for double side lapping of plane surfaces

Industry

CPC
B24B37/28

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/28for double side lapping of plane surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Double-side or one-side machine tool
- Patent number 12,318,883
- Issue date Jun 3, 2025
- Lapmaster Wolters GmbH
- Hans-Peter Boller
- B24 - GRINDING POLISHING
Information Patent Grant
Glass article and method of producing glass article
- Patent number 12,263,555
- Issue date Apr 1, 2025
- AGC Inc.
- Toru Momose
- B24 - GRINDING POLISHING
Information Patent Grant
Glass article and method of producing glass article
- Patent number 11,969,857
- Issue date Apr 30, 2024
- AGC Inc.
- Toru Momose
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided wafer polishing method
- Patent number 11,772,231
- Issue date Oct 3, 2023
- Sumco Corporation
- Shunsuke Mikuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of double-side polishing semiconductor wafer
- Patent number 11,731,234
- Issue date Aug 22, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
- Patent number 11,453,098
- Issue date Sep 27, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of lapping semiconductor wafer and semiconductor wafer
- Patent number 11,456,168
- Issue date Sep 27, 2022
- Sumco Corporation
- Daisuke Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-surface polishing device and dual-surface polishing method
- Patent number 11,440,157
- Issue date Sep 13, 2022
- Sumco Corporation
- Keisuke Esaki
- B24 - GRINDING POLISHING
Information Patent Grant
Assembly and method for loading parts to be treated in a single-sid...
- Patent number 11,376,706
- Issue date Jul 5, 2022
- PBMC SA
- Denis Munier
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing method and double-side polishing apparatus
- Patent number 11,325,220
- Issue date May 10, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for double-side polishing wafer
- Patent number 11,298,796
- Issue date Apr 12, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Double disc surface grinding machine and grinding method
- Patent number 11,278,998
- Issue date Mar 22, 2022
- NISSEI INDUSTRY CORPORATION
- Sajio Osaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing carrier and method of polishing wafer
- Patent number 11,127,584
- Issue date Sep 21, 2021
- Sumco Corporation
- Shunsuke Mikuriya
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
- Patent number 11,065,735
- Issue date Jul 20, 2021
- Shin-Etsu Handotai Co., Ltd.
- Daichi Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier ring, grinding device, and grinding method
- Patent number 11,052,506
- Issue date Jul 6, 2021
- Sumco Corporation
- Yoshinobu Nishimura
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece processing apparatus
- Patent number 10,335,918
- Issue date Jul 2, 2019
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing method
- Patent number 9,987,721
- Issue date Jun 5, 2018
- Masanao Sasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing carrier for use in double-side polishing appara...
- Patent number 9,764,443
- Issue date Sep 19, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing apparatus
- Patent number 9,744,641
- Issue date Aug 29, 2017
- LG SILTRON INCORPORATED
- Kee Yun Han
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing polished object and polishing composition kit
- Patent number 9,685,343
- Issue date Jun 20, 2017
- Fujimi Incorporated
- Makoto Tabata
- B24 - GRINDING POLISHING
Information Patent Grant
Double-disc grinding apparatus and workpiece double-disc grinding m...
- Patent number 9,669,513
- Issue date Jun 6, 2017
- Shin-Etsu Chemical Co., Ltd.
- Kenji Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing apparatus and method
- Patent number 9,576,807
- Issue date Feb 21, 2017
- LG SILTRON INCORPORATED
- Jun Hee Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier, method for coating a carrier, and method for the simultane...
- Patent number 9,539,695
- Issue date Jan 10, 2017
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for processing wafer
- Patent number 9,490,180
- Issue date Nov 8, 2016
- Shin-Etsu Handotai Co., Ltd.
- Shinya Kanno
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided polishing of hard substrate materials
- Patent number 9,427,841
- Issue date Aug 30, 2016
- II-VI Incorporated
- Samuel J. Goldstein
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for a double-side polishing apparatus, double-side polishin...
- Patent number 9,327,382
- Issue date May 3, 2016
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a glass substrate for a magnetic disk and m...
- Patent number 9,299,382
- Issue date Mar 29, 2016
- Hoya Corporation
- Hideo Sakai
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a glass substrate for a magnetic disk and m...
- Patent number 9,183,868
- Issue date Nov 10, 2015
- Hoya Corporation
- Hideo Sakai
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
- Patent number 9,050,698
- Issue date Jun 9, 2015
