surface of the platen and spaced apart from one another by a second distance less than the first distance; andbringing a surface of the object to be polished into contact with an upper surface of the polishing belt.

13. The method of claim 12, wherein a center of the surface of the object to be polished makes contact with a portion of the upper surface of the polishing belt corresponding to the middle portion of the platen when the polishing belt is circulated.

14. The method of claim 12, further comprising controlling pressures of the first and second bladders in accordance with a degree of polishing of different regions of the object.