for single side lapping of plane surfaces

Industry

CPC
B24B37/30

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/30for single side lapping of plane surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical cleaning tool for wafer polishing tool system
- Patent number 12,128,455
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 12,103,133
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer loading bracket, wafer loading system, and wafer mounting met...
- Patent number 12,103,134
- Issue date Oct 1, 2024
- HANGZHOU ZHONGGUI ELECTRONIC TECHNOLOGY CO., LTD
- Hui Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods for suction pad assemblies
- Patent number 12,087,646
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Chao
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing platens and polishing platen manufacturing methods
- Patent number 12,076,877
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Bum Jick Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic membrane, substrate holding device, and polishing apparatus
- Patent number 12,068,189
- Issue date Aug 20, 2024
- Ebara Corporation
- Satoru Yamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head having abrasive structure on retainer ring
- Patent number 12,011,803
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Sheng Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system with a potentiostat and pulsed...
- Patent number 12,011,800
- Issue date Jun 18, 2024
- BRUKER NANO INC.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,969,855
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,969,858
- Issue date Apr 30, 2024
- Ebara Corporation
- Keisuke Namiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate holding apparatus, elastic membrane, polishing apparatus,...
- Patent number 11,958,163
- Issue date Apr 16, 2024
- Ebara Corporation
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Grant
Deformable substrate chuck
- Patent number 11,931,857
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier wafers and methods of forming carrier wafers
- Patent number 11,919,125
- Issue date Mar 5, 2024
- Corning Incorporated
- Lance Changyong Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Monolithic platen
- Patent number 11,919,126
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,911,872
- Issue date Feb 27, 2024
- Ebara Corporation
- Nobuyuki Takada
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control in chemical mechanical polish
- Patent number 11,904,430
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor manufacturing device and method of polishing semicond...
- Patent number 11,894,235
- Issue date Feb 6, 2024
- Lapis Semiconductor Co., Ltd.
- Kiyohiko Toshikawa
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,887,869
- Issue date Jan 30, 2024
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Polishing apparatus
- Patent number 11,865,665
- Issue date Jan 9, 2024
- Ebara Corporation
- Kenichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,869,815
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,858,088
- Issue date Jan 2, 2024
- Disco Corporation
- Toshiyuki Moriya
- B24 - GRINDING POLISHING
Information Patent Grant
RFID part authentication and tracking of processing components
- Patent number 11,848,220
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Earl Hunter
- B24 - GRINDING POLISHING
Information Patent Grant
Advanced polishing pads and related polishing pad manufacturing met...
- Patent number 11,806,829
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Puneet Narendra Jawali
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing carrier head with multiple angular pressurizable zones
- Patent number 11,780,049
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding equipment
- Patent number 11,772,232
- Issue date Oct 3, 2023
- AM TECHNOLOGY CO., LTD.
- Hyoung Joo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus
- Patent number 11,772,226
- Issue date Oct 3, 2023
- Disco Corporation
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer holder
- Patent number 11,759,910
- Issue date Sep 19, 2023
- P.R. Hoffman Machine Products, Inc.
- David Melville Hutton
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 11,752,590
- Issue date Sep 12, 2023
- Ebara Corporation
- Yuichi Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making carrier head membrane with regions of different ro...
- Patent number 11,738,421
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Young J. Paik
- B24 - GRINDING POLISHING
Information Patent Grant
Method for selecting template assembly, method for polishing workpi...
- Patent number 11,731,236
- Issue date Aug 22, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240367282
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Hisashi SARUWATARI
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240367202
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES
- Publication number 20240371708
- Publication date Nov 7, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Hsiang CHAO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20240286242
- Publication date Aug 29, 2024
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...
- Publication number 20240226970
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Edwin VELAZQUEZ
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240213046
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Application
SUBSTRATE ROTATION PROCESSING DEVICE AND SUBSTRATE POLISHING DEVICE
- Publication number 20240207999
- Publication date Jun 27, 2024
- EBARA CORPORATION
- HIROKI MIYAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICO...
- Publication number 20240198479
- Publication date Jun 20, 2024
- SUMCO CORPORATION
- Hiroki OTA
- B24 - GRINDING POLISHING
Information Patent Application
MONOLITHIC PLATEN
- Publication number 20240181598
- Publication date Jun 6, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Lung LAI
- B24 - GRINDING POLISHING
Information Patent Application
DEFORMABLE SUBSTRATE CHUCK
- Publication number 20240173816
- Publication date May 30, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature Control in Chemical Mechanical Polish
- Publication number 20240149388
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20240149391
- Publication date May 9, 2024
- Tokyo Seimitsu Co., Ltd.
- Tadashi MURASATO
- B24 - GRINDING POLISHING
Information Patent Application
GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...
- Publication number 20240131562
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Edwin VELAZQUEZ
- B08 - CLEANING
Information Patent Application
MEMBRANE FAILURE DETECTION SYSTEM
- Publication number 20240109164
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Chang ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Application
MINIMIZING SUBSTRATE BOW DURING POLISHING
- Publication number 20240033878
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Eric L. Lau
- B24 - GRINDING POLISHING
Information Patent Application
ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...
- Publication number 20240025010
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Puneet Narendra JAWALI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230405756
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING CARRIER HEAD WITH MULTIPLE ZONES
- Publication number 20230405758
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR POLISHING AND METHOD OF POLISHING
- Publication number 20230381916
- Publication date Nov 30, 2023
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
Carrier Head Membrane With Regions of Different Roughness
- Publication number 20230356353
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Young J. Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...
- Publication number 20230311269
- Publication date Oct 5, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- John R. McCormick
- B24 - GRINDING POLISHING
Information Patent Application
FILTERING DURING IN-SITU MONITORING OF POLISHING
- Publication number 20230286105
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS
- Publication number 20230286106
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...
- Publication number 20230211457
- Publication date Jul 6, 2023
- SK SILTRON CO., LTD.
- Jae Pyo LEE
- B24 - GRINDING POLISHING
Information Patent Application
CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...
- Publication number 20230128739
- Publication date Apr 27, 2023
- STMicroelectronics S.r.l.
- Agata GRASSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD USING THE...
- Publication number 20230052061
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Hyojin PARK
- B24 - GRINDING POLISHING

