operating processes therefor

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CPC
B24B37/042

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BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/042operating processes therefor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for polishing a wafer and method for fabricating a semico...
- Patent number 12,341,015
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Dong Hoon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus with thickness measuring unit
- Patent number 12,330,266
- Issue date Jun 17, 2025
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 12,325,101
- Issue date Jun 10, 2025
- Ebara Corporation
- Masaki Kinoshita
- B24 - GRINDING POLISHING
Information Patent Grant
Photoelectric fluid field cluster catalytic method for atomic-scale...
- Patent number 12,325,017
- Issue date Jun 10, 2025
- Zhejiang University
- Wule Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate polishing apparatus and substrate polishing method
- Patent number 12,318,881
- Issue date Jun 3, 2025
- Ebara Corporation
- Takuya Fujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided polishing method for optical lens
- Patent number 12,318,884
- Issue date Jun 3, 2025
- Dalian University of Technology
- Jiang Guo
- B24 - GRINDING POLISHING
Information Patent Grant
Resistivity-based adjustment of thresholds for in-situ monitoring
- Patent number 12,320,883
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Kun Xu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Monolithic platen
- Patent number 12,311,498
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Method of double-side polishing work, method of producing work, and...
- Patent number 12,311,496
- Issue date May 27, 2025
- Sumco Corporation
- Kazushige Takaishi
- B24 - GRINDING POLISHING
Information Patent Grant
Pressure signals during motor torque monitoring to provide spatial...
- Patent number 12,311,494
- Issue date May 27, 2025
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for removing debris during chemical mechanical pl...
- Patent number 12,311,501
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
High throughput polishing modules and modular polishing systems
- Patent number 12,308,272
- Issue date May 20, 2025
- Applied Materials, Inc.
- Jagan Rangarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for thinning substrates for semiconductor devices
- Patent number 12,290,900
- Issue date May 6, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer surface chemical distribution sensing system and methods for...
- Patent number 12,285,837
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Shota Yatsuzuka
- B24 - GRINDING POLISHING
Information Patent Grant
End point detection method, polishing apparatus, and polishing method
- Patent number 12,285,836
- Issue date Apr 29, 2025
- Ebara Corporation
- Taro Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 12,285,838
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus, substrate polishing system including...
- Patent number 12,280,466
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jaehyug Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and methods for susceptor deposition material removal
- Patent number 12,280,465
- Issue date Apr 22, 2025
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mounting press, grinding and/or polishing device, and production li...
- Patent number 12,263,548
- Issue date Apr 1, 2025
- ATM Qness GmbH
- Robert Höll
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding method for workpiece and grinding apparatus
- Patent number 12,263,553
- Issue date Apr 1, 2025
- Disco Corporation
- Keisuke Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,251,789
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization strategy in nano-sized fabrication
- Patent number 12,254,906
- Issue date Mar 18, 2025
- Seagate Technology LLC
- Cheng Bi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with capacitive shear sensor
- Patent number 12,233,505
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding apparatus, substrate suction determination method...
- Patent number 12,230,529
- Issue date Feb 18, 2025
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,208,487
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Roller for location-specific wafer polishing
- Patent number 12,194,591
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Ekaterina A. Mikhaylichenko
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing, processing system, and method of polishing
- Patent number 12,179,312
- Issue date Dec 31, 2024
- Ebara Corporation
- Takuya Moriura
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry and polishing method
- Patent number 12,173,219
- Issue date Dec 24, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,172,263
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Michael Yen
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus using a magnetically couple...
- Patent number 12,151,336
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Pin Ho
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20250205846
- Publication date Jun 26, 2025
- EBARA CORPORATION
- Kohei OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES
- Publication number 20250205845
- Publication date Jun 26, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD OF WAFER
- Publication number 20250191925
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Kai ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD, POLISHING PAD MANUFACTURING METHOD, AND WAFER POLISH...
- Publication number 20250178154
- Publication date Jun 5, 2025
- NORITAKE CO., LIMITED
- Ryoma ITO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20250170688
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi HUANG
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE SUPPORT DEVICE, CLEANING DEVICE, DEVICE AND METHOD FOR CA...
- Publication number 20250164977
- Publication date May 22, 2025
- EBARA CORPORATION
- Michiaki MATSUDA
- G05 - CONTROLLING REGULATING
Information Patent Application
POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...
- Publication number 20250144764
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR P...
- Publication number 20250144765
- Publication date May 8, 2025
- FUJIBO HOLDINGS, INC.
- Yoshihide KAWAMURA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20250129279
- Publication date Apr 24, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE
- Publication number 20250114902
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Avyay Panchapakesan
- B24 - GRINDING POLISHING
Information Patent Application
EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...
- Publication number 20250114897
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...
- Publication number 20250114901
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Zhize Zhu
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING-RING-LESS CMP PROCESS
- Publication number 20250114903
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL
- Publication number 20250108473
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Andrew J. Nagengast
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20250084294
- Publication date Mar 13, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
FREE JOINT STRUCTURE, PUSH-PULL DEVICE, AND SUBSTRATE PROCESSING MO...
- Publication number 20250073851
- Publication date Mar 6, 2025
- EBARA CORPORATION
- MATSUTARO MIYAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
CONTAINMENT AND EXHAUST SYSTEM FOR SUBSTRATE POLISHING COMPONENTS
- Publication number 20250065473
- Publication date Feb 27, 2025
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING METHODS
- Publication number 20250062148
- Publication date Feb 20, 2025
- GLOBALWAFERS CO., LTD.
- ShinBae Park
- B08 - CLEANING
Information Patent Application
APPARATUS FOR POLISHING, PROCESSING SYSTEM, AND METHOD OF POLISHING
- Publication number 20250058431
- Publication date Feb 20, 2025
- EBARA CORPORATION
- Takuya MORIURA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...
- Publication number 20250033160
- Publication date Jan 30, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING DIAMOND CRYSTAL, AND DIAMOND CRYSTAL
- Publication number 20250018524
- Publication date Jan 16, 2025
- ORBRAY CO., LTD.
- Seongwoo KIM
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING DEVICE, SUBSTRATE TREATING APPARATUS, AND POLISHING METHOD
- Publication number 20250018523
- Publication date Jan 16, 2025
- SCREEN Holdings Co., Ltd.
- Hiroaki ISHII
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRA...
- Publication number 20250010431
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Jianjun HU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING DEVICE, POLISHING METHOD, AND MACHINE PART
- Publication number 20250010425
- Publication date Jan 9, 2025
- NHK Spring Co., Ltd.
- Masahiro FUJII
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL
- Publication number 20250001546
- Publication date Jan 2, 2025
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20240425737
- Publication date Dec 26, 2024
- Resonac Corporation
- Satoyuki NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240399529
- Publication date Dec 5, 2024
- Fujikoshi Machinery Corp.
- Yuya KANNO
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20240404894
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING

operating processes therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for polishing a wafer and method for fabricating a semico...

Polishing apparatus with thickness measuring unit

Polishing apparatus and polishing method

Photoelectric fluid field cluster catalytic method for atomic-scale...

Substrate polishing apparatus and substrate polishing method

Double-sided polishing method for optical lens

Resistivity-based adjustment of thresholds for in-situ monitoring

Monolithic platen

Method of double-side polishing work, method of producing work, and...

Pressure signals during motor torque monitoring to provide spatial...

System and method for removing debris during chemical mechanical pl...

High throughput polishing modules and modular polishing systems

Methods for thinning substrates for semiconductor devices

Wafer surface chemical distribution sensing system and methods for...

End point detection method, polishing apparatus, and polishing method

Wafer edge asymmetry correction using groove in polishing pad

Substrate polishing apparatus, substrate polishing system including...

Apparatus and methods for susceptor deposition material removal

Mounting press, grinding and/or polishing device, and production li...

Grinding method for workpiece and grinding apparatus

Chemical mechanical polishing apparatus and method

Planarization strategy in nano-sized fabrication

Polishing system with capacitive shear sensor

Substrate holding apparatus, substrate suction determination method...

Chemical mechanical polishing apparatus and method

Roller for location-specific wafer polishing

Apparatus for polishing, processing system, and method of polishing

Slurry and polishing method

Chemical mechanical planarization tool

Chemical mechanical polishing apparatus using a magnetically couple...

Patents Applicationslast 30 patents

POLISHING APPARATUS AND POLISHING METHOD

METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES

PLANARIZATION METHOD OF WAFER

POLISHING PAD, POLISHING PAD MANUFACTURING METHOD, AND WAFER POLISH...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

SUBSTRATE SUPPORT DEVICE, CLEANING DEVICE, DEVICE AND METHOD FOR CA...

POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...

POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR P...

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

SLURRY, SCREENING METHOD, AND POLISHING METHOD

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE

EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL PO...

GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL P...

RETAINING-RING-LESS CMP PROCESS

POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL

SLURRY AND POLISHING METHOD

FREE JOINT STRUCTURE, PUSH-PULL DEVICE, AND SUBSTRATE PROCESSING MO...

CONTAINMENT AND EXHAUST SYSTEM FOR SUBSTRATE POLISHING COMPONENTS

AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING METHODS

APPARATUS FOR POLISHING, PROCESSING SYSTEM, AND METHOD OF POLISHING

POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...

METHOD FOR POLISHING DIAMOND CRYSTAL, AND DIAMOND CRYSTAL

POLISHING DEVICE, SUBSTRATE TREATING APPARATUS, AND POLISHING METHOD

POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRA...

POLISHING DEVICE, POLISHING METHOD, AND MACHINE PART

DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL

SLURRY, SCREENING METHOD, AND POLISHING METHOD

POLISHING APPARATUS AND POLISHING METHOD

SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION