characterised by the shape of the lapping pad surface

Industry

CPC
B24B37/26

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/26characterised by the shape of the lapping pad surface

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing pad and preparation thereof
- Patent number 12,220,784
- Issue date Feb 11, 2025
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Microreplicated polishing surface with enhanced co-planarity
- Patent number 12,208,483
- Issue date Jan 28, 2025
- 3M Innovative Properties Company
- Kenneth A. P. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad, method for manufacturing polishing pad, and polishin...
- Patent number 12,186,855
- Issue date Jan 7, 2025
- Kuraray Co., Ltd.
- Mitsuru Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,172,263
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Michael Yen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, chemical-mechanical polishing system and method for...
- Patent number 12,128,522
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Bin Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Composition for polishing pad and polishing pad
- Patent number 12,122,013
- Issue date Oct 22, 2024
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Method of using polishing pad
- Patent number 12,070,833
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- ChunHung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Formulations for chemical mechanical polishing pads with high plana...
- Patent number 12,064,845
- Issue date Aug 20, 2024
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bryan E. Barton
- B24 - GRINDING POLISHING
Information Patent Grant
Surface projection polishing pad
- Patent number 12,048,980
- Issue date Jul 30, 2024
- 3M Innovative Properties Company
- Lian S. Tan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing articles and integrated system and methods for manufactur...
- Patent number 12,023,853
- Issue date Jul 2, 2024
- Applied Materials, Inc.
- Kasiraman Krishnan
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus
- Patent number 12,020,946
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ld.
- Yu-Ping Tseng
- B24 - GRINDING POLISHING
Information Patent Grant
Printing a chemical mechanical polishing pad
- Patent number 12,011,801
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Techniques for combining CMP process tracking data with 3D printed...
- Patent number 11,986,922
- Issue date May 21, 2024
- Applied Materials, Inc.
- Jason G. Fung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated abrasive polishing pads and manufacturing methods
- Patent number 11,980,992
- Issue date May 14, 2024
- Applied Materials, Inc.
- Ashavani Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Method for machining a workpiece in the production of an optical el...
- Patent number 11,980,990
- Issue date May 14, 2024
- Carl Zeiss SMT GmbH
- Manfred Matena
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method of forming a polishing article that has a desi...
- Patent number 11,964,359
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Ashwin Chockalingham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP pad construction with composite material properties using addit...
- Patent number 11,958,162
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, method for producing the same and method of fabricat...
- Patent number 11,951,591
- Issue date Apr 9, 2024
- SK ENPULSE CO., LTD.
- Hye Young Heo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pads with interconnected pores
- Patent number 11,951,590
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 11,951,589
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization pads with constant groove volume
- Patent number 11,938,584
- Issue date Mar 26, 2024
- CMC MATERIALS LLC
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,931,854
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, process for preparing the same, and process for prep...
- Patent number 11,931,856
- Issue date Mar 19, 2024
- SK ENPULSE CO., LTD.
- Sunghoon Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for CMP temperature control
- Patent number 11,919,123
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pads for high temperature processing
- Patent number 11,911,870
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Sivapackia Ganapathiappan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus for smoothing diamonds
- Patent number 11,897,087
- Issue date Feb 13, 2024
- Board of Trustees of Michigan State University
- Aaron Hardy
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with platen for substrate edge control
- Patent number 11,890,717
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Jay Gurusamy
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, semiconductor fabricating device and fabricating met...
- Patent number 11,883,926
- Issue date Jan 30, 2024
- Kioxia Corporation
- Takahiko Kawasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,883,923
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, polishing apparatus and method of manufacturing semi...
- Patent number 11,878,388
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEVERAGED POROMERIC POLISHING PAD
- Publication number 20250058426
- Publication date Feb 20, 2025
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Wei-Wen TSAI
- B24 - GRINDING POLISHING
Information Patent Application
MICROREPLICATED POLISHING PAD INCLUDING FLUORINATED POLYMER WINDOW
- Publication number 20250033162
- Publication date Jan 30, 2025
- 3M Innovative Properties Company
- Qin Lin
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF USING POLISHING PAD
- Publication number 20240359288
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- ChunHung CHEN
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...
- Publication number 20240359287
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20240304455
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing, Ltd.
- Yu-Ping TSENG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND WAFER NOTCH POLISHING METHOD
- Publication number 20240293911
- Publication date Sep 5, 2024
- NORITAKE CO., LIMITED
- Takamasa GOTO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
- Publication number 20240238937
- Publication date Jul 18, 2024
- CMC Materials LLC
- Paul Andre LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND POLISHING METHOD
- Publication number 20240227119
- Publication date Jul 11, 2024
- FUJIMI INCORPORATED
- Kyosuke Tenko
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF REPLACING POL...
- Publication number 20240217057
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Donghoon Kwon
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING T...
- Publication number 20240217059
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- WONKEUN CHO
- B24 - GRINDING POLISHING
Information Patent Application
ABRASIVE ARTICLES AND METHODS OF FORMING SAME
- Publication number 20240217058
- Publication date Jul 4, 2024
- Saint-Gobain Abrasives, Inc.
- Tony M. LANDES
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD WITH FLUORINATED POLYMER AND MULT...
- Publication number 20240207998
- Publication date Jun 27, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Matthew R. Gadinski
- B24 - GRINDING POLISHING
Information Patent Application
MICRO-LAYER CMP POLISHING SUBPAD
- Publication number 20240181596
- Publication date Jun 6, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Guanhua Hou
- B24 - GRINDING POLISHING
Information Patent Application
DUAL-LAYER CMP POLISHING SUBPAD
- Publication number 20240181597
- Publication date Jun 6, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Guanhua Hou
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240157504
- Publication date May 16, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND POLISHING METHOD
- Publication number 20240131654
- Publication date Apr 25, 2024
- FUJIMI INCORPORATED
- Kyosuke Tenko
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND PRECURSOR FORMULATIONS FOR FORMING ADVANCED POLISHING P...
- Publication number 20240123568
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Sivapackia GANAPATHIAPPAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL
- Publication number 20240100646
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Jay Gurusamy
- B24 - GRINDING POLISHING
Information Patent Application
WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD
- Publication number 20240075583
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING A POLISHING SHEET AND A POLISHING PAD
- Publication number 20240066661
- Publication date Feb 29, 2024
- SK enpulse Co., Ltd.
- Joonho AN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...
- Publication number 20240025010
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Puneet Narendra JAWALI
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
- Publication number 20240017376
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
- Publication number 20230415300
- Publication date Dec 28, 2023
- FUJIBO HOLDINGS, INC.
- Teppei TATENO
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK
- Publication number 20230415299
- Publication date Dec 28, 2023
- EBARA CORPORATION
- HIROYUKI SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
Polyurethanes, Polishing Articles and Polishing Systems Therefrom a...
- Publication number 20230383048
- Publication date Nov 30, 2023
- 3M Innovative Properties Company
- Joseph D. Rule
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF USING POLISHING PAD
- Publication number 20230339068
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- ChunHung CHEN
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITE PAD FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230339067
- Publication date Oct 26, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Zhan Liu
- B24 - GRINDING POLISHING
Information Patent Application
POROUS CHEMICAL MECHANICAL POLISHING PADS
- Publication number 20230330805
- Publication date Oct 19, 2023
- Applied Materials, Inc.
- Sivapackia GANAPATHIAPPAN
- B24 - GRINDING POLISHING
Information Patent Application
CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...
- Publication number 20230311269
- Publication date Oct 5, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- John R. McCormick
- B24 - GRINDING POLISHING
Information Patent Application
EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING
- Publication number 20230286107
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING

