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B24B37/28
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PERFORMING OPERATIONS TRANSPORTING
B24
Grinding technology
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
B24B37/00
Lapping machines or devices Accessories
Current Industry
B24B37/28
for double side lapping of plane surfaces
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Patents Grants
last 30 patents
Information
Patent Grant
Double-side or one-side machine tool
Patent number
12,318,883
Issue date
Jun 3, 2025
Lapmaster Wolters GmbH
Hans-Peter Boller
B24 - GRINDING POLISHING
Information
Patent Grant
Glass article and method of producing glass article
Patent number
12,263,555
Issue date
Apr 1, 2025
AGC Inc.
Toru Momose
B24 - GRINDING POLISHING
Information
Patent Grant
Glass article and method of producing glass article
Patent number
11,969,857
Issue date
Apr 30, 2024
AGC Inc.
Toru Momose
B24 - GRINDING POLISHING
Information
Patent Grant
Double-sided wafer polishing method
Patent number
11,772,231
Issue date
Oct 3, 2023
Sumco Corporation
Shunsuke Mikuriya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of double-side polishing semiconductor wafer
Patent number
11,731,234
Issue date
Aug 22, 2023
Sumco Corporation
Mami Kubota
B24 - GRINDING POLISHING
Information
Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
Patent number
11,453,098
Issue date
Sep 27, 2022
Shin-Etsu Handotai Co., Ltd.
Yuki Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Method of lapping semiconductor wafer and semiconductor wafer
Patent number
11,456,168
Issue date
Sep 27, 2022
Sumco Corporation
Daisuke Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-surface polishing device and dual-surface polishing method
Patent number
11,440,157
Issue date
Sep 13, 2022
Sumco Corporation
Keisuke Esaki
B24 - GRINDING POLISHING
Information
Patent Grant
Assembly and method for loading parts to be treated in a single-sid...
Patent number
11,376,706
Issue date
Jul 5, 2022
PBMC SA
Denis Munier
B24 - GRINDING POLISHING
Information
Patent Grant
Double-side polishing method and double-side polishing apparatus
Patent number
11,325,220
Issue date
May 10, 2022
Shin-Etsu Handotai Co., Ltd.
Yuki Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Method for double-side polishing wafer
Patent number
11,298,796
Issue date
Apr 12, 2022
Shin-Etsu Handotai Co., Ltd.
Yuki Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Double disc surface grinding machine and grinding method
Patent number
11,278,998
Issue date
Mar 22, 2022
NISSEI INDUSTRY CORPORATION
Sajio Osaki
B24 - GRINDING POLISHING
Information
Patent Grant
Method of producing carrier and method of polishing wafer
Patent number
11,127,584
Issue date
Sep 21, 2021
Sumco Corporation
Shunsuke Mikuriya
B24 - GRINDING POLISHING
Information
Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
Patent number
11,065,735
Issue date
Jul 20, 2021
Shin-Etsu Handotai Co., Ltd.
Daichi Kitazume
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier ring, grinding device, and grinding method
Patent number
11,052,506
Issue date
Jul 6, 2021
Sumco Corporation
Yoshinobu Nishimura
B24 - GRINDING POLISHING
Information
Patent Grant
Workpiece processing apparatus
Patent number
10,335,918
Issue date
Jul 2, 2019
Shin-Etsu Handotai Co., Ltd.
Taichi Yasuda
B24 - GRINDING POLISHING
Information
Patent Grant
Double-side polishing method
Patent number
9,987,721
Issue date
Jun 5, 2018
Masanao Sasaki
B24 - GRINDING POLISHING
Information
Patent Grant
Method of producing carrier for use in double-side polishing appara...
Patent number
9,764,443
Issue date
Sep 19, 2017
Shin-Etsu Handotai Co., Ltd.
Kazuya Sato
B24 - GRINDING POLISHING
Information
Patent Grant
Wafer polishing apparatus
Patent number
9,744,641
Issue date
Aug 29, 2017
LG SILTRON INCORPORATED
Kee Yun Han
B24 - GRINDING POLISHING
Information
Patent Grant
Method for producing polished object and polishing composition kit
Patent number
9,685,343
Issue date
Jun 20, 2017
Fujimi Incorporated
Makoto Tabata
B24 - GRINDING POLISHING
Information
Patent Grant
Double-disc grinding apparatus and workpiece double-disc grinding m...
