for single side lapping of plane surfaces

Industry

CPC
B24B37/30

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/30for single side lapping of plane surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature control in chemical mechanical polish
- Patent number 12,311,495
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Monolithic platen
- Patent number 12,311,498
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
High throughput polishing modules and modular polishing systems
- Patent number 12,308,272
- Issue date May 20, 2025
- Applied Materials, Inc.
- Jagan Rangarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head for chemical mechanical polishing apparatus comprising...
- Patent number 12,285,839
- Issue date Apr 29, 2025
- Joon Mo Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic abrasion compensation system of lower plate and wafer lap...
- Patent number 12,285,841
- Issue date Apr 29, 2025
- SK SILTRON CO., LTD.
- Jae Pyo Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization equipment, wafer transfer method,...
- Patent number 12,251,785
- Issue date Mar 18, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- EdwardLiCang Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate transporter and substrate processing apparatus including...
- Patent number 12,237,194
- Issue date Feb 25, 2025
- EBARA CORPORATION
- Akihiro Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,230,515
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Substrate holding apparatus, substrate suction determination method...
- Patent number 12,230,529
- Issue date Feb 18, 2025
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling mechanism with spherical bearing, method of determining be...
- Patent number 12,208,488
- Issue date Jan 28, 2025
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing and loading/unloading component module
- Patent number 12,194,592
- Issue date Jan 14, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B24 - GRINDING POLISHING
Information Patent Grant
Method of transferring semiconductor wafer to polishing apparatus a...
- Patent number 12,179,308
- Issue date Dec 31, 2024
- Sumco Corporation
- Ryoya Terakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head membrane with regions of different roughness
- Patent number 12,172,264
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Young J. Paik
- B24 - GRINDING POLISHING
Information Patent Grant
Electrical cleaning tool for wafer polishing tool system
- Patent number 12,128,455
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 12,103,133
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer loading bracket, wafer loading system, and wafer mounting met...
- Patent number 12,103,134
- Issue date Oct 1, 2024
- HANGZHOU ZHONGGUI ELECTRONIC TECHNOLOGY CO., LTD
- Hui Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods for suction pad assemblies
- Patent number 12,087,646
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Chao
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing platens and polishing platen manufacturing methods
- Patent number 12,076,877
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Bum Jick Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic membrane, substrate holding device, and polishing apparatus
- Patent number 12,068,189
- Issue date Aug 20, 2024
- Ebara Corporation
- Satoru Yamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head having abrasive structure on retainer ring
- Patent number 12,011,803
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Sheng Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system with a potentiostat and pulsed...
- Patent number 12,011,800
- Issue date Jun 18, 2024
- BRUKER NANO INC.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,969,855
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,969,858
- Issue date Apr 30, 2024
- Ebara Corporation
- Keisuke Namiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate holding apparatus, elastic membrane, polishing apparatus,...
- Patent number 11,958,163
- Issue date Apr 16, 2024
- Ebara Corporation
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Grant
Deformable substrate chuck
- Patent number 11,931,857
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier wafers and methods of forming carrier wafers
- Patent number 11,919,125
- Issue date Mar 5, 2024
- Corning Incorporated
- Lance Changyong Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Monolithic platen
- Patent number 11,919,126
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,911,872
- Issue date Feb 27, 2024
- Ebara Corporation
- Nobuyuki Takada
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control in chemical mechanical polish
- Patent number 11,904,430
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor manufacturing device and method of polishing semicond...
- Patent number 11,894,235
- Issue date Feb 6, 2024
- Lapis Semiconductor Co., Ltd.
- Kiyohiko Toshikawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250229378
- Publication date Jul 17, 2025
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD FOR SUBSTRATE POLISHING
- Publication number 20250205848
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Ashwin CHOCKALINGAM
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20250196286
- Publication date Jun 19, 2025
- WINBOND ELECTRONICS CORP.
- Min-Hsun Lin
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEMS AND METHODS
- Publication number 20250196287
- Publication date Jun 19, 2025
- Fraunhofer USA, Inc.
- Aaron HARDY
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR POLISHING A WAFER
- Publication number 20250170684
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Ju Bong LEE
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE
- Publication number 20250114902
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Avyay Panchapakesan
- B24 - GRINDING POLISHING
Information Patent Application
HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRAT...
- Publication number 20250114910
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Priscilla Diep LaRosa
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING-RING-LESS CMP PROCESS
- Publication number 20250114903
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
CMP INNER RING IN SMART HEAD
- Publication number 20250100105
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Michael Prestoza DECENA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING DEVICE, POLISHING METHOD, AND COMPUTER-READABLE STORAGE M...
- Publication number 20250041986
- Publication date Feb 6, 2025
- SANOH INDUSTRIAL CO., LTD.
- Hideo AIDA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING DEVICE, SUBSTRATE TREATING APPARATUS, AND POLISHING METHOD
- Publication number 20250018523
- Publication date Jan 16, 2025
- SCREEN Holdings Co., Ltd.
- Hiroaki ISHII
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240367282
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Hisashi SARUWATARI
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240367202
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES
- Publication number 20240371708
- Publication date Nov 7, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Hsiang CHAO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20240286242
- Publication date Aug 29, 2024
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...
- Publication number 20240226970
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Edwin VELAZQUEZ
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240213046
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Application
SUBSTRATE ROTATION PROCESSING DEVICE AND SUBSTRATE POLISHING DEVICE
- Publication number 20240207999
- Publication date Jun 27, 2024
- EBARA CORPORATION
- HIROKI MIYAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICO...
- Publication number 20240198479
- Publication date Jun 20, 2024
- SUMCO CORPORATION
- Hiroki OTA
- B24 - GRINDING POLISHING
Information Patent Application
MONOLITHIC PLATEN
- Publication number 20240181598
- Publication date Jun 6, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Lung LAI
- B24 - GRINDING POLISHING
Information Patent Application
DEFORMABLE SUBSTRATE CHUCK
- Publication number 20240173816
- Publication date May 30, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature Control in Chemical Mechanical Polish
- Publication number 20240149388
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20240149391
- Publication date May 9, 2024
- Tokyo Seimitsu Co., Ltd.
- Tadashi MURASATO
- B24 - GRINDING POLISHING
Information Patent Application
GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...
- Publication number 20240131562
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Edwin VELAZQUEZ
- B08 - CLEANING
Information Patent Application
MEMBRANE FAILURE DETECTION SYSTEM
- Publication number 20240109164
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Chang ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING

for single side lapping of plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature control in chemical mechanical polish

Monolithic platen

High throughput polishing modules and modular polishing systems

Carrier head for chemical mechanical polishing apparatus comprising...

Automatic abrasion compensation system of lower plate and wafer lap...

Chemical mechanical planarization equipment, wafer transfer method,...

Substrate transporter and substrate processing apparatus including...

Substrate processing apparatus and substrate processing method

Substrate holding apparatus, substrate suction determination method...

Coupling mechanism with spherical bearing, method of determining be...

Polishing and loading/unloading component module

Method of transferring semiconductor wafer to polishing apparatus a...

Carrier head membrane with regions of different roughness

Electrical cleaning tool for wafer polishing tool system

Chemical-mechanical polishing apparatus

Wafer loading bracket, wafer loading system, and wafer mounting met...

Systems and methods for suction pad assemblies

Polishing platens and polishing platen manufacturing methods

Elastic membrane, substrate holding device, and polishing apparatus

Carrier head having abrasive structure on retainer ring

Chemical-mechanical polishing system with a potentiostat and pulsed...

Filtering during in-situ monitoring of polishing

Substrate processing apparatus

Substrate holding apparatus, elastic membrane, polishing apparatus,...

Deformable substrate chuck

Carrier wafers and methods of forming carrier wafers

Monolithic platen

Substrate processing apparatus and substrate processing method

Temperature control in chemical mechanical polish

Semiconductor manufacturing device and method of polishing semicond...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

POLISHING HEAD FOR SUBSTRATE POLISHING

POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS

POLISHING SYSTEMS AND METHODS

APPARATUS FOR POLISHING A WAFER

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE

HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRAT...

RETAINING-RING-LESS CMP PROCESS

CMP INNER RING IN SMART HEAD

POLISHING DEVICE, POLISHING METHOD, AND COMPUTER-READABLE STORAGE M...

POLISHING DEVICE, SUBSTRATE TREATING APPARATUS, AND POLISHING METHOD

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

POLISHING METHOD AND POLISHING APPARATUS

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE ROTATION PROCESSING DEVICE AND SUBSTRATE POLISHING DEVICE

POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICO...

MONOLITHIC PLATEN

DEFORMABLE SUBSTRATE CHUCK

Temperature Control in Chemical Mechanical Polish

PROCESSING APPARATUS

GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL...

MEMBRANE FAILURE DETECTION SYSTEM

POLISHING APPARATUS

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM