Claims
- 1. A method for chemical-mechanical polishing of a field emission display grid, comprising polishing said grid with an aqueous polishing slurry containing 20% to 50% by weight colloidal particles of amorphous silica having an average diameter ranging from about 12 nm to about 50 nm, and a sufficient amount of an alkaline compound to such that the pH of said slurry is above about 9.5.
- 2. The method of claim 1 wherein the colloidal particles have an average diameter of about 25 nm.
- 3. The method of claim 1 where the aqueous polishing slurry comprises about 30% by weight colloidal particles.
- 4. The method of claim 1 wherein the alkaline compound is selected from potassium hydroxide and sodium hydroxide.
- 5. The method of claim 1 wherein the alkaline compound is sodium hydroxide.
- 6. The method of claim 1 wherein the pH of the slurry ranges from 9.5 to 12.0.
- 7. The method of claim 1 wherein the pH of the slurry ranges from 10.5 to 11.0.
- 8. The method of claim 1 wherein the polishing slurry further comprises ammonium ion stabilizer.
- 9. The method of claim 8 wherein the ammonium ion is present in the slurry in an amount ranging from about 0.1% to 0.3% by weight.
- 10. A method for chemical-mechanical polishing of a field emission display grid, comprising polishing said grid with an aqueous polishing slurry containing about 30% by weight colloidal particles of amorphous silica having an average diameter of about 25 nm, an ammonium ion stabilizer, and a sufficient amount of an alkaline compound such that the pH of said slurry ranges from 9.5-11.0.
- 11. A polished field emission display grid made according to the method of any one of claims 1-10.
Parent Case Info
This application claims benefit to Provisional Application No. 60/051,520 filed Jul. 2, 1997.
US Referenced Citations (5)
Provisional Applications (1)
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Number |
Date |
Country |
|
60/051520 |
Jul 1997 |
US |