Patent number
9,669,513
Issue date
Jun 6, 2017
Shin-Etsu Chemical Co., Ltd.
Kenji Kobayashi
B24 - GRINDING POLISHING
Information
Patent Grant
Wafer polishing apparatus and method
Patent number
9,576,807
Issue date
Feb 21, 2017
LG SILTRON INCORPORATED
Jun Hee Lee
B24 - GRINDING POLISHING
Information
Patent Grant
Carrier, method for coating a carrier, and method for the simultane...
Patent number
9,539,695
Issue date
Jan 10, 2017
Siltronic AG
Georg Pietsch
B24 - GRINDING POLISHING
Information
Patent Grant
Method for processing wafer
Patent number
9,490,180
Issue date
Nov 8, 2016
Shin-Etsu Handotai Co., Ltd.
Shinya Kanno
B24 - GRINDING POLISHING
Information
Patent Grant
Double-sided polishing of hard substrate materials
Patent number
9,427,841
Issue date
Aug 30, 2016
II-VI Incorporated
Samuel J. Goldstein
B24 - GRINDING POLISHING
Information
Patent Grant
Carrier for a double-side polishing apparatus, double-side polishin...
Patent number
9,327,382
Issue date
May 3, 2016
Shin-Etsu Handotai Co., Ltd.
Junichi Ueno
B24 - GRINDING POLISHING
Information
Patent Grant
Method of manufacturing a glass substrate for a magnetic disk and m...
Patent number
9,299,382
Issue date
Mar 29, 2016
Hoya Corporation
Hideo Sakai
B24 - GRINDING POLISHING
Information
Patent Grant
Method of manufacturing a glass substrate for a magnetic disk and m...
Patent number
9,183,868
Issue date
Nov 10, 2015
Hoya Corporation
Hideo Sakai
B24 - GRINDING POLISHING
Information
Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
Patent number
9,050,698
Issue date
Jun 9, 2015
Shin-Etsu Handotai Co., Ltd.
Taichi Yasuda
B24 - GRINDING POLISHING
Information
Patent Grant
Flat SiC semiconductor substrate
Patent number
9,018,639
Issue date
Apr 28, 2015
Dow Corning Corporation
Mark Loboda
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
POLISHING APPARATUS AND POLISHING METHOD
Publication number
20250114904
Publication date
Apr 10, 2025
Disco Corporation
Keita TOMONARI
B24 - GRINDING POLISHING
Information
Patent Application
WAFER DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF EVALUATING THE...
Publication number
20250100102
Publication date
Mar 27, 2025
SK SILTRON CO., LTD.
Hyung Rak LEE
B24 - GRINDING POLISHING
Information
Patent Application
DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL
Publication number
20250001546
Publication date
Jan 2, 2025
GLOBALWAFERS CO., LTD.
Yung Hsing Chu
B24 - GRINDING POLISHING
Information
Patent Application
GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE
Publication number
20240227117
Publication date
Jul 11, 2024
AGC Inc.
Toru MOMOSE
B24 - GRINDING POLISHING
Information
Patent Application
CARRIER AND METHOD FOR MANUFACTURING SUBSTRATE
Publication number
20230110750
Publication date
Apr 13, 2023
HOYA CORPORATION
Tam Dinh VIEN
B24 - GRINDING POLISHING
Information
Patent Application
APPARATUS FOR DOUBLE-SIDE POLISHING WORK
Publication number
20230106784
Publication date
Apr 6, 2023
SUMCO CORPORATION
Yuji MIYAZAKI
B24 - GRINDING POLISHING
Information
Patent Application
GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE
Publication number
20230051824
Publication date
Feb 16, 2023
AGC Inc.
Toru MOMOSE
B24 - GRINDING POLISHING
Information
Patent Application
DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL
Publication number
20220258300
Publication date
Aug 18, 2022
Lapmaster Wolters GmbH
Hans-Peter Boller
B24 - GRINDING POLISHING
Information
Patent Application
DOUBLE-SIDE POLISHING METHOD
Publication number
20220168865
Publication date
Jun 2, 2022
Shin-Etsu Handotai Co., Ltd.
Yuki TANAKA
B24 - GRINDING POLISHING
Information
Patent Application
DOUBLE-SIDED POLISHING OR SANDING MEMBER FOR ATTACHMENT TO A HAND-G...