characterised by the shape of the lapping pad surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemical mechanical polishing pad and preparation thereof

Microreplicated polishing surface with enhanced co-planarity

Polishing pad, method for manufacturing polishing pad, and polishin...

Chemical mechanical planarization tool

Polishing head, chemical-mechanical polishing system and method for...

Composition for polishing pad and polishing pad

Method of using polishing pad

Formulations for chemical mechanical polishing pads with high plana...

Surface projection polishing pad

Polishing articles and integrated system and methods for manufactur...

Chemical mechanical polishing apparatus

Printing a chemical mechanical polishing pad

Techniques for combining CMP process tracking data with 3D printed...

Integrated abrasive polishing pads and manufacturing methods

Method for machining a workpiece in the production of an optical el...

Apparatus and method of forming a polishing article that has a desi...

CMP pad construction with composite material properties using addit...

Polishing pad, method for producing the same and method of fabricat...

Polishing pads with interconnected pores

Wafer edge asymmetry correction using groove in polishing pad

Chemical mechanical planarization pads with constant groove volume

Chemical mechanical polishing using time share control

Polishing pad, process for preparing the same, and process for prep...

Apparatus and method for CMP temperature control

Polishing pads for high temperature processing

Polishing apparatus for smoothing diamonds

Polishing system with platen for substrate edge control

Polishing pad, semiconductor fabricating device and fabricating met...

Chemical mechanical polishing using time share control

Polishing pad, polishing apparatus and method of manufacturing semi...

Patents Applicationslast 30 patents

LEVERAGED POROMERIC POLISHING PAD

MICROREPLICATED POLISHING PAD INCLUDING FLUORINATED POLYMER WINDOW

METHOD OF USING POLISHING PAD

SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING TH...

CHEMICAL MECHANICAL POLISHING APPARATUS

POLISHING PAD AND WAFER NOTCH POLISHING METHOD

CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME

POLISHING PAD AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF REPLACING POL...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING T...

ABRASIVE ARTICLES AND METHODS OF FORMING SAME

CHEMICAL MECHANICAL POLISHING PAD WITH FLUORINATED POLYMER AND MULT...

MICRO-LAYER CMP POLISHING SUBPAD

DUAL-LAYER CMP POLISHING SUBPAD

APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

POLISHING PAD AND POLISHING METHOD

METHODS AND PRECURSOR FORMULATIONS FOR FORMING ADVANCED POLISHING P...

POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL

WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD

METHOD FOR MANUFACTURING A POLISHING SHEET AND A POLISHING PAD

ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD

SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK

Polyurethanes, Polishing Articles and Polishing Systems Therefrom a...

METHOD OF USING POLISHING PAD

COMPOSITE PAD FOR CHEMICAL MECHANICAL POLISHING

POROUS CHEMICAL MECHANICAL POLISHING PADS

CMP POLISHING PAD WITH PROTRUDING STRUCTURES HAVING ENGINEERED OPEN...

EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING