IBM® is a registered trademark of International Business Machines Corporation, Armonk, N.Y., U.S.A. Other names used herein may be registered trademarks, trademarks or product names of International Business Machines Corporation or other companies.
1. Field of the Invention
The present invention relates to heat sinks for electronic devices, and more particularly, to improved heat sink arrangements in enclosed housings.
2. Description of Background
The use of heat sinks for electronic devices is well known. Typically, a heat sink is arranged proximate to a heat generating electronic component such as a processor within a server. Heat generated by processor is transferred to the heat sink and then dissipated from the heat sink to the surrounding air. One type of heat sink includes a metallic base plate. Heat dissipating fins extend from the base plate to increase the surface area of the heat sink. Heat transferred from the component to the base plate is spread throughout the base plate and the fins.
As the operational speed and power density of a processor is increased, heat transfer from the processor to the surrounding environment becomes more and more critical for maintaining proper operation of the processor. To further facilitate the dissipation of heat from the processor, a fan can be used to circulate air about outer surfaces of the fins and the base plate. However, in many system applications such as computer servers, space is at a premium. A fan or other air circulation device occupies space that may be needed for media access, cable ingress and egress, or performing periodic maintenance activities. Moreover, fans and air circulation devices generate noise which may be annoying or distracting in many system applications. Meeting the increased heat transfer needs of more powerful processors adds to the challenge of cooling new processor technology. What is needed is an improved heat sink design that is capable of moving a volume of air sufficient to cool processor and other heat sinks within a server or other electronic equipment. The improved heat sink design should not occupy areas required for cable routing, media access, or maintenance activities, and should not generate undesired noise.
The shortcomings of the prior art are overcome and additional advantages are provided in the form of a heat sink including one or more vented pipes for directing air through a plurality of enclosed chambers formed by a plurality of fins in an enclosed structure having at least a first side and a second side. An air inlet in the first side of the enclosed structure allows pressurized air to enter the plurality of enclosed chambers through the one or more vented pipes. An air outlet in the first side of the enclosed structure allows pressurized air to exit the plurality of enclosed chambers through the one or more vented pipes.
Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with advantages and features, refer to the description and to the drawings.
As a result of the summarized invention, technically we have achieved a solution wherein pressurized air is directed through a plurality of vented pipes in an enclosed heat sink structure and across a plurality of fins in the enclosed heat sink structure so as to dissipate thermal energy, and so as to provide enhanced noise abatement relative to fan-cooled designs.
The subject matter, which is regarded as the invention, is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
Like reference numerals are used to refer to like elements throughout the drawings. The detailed description explains the preferred embodiments of the invention, together with advantages and features, by way of example with reference to the drawings.
Air exits one or more vent holes in first vented pipe 307 and second vented pipe 321, circulates in proximity to fins 302, 301, and 303, and enters one or more vent holes in a third vented pipe 311. Likewise, air exits one or more vent holes in third vented pipe 311, circulates in proximity to fins 303, 301, and 304, and enters one or more vent holes in a fourth vented pipe 309 and one or more holes in a fifth vented pipe 319. Air then exits one or more vent holes in fourth vented pipe 309 and the one or more vent holes in fifth vented pipe 319, circulates in proximity to fins 304, 301, 305 and enters one or more vent holes in a sixth vented pipe 313. Air then exits one or more vent holes in sixth vented pipe 313, circulates in proximity to fins 305, and 301, and enters one or more vent holes in a seventh vented pipe 322. In the example of
Air exits one or more vent holes in seventh vented pipe 322, circulates in proximity to fins 301, 305, and enters one or more vent holes in an eighth vented pipe 312. Air exits one or more vent holes in eighth vented pipe 312, circulates in proximity to fins 305, 301, 304, and enters one or more vent holes in a ninth vented pipe 316. Air exits one or more vent holes in ninth vented pipe 316, circulates in proximity to fins 304, 301, 303, and enters one or more vent holes in a tenth vented pipe 310. Air exits one or more vent holes in tenth vented pipe 310, circulates in proximity to fins 303, 301, 302, and enters one or more vent holes in an eleventh vented pipe 306. Air exits one or more vent holes in eleventh vented pipe 306, circulates in proximity to fins 302, 301, and enters one or more vent holes of a vented outlet pipe 118. Air then exits from air outlet 117 of vented outlet pipe 118.
Pressurized air enters first chamber 335 from vented inlet pipe 119. Air exits first chamber 335 from first and second vented pipes 307 and 321. Air enters second chamber 336 from first and second vented pipes 307 and 321, and air exits second chamber 336 from third vented pipe 311 and a twelfth vented pipe 315 not visible in
Air enters fifth chamber 339 (
The diagrams depicted herein present illustrative examples. There may be many variations to these diagrams or the steps (or operations) described therein without departing from the spirit and scope of the invention. For instance, a different number of fins, vented pipes, and vent holes may be provided other than what is shown in
While the preferred embodiment to the invention has been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.