Claims
- 1. An apparatus for polishing a substrate, comprising:
a polishing platen for mounting said substrate; a polishing head; a polishing pad adhered to a bottom face of said polishing head; a rocking section, connected to said polishing head, for rocking said polishing head with respect to said polishing platen; and a control circuit, connected to said polishing head and said rocking section, for controlling a load of said polishing pad applied to said substrate in accordance with a contact area of said polishing pad to said substrate.
- 2. The apparatus as set forth in claim 1, wherein said control circuit calculates the contact area of said polishing pad to said substrate and allocates the load of said polishing pad by multiplying the contact area of said polishing pad to said substrate by a constant polishing pressure value.
- 3. The apparatus as set forth in claim 1, wherein a substrate diameter of said polishing pad is approximately half of a diameter of said substrate.
- 4. The apparatus as set forth in claim 1, wherein said polishing pad is circular.
- 5. The apparatus as set forth in claim 1, wherein said polishing pad is elliptic.
- 6. The apparatus as set forth in claim 5, wherein a short diameter of said polishing pad is smaller than a radius of said substrate.
- 7. The apparatus as set forth in claim 1, wherein said polishing pad is non-circular.
- 8. The apparatus as set forth in claim 7, wherein said polishing pad is a polishing pad obtained by partly cutting out at least one region of a periphery of a circular polishing pad.
- 9. The apparatus as set forth in claim 1, wherein said control circuit drives said polishing platen and said polishing head to rotate in opposite directions to each other.
- 10. The apparatus as set forth in claim 1, wherein said polishing head comprises a pipe for supplying polishing liquid to said substrate.
- 11. An apparatus for polishing a substrate, comprising:
a polishing platen for mounting said substrate; a polishing head; a polishing pad adhered to a bottom face of said polishing head; and a rocking section, connected to said polishing head, for rocking said polishing head with respect to said polishing platen; a substrate diameter of said polishing pad being approximately half of a diameter of said substrate.
- 12. The apparatus as set forth in claim 11, wherein said polishing pad is circular.
- 13. The apparatus as set forth in claim 11, wherein said polishing pad is elliptic.
- 14. The apparatus as set forth in claim 11, wherein a short diameter of said polishing pad is smaller than a radius of said substrate.
- 15. The apparatus as set forth in claim 11, wherein said polishing pad is non-circular.
- 16. The apparatus as set forth in claim 15, wherein said polishing pad is a polishing pad obtained by partly cutting out at least one region of a periphery of a circular polishing pad.
- 17. The apparatus as set forth in claim 11, further comprising a control circuit, connected to said polishing platter and polishing head, for driving said polishing platen and said polishing head to rotate in opposite directions to each other.
- 18. The apparatus as set forth in claim 11, wherein said polishing head comprises a pipe for supplying polishing liquid to said substrate.
- 19. A method for polishing a substrate in a polishing apparatus including: a polishing platen for mounting said substrate; a polishing head; a polishing pad adhered to a bottom face of said polishing head; and a rocking section, connected to said polishing head, for rocking said polishing head with respect to said polishing platen, comprising the steps of:
calculating a contact area of said polishing pad to said substrate; calculating a load of said polishing pad by multiplying the contact are of said polishing pad to said substrate a constant polishing pressure value; and controlling a load of said polishing pad in accordance with the calculated load of said polishing pad.
- 20. The method as set forth in claim 19, wherein a substrate diameter of said polishing pad is approximately half of a diameter of said substrate.
- 21. The method as set forth in claim 19, wherein said polishing pad is circular.
- 22. The method as set forth in claim 19, wherein said polishing pad is elliptic.
- 23. The method as set forth in claim 22, wherein said contact are calculating step calculates an area of said polishing pad by
- 24. The method as set for the in claim 22, wherein a short diameter of said polishing pad is smaller than a radius of said substrate.
- 25. The method as set forth in claim 19, wherein said polishing pad is non-circular.
- 26. The method as set forth in claim 25, wherein said polishing pad is a polishing pad obtained by partly cutting out at least one region of a periphery of a circular polishing pad.
- 27. The method as set forth in claim 25, wherein said contact are calculating step calculations an area of said polishing pad by
- 28. The method as se forth in claim 19, further comprising a step of driving said polishing platen and said polishing head to rotate in opposite directions to each other.
- 29. The method as set forth in claim 28, wherein a rotational speed of said polishing head is twice a rotational speed of said substrate.
- 30. A method for polishing a substrate, in a polishing apparatus including: a polishing platen for mounting said substrate; a polishing head; a polishing pad adhered to a bottom face of said polishing head; and a rocking section, connected to said polishing head, for rocking said polishing head with respect to said polishing platen, comprising the steps of;
calculating a relationship between center positions of said polishing pad and loads of said polishing pad; storing said relationship in a table; and controlling a load of said polishing pad applied to said substrate in accordance with a current center position of said polishing pad with reference to said table, so that a contact polishing pressure of said polishing pad to said substrate is brought close to a contact value.
Priority Claims (1)
Number |
Date |
Country |
Kind |
173715/1998 |
Jun 1998 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATION
[0001] The present application is a divisional application of application Ser. No. 09/335,985 filed on Jun. 18, 1999.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09335985 |
Jun 1999 |
US |
Child |
09852179 |
May 2001 |
US |