Patent Application
20240200222
The present disclosure relates to a plating electrode used for forming a plating film on an object to be plated, and relates to a plating method that uses the plating electrode.
There has been a known electroplating method that forms a plating film by performing electroplating treatment on an object to be plated. In the electroplating method, to prevent the plating film from being formed at portions other than the portion to be plated, which is a portion where the plating film is to be formed, before electroplating treatment is performed, masking work is performed in which the portions other than the portion to be plated are protected by a masking material, such as a resist. However, the known electroplating method has a problem of increasing the processing time period by such masking work, which reduces productivity. In view of the above, Patent Literature 1, for example, discloses a partial plating method that can omit masking work. This partial plating method is structured in which a plating target portion of an object to be plated is immersed in a plating solution in a plating tank and a plating non-target portion is exposed from the surface of the plating solution so that a plating film is formed by electroplating only on the surface of the portion to be plated.
Patent Literature 1: Japanese Patent No. 6510993
However, the partial plating method disclosed in Patent Literature 1 is structured in which the entire plating target portion is immersed in the plating solution in the plating tank and hence, a plating film is formed on the entire periphery of the immersed portion. Therefore, it is impossible to selectively form a plating film only on the surface of the portion of the object to be plated. That is, in the partial plating method disclosed in Patent Literature 1, there is a limitation on a target portion on which partial plating is performed and hence, partial plating treatment with various patterns cannot be performed.
The present disclosure has been made to solve the above-mentioned problem, and it is an object of the present disclosure to provide a plating electrode that does not require masking work, in which portions other than a portion to be plated are protected by a masking material, and that can selectively apply partial plating only to the surface of a portion of an object to be plated, and it is another object of the present disclosure to provide a plating method that uses the plating electrode.
A plating electrode according to one embodiment of the present disclosure is a plating electrode used for forming a plating film on an object to be plated, the plating electrode including a plating-solution-impregnated fabric formed into an annular shape; an annular part disposed inside the annular shape of the plating-solution-impregnated fabric, and provided in a state in which an outer surface of the annular part is kept in close contact with an inner surface of the plating-solution-impregnated fabric, the annular part having conductivity; a first rotary part provided inside the annular part, electrically connected to the annular part, and configured to be rotatable while ensuring conductivity; and a second rotary part provided inside the annular part, and configured to rotate in synchronization with driving of a motor. An anode of a DC conversion power supply is electrically connected to the first rotary part, and a cathode of the DC conversion power supply is electrically connected to the object to be plated, and the annular part is caused to turn in synchronization with rotation of the first rotary part and the second rotary part to cause the plating-solution-impregnated fabric to turn in an annular direction, thereby causing the plating-solution-impregnated fabric to come into contact with and to slide against a portion to be plated of the object to be plated.
A plating method according to another embodiment of the present disclosure is a plating method that uses the plating electrode, including performing plating treatment, the performing plating treatment including turning the plating-solution-impregnated fabric with the plating-solution-impregnated fabric impregnated the plating solution; transmitting an electric current through the plating-solution-impregnated fabric by use of the DC conversion power supply; and causing the plating-solution-impregnated fabric to come into contact with and to slide against the portion to be plated of the object to be plated.
According to an embodiment of the present disclosure, the plating-solution-impregnated fabric is caused to be in close contact with the annular part, which is electrically connected to the anode of the DC conversion power supply via the first rotary part, and the plating-solution-impregnated fabric slides while keeping in contact with the portion to be plated of the object to be plated, which is electrically connected to the cathode of the DC conversion power supply, and hence, it is possible to form a plating film only at the portion to be plated with which the plating-solution-impregnated fabric comes into contact. Therefore, masking work, in which portions other than the portion to be plated are protected by a masking material, is not required, and it is possible to selectively form a plating film only on the surface of the portion of the object to be plated.
Hereinafter, Embodiments will be described with reference to drawings. In the respective drawings, identical or corresponding components are given the same reference signs, and the description of such components is omitted or simplified when appropriate. The shapes, the sizes, the arrangement, and other features of the components described in the respective drawings may be suitably changed.
A plating electrode 100 according to Embodiment 1 is used for forming a plating film on a portion to be plated 200a of an object to be plated 200. The portion to be plated 200a is a region of the surface of the object to be plated 200 in which a plating film is formed. As shown in
As shown in
The annular part 2 is formed from a mesh having conductivity, for example. The annular part 2 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use. For example, the annular part 2 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
As shown in
The first rotary part 3 and the second rotary part 4 are disposed inside the annular part 2. The annular part 2 is electrically connected with the first rotary part 3. The annular part 2 turns in the annular direction in synchronization with rotation of the first rotary part 3 and the second rotary part 4. When the annular part 2 turns in the annular direction, the plating-solution-impregnated fabric 1 that is in close contact with the annular part 2 also turns in the annular direction in synchronization with the rotation of the first rotary part 3 and the second rotary part 4.
Although not shown in the drawing, it is preferable for the annular part 2 to have notches at edges 2a of the annular shape. By causing the edges 2a of the annular shape of the annular part 2 to have the notches, it is possible to prevent generation of an excessive tension in the annular part 2 at the time when the first rotary part 3 and the second rotary part 4 come into contact with the annular part 2 and hence, breakage of the end portion of the annular part 2 can be prevented.
The annular part 2 is not limited to the above-mentioned mesh, and may be formed from other parts, such as a thin plate, provided that the annular part 2 can turn in the annular direction in synchronization with the rotation of the first rotary part 3 and the second rotary part 4 while the annular part 2 is electrically connected with the first rotary part 3.
The first rotary part 3 is a rotary connecting connector including a rotary shaft 30 and a rotary body 31 electrically connected to the rotary shaft 30 and having a cylindrical shape. The first rotary part 3 is provided inside the annular part 2. The first rotary part 3 is electrically connected to the annular part 2, and is configured to be rotatable while ensuring conductivity of the rotary shaft 30 and the rotary body 31.
The first rotary part 3 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use. For example, the first rotary part 3 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C). For the first rotary part 3, a commercially available connector may be used in which conductivity of the rotary shaft 30 and the rotary body 31 is ensured by use of, for example, a carbon brush, a mercury-gallium alloy, or a roller current collector.
The anode of a DC conversion power supply 5 is electrically connected to the rotary shaft 30 of the first rotary part 3 via a conductive wire 5a. The cathode of the DC conversion power supply 5 is electrically connected to the object to be plated 200 via a conductive wire 5b. The rotary body 31 of the first rotary part 3 can be rotated independently from the rotary shaft 30. The DC conversion power supply 5 includes a power supply circuit that is controlled such that the DC output voltage always remains at a constant value.
As shown in
The second rotary part 4 includes a rotary shaft 40 and a rotary body 41 rotated by the rotary shaft 40 and having a cylindrical shape. The second rotary part 4 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use. For example, the second rotary part 4 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
The rotary shaft 40 is provided at the center of the circle of the rotary body 41. One end of the rotary shaft 40 is connected to the motor 6 connected to a power supply (not shown in the drawing). The second rotary part 4 is configured such that the rotary body 41 rotates about the rotary shaft 40 when the motor 6 is driven.
As shown in
Each of the rotary bodies 31 and 41 is not limited to a cylindrical shape shown in the drawing. For example, each of the rotary bodies 31 and 41 may have a shape obtained by arranging a plurality of spherical bodies or gears with a shaft in a row, or may have a configuration in which a plurality of polygonal prisms or cylindrical bodies with a shaft are arranged in a row. The rotary parts that cause the annular part 2 to turn in synchronization with the rotary parts are not limited to two rotary parts, that is, the first rotary part 3 and the second rotary part 4 shown in the drawing. The rotary parts may include three or more rotary parts depending on the purpose of use, the shape of the object to be plated 200, and other features. For example, in the case in which plating is applied to an object to be plated 200 that includes a recessed portion as shown in
The plating solution supplier 7 is a device that supplies a plating solution 70 to the plating-solution-impregnated fabric 1. The plating solution supplier 7 shown in
As shown in
It is desirable that the holder 8 is formed to pass over the outside of the first rotary part 3, the outside of the second rotary part 4, and the outside of the annular part 2, and to hold the plating electrode 100. The reason for this form is to prevent the holder 8 from preventing the rotation of the first rotary part 3, the second rotary part 4, and the motor 6. Another reason is to prevent the holder 8 from preventing conduction of the plating-solution-impregnated fabric 1, the annular part 2, and the first rotary part 3. Still another reason is to prevent the holder 8 from interfering with a turning path in which the plating-solution-impregnated fabric 1 turns.
An operation mechanism not shown in the drawing including the arm of a robot or other mechanism is connected to the holder 8. The operation mechanism is configured to freely move the plating electrode 100 via the holder 8, and is also configured to adjust the contact pressure of the plating-solution-impregnated fabric 1 against the portion to be plated 200a, for example. The operation mechanism may be formed to include a grip portion that can be manually operated by the operator. In this case, the grip portion is made of an insulating material, such as a resin.
Next, a plating method that uses the above-mentioned plating electrode will be described. In the plating method, a degreasing step, an acid cleaning step, a neutralizing step, and a plating step are performed in this order. Hereinafter, the respective steps will be described in detail. In Embodiment 1, a method for applying silver plating to a copper alloy material, which is a highly versatile material as the target for plating treatment, will be described as an example.
First, a copper alloy material processed into a set shape is prepared as the object to be plated 200. Then, the degreasing treatment is performed on the object to be plated 200 by use of a degreasing agent. With such treatment, contaminants on the surface, such as organic foreign matters, are removed from the surface of the object to be plated 200 so that solution wettability is ensured. For the degreasing agent a commercially available sodium-hydroxide-based or sodium-carbonate-based alkaline degreasing agent, for example, may be used.
Next, the acid cleaning treatment is performed on the object to be plated 200 by use of an acid cleaning agent. With such treatment, contaminants on the surface, such as inorganic foreign matters, and an oxide film are removed from the surface of the copper alloy material. In the acid cleaning step, solution wettability is ensured by exposing an active metal surface to ensure close contact between a plating film to be formed in a later plating step and the object to be plated 200, which is the base material. For the acid cleaning agent, an etchant obtained by diluting nitric acid or sulfuric acid, or a commercially available acid cleaning agent, for example, may be used.
Next, the neutralization treatment is performed on the object to be plated 200 by use of a neutralizing agent. With such treatment, traces of acid remaining on the surface of the copper alloy material are removed so that corrosion of the copper alloy material is averted. For the neutralizing agent, a cyanide-based solution, such as sodium cyanide, a dilute sodium-hydroxide-based cleaning solution, and a commercially available neutralizing agent, for example, may be used.
Next, silver plating treatment is performed on the object to be plated 200 by use of a silver plating solution by a silver electroplating method. In the plating step, a silver plating film is formed on the surface of the object to be plated 200 at the portion to be plated 200a. For the silver electroplating method, cathode electrolytic treatment that is generally performed in plating treatment is performed.
In the silver electroplating method, conditions, such as a plating time period, a current density, and the temperature of the silver plating solution may be suitably set. The plating time period is a time period during which the plating-solution-impregnated fabric 1 impregnated with the silver plating solution is caused to be in contact with the portion to be plated 200a. For example, when the plating time period is set to 30 seconds, the current density is set to 20 A/dm2, and the temperature of the silver plating solution is set to 25 degrees C., a silver plating film of 5 μm can be obtained. An appropriate temperature of the silver plating solution is a temperature in the vicinity of 25 degrees C. If a silver plating film is formed at an inappropriate temperature, there is a possibility of a reduction in film forming speed, decomposition of the silver plating solution, generation of defects in the silver plating film, or occurrence of roughness on the silver plating film, for example.
For the silver plating solution used in the plating step, a known plating solution for silver plating is used. The known plating solution for silver plating is a plating solution the pH of which is adjusted to 7 by use of, as metal salts, silver ion of 1 wt % to 5 wt %, potassium iodide of 30 wt % to 40 wt %, and methanesulfonic acid of 1 wt % to 5 wt %, for example. Alternatively, the known plating solution for silver plating is a plating solution that is adjusted by use of, as metal salts, silver ion of 3 wt % to 15 wt %, free cyanide of 5 wt % to 15 wt %, and potassium carbonate of 2 wt % to 7 wt %. Note that “wt %” denotes a value relative to the entire adjusted solution.
In the plating step, first, the object to be plated 200 is fixed, and the plating electrode 100 is held by use of the operation mechanism not shown in the drawing and connected to the holder 8. At this point of operation, the plating electrode 100 is kept away from the object to be plated 200.
Next, the contact pressure of the plating-solution-impregnated fabric 1 that is caused to come into contact with the portion to be plated 200a is set. The contact pressure is adjusted such that the film thickness of a plating film to be formed at the portion to be plated 200a is at the target film thickness. It is preferable that the contact pressure be 0.25 kgf/cm2 to 2.0 kgf/cm2. The reason is that when the contact pressure is less than 0.25 kgf/cm2, burning of a silver plating film is likely to occur, which causes the problem of failing in obtaining a good plating film. Further, when the contact pressure is higher than 2.0 kgf/cm2, a precipitated plating film is worn by the plating-solution-impregnated fabric 1, preventing growth of the plating film, which causes the problem of failing in obtaining the target plating thickness.
After the contact pressure of the plating electrode 100 against the object to be plated 200 is set, the motor 6 is driven to rotate the second rotary part 4. With such an operation, it is possible to cause the plating-solution-impregnated fabric 1 to turn in the annular direction via the annular part 2, which turns in the annular direction in synchronization with the second rotary part 4.
Next, the DC conversion power supply 5 is brought into an on state from an off state while a turning state in which the plating-solution-impregnated fabric 1 turns is maintained. After the DC conversion power supply 5 is brought into an on state, the operation mechanism not shown in the drawing is operated to move the holder 8, thereby causing the plating-solution-impregnated fabric 1 to come into contact with the portion to be plated 200a at a set contact pressure. An electric current starts to be transmitted through the plating-solution-impregnated fabric 1 at the moment when the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200a. By causing the plating-solution-impregnated fabric 1 to slide against the portion to be plated 200a in such a state, silver plating treatment is performed. The plating time period may be 30 seconds, for example. The plating time period is suitably determined depending on the target plating film thickness. It is preferable that the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min. The reason is that, in the silver plating, when the sliding speed is less than 12.5 m/min, burning of a plating film occurs, which causes the problem of failing in obtaining a good plating film. Further, when the sliding speed is more than 17.5 m/min, a large amount of wear occurs between a precipitated plating film and the plating-solution-impregnated fabric 1, preventing growth of the plating film, which causes the problem of failing in obtaining the target plating thickness.
Provided that an electric current is transmitted through the plating-solution-impregnated fabric 1 while a turning state in which the plating-solution-impregnated fabric 1 turns is maintained, the above-mentioned procedure may be changed. For example, a configuration may be adopted in which, after the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200a, the plating-solution-impregnated fabric 1 is turned and, thereafter, the DC conversion power supply 5 is brought into an on state to transmit an electric current. However, when metal of a plating film has less ionization tendency than the object to be plated 200 as in the case in which silver plating treatment is performed on a copper alloy material, it is desirable to adopt a procedure in which the DC conversion power supply 5 is brought into an on state and, thereafter, the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200a. The reason is that a displacement plating film having a small close contact force is formed at a point of time when the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200a.
After the silver plating film is formed at the portion to be plated 200a, the operation mechanism not shown in the drawing is operated to move the plating electrode 100 by making use of the holder 8, thereby separating the plating-solution-impregnated fabric 1 from the object to be plated 200 as shown in
After each step ends, a water-washing step may be added in which the plating-solution-impregnated fabric 1 is immersed in pure water and, thereafter, is dried. By performing the water-washing step, it is possible to remove deteriorated treatment solution that is impregnated in the plating-solution-impregnated fabric 1.
The target for the plating treatment is not limited to a copper alloy material. Further, the kind of plating is not limited to silver plating. For example, the above-mentioned plating method is also applicable to formation of a plurality of plating layers, such as a case in which nickel plating is formed on an aluminum alloy material, which is the target for the plating treatment, and tin plating is further formed on the upper surface of the nickel plating.
In the above-mentioned plating method, electrolytic treatment is also applicable to the post treatment and the water-washing step performed after the degreasing step, the acid cleaning step, the neutralizing step, and the plating step are performed. For example, electrolytic treatment applied in the degreasing step is electrolytic degreasing. In this case, a degreasing solution is impregnated into the plating-solution-impregnated fabric 1 as a degreasing agent, and the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200a. When, in such a state, the anode of the DC conversion power supply 5 is connected to the rotary shaft 30 of the first rotary part 3, the cathode of the DC conversion power supply 5 is connected to the object to be plated 200, and the DC conversion power supply 5 is brought into an on state to transmit an electric current, cathode electrolytic treatment can be applied as the degreasing treatment. In contrast, when the cathode of the DC conversion power supply 5 is connected to the rotary shaft 30 of the first rotary part 3, the anode of the DC conversion power supply 5 is connected to the object to be plated 200, and the DC conversion power supply 5 is brought into an on state to transmit an electric current, anode electrolytic treatment can be applied as the degreasing treatment. In the case in which electrolytic treatment is applied to a step other than the plating step, it is not always necessary to cause the plating-solution-impregnated fabric 1 to slide against the portion to be plated 200a.
With the above-mentioned plating method, it is also possible to form the plating film 200b without using the annular part 2 by turning the plating-solution-impregnated fabric 1 by causing the plating-solution-impregnated fabric 1 to come into direct contact with the first rotary part 3 and the second rotary part 4. However, in this case, of the portion to be plated 200a, a portion in the vicinity of the first rotary part 3 that plays the role of an anode has a significantly higher current density than other portions and hence, there is a possibility that a normal plating film cannot be obtained and uniformity of a film thickness deteriorates. That is, interposing the annular part 2 can make current density distribution uniform, thereby improving uniformity of a film thickness.
As described above, the plating electrode 100 according to Embodiment 1 includes the plating-solution-impregnated fabric 1 formed into an annular shape, and the annular part 2 disposed inside the annular shape of the plating-solution-impregnated fabric 1 and provided in a state in which the outer surface of the annular part 2 is kept in close contact with the inner surface of the plating-solution-impregnated fabric 1, and the annular part 2 has conductivity. The plating electrode 100 according to Embodiment 1 also includes the first rotary part 3 provided inside the annular part 2, electrically connected to the annular part 2, and configured to be rotatable while ensuring conductivity, and the second rotary part 4 provided inside the annular part 2 and configured to rotate in synchronization with the driving of the motor 6. The anode of the DC conversion power supply 5 is electrically connected to the first rotary part 3, and the cathode of the DC conversion power supply 5 is electrically connected to the object to be plated 200. The annular part 2 is caused to turn in synchronization with the rotation of the first rotary part 3 and the second rotary part 4 to cause the plating-solution-impregnated fabric 1 to turn in the annular direction, thereby causing the plating-solution-impregnated fabric 1 to come into contact with and to slide against the portion to be plated 200a of the object to be plated 200.
Therefore, with the plating electrode 100 and the plating method according to Embodiment 1, the plating-solution-impregnated fabric 1 is caused to be in close contact with the annular part 2, which is electrically connected to the anode of the DC conversion power supply 5 via the first rotary part 3, and the plating-solution-impregnated fabric 1 slides while keeping in contact with the portion to be plated 200a of the object to be plated 200, which is electrically connected to the cathode of the DC conversion power supply 5, and hence, it is possible to form a plating film only at the portion to be plated 200a with which the plating-solution-impregnated fabric 1 comes into contact. Therefore, masking work, in which portions other than the portion to be plated are protected by a masking material, is not required, and it is possible to selectively form a plating film only on the surface of the portion of the object to be plated 200.
The annular part 2 has a mesh shape. The first rotary part 3 includes the protruding portions 32, and the second rotary part 4 includes the protruding portions 42, and the protruding portions 32 and 42 each have a smaller width than the width of the openings of the annular part 2. The protruding portions 32 and 42 fit into the openings of the annular part 2 when the first rotary part 3 and the second rotary part 4 rotate. Therefore, it is possible to generate a frictional force between the annular part 2 and the first rotary part 3 and between the annular part 2 and the second rotary part 4 and hence, the annular part 2 can be turned in the annular direction in synchronization with the rotation of the first rotary part 3 and the second rotary part 4.
The plating-solution-impregnated fabric 1 includes the folded-back portions 1a obtained by folding back the edges of the annular shape of the plating-solution-impregnated fabric 1. The folded-back portions 1a are hooked on the edges of the annular shape of the annular part 2, and are fixed by the fixing parts 20. Therefore, the plating-solution-impregnated fabric 1 can be surely caused to be in close contact with the annular part 2.
The plating electrode 100 according to Embodiment 1 further includes the plating solution supplier 7 disposed on a turning path along which the plating-solution-impregnated fabric 1 turns, and the plating solution supplier 7 is configured to supply the plating solution 70 to the plating-solution-impregnated fabric 1. Therefore, in the plating electrode 100 and the plating method according to Embodiment 1, the plating solution 70 can be supplied to the plating-solution-impregnated fabric 1 while plating treatment is performed. Accordingly, a shortage of the plating solution 70 in the plating-solution-impregnated fabric 1 can be averted so that a loss of quality of a plating film is averted.
Next, modification 1 of the plating method according to Embodiment 1 will be described with reference to
Next, in step S103, the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance. When the controller 81 determines that the measured value measured by the load measurer 82 is not less than or equal to the lower limit value set in advance, the controller 81 advances to step S104 where the plating electrode 100 is moved toward the object to be plated 200 by controlling the operation mechanism 80 to adjust the contact pressure. Then, the controller 81 returns again to step S103 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
When the controller 81 determines in step S103 that the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance, the controller 81 advances to step S105. In step S105, the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance. When the controller 81 determines that the measured value measured by the load measurer 82 is not more than or equal to the upper limit value set in advance, the controller 81 advances to step S106 where the plating electrode 100 is moved away from the object to be plated 200 by controlling the operation mechanism 80 to adjust the contact pressure. Then, the controller 81 returns again to step S105 where the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance.
When the controller 81 determines in step S105 that the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance, the controller 81 advances to step S107. In step S107, the controller 81 determines whether the plating time period has elapsed for the target time period set in advance. When the controller 81 determines that the plating time period has not elapsed for the target time period set in advance, the controller 81 returns again to step S103 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance. In contrast, when the controller 81 determines in step S107 that the plating time period has elapsed for the target time period set in advance, the controller 81 advances to step S108 where the controller 81 causes driving of the motor 6 to stop to end the turning of the plating-solution-impregnated fabric 1.
Next, modification 2 of the plating method according to Embodiment 1 will be described with reference to
The operation mechanism 80 of modification 2 is formed to include a grip portion that can be manually operated by the operator, and the holder 8 is gripped at the grip portion. Although a load cell, for example, is preferably used as the load measurer 82, other configurations may be adopted. The notifier 83 is controlled by the controller 81 on the basis of the measured value measured by the load measurer 82. The notifier 83 may be a lamp, a buzzer, or a vibration, for example. In the case in which the notifier 83 is a lamp, a notification is issued by turning on or blinking the lamp. In the case in which the notifier 83 is a buzzer, a notification is issued by buzzer sound. In the case in which the notifier 83 is a vibration, a notification is issued by vibrations. The notifier 83 may be configured to display the contact pressure as a numerical value.
Next, in step S203, the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance. When the controller 81 determines that the measured value measured by the load measurer 82 is not less than or equal to the lower limit value set in advance, the controller 81 advances to step S204 where the controller 81 causes the lamp, which is the notifier 83, to blink to notify that the contact pressure is not at the target contact pressure. Then, the controller 81 returns again to step S203 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
When the controller 81 determines in step S203 that the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance, the controller 81 advances to step S205. In step S205, the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance. When the controller 81 determines that the measured value measured by the load measurer 82 is not more than or equal to the upper limit value set in advance, the controller 81 advances to step S206 where the controller 81 causes the lamp, which is the notifier 83, to blink to notify that the contact pressure is not at the target contact pressure. Then, the controller 81 returns again to step S205 where the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance.
When the controller 81 determines in step S205 that the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance, the controller 81 advances to step S207. In step S205, to notify that the contact pressure of the plating electrode 100 that is caused to come into contact with the portion to be plated 200a is at the target contact pressure, the controller 81 causes the lamp, which is the notifier 83, to be turned on. With such a configuration, the operator can be notified that the contact pressure of the plating-solution-impregnated fabric 1 that is caused to come into contact with the portion to be plated 200a is at the target contact pressure.
Next, the controller 81 advances to step S208 where the controller 81 determines whether the plating time period has elapsed for the target time period set in advance. When the controller 81 determines that the plating time period has not elapsed for the target time period set in advance, the controller 81 returns again to step S203 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance. In contrast, when the controller 81 determines in step S208 that the plating time period has elapsed for the target time period set in advance, the controller 81 advances to step S209 where the controller 81 causes driving of the motor 6 to stop to end the turning of the plating-solution-impregnated fabric 1.
It is not always necessary to provide the notifier 83. In this case, the plating electrode 100 is caused to come into contact with the portion to be plated 200a by the operator as follows. The operator operates the operation mechanism 80 while observing the measured value from the load measurer 82 to achieve a proper contact pressure.
Next, modification 3 of the plating method according to Embodiment 1 will be described with reference to
Next, in step S302, the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200a of the object to be plated 200 by controlling the operation mechanism 80. The operation mechanism 80 may be formed to include the arm of a robot or other mechanism, or may be formed to include a grip portion that can be manually operated by the operator. Provided that an electric current is transmitted through the plating-solution-impregnated fabric 1 while a turning state in which the plating-solution-impregnated fabric 1 turns is maintained, step S301 and step S302 may be performed in the opposite order. That is, after the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200a of the object to be plated 200 by controlling the operation mechanism 80, the motor 6 may be driven to turn the plating-solution-impregnated fabric 1 in the annular direction.
Next, in step S303, the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance. When the controller 81 determines that the measured value measured by the rotation frequency measurer 84 is not less than or equal to the lower limit value set in advance, the controller 81 advances to step S304 where the controller 81 increases the rotation frequency of the motor 6 to increase the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200. Then, the controller 81 returns again to step S303 where the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance.
When the controller 81 determines in step S303 that the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance, the controller 81 advances to step S305. In step S305, the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is more than or equal to the upper limit value set in advance. When the controller 81 determines that the measured value measured by the rotation frequency measurer 84 is not more than or equal to the upper limit value set in advance, the controller 81 advances to step S306 where the controller 81 reduces the rotation frequency of the motor 6 to reduce the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200. Then, the controller 81 returns again to step S305 where the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is more than or equal to the upper limit value set in advance. With such operations, it is possible to maintain the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 at a constant value and hence, it is possible to prevent a loss of plating quality caused by a change in sliding speed.
When the controller 81 determines in step S305 that the measured value measured by the rotation frequency measurer 84 is more than or equal to the upper limit value set in advance, the controller 81 advances to step S307. In step S307, the controller 81 determines whether the plating time period has elapsed for the target time period set in advance. When the controller 81 determines that the plating time period has not elapsed for the target time period set in advance, the controller 81 returns again to step S303 where the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance. In contrast, when the controller 81 determines in step S307 that the plating time period has elapsed for the target time period set in advance, the controller 81 advances to step S308 where the controller 81 causes driving of the motor 6 to stop to end the turning of the plating-solution-impregnated fabric 1.
Next, a plating electrode 101 according to Embodiment 2 and a plating method that uses the plating electrode 101 will be described with reference to
The plating electrode 101 according to Embodiment 2 shown in
The movable contact group 9 and the tension adjuster 10 are disposed inside the annular part 2 together with the first rotary part 3 and the second rotary part 4. The movable contact group 9 are structured in which a plurality of first movable contacts 9a, each of which is formed by a cylindrical body, are arranged in parallel along the annular direction of the annular part 2 in which the annular part 2 rotates. In the case of the example shown in the drawing, the movable contact group 9 is formed by an aggregate of five first movable contacts 9a. The first movable contacts 9a are made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use. For example, the first movable contacts 9a are made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
The first movable contacts 9a are held by the holder 8, for example, such that the first movable contacts 9a are movable. The first movable contacts 9a can be moved toward an object to be plated 200 in the annular part 2. The movement of the first movable contacts 9a is controlled by a control unit not shown in the drawing. By moving the first movable contacts 9a, it is possible to push the plating-solution-impregnated fabric 1 against a portion to be plated 200a such that the annular part 2 is located between the first movable contacts 9a and the plating-solution-impregnated fabric 1. It is possible to either move all of the first movable contacts 9a of the movable contact group 9, or to move only some of the first movable contacts 9a of the movable contact group 9.
The movable contact group 9 is not limited to the aggregate of the five first movable contacts 9a. It is sufficient for the movable contact group 9 to include one or more first movable contacts 9a. The number of first movable contacts 9a may be suitably changed depending on the purpose of use and the shape of the object to be plated 200. The shape of the first movable contacts 9a is not limited to a cylindrical shape shown in the drawing. The first movable contacts 9a may have any shape provided that the first movable contacts 9a do not inhibit the turning of the annular part 2 and the plating-solution-impregnated fabric 1. For example, each first movable contact 9a may be formed by a cylindrical body having a smooth surface, a semi-cylindrical body, a prism, or a thin plate, or may be formed by a cylindrical body or a spherical body having a mechanism that rotates about a shaft. Alternatively, the first movable contact 9a may have a shape that conforms to the shape of the portion to be plated 200a. By adopting such a shape, it is possible to improve close contact between the plating-solution-impregnated fabric 1 and the portion to be plated 200a during plating treatment.
The tension adjuster 10 is provided to maintain the tension of the plating-solution-impregnated fabric 1 and the tension of the annular part 2 at constant values. The tension adjuster 10 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use. For example, the tension adjuster 10 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
The tension adjuster 10 has a cylindrical shape having a mechanism that rotates about a shaft portion. The tension adjuster 10 is disposed inside the annular part 2 in a state in which the outer surface of the cylindrical body is kept in contact with the inner surface of the annular part 2. The tension adjuster 10 may be formed by a cylindrical body having a smooth surface, a semi-cylindrical body, a prism, or a thin plate provided that the tension adjuster 10 does not inhibit the turning of the annular part 2 and the plating-solution-impregnated fabric 1. The number of tension adjusters 10 is not limited to one shown in the drawing, and may be suitably changed depending on the purpose of use and the shape of the object to be plated 200.
The tension adjuster 10 is held by the holder 8, for example, such that the tension adjuster 10 is movable. The movement of the tension adjuster 10 is controlled by a control unit not shown in the drawing. By moving the tension adjuster 10 together with the first movable contacts 9a at the time when the first movable contacts 9a are moved, it is possible to maintain the tension of the plating-solution-impregnated fabric 1 and the tension of the annular part 2 at constant values. Thus, when the first movable contacts 9a are moved, it is possible to prevent generation of an excessive tension in the plating-solution-impregnated fabric 1 and the annular part 2 and hence, breakage of the plating-solution-impregnated fabric 1 and the annular part 2 can be prevented. It is not always necessary to provide the tension adjuster 10. A configuration may be adopted in which the tension of the plating-solution-impregnated fabric 1 and the tension of the annular part 2 are maintained at constant values by moving either one of the first rotary part 3 or the second rotary part 4 or by moving both the first rotary part 3 and the second rotary part 4.
A configuration may be adopted in which the first movable contacts 9a are moved to the outside from the inside of the annular part 2 through the annular opening of the annular part 2. In the case in which some of the first movable contact 9a are unnecessary, it is possible to remove unnecessary first movable contacts 9a to prevent the unnecessary first movable contacts 9a from interfering with the other first movable contacts 9a. In the case in which the annular part 2 is not used, the tension adjuster 10 is caused to come into direct contact with the plating-solution-impregnated fabric 1.
Next, the plating method that uses the plating electrode 101 according to Embodiment 2 will be described. Also in the plating method of Embodiment 2, in the same manner as Embodiment 1, a degreasing step, an acid cleaning step, a neutralizing step, and a plating step are performed in this order. In Embodiment 2, a method for applying silver plating to a copper alloy material having high versatility as the target for plating treatment, will be described as an example.
Post treatment and a water-washing step performed after the degreasing step, the acid cleaning step, the neutralizing step, and the plating step are substantially equal to corresponding steps in Embodiment 1. Further, conditions for plating treatment, such as a silver plating solution, current density, a plating time period, and the turning of the plating-solution-impregnated fabric 1, are also substantially equal to corresponding conditions in Embodiment 1.
In the plating electrode 101 of Embodiment 2, by operating an operation mechanism not shown in the drawing to cause the plating-solution-impregnated fabric 1 to come into contact with the portion to be plated 200a in a state in which the movable contact group 9 is not in contact with the plating-solution-impregnated fabric 1 as shown in
In contrast, in the plating electrode 101 of Embodiment 2, by moving the movable contact group 9 as shown in
Each first movable contact 9a is configured to adjust the contact pressure of the plating-solution-impregnated fabric 1 against the portion to be plated 200a. The contact pressure is adjusted by a control unit, for example. With such a configuration, it is possible to allow a plating film formed at the portion to be plated 200a to have the target film thickness. It is preferable that the contact pressure be set to 0.25 kgf/cm2 to 2.0 kgf/cm2.
In the plating electrode 101, by turning the plating-solution-impregnated fabric 1 and by transmitting an electric current through the plating-solution-impregnated fabric 1 in a state in which the plating-solution-impregnated fabric 1 is caused to be in contact with the portion to be plated 200a, it is possible to form a silver plating film at the portion to be plated 200a. In the same manner as Embodiment 1, it is preferable that the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min.
After the silver plating film is formed at the portion to be plated 200a, the movable contact group 9 is moved to separate the plating-solution-impregnated fabric 1 from the object to be plated 200. Then, after post treatment is performed on the object to be plated 200 when necessary and a water-washing step is performed on the object to be plated 200, the silver plating film can be formed.
In the plating electrode 101, by electrically connecting the anode of the DC conversion power supply 5 to the movable contact group 9, electric resistance at the time when an electric current is transmitted can be reduced and hence, it is possible to ensure conduction between the anode and the cathode. The movable contact group 9 may be electrically connected to the anode of the DC conversion power supply 5 by use of, for example, a rotary connecting connector in which a rotary shaft and a rotary portion disposed on the periphery of the rotary shaft are electrically connected to each other. For the rotary connecting connector, a commercially available connector may be used in which conductivity of a rotary shaft and a rotary portion disposed on the periphery of the rotary shaft is ensured by use of, for example, a carbon brush, a mercury or gallium alloy, or a roller current collector.
The target for the plating treatment is not limited to a copper alloy material. Further, the kind of plating is not limited to silver plating. For example, the above-mentioned plating method is also applicable to formation of a plurality of plating layers, such as a case in which nickel plating is formed on an aluminum alloy material, which is the target for the plating treatment, and tin plating is further formed on the upper surface of the nickel plating. Although the plating electrode 101 is mainly used in the plating step, the plating electrode 101 may also be used in the degreasing step, the acid cleaning step, and the neutralizing step. The above-mentioned plating electrode 101 may also be used in the water-washing step performed between respective steps of the plating method.
As described above, the plating electrode 101 according to Embodiment 2 includes one or more first movable contacts 9a and one or more tension adjusters 10. The one or more first movable contacts 9a are disposed inside the annular part 2 and are configured to push the plating-solution-impregnated fabric 1 against the object to be plated 200 such that the annular part 2 is located between the one or more first movable contacts 9a and the plating-solution-impregnated fabric 1. The one or more tension adjusters 10 are disposed inside the annular part 2 such that the one or more tension adjusters 10 are movable and are configured to maintain the tension of the plating-solution-impregnated fabric 1 and the tension of the annular part 2 at constant values.
Accordingly, the plating electrode 101 according to Embodiment 2 and the plating method that uses the plating electrode 101 can freely change the region in and the position at which the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200a and hence, the plating electrode 101 according to Embodiment 2 and the plating method that uses the plating electrode 101 can accommodate a plurality of partial plating patterns.
In the plating electrode 101 shown in
Next, a plating electrode 102 according to Embodiment 3 and a plating method that uses the plating electrode 102 will be described with reference to
As shown in
The plating tank 71 is disposed in a turning path in which the plating-solution-impregnated fabric 1 turns. In the plating electrode 102 according to Embodiment 3, while plating treatment is performed, the plating-solution-impregnated fabric 1, which is turning, passes through the plating tank 71 so that the plating solution 70 is supplied to the plating-solution-impregnated fabric 1. The third rotary part 11 is disposed in the plating tank 71. The third rotary part 11 has a configuration identical to the configuration of the second rotary part 4. The third rotary part 11 is held by the holder 8, for example. The third rotary part 11 is provided inside the annular part 2, and the outer surface of a rotary body of the third rotary part 11 is in contact with the inner surface of the annular part 2.
In the plating electrode 102 according to Embodiment 3, in the turning path in which the plating-solution-impregnated fabric 1 turns, a pressure adjuster 12 is provided between the first rotary part 3 and the third rotary part 11, and a pressure adjuster 13 is provided between the second rotary part 4 and the third rotary part 11. The pressure adjusters 12 and 13 are held by the holder 8, for example. The pressure adjusters 12 and 13 are configured to apply adjusted pressure to the plating-solution-impregnated fabric 1 and the annular part 2, which are turning. The pressure adjuster 12, which is provided between the first rotary part 3 and the third rotary part 11, is disposed in the annular part 2, and is configured to apply a pressure toward the outside of the annular shape. The pressure adjuster 13, which is provided between the second rotary part 4 and the third rotary part 11, is disposed outside the annular shape of the plating-solution-impregnated fabric 1, and is configured to apply a pressure toward the inside of the annular shape. With such a configuration, it is possible to apply tension to the plating-solution-impregnated fabric 1 and hence, plating treatment can be preferably performed. Further, when the holder 8 is moved by use of an operation mechanism not shown in the drawing, it is possible to accommodate a change in tension of the plating-solution-impregnated fabric 1 and hence, breakage of the plating-solution-impregnated fabric 1 caused by an excessive tension can be prevented.
The operation mechanism is configured to adjust the contact pressure of the plating-solution-impregnated fabric 1 against the portion to be plated 200a. Thus, it is possible to allow a plating film formed at the portion to be plated 200a to have the target film thickness. It is preferable that the contact pressure be set to 0.25 kgf/cm2 to 2.0 kgf/cm2, for example.
In the plating electrode 102 according to Embodiment 3, as shown in
As described above, with the plating electrode 102 according to Embodiment 3 and the plating method that uses the plating electrode 102, plating treatment can be performed while the plating solution 70 is supplied to the plating-solution-impregnated fabric 1. Accordingly, it is unnecessary to additionally provide a step of immersing the plating-solution-impregnated fabric 1 in the plating solution 70 and hence, productivity can be improved. Further, a large amount of the plating solution 70 can be supplied to the plating-solution-impregnated fabric 1 and hence, it is possible to prevent plating defects, such as seizure, caused by a shortage of a plating solution. The configuration of the above-mentioned Embodiment 2 may be applied to the plating electrode 102 according to Embodiment 3 and the plating method that uses the plating electrode 102.
Next, a plating electrode 100 according to Embodiment 4 and a plating method that uses the plating electrode 100 will be described with reference to
The plating electrode 100 used in the plating method according to Embodiment 4 has a configuration identical to the configuration of the plating electrode 100 described in Embodiment 1. The plating method according to Embodiment 4 is performed in the case of forming a plating film 200b in a region A that is larger than the area of a portion to be plated 200a with which the plating-solution-impregnated fabric 1 comes into contact as shown in
In the plating electrode 100, an operation mechanism not shown in the drawing is operated to move the holder 8, thereby causing the plating-solution-impregnated fabric 1 brought into a turning state to come into contact with the portion to be plated 200a. An electric current starts to be transmitted through the plating-solution-impregnated fabric 1 at the moment when the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200a. In such a state, by operating the operation mechanism to move the plating-solution-impregnated fabric 1 such that the plating-solution-impregnated fabric 1 extends along the region A in which the plating film 200b is desired to be formed, it is possible to form the plating film 200b having an area larger than the area of the portion to be plated 200a with which the plating-solution-impregnated fabric 1 comes into contact.
It is preferable that the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min. The plating time period is calculated from current density, the target film thickness, the area in which the plating-solution-impregnated fabric 1 comes into contact with the object to be plated 200, and the area of the region A in which the plating film 200b is desired to be formed, for example, and the plating time period thus calculated is set. Specifically, the plating time period is set by use of the following relational expression (1).
t=(TvCdS)/(IsA) (1)
In the expression, “t” denotes the plating time period, “T” denotes the target film thickness, “v” denotes the valence of the plating metal ion, “C” denotes the Faraday constant, “d” denotes the density of plating metal, “S” denotes the area of the region A in which the plating film 200b is desired to be formed, “I” denotes current density, “s” denotes the area in which the plating-solution-impregnated fabric 1 comes into contact with the object to be plated 200, and “A” denotes the atomic weight of plating metal. Current density is obtained by dividing the electric current that flows at the time when a voltage is applied by the area in which the plating-solution-impregnated fabric 1 comes into contact with the object to be plated 200.
