Claims
- 1. A polyimide composite tube for use to heat fixing belts in electrophotographic printers, comprising a seamless cast thermosetting polyimide layer as a substrate, a conductive primer layer on the surface of said polyimide layer, and a baked fluororesin layer on the surface of said conductive primer layer.
- 2. A polyimide composite tube according to claim 1, wherein the seamless polyimide layer has a thickness of from 3 .mu.m to 500 .mu.m.
- 3. A polyimide composite tube according to claim 1, wherein the conductive primer layer comprises at least one compound selected from the group consisting of polyphenylenesulfide, polyethersulfone, polysulfone, polyamideimide, polyimide, derivative of polyphenylenesulfide, derivative of polyethersulfone, derivative of polysulfone, derivative of polyamideimide, derivative of polyimide, and fluororesin.
- 4. A polyimide composite tube according to claim 1, wherein the conductive primer layer has a thickness of from 0.5 .mu.m to 10 .mu.m, and wherein said conductive primer layer comprises an exposed area.
- 5. A polyimide composite tube according to claim 1, wherein the conductive primer layer has a surface electrical resistance of from 1.times.10.sup.-2 .OMEGA..multidot.cm to 1.times.10.sup.7 .OMEGA..multidot.cm.
- 6. A polyimide composite tube according to claim 1, wherein the conductive primer layer comprises 1-40% by weight carbon powder.
- 7. A polyimide composite tube according to claim 1, wherein the fluororesin is at least one compound selected from the group consisting of polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinylether copolymer, and tetrafluoroethylene-hexafluoropropylene copolymer.
- 8. A polyimide composite tube according to claim 1 wherein the fluororesin layer has a thickness of from 2 .mu.m to 30 .mu.m.
- 9. A polyimide composite tube according to claim 1, wherein the fluororesin layer comprises 0.1-3.0% by weight carbon powder.
Priority Claims (1)
Number |
Date |
Country |
Kind |
5-284576 |
Nov 1993 |
JPX |
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Parent Case Info
This application is a continuation of U.S. application Ser. No. 08/531,297 filed Sep. 20, 1995, now U.S. Pat. No. 5,582,886 which is a continuation of Ser. No. 08/167,360, filed December 16, 1993, now abandoned.
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Continuations (2)
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Number |
Date |
Country |
Parent |
531297 |
Sep 1995 |
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Parent |
167360 |
Dec 1993 |
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