for single side lapping of plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical cleaning tool for wafer polishing tool system

Chemical-mechanical polishing apparatus

Wafer loading bracket, wafer loading system, and wafer mounting met...

Systems and methods for suction pad assemblies

Polishing platens and polishing platen manufacturing methods

Elastic membrane, substrate holding device, and polishing apparatus

Carrier head having abrasive structure on retainer ring

Chemical-mechanical polishing system with a potentiostat and pulsed...

Filtering during in-situ monitoring of polishing

Substrate processing apparatus

Substrate holding apparatus, elastic membrane, polishing apparatus,...

Deformable substrate chuck

Carrier wafers and methods of forming carrier wafers

Monolithic platen

Substrate processing apparatus and substrate processing method

Temperature control in chemical mechanical polish

Semiconductor manufacturing device and method of polishing semicond...

Substrate processing apparatus and substrate processing method

Polishing apparatus

Asymmetry correction via oriented wafer loading

Polishing apparatus

RFID part authentication and tracking of processing components

Advanced polishing pads and related polishing pad manufacturing met...

Polishing carrier head with multiple angular pressurizable zones

Grinding equipment

Polishing apparatus

Method of manufacturing wafer holder

Polishing head and polishing apparatus

Method of making carrier head membrane with regions of different ro...

Method for selecting template assembly, method for polishing workpi...

Patents Applicationslast 30 patents

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

POLISHING METHOD AND POLISHING APPARATUS

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE ROTATION PROCESSING DEVICE AND SUBSTRATE POLISHING DEVICE

POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICO...

MONOLITHIC PLATEN

DEFORMABLE SUBSTRATE CHUCK

Temperature Control in Chemical Mechanical Polish

PROCESSING APPARATUS

GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...

MEMBRANE FAILURE DETECTION SYSTEM

POLISHING APPARATUS

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

MINIMIZING SUBSTRATE BOW DURING POLISHING

ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

POLISHING CARRIER HEAD WITH MULTIPLE ZONES

APPARATUS FOR POLISHING AND METHOD OF POLISHING

Carrier Head Membrane With Regions of Different Roughness

CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...

FILTERING DURING IN-SITU MONITORING OF POLISHING

NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS

AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...

CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...

SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD USING THE...