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Flat SiC semiconductor substrate
- Patent number 9,018,639
- Issue date Apr 28, 2015
- Dow Corning Corporation
- Mark Loboda
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20250114904
- Publication date Apr 10, 2025
- Disco Corporation
- Keita TOMONARI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF EVALUATING THE...
- Publication number 20250100102
- Publication date Mar 27, 2025
- SK SILTRON CO., LTD.
- Hyung Rak LEE
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL
- Publication number 20250001546
- Publication date Jan 2, 2025
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- B24 - GRINDING POLISHING
Information Patent Application
GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE
- Publication number 20240227117
- Publication date Jul 11, 2024
- AGC Inc.
- Toru MOMOSE
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER AND METHOD FOR MANUFACTURING SUBSTRATE
- Publication number 20230110750
- Publication date Apr 13, 2023
- HOYA CORPORATION
- Tam Dinh VIEN
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20230106784
- Publication date Apr 6, 2023
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE
- Publication number 20230051824
- Publication date Feb 16, 2023
- AGC Inc.
- Toru MOMOSE
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL
- Publication number 20220258300
- Publication date Aug 18, 2022
- Lapmaster Wolters GmbH
- Hans-Peter Boller
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING METHOD
- Publication number 20220168865
- Publication date Jun 2, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDED POLISHING OR SANDING MEMBER FOR ATTACHMENT TO A HAND-G...
- Publication number 20210308824
- Publication date Oct 7, 2021
- Guido Valentini
- B24 - GRINDING POLISHING
Information Patent Application
ASSEMBLY AND METHOD FOR LOADING PARTS TO BE TREATED IN A SINGLE-SID...
- Publication number 20210197336
- Publication date Jul 1, 2021
- PBMC SA
- Denis MUNIER
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PRODUCING CARRIER AND METHOD OF POLISHING WAFER
- Publication number 20200365387
- Publication date Nov 19, 2020
- SUMCO CORPORATION
- Shunsuke MIKURIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...
- Publication number 20200061772
- Publication date Feb 27, 2020
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING SEMICONDUCTOR WAFER
- Publication number 20200039021
- Publication date Feb 6, 2020
- SUMCO CORPORATION
- Mami KUBOTA
- B24 - GRINDING POLISHING
Information Patent Application
DUAL-SURFACE POLISHING DEVICE
- Publication number 20190224807
- Publication date Jul 25, 2019
- SUMCO CORPORATION
- Keisuke ESAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED WAFER POLISHING METHOD
- Publication number 20190160627
- Publication date May 30, 2019
- SUMCO CORPORATION
- Shunsuke MIKURIYA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
- Publication number 20190047113
- Publication date Feb 14, 2019
- Shin-Etsu Handotai Co., Ltd.
- Daichi KITAZUME
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20180361530
- Publication date Dec 20, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DOUBLE-SIDE POLISHING WAFER
- Publication number 20180272497
- Publication date Sep 27, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE PROCESSING APPARATUS
- Publication number 20180117729
- Publication date May 3, 2018
- Shin-Etsu Handotai Co., Ltd.
- Taichi YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
- Publication number 20170069502
- Publication date Mar 9, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARA...
- Publication number 20150375363
- Publication date Dec 31, 2015
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF DO...
- Publication number 20150321311
- Publication date Nov 12, 2015
- Shin-Etsu Handotai Co., Ltd.
- Masanao SASAKI
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS FOR, METHODS OF, AND APPARATUS FOR PROCESSING SUBSTRATE SUR...
- Publication number 20150306728
- Publication date Oct 29, 2015
- SILICON QUEST INTERNATIONAL, INCORPORATED
- Yevsey SENDERZON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE POLISHING METHOD
- Publication number 20150217425
- Publication date Aug 6, 2015
- Shin-Etsu Handotai Co., Ltd.
- Masanao Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING WAFER
- Publication number 20140320867
- Publication date Oct 30, 2014
- Shin-Etsu Handotai Co., Ltd.
- Shinya Kanno
- G01 - MEASURING TESTING
Information Patent Application
Double-Sided Polishing of Hard Substrate Materials
- Publication number 20140273760
- Publication date Sep 18, 2014
- II-VI Incorporated
- Samuel J. Goldstein
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...
- Publication number 20140170942
- Publication date Jun 19, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...
- Publication number 20140170939
- Publication date Jun 19, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
FLAT SIC SEMICONDUCTOR SUBSTRATE
- Publication number 20140117380
- Publication date May 1, 2014
- Dow Corning Corporation
- Mark LOBODA
- C30 - CRYSTAL GROWTH

