Claims
- 1. A polyimide composite tube for use to heat fixing belts in electrophotographic printers, comprising a seamless cast thermosetting polyimide layer as a substrate, a conductive primer layer on the surface of said polyimide layer, and a baked fluororesin layer on the surface of said conductive primer layer, said polyimide composite tube being the product of the process comprising:
- coating a thermosetting polyimide precursor solution on an outside surface of a metallic cylinder, molding the coated thermosetting polyimide precursor solution with a ring die to produce a layer of uniform thickness of said thermosetting polyimide precursor solution on the surface of the metallic cylinder, generating an imide reaction in said layer by drying and heating said layer to carry said imide reaction partially to completion to form a partially cured thermosetting polyimide layer, applying a conductive primer layer and then a fluororesin layer to the partially cured polyimide layer, and heating the partially cured polyimide layer, the conductive layer and the fluororesin layer to complete the imide reaction and to bake the fluororesin layer at the same time.
- 2. A polyimide composite tube according to claim 1 manufactured by the steps of:
- coating a polyimide precursor solution on the outside surface of a metallic cylinder;
- casting the coated polyimide precursor solution with a metallic ring at a uniform thickness;
- generating a halfway imide reaction by drying and heating said polyimide precursor solution coated on said metallic cylinder, thereby forming a half-hard polyimide layer;
- coating a conductive primer layer and then fluororesin layer on the surface of said half-hard polyimide layer; and
- heating said half-hard polyimide layer coated with said conductive primer layer and fluororesin layer to complete the imide reaction and bake said fluororesin layer at the same time.
- 3. A polyimide composite tube according to claim 1, wherein the seamless polyimide layer has a thickness of from 3 .mu.m to 500 .mu.m.
- 4. A polyimide composite tube according to claim 1, wherein the conductive primer layer comprises at least one compound selected from the group consisting of polyphenylenesulfide, polyethersulfone, polysulfone, polyamideimide, polyimide, derivative of polyphenylenesulfide, derivative of polyethersulfone, derivative of polysulfone, derivative of polyamideimide, derivative of polyimide, and fluororesin.
- 5. A polyimide composite tube according to claim 1, wherein the conductive primer layer has a thickness of from 0.5 .mu.m to 10 .mu.m, and wherein said baked fluororesin layer covers less than the entire conductive primer layer so as to provide an exposed area of said conductive primer layer.
- 6. A polyimide composite tube according to claim 1, wherein the conductive primer layer has a surface electrical resistance of from 1.times.10.sup.-2 .OMEGA..multidot.cm to 1.times.10.sup.7 .OMEGA..multidot.cm.
- 7. A polyimide composite tube according to claim 1, wherein the conductive primer layer comprises 1-40% by weight of carbon powder.
- 8. A polyimide composite tube according to claim 1, wherein the fluororesin is at least one compound selected from the group consisting of polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinylether copolymer, and tetrafluoroethylene-hexafluoropropylene copolymer.
- 9. A polyimide composite tube according to claim 1, wherein the fluororesin layer has a thickness of from 2 .mu.m to 30 .mu.m.
- 10. A polyimide composite tube according to claim 1, wherein the fluororesin layer comprises 0.1-3.0% by weight of carbon powder.
- 11. A method of manufacturing a polyimide composite tube comprising:
- coating a polyimide precursor solution on an outside surface of a metallic cylinder;
- casting the coated polyimide precursor solution with a metallic ring at a uniform thickness;
- generating a halfway imide reaction by drying and heating said polyimide precursor solution coated on said metallic cylinder, thus forming a half-hard polyimide layer;
- coating a conductive primer layer and then fluororesin layer on the surface of said half-hard polyimide layer; and
- heating the half-hard polyimide layer coated with said conductive primer layer and fluororesin layer to complete the imide reaction and bake said fluororesin layer at the same time.
- 12. A method according to claim 11, wherein the reduction ratio of the thickness of the polyimide precursor solution at the halfway imide reaction is from 50% to 95%, and wherein said reduction ratio is expressed as follows:
- x={(V.sub.o -V.sub.a)/V.sub.o }.times.100, Formula A
- wherein x represents said reduction ratio;
- V.sub.o represents the thickness of said polyimide precursor solution right after the application of said solution; and
- V.sub.a represents the thickness of the half-hard polyimide layer at the midway imide reaction.
- 13. A method according to claim 11, wherein the fluororesin is at least one compound dispersion, wherein said compound is selected from the group consisting of polytetrafluoroethylene, tetrafluoroethyleneperfluoroalkylvinylether copolymer, and tetrafluoroethylenehexafluoropropylene copolymer, and wherein said fluororesin is coated on a surface of the metallic cylinder by a dipping and holding method.
- 14. A method according to claim 11 or 13, wherein the fluororesin is mixed with carbon black.
- 15. A method according to claim 11, wherein the conductive primer is coated on a surface of the half-hard polyimide layer adhered to a surface of the metallic cylinder, and wherein the fluororesin is then coated on a surface of the conductive primer.
- 16. A method according to claim 11, wherein the fluororesin is coated on a surface of the conductive primer while the metallic cylinder is rotating.
- 17. A method according to claim 11, wherein the polyimide precursor solution is an aromatic polyimide precursor, and wherein said polyimide precursor solution has a viscosity of from 50 poise to 10000 poise.
- 18. A method according to claim 11, wherein the coated polyimide precursor solution has a thickness of from 10 .mu.m to 1000 .mu.m.
- 19. A method according to claim 11, wherein a metallic mold is arranged outside of the metallic cylinder at a constant distance, and wherein at least one of said metallic cylinder and said metallic mold is shifted, thus molding the polyimide precursor solution on the surface of said metallic cylinder at a uniform thickness.
- 20. A method according to claim 11, wherein the conductive primer layer comprises 1-40% by weight of carbon powder.
- 21. A method according to claim 11, wherein the conductive primer is coated on the surface of the half-hard polyimide layer while the metallic cylinder is rotating.
Priority Claims (1)
Number |
Date |
Country |
Kind |
5-284576 |
Nov 1993 |
JPX |
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Parent Case Info
This application is a continuation of U.S. application Ser. No. 08/167,360, filed Dec. 16, 1993, now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5021109 |
Petropoulos et al. |
Jun 1991 |
|
Foreign Referenced Citations (4)
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Country |
436033 |
Oct 1991 |
EPX |
1-156017 |
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JPX |
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JPX |
3-261518 |
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JPX |
Non-Patent Literature Citations (3)
Entry |
Database WPI; Week 9012; Derwent Publications Ltd., London, GB; AN 90-088400 & JP-A-02 043 046 (Nitto Denko) 13 Feb. 1990 *abstract*. |
Database WPI; Week 9330; Derwent Publications Ltd., London, GB; AN 93-240082 & JP-A-05 163 360 (Nitto Denko) 29 Jun. 1993 *abstract*. |
Database WPI; Week 9329; Derwent Publications Ltd., London, GB; AN 93-231999 & JP-A-05 154 963 (Nitto Denko) 22 Jun. 1993 *abstract*. |
Continuations (1)
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Number |
Date |
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Parent |
167360 |
Dec 1993 |
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