Claims
- 1. A polishing pad comprising a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors, the fibers defining interstices, and said precursors filling said interstices substantially completely before completion of said reaction, wherein said polishing pad further comprises a polishing layer of free fibers, at least a portion of which have a segment thereof embedded in the matrix polymer of said body.
- 2. A polishing pad according to claim 1, wherein said polishing layer of free fibers has a thickness of about 2 mils or less.
- 3. Polishing pad according to claim 1, wherein said fibers comprise a fiber web formed by a nonwoven technique, including needle-punching, hydroentangling, chemical bonding, or air-through bonding, or by a woven technique, including weaving, knitting, or felting.
- 4. A polishing pad according to claim 3, wherein said fiber web has a Durometer hardness in the range of about 10 to about 90 Shore A.
- 5. A polishing pad according to claim 3, wherein said fiber web has a density in the range of about 0.15 to about 0.9 g/cc.
- 6. A polishing pad according to claim 1, wherein the fibers are made of a polyester, polypropylene, polyamide, rayon, polyimide, or polyphenylene, or a combination of said fibers.
- 7. A polishing pad according to claim 1, wherein said polymer is a solid or a porous polyurethane, polycarbonate, polymethylmethacrylate (PMMA) or epoxy.
- 8. A polishing pad according to claim 1, wherein after said reaction said pad has a Durometer hardness in the range of about 50 to about 100 Shore D.
- 9. A polishing pad according to claim 1, wherein said polymer is a solid polyurethane.
- 10. A polishing pad according to claim 1, wherein, after said reaction, said pad comprises about 20% to about 80% fibers by weight and about 80% to about 20% polymer by weight.
- 11. A polishing pad according to claim 1, wherein, after said reaction, said pad has a density in the range of about 0.5 to about 1.1 g/cc.
- 12. A polishing pad according to claim 1, wherein, after said reaction, said pad has a thickness in the range of about 10 to about 130 mils.
- 13. A polishing pad comprising a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors, the fibers defining interstices, and said precursors filling said interstices substantially completely before completion of said reaction, wherein said polishing pad further comprises a polishing layer of free fibers, at least a portion of which have a segment thereof embedded in the matrix polymer of said body, and wherein said reaction results from applying both pressure and heat to said polishing pad.
- 14. A polishing pad according to claim 13, wherein said polishing layer of free fibers has a thickness of about 2 mils or less.
- 15. A polishing pad according to claim 13, wherein said fibers comprise a fiber web formed by a nonwoven technique, including needle-punching, hydroentangling, chemical bonding, or air-through bonding, or by a woven technique, including weaving, knitting, or felting.
- 16. A polishing pad according to claim 15, wherein said fiber web has a Durometer hardness in the range of about 10 to about 90 Shore A.
- 17. A polishing pad according to claim 15, wherein said fiber web has a density in the range of about 0.15 to about 0.9 g/cc.
- 18. A polishing pad according to claim 13, wherein the fibers are made of a polyester, polypropylene, polyamide, rayon, polyimide, or polyphenylene, or a combination of said fibers.
- 19. A polishing pad according to claim 13, wherein said polymer is a solid or a porous polyurethane, polycarbonate, polymethylmethacrylate (PMMA) or epoxy.
- 20. A polishing pad according to claim 13, wherein after said reaction said pad has a Durometer hardness in the range of about 50 to about 100 Shore D.
- 21. A polishing pad according to claim 13, wherein said polymer is a solid polyurethane.
- 22. A polishing pad according to claim 13, wherein after said reaction, said pad comprises about 20% to about 80% fibers by weight and about 80% to about 20% polymer by weight.
- 23. A polishing pad according to claim 13, wherein, after said reaction, said pad has a density in the range of about 0.5 to about 1.1 g/cc.
- 24. A polishing pad according to claim 13, wherein, after said reaction, said pad has a thickness in the range of about 10 to about 130 mils.
RELATED APPLICATION
This application is a Continuation-in-part of U.S. patent application Ser. No. 09/599,514, filed Jun. 23, 2000, for a “Multilayered Polishing Pad, Method for Fabricating, and Uses Thereof”, and claims the benefit under 35 U.S.C. §119(e) of Provisional Application Serial No. 60/214,774, filed Jun. 29, 2000, and entitled “Grooved Polishing Pads and Methods of Use”, the entire contents of these applications being incorporated herein by reference.
US Referenced Citations (4)
Non-Patent Literature Citations (3)
Entry |
U.S. patent application Ser. No. 09/599,514, Chen et al., filed Jun. 23, 2000. |
U.S. patent application Ser. No. 09/605,869, Chen et al., filed Jun. 29, 2000. |
U.S. patent application Ser. No. 09/668,142, Chen et al., filed Sep. 25, 2000. |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/214774 |
Jun 2000 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09/599514 |
Jun 2000 |
US |
Child |
09/715184 |
|
US |