for double side lapping of plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Double-side or one-side machine tool

Glass article and method of producing glass article

Glass article and method of producing glass article

Double-sided wafer polishing method

Method of double-side polishing semiconductor wafer

Carrier for double-side polishing apparatus, double-side polishing...

Method of lapping semiconductor wafer and semiconductor wafer

Dual-surface polishing device and dual-surface polishing method

Assembly and method for loading parts to be treated in a single-sid...

Double-side polishing method and double-side polishing apparatus

Method for double-side polishing wafer

Double disc surface grinding machine and grinding method

Method of producing carrier and method of polishing wafer

Manufacturing method of carrier for double-side polishing apparatus...

Carrier ring, grinding device, and grinding method

Workpiece processing apparatus

Double-side polishing method

Method of producing carrier for use in double-side polishing appara...

Wafer polishing apparatus

Method for producing polished object and polishing composition kit

Double-disc grinding apparatus and workpiece double-disc grinding m...

Wafer polishing apparatus and method

Carrier, method for coating a carrier, and method for the simultane...

Method for processing wafer

Double-sided polishing of hard substrate materials

Carrier for a double-side polishing apparatus, double-side polishin...

Method of manufacturing a glass substrate for a magnetic disk and m...

Method of manufacturing a glass substrate for a magnetic disk and m...

Manufacturing method of carrier for double-side polishing apparatus...

Flat SiC semiconductor substrate

Patents Applicationslast 30 patents

POLISHING APPARATUS AND POLISHING METHOD

WAFER DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF EVALUATING THE...

DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL

GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE

CARRIER AND METHOD FOR MANUFACTURING SUBSTRATE

APPARATUS FOR DOUBLE-SIDE POLISHING WORK

GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE

DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL

DOUBLE-SIDE POLISHING METHOD

DOUBLE-SIDED POLISHING OR SANDING MEMBER FOR ATTACHMENT TO A HAND-G...

ASSEMBLY AND METHOD FOR LOADING PARTS TO BE TREATED IN A SINGLE-SID...

METHOD OF PRODUCING CARRIER AND METHOD OF POLISHING WAFER

CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...

METHOD OF DOUBLE-SIDE POLISHING SEMICONDUCTOR WAFER

DUAL-SURFACE POLISHING DEVICE

DOUBLE-SIDED WAFER POLISHING METHOD

MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...

DOUBLE-SIDE POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS

METHOD FOR DOUBLE-SIDE POLISHING WAFER

WORKPIECE PROCESSING APPARATUS

MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...

METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARA...

CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF DO...

SYSTEMS FOR, METHODS OF, AND APPARATUS FOR PROCESSING SUBSTRATE SUR...

DOUBLE-SIDE POLISHING METHOD

METHOD FOR PROCESSING WAFER

Double-Sided Polishing of Hard Substrate Materials

METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...

METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...

FLAT SIC SEMICONDUCTOR SUBSTRATE