Process control or regulation

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CPC
C25D21/12

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D21/00Processes for servicing or operating cells for electrolytic coating

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C25D21/12Process control or regulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
TSV process window and fill performance enhancement by long pulsing...
- Patent number 12,305,307
- Issue date May 20, 2025
- Lam Research Corporation
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Coating system and method for e-coating and degasification of e-coa...
- Patent number 12,305,308
- Issue date May 20, 2025
- Tesla, Inc.
- Gunjan Agarwal
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus for plating and method of controlling apparatus for plating
- Patent number 12,297,555
- Issue date May 13, 2025
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical methods, devices and compositions
- Patent number 12,286,720
- Issue date Apr 29, 2025
- Iontra Inc
- Daniel A. Konopka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems for updating target maps including considerations of rotati...
- Patent number 12,257,784
- Issue date Mar 25, 2025
- FABRIC8LABS, INC.
- David Pain
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrochemical-deposition system, apparatus, and method using opti...
- Patent number 12,252,801
- Issue date Mar 18, 2025
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseal edge exclusion engineering to maintain material integrity a...
- Patent number 12,247,310
- Issue date Mar 11, 2025
- Lam Research Corporation
- Justin Oberst
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating process method
- Patent number 12,247,311
- Issue date Mar 11, 2025
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for electrochemical additive manufacturing of parts
- Patent number 12,227,862
- Issue date Feb 18, 2025
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for electrochemical process
- Patent number 12,227,866
- Issue date Feb 18, 2025
- Yuming Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 12,221,712
- Issue date Feb 11, 2025
- Ebara Corporation
- Shigeyuki Nakahama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for creating a chromium-plated surface with a matte finish
- Patent number 12,221,717
- Issue date Feb 11, 2025
- Kings Mountain International, Inc
- Jordi Reichert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface processing system
- Patent number 12,216,739
- Issue date Feb 4, 2025
- Nippon Telegraph and Telephone Corporation
- Yuichi Okabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanofiltration for wafer rinsing
- Patent number 12,209,325
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- John L. Klocke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Meniscus-confined three-dimensional electrodeposition
- Patent number 12,202,193
- Issue date Jan 21, 2025
- Ramot at Tel-Aviv University Ltd.
- David Eliyahu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wafer immersion in semiconductor processing chambers
- Patent number 12,188,144
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- John L. Klocke
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus
- Patent number 12,180,606
- Issue date Dec 31, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition system including optical probes
- Patent number 12,180,607
- Issue date Dec 31, 2024
- Lam Research Corporation
- Andrew James Pfau
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of adjusting plating module
- Patent number 12,163,244
- Issue date Dec 10, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 12,157,949
- Issue date Dec 3, 2024
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating and deplating currents for material co-planarity in semicon...
- Patent number 12,146,235
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic device including metal housing
- Patent number 12,150,263
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Jongsu Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical treatment system
- Patent number 12,139,809
- Issue date Nov 12, 2024
- Corrdesa, LLC
- Alan Rose
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and cleaning method of contact member of plating...
- Patent number 12,134,833
- Issue date Nov 5, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip component production method
- Patent number 12,125,618
- Issue date Oct 22, 2024
- Koa Corporation
- Yasushi Akahane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for continuous electrochemical production of t...
- Patent number 12,123,101
- Issue date Oct 22, 2024
- ADDIONICS IL LTD
- Moshiel Biton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SETTING FORWARD/BACKWARD MOVEMENT RECIPE FOR SHIELDING B...
- Publication number 20250163601
- Publication date May 22, 2025
- EBARA CORPORATION
- Masayuki FUJIKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING OF P...
- Publication number 20250163598
- Publication date May 22, 2025
- FABRIC8LABS, INC.
- David Pain
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
JERK ELECTROLYTIC PROCESSING APPARATUS
- Publication number 20250154678
- Publication date May 15, 2025
- National Taiwan Normal University
- Shun-Tong Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE STATE MEASUREMENT DEVICE, PLATING APPARATUS, AND SUBSTRAT...
- Publication number 20250146952
- Publication date May 8, 2025
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR DETERMINING THE HEIGHT OF A FOAM BLANKET ON AN ELECTROPL...
- Publication number 20250146168
- Publication date May 8, 2025
- Atotech Deutschland GmbH & Co. KG
- Thorsten ROSS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20250146167
- Publication date May 8, 2025
- EBARA CORPORATION
- Ryosuke HIWATASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING TH...
- Publication number 20250137155
- Publication date May 1, 2025
- Nan Ya Plastics Corporation
- Te-Chao LIAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Anode Array and Controller for Electrochemical Layer Deposition
- Publication number 20250122638
- Publication date Apr 17, 2025
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES
- Publication number 20250122639
- Publication date Apr 17, 2025
- LAM RESEARCH CORPORATION
- Andrew James PFAU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MENISCUS-CONFINED THREE-DIMENSIONAL ELECTRODEPOSITION
- Publication number 20250108558
- Publication date Apr 3, 2025
- Ramot at Tel Aviv University Ltd.
- David Eliyahu
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Determining Distance from Printheads in Electrochemical-Additive Ma...
- Publication number 20250109519
- Publication date Apr 3, 2025
- FABRIC8LABS, INC.
- Justin Pierce
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PLATING AND APPARATUS FOR PLATING
- Publication number 20250075364
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Yasuyuki MASUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20250051951
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20250051955
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20250051953
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrochemical Layer Deposition by Anode Array Using Measurement I...
- Publication number 20250043453
- Publication date Feb 6, 2025
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF MOLYBDENUM DISULFIDE DRY FILM LUBRICANT COATINGS
- Publication number 20250027223
- Publication date Jan 23, 2025
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Adam Paul Rabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20250011966
- Publication date Jan 9, 2025
- EBARA CORPORATION
- Kazuhito TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR ANODISING AN INNER SURFACE OF A TUBE
- Publication number 20250003107
- Publication date Jan 2, 2025
- Carrier Corporation
- Ian Robinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for Electrochemical Treatment and Method Thereof
- Publication number 20240417879
- Publication date Dec 19, 2024
- QUAKER CHEMICAL CORPORATION
- Danijela Milosevic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR COLORIZING ALUMINUM-CONTAINING OBJECT AND COLORIZED ALUM...
- Publication number 20240384431
- Publication date Nov 21, 2024
- Jabil Circuit (Singapore) Pte. Ltd.
- Yi-Chung Su
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240368800
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Shigeyuki NAKAHAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF ELECTROCHEMICAL PLATING
- Publication number 20240360585
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEM AND METHOD OF PLATING WAFER
- Publication number 20240360584
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COUNTER-ELECTRODE FOR ELECTROCHEMICAL METHOD WITH AUTOMATIC ADAPTAT...
- Publication number 20240344232
- Publication date Oct 17, 2024
- Centre de Recherches Métallurgiques ASBL - Centrum voor Research in de Metall...
- Nicolas NUTAL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...
- Publication number 20240337628
- Publication date Oct 10, 2024
- ECI Technology, Inc.
- Jake Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Dynamic Glass Element Using Reversible Metal Electrodeposition Elec...
- Publication number 20240329480
- Publication date Oct 3, 2024
- The Board of Regents of the Nevada System of Higher Education, on behalf of t...
- Christopher J. Barile
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Process control or regulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

TSV process window and fill performance enhancement by long pulsing...

Coating system and method for e-coating and degasification of e-coa...

Apparatus for plating and method of controlling apparatus for plating

Electrochemical methods, devices and compositions

Systems for updating target maps including considerations of rotati...

Electrochemical-deposition system, apparatus, and method using opti...

Lipseal edge exclusion engineering to maintain material integrity a...

Plating apparatus and plating process method

Wafer shielding for prevention of lipseal plate-out

Methods for electrochemical additive manufacturing of parts

Systems and methods for electrochemical process

Plating apparatus

Plating method and plating apparatus

Method for creating a chromium-plated surface with a matte finish

Surface processing system

Nanofiltration for wafer rinsing

Meniscus-confined three-dimensional electrodeposition

Wafer immersion in semiconductor processing chambers

Semiconductor manufacturing apparatus, failure prediction method fo...

Plating apparatus

Electrochemical deposition system including optical probes

Method of adjusting plating module

Plating method, insoluble anode for plating, and plating apparatus

Cross flow conduit for foaming prevention in high convection platin...

Plating and deplating currents for material co-planarity in semicon...

Electronic device including metal housing

Electrochemical treatment system

Plating apparatus and cleaning method of contact member of plating...

Chip component production method

Method and apparatus for continuous electrochemical production of t...

Patents Applicationslast 30 patents

METHOD FOR SETTING FORWARD/BACKWARD MOVEMENT RECIPE FOR SHIELDING B...

SYSTEMS AND METHODS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING OF P...

JERK ELECTROLYTIC PROCESSING APPARATUS

SUBSTRATE STATE MEASUREMENT DEVICE, PLATING APPARATUS, AND SUBSTRAT...

METHOD FOR DETERMINING THE HEIGHT OF A FOAM BLANKET ON AN ELECTROPL...

PLATING APPARATUS

CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING TH...

Anode Array and Controller for Electrochemical Layer Deposition

ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES

MENISCUS-CONFINED THREE-DIMENSIONAL ELECTRODEPOSITION

Determining Distance from Printheads in Electrochemical-Additive Ma...

METHOD OF PLATING AND APPARATUS FOR PLATING

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

METHOD OF ADJUSTING PLATING MODULE

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

Electrochemical Layer Deposition by Anode Array Using Measurement I...

ELECTRODEPOSITION OF MOLYBDENUM DISULFIDE DRY FILM LUBRICANT COATINGS

PLATING METHOD AND PLATING APPARATUS

APPARATUS AND METHOD FOR ANODISING AN INNER SURFACE OF A TUBE

System for Electrochemical Treatment and Method Thereof

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

METHOD FOR COLORIZING ALUMINUM-CONTAINING OBJECT AND COLORIZED ALUM...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

PLATING APPARATUS

METHODS OF ELECTROCHEMICAL PLATING

PLATING SYSTEM AND METHOD OF PLATING WAFER

COUNTER-ELECTRODE FOR ELECTROCHEMICAL METHOD WITH AUTOMATIC ADAPTAT...

QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...

Dynamic Glass Element Using Reversible Metal Electrodeposition Elec...

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...