Publication number
20210308824
Publication date
Oct 7, 2021
Guido Valentini
B24 - GRINDING POLISHING
Information
Patent Application
ASSEMBLY AND METHOD FOR LOADING PARTS TO BE TREATED IN A SINGLE-SID...
Publication number
20210197336
Publication date
Jul 1, 2021
PBMC SA
Denis MUNIER
B24 - GRINDING POLISHING
Information
Patent Application
METHOD OF PRODUCING CARRIER AND METHOD OF POLISHING WAFER
Publication number
20200365387
Publication date
Nov 19, 2020
SUMCO CORPORATION
Shunsuke MIKURIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...
Publication number
20200061772
Publication date
Feb 27, 2020
Shin-Etsu Handotai Co., Ltd.
Yuki TANAKA
B24 - GRINDING POLISHING
Information
Patent Application
METHOD OF DOUBLE-SIDE POLISHING SEMICONDUCTOR WAFER
Publication number
20200039021
Publication date
Feb 6, 2020
SUMCO CORPORATION
Mami KUBOTA
B24 - GRINDING POLISHING
Information
Patent Application
DUAL-SURFACE POLISHING DEVICE
Publication number
20190224807
Publication date
Jul 25, 2019
SUMCO CORPORATION
Keisuke ESAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDED WAFER POLISHING METHOD
Publication number
20190160627
Publication date
May 30, 2019
SUMCO CORPORATION
Shunsuke MIKURIYA
B24 - GRINDING POLISHING
Information
Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
Publication number
20190047113
Publication date
Feb 14, 2019
Shin-Etsu Handotai Co., Ltd.
Daichi KITAZUME
B24 - GRINDING POLISHING
Information
Patent Application
DOUBLE-SIDE POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
Publication number
20180361530
Publication date
Dec 20, 2018
Shin-Etsu Handotai Co., Ltd.
Yuki TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR DOUBLE-SIDE POLISHING WAFER
Publication number
20180272497
Publication date
Sep 27, 2018
Shin-Etsu Handotai Co., Ltd.
Yuki TANAKA
B24 - GRINDING POLISHING
Information
Patent Application
WORKPIECE PROCESSING APPARATUS
Publication number
20180117729
Publication date
May 3, 2018
Shin-Etsu Handotai Co., Ltd.
Taichi YASUDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
Publication number
20170069502
Publication date
Mar 9, 2017
Shin-Etsu Handotai Co., Ltd.
Kazuya Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARA...
Publication number
20150375363
Publication date
Dec 31, 2015
Shin-Etsu Handotai Co., Ltd.
Kazuya SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF DO...
Publication number
20150321311
Publication date
Nov 12, 2015
Shin-Etsu Handotai Co., Ltd.
Masanao SASAKI
B24 - GRINDING POLISHING
Information
Patent Application
SYSTEMS FOR, METHODS OF, AND APPARATUS FOR PROCESSING SUBSTRATE SUR...
Publication number
20150306728
Publication date
Oct 29, 2015
SILICON QUEST INTERNATIONAL, INCORPORATED
Yevsey SENDERZON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDE POLISHING METHOD
Publication number
20150217425
Publication date
Aug 6, 2015
Shin-Etsu Handotai Co., Ltd.
Masanao Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PROCESSING WAFER
Publication number
20140320867
Publication date
Oct 30, 2014
Shin-Etsu Handotai Co., Ltd.
Shinya Kanno
G01 - MEASURING TESTING
Information
Patent Application
Double-Sided Polishing of Hard Substrate Materials
Publication number
20140273760
Publication date
Sep 18, 2014
II-VI Incorporated
Samuel J. Goldstein
B24 - GRINDING POLISHING
Information
Patent Application
METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...
Publication number
20140170942
Publication date
Jun 19, 2014
Siltronic AG
Georg Pietsch
B24 - GRINDING POLISHING
Information
Patent Application
METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...
Publication number
20140170939
Publication date
Jun 19, 2014
Siltronic AG
Georg Pietsch
B24 - GRINDING POLISHING
Information
Patent Application
FLAT SIC SEMICONDUCTOR SUBSTRATE
Publication number
20140117380
Publication date
May 1, 2014
Dow Corning Corporation
Mark LOBODA
C30 - CRYSTAL GROWTH