POLISHING HEAD FOR POLISHING SEMICONDUCTOR WAFERS

Abstract

A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a vertical cross-sectional view of a polishing head in accordance with an embodiment of the present invention.

FIG. 2 is a bottom view of the polishing head of FIG. 1 with an outer flexible membrane being partially cut away to show first, second and third inner annular flexible membranes in accordance with an embodiment of the invention.

FIG. 3A is a bottom view of a first annular disc of the polishing head of FIG. 1 in accordance with an embodiment of the invention.

FIG. 3B is a cross-sectional view of the first annular disc of FIG. 3A.

FIG. 4A is a perspective view of an inner annular flexible membrane of the polishing head of FIG. 1 in accordance with an embodiment of the invention.

FIG. 4B is a cross-sectional view of the inner annular flexible membrane of FIG. 4A.

FIG. 5 is a cross-sectional view of an annular disc and an inner annular flexible membrane in accordance with an embodiment of the invention.

FIG. 6A is a cross-sectional view of an example of second and third annular discs with the second and third inner annular flexible membranes in accordance with an embodiment of the invention.

FIG. 6B is a cross-sectional view of another example of the second and third annular discs with the second and third inner annular flexible membranes in accordance with an embodiment of the invention.

FIG. 7A is a block diagram of a valve-and-regulator assembly of the polishing head of FIG. 1 in accordance with an embodiment of the invention.

FIG. 7B is a block diagram of the valve-and-regulator assembly of the polishing head of FIG. 1 in accordance with an alternative embodiment of the invention.

FIG. 8 is another vertical cross-sectional view of the polishing head of FIG. 1 with a semiconductor wafer chucked onto the polishing head in accordance with an embodiment of the present invention.

FIG. 9 is a bottom view of the first, second and third annular discs with interconnected recess regions in accordance with an embodiment of the invention.

FIG. 10 is a bottom view of the outer flexible membrane that has conformed to the interconnected recess regions of the annular discs in accordance with an embodiment of the invention.

FIG. 11A is a cross-sectional view showing a portion of the outer flexible membrane with an annular flap in accordance with an embodiment of the invention.

FIG. 11B is a cross-sectional view showing the portion of the outer flexible membrane with the annular flap in accordance with an alternative embodiment of the invention.

FIG. 12 is a process flow diagram of a method of handling and polishing a semiconductor wafer in accordance with an embodiment of the invention.

Claims

1. A polishing head comprising: a base structure having a lower surface, said base structure being configured to include at least one recess region on said lower surface;an outer flexible membrane positioned below said base structure, said outer flexible membrane and said base structure defining a chamber below said base structure;a first fluid channel operatively connected to said chamber to apply suction to at least a portion of said chamber, said suction causing said outer flexible membrane to conform to said at least one recess region of said base structure such that at least one depression is formed on a bottom surface of said outer flexible membrane; anda second fluid channel configured to extend through said outer flexible membrane such that an opening of said second fluid channel is positioned in said at least one depression when said suction is applied to said chamber, said second fluid channel being used to apply another suction to said at least one depression to hold a semiconductor wafer onto said outer flexible membrane.

2. The polishing head of claim 1 wherein said at least one recess region includes a circular recess region near the center of said base structure such that said at least one depression includes a circular depression.

3. The polishing head of claim 1 wherein said at least one recess region includes interconnected recess regions such that said at least one depression includes interconnected depressions.

4. The polishing head of claim 3 wherein said interconnected recess regions include one or more annular recess regions.

5. The polishing head of claim 1 wherein said base structure includes a base and a plurality of annular discs attached to said base, at least some of said annular discs including said at least one recess region.

6. The polishing head of claim 1 further comprising a housing attached to said base structure and a valve-and-regulator assembly positioned within said housing, said valve-and-regulator assembly being connected to said first and second fluid channels.

7. The polishing head of claim 6 further comprising a retainer ring positioned below said housing and a circular tube positioned between said housing and said retainer ring.

8. The polishing head of claim 7 further comprising a flexure attached to said retainer ring and said housing.

9. The polishing head of claim 1 wherein said outer flexible membrane is configured to include an annular upside down U-shaped portion.

10. The polishing head of claim 1 further comprising a plurality of inner annular flexible membranes attached to said base structure, said inner annular flexible membranes being positioned within said outer flexible membrane, each of said inner annular flexible membranes defining an annular chamber that is connected to a fluid channel.

11. The polishing head of claim 10 wherein said outer flexible membrane includes an annular flap configured to extend toward said base structure, said annular flap being positioned between adjacent sidewalls of said inner annular flexible membranes.

12. The polishing head of claim 10 wherein the thicknesses of said inner annular flexible membranes are thinner than the thickness of said outer flexible membrane.

13. The polishing head of claim 10 wherein at least one of said inner annular flexible membranes includes an annular wrinkled portion on a sidewall.

14. The polishing head of claim 1 wherein said base structure includes a base and at least first and second annular discs attached to said base, an outer edge of said first annular disc being configured to include a step and an inner edge of said second annular disc being configured to include an inverted step such that said step of said first annular disc fits said inverted step of said second annular disc.

15. A method for handling and polishing a semiconductor wafer using a polishing head, said method comprising: moving said polishing head such that an outer flexible membrane of said polishing head is at least in close proximity to a surface of said semiconductor wafer;applying suction to at least a portion of a chamber of said polishing head defined by said outer flexible membrane and a base structure of said polishing head, said base structure being configured to include at least one recess region on a lower surface of said base structure, said applying of said suction to at least said portion of said chamber causing said outer flexible membrane to conform to said at least one recess region of said base structure such that at least one depression is formed on a bottom surface of said outer flexible membrane; andapplying another suction to said at least one depression on said bottom surface of said outer flexible membrane to hold said semiconductor wafer onto said outer flexible membrane of said polishing head.

16. The method of claim 15 wherein said at least one recess region includes a circular recess region near the center of said base structure such that said at least one depression includes a circular depression.

17. The method of claim 15 wherein said at least one recess region includes interconnected recess regions such that said at least one depression includes interconnected depressions.

18. The method of claim 17 wherein said interconnected recess regions of said base structure include one or more annular recess regions.

19. The method of claim 15 wherein said base structure includes a base and a plurality of annular discs attached to said base, at least some of said annular discs including said at least one recess region.

20. The method of claim 15 further comprising absorbing vibrations of a retainer ring of said polishing head at a sealed annular tube positioned over said retainer ring.

21. The method of claim 15 further comprising expanding said outer flexible membrane, including straightening an annular upside down U-shaped portion of said outer flexible membrane.

22. The method of claim 15 further comprising applying pressurized gas to annular chambers of said polishing head, said annular chambers being defined by a plurality of inner annular flexible membranes and said base structure, said inner annular flexible membranes being positioned within said outer flexible membrane.

23. The method of claim 22 wherein said applying said pressurized gas includes controlling pressures in said annular chambers using said pressurized gas.

24. The method of claim 22 further comprising expanding a particular annular chamber of said annular chambers, including straightening an annular wrinkled portion of one of said inner annular flexible membranes associated with said particular annular chamber.

25. The method of claim 15 wherein said applying said suction to at least said portion of said chamber includes applying said suction to a space between said outer flexible membrane and a plurality of inner annular flexible membranes, said inner annular flexible membranes being positioned within said outer flexible membrane.

26. The method of claim 15 wherein said applying said suction to at least said portion of said chamber includes applying suction to at least one of annular chambers of said polishing head, said annular chambers being defined by a plurality of inner annular flexible membranes and said base structure, said inner annular flexible membranes being positioned within said outer flexible membrane.