In the plating method according to Embodiment 4, in moving the plating-solution-impregnated fabric 1 along the region A by operating the operation mechanism, the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 changes at the time when the turning of the plating-solution-impregnated fabric 1 is started and at the time when the direction of the plating-solution-impregnated fabric 1 is changed. The sliding speed at which the plating-solution-impregnated fabric 1 is slid significantly affects plating quality. A change in sliding speed may lead to a loss of plating quality.
In view of the above, the turning speed at which the plating-solution-impregnated fabric 1 turns is changed by changing the rotation frequency of the motor 6 according to a change in the moving speed at which the plating electrode 100 is moved caused by the operation of the operation mechanism. As a result, it is possible to maintain the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 at a constant value and hence, plating quality can be stabilized. In the case in which the moving speed at which the plating electrode is moved reduces by 1 m/min, for example, by exercising control such that the turning speed at which the plating-solution-impregnated fabric 1 turns is increased by 1 m/min, it is possible to prevent a reduction in sliding speed. Further, by rotating the plating electrode 100 with the operation mechanism by use of, as the axis, the vertical direction to the region A in which the plating film 200b is desired to be formed, it is possible to change the sliding direction in which the plating-solution-impregnated fabric 1 is slid. By changing the sliding direction in which the plating electrode 100 is slid at fixed time intervals as described above, anisotropy of the plating film resulting from the sliding direction can be reduced, thereby preventing variation in quality of plating films.
After the plating film is formed at the portion to be plated 200a, the operation mechanism is operated to move the holder 8, thereby separating the plating-solution-impregnated fabric 1 from the object to be plated 200. Then, after post treatment is performed on the object to be plated 200 when necessary and water-washing step is performed on the object to be plated 200, the plating film 200b can be obtained.
The region A in which the plating film 200b is desired to be formed is not limited to a rectangular shape shown in
The configuration of the above-mentioned Embodiment 3 may be applied to Embodiment 4. In this case, by also moving the plating tank 71 provided in the path in which the plating-solution-impregnated fabric 1 turns in conjunction with the plating electrode 100, it is possible to prevent a change in tension of and damage to the plating-solution-impregnated fabric 1.
As described above, with the plating electrode 100 according to Embodiment 4 and the plating method, one plating electrode 100 can accommodate a case in which the plating film 200b is formed in the region A larger than the area of the portion to be plated 200a with which the plating-solution-impregnated fabric 1 comes into contact. Accordingly, it is unnecessary to prepare a plurality of plating electrodes and hence, a reduction in space and the omission of the step of exchanging the plating electrode 100 can be achieved, thereby improving productivity.
Further, the turning speed at which the plating-solution-impregnated fabric 1 turns is adjusted by controlling the rotation frequency of the second rotary part 4 such that the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 is maintained at a constant value and hence, it is possible to prevent a loss of plating quality caused by a change in sliding speed.
Next, a plating electrode 103 according to Embodiment 5 and a plating method that uses the plating electrode 103 will be described with reference to
As shown in
The plating-solution-impregnated fabric 1 of the plating electrode 103 shown in
In the plating electrode 103 shown in
In the plating method shown in
The operation mechanism for the plating electrode 103 according to Embodiment 5 shown in
In the plating electrode 103 according to Embodiment 5 shown in
As described above, with the plating electrode 103 according to Embodiment 5 and the plating method that uses the plating electrode 103, plating treatment can be performed while the plating solution 70 is supplied to the plating-solution-impregnated fabric 1. Accordingly, it is unnecessary to additionally provide a complicated step of supplying the plating solution 70 to the plating-solution-impregnated fabric 1 and a large amount of the plating solution 70 can be supplied to the plating-solution-impregnated fabric 1 and hence, it is possible to prevent plating defects, such as seizure, caused by a shortage of the plating solution 70. Further, separation of the plating solution 70 adhering to the object to be plated 200 can be promoted by gravity action and hence, it is possible to reduce the amount of the plating solution 70 taken to the next step. The plating tank 71 is located below the plating electrode 103 and hence, it is possible to easily collect the separated plating solution 70 and hence, a loss of the plating solution 70 can be kept to a minimum possible. In the plating method shown in
The configurations of the above-mentioned Embodiments 1 to 4 may be applied to the plating electrode 103 according to Embodiment 5 and the plating method that uses the plating electrode 103. In the case in which the plating method shown in
The plating electrodes (100, 101, 102, 103) and the plating methods that use the plating electrodes (100, 101, 102, 103) have been described above with reference to Embodiments. However, the plating electrodes (100, 101, 102, 103) are not limited to the configurations of the above-described Embodiments. For example, the plating electrodes (100, 101, 102, 103) shown in the drawing are merely examples, and may include other constituent elements. In short, the plating electrodes (100, 101, 102, 103) include variations to which design changes or applications are normally added by those who are skilled in the art without departing from the technical concept.
1: plating-solution-impregnated fabric, 1a: folded-back portion, 2: annular part, 2a: edge, 3: first rotary part, 4: second rotary part, 5: DC conversion power supply, 5a, 5b: conductive wire, 6: motor, 7: plating solution supplier, 8: holder, 9: movable contact group, 9a: first movable contact, 9b: second movable contact, 10: tension adjuster, 11: third rotary part, 12, 13: pressure adjuster, 20: fixing part, 30: rotary shaft, 31: rotary body, 32: protruding portion, 40: rotary shaft, 41: rotary body, 42: protruding portion, 70: plating solution, 71: plating tank, 72: solution scattering prevention wall, 80: operation mechanism, 81: controller, 82: load measurer, 83: notifier, 84: rotation frequency measurer, 100, 101, 102, 103: plating electrode, 200: object to be plated, 200a: portion to be plated, 200b: plating film
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-071550 | Apr 2021 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2022/017104 | 4/5/2022 | WO |
