Claims
- 1. A polished-piece holder of a laminated structure, comprising:a core layer; and a surface layer laminatedly formed on at least one of front and rear surfaces of said core layer and exhibiting wear resistance; said surface layer being constituted by a thermosetting resin impregnated fibrous layer; said thermosetting resin impregnated fibrous layer being formed by subjected a prepreg to heating and pressurizing; said prepreg being made by impregnating a nonwoven aramid fiber substrate with thermosetting resin, said nonwoven aramid fiber substrate having a para-aramid fiber content of 17% by weight or more.
- 2. A polished-piece holder as defined in claim 1, wherein said surface layer is laminated on each of said front and rear surfaces of said core layer.
- 3. A polished-piece holder as defined in claim 2, wherein said thermosetting resin is epoxy resin.
- 4. A polished-piece holder as defined in claim 2, wherein said thermosetting resin is flexible epoxy resin which exhibits flexibility after curing.
- 5. A polished-piece holder as defined in claim 1, wherein said core layer is constituted of at least one thermosetting resin impregnated fibrous layer;said thermosetting resin impregnated fibrous layer being formed by subjecting a prepreg made by impregnating a woven glass fiber substrate with thermosetting resin to heating and pressurizing.
- 6. A polished-piece holder as defined in claim 5, wherein said thermosetting resin, which is impregnated into the fibrous layer forming said surface layer and the fibrous layer forming said core layer, respectively, is epoxy resin.
- 7. A polished-piece holder as defined in claim 5, wherein said thermosetting resin, which is impregnated into the fibrous layer forming said surface layer and the fibrous layer forming said core layer, respectively, is flexible epoxy resin which exhibits flexibility after curing.
- 8. A polished-piece holder as defined in claim 1, wherein said core layer is constituted of at least one thermosetting resin impregnated fibrous layer;said thermosetting resin impregnated fibrous layer being formed by subjecting a prepreg made by impregnating a polyester fiber substrate with thermosetting resin to heating and pressurizing.
- 9. A polished-piece holder as defined in claim 8, wherein said polyester fiber substrate is a woven fabric.
- 10. A polished-piece holder as defined in claim 8, wherein said thermosetting resin, which is impregnated into the fibrous layer forming said surface layer and the fibrous layer forming said core layer, respectively, is epoxy resin.
- 11. A polished-piece holder as defined in claim 8, wherein said thermosetting resin, which is impregnated into the fibrous layer forming said surface layer and the fibrous layer forming said core layer, respectively, is flexible epoxy resin which exhibits flexibility after curing.
- 12. A polished-piece holder as defined in claim 1, wherein said core layer is constituted of at least one thermosetting resin impregnated fibrous layer;said thermosetting resin impregnated fibrous layer being formed by subjecting a prepreg made by impregnating a nonwoven aramid fiber substrate with thermosetting resin to heating and pressurizing.
- 13. A polished-piece holder as defined in claim 12, wherein said thermosetting resin, which is impregnated into the fibrous layer forming said surface layer and the fibrous layer forming said core layer, respectively, is epoxy resin.
- 14. A polished-piece holder as defined in claim 12, wherein said thermosetting resin, which is impregnated into the fibrous layer forming said surface layer and the fibrous layer forming said core layer, respectively, is flexible epoxy resin which exhibits flexibility after curing.
- 15. A polished-piece holder as defined in claim 1, wherein said thermosetting resin is epoxy resin.
- 16. A polished-piece holder as defined in claim 1, wherein said thermosetting resin is flexible epoxy resin which exhibits flexibility after curing.
- 17. A polished-piece holder as defined in claim 1, wherein said para-aramid fiber is poly-p-phenylenediphenyl ether terephthalamide.
Priority Claims (3)
Number |
Date |
Country |
Kind |
9-286505 |
Oct 1997 |
JP |
|
10-46844 |
Feb 1998 |
JP |
|
10-150840 |
Jun 1998 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATION
The present application is a division of application Ser. No. 09/152,823 filed Sep. 14, 1998, now U.S. Pat. No. 6,291,373.
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5484647 |
Nakatani et al. |
Jan 1996 |
A |
6291373 |
Sakaguchi et al. |
Sep 2001 |
B1 |
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