Claims
- 1. A polymerizable oligomer selected from the group consisting of polyamic acids, corresponding amic esters, corresponding isoimides, corresponding imides, and mixtures thereof, and wherein said polymerizable oligomer is end-capped with a diaryl substituted acetylene (DASA) having the general formula: ##STR14## wherein m=0 to 5, L=0 to 4, R and R.sup.1 are independently selected from the group consisting of halogen, C.sub.1 -C.sub.4 alkyl, alkoxy, aryloxy, haloaryl, haloalkyl, haloacyl, aryl, and acyl, and X is a linking group to the oligomer backbone selected from the group consisting of NH.sub.2, CHO, isocyanate, anhydride, carboxylic acid, ester, and acyl halide; provided that m or L.noteq.0 when the oligomer backbone is composed of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 1,3-bis(3-amino-phenoxy) benzene and X=NH.sub.2 ; and said polymerizable oligomer must have a glass transition temperature (Tg) greater than 135.degree. C. after imidization, but prior to the onset of cure of the DASA end-caps.
- 2. The cured polyimide according to claim 1.
- 3. The oligomer according to claim 1, having a glass transition temperature (Tg) greater than 160.degree. C. after imidization, but prior to the onset of cure of the DASA end caps.
- 4. The oligomer according to claim 1, wherein DASA has the structure: ##STR15##
- 5. The polymerizable oligomer according to claim 1, having the following general formula:
- (DASA)--B.sub.p --(AB)--.sub.n A.sub.r --(DASA)
- where A is a diamine, B is a dianhydride or a tetracid, tetraester, diester diacid, or dihaloformyldiester of a dianhydride or combinations thereof, (AB).sub.n is the reaction product of A and B, n is 0 to 100, p and r are 0 or 1, but p is 0 when r is 1, and p is 1 when r is 0.
- 6. The oligomer according to claim 5, wherein the diamine is a primary aromatic diamine selected from the group consisting of phenylene diamine, oxydianiline, bisanilines, and mixtures thereof.
- 7. A monomeric mixture of A, DASA and B, wherein B is selected from the group consisting of either a tetracid, tetraester or a diacid diester of a dianhydride, A and DASA are defined as in claim 5 to produce said polymerizable oligomer according to claim 5 upon heating.
- 8. The oligomer according to claim 5, wherein the dianhydride is an aromatic dianhydride selected from the group consisting of benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, pyromellitic dianhydride, oxydiphthalic-dianhydride, 5,5'-[2,2,2-trifluoro-1-(trifluoromethyl)ethylidene]bis-1,3-isobenzofurandione (6FDA), and mixtures thereof.
- 9. The oligomer according to claim 5, wherein the dianhydride is benzophenone tetracarboxylic dianhydride, the diamine is bisaniline, and n is 1 to 15.
- 10. The oligomer according to claim 5, wherein the dianhydride is biphenyl tetracarboxylic dianhydride, the diamine is phenylene diamine and n is 1 to 15.
- 11. The oligomer according to claim 5, wherein the dianhydride is 5,5'-[2,2,2-trifluoro-1-(trifluoromethyl)ethylidene] bis-1,3-isobenzofurandione, the diamine is 1,4-phenylene diamine and n is 1 to 15.
- 12. The oligomer according to claim 5, wherein the dianhydride is 3,4,3',4'-oxydiphthalic dianhydride, the diamine is 4,4'-oxydianiline and n is 1 to 15.
- 13. A polymerizable oligomer selected from the group consisting of polyamic acids, corresponding amic esters, corresponding isoimides, corresponding imides, and mixtures thereof, and wherein said polymerizable oligomer is end-capped with a diaryl substituted acetylene (DASA) having the general formula: ##STR16## wherein m=0 to 5, R is selected from the group consisting of halogen, C.sub.1 -C.sub.4 alkyl, alkoxy, aryloxy, haloaryl, haloalkyl, haloacyl, aryl, and acyl, R.sup.10 is --O--, --S--, --C(CF.sub.3).sub.2 --, SO.sub.2, ##STR17## --CH.sub.2 --, or --C(CH.sub.3).sub.2 --, and X is a linking group to the oligomer backbone selected from the group consisting of NH.sub.2, CHO, isocyanate, anhydride, carboxylic acid, ester, and acyl halide.
- 14. The oligomer according to claim 13, wherein DASA has the structure: ##STR18##
- 15. A composite prepared by combining reinforcing fibers with a polymerizable oligomer selected from the group consisting of polyamic acids, corresponding amic esters, corresponding isoimides, corresponding imides, and mixtures thereof, and wherein said polymerizable oligomer is end-capped with a diaryl substituted acetylene (DASA) having the general formula: ##STR19## wherein m=0 to 5, L=0 to 4, R and R.sup.1 are independently selected from the group consisting of halogen, C.sub.1 -C.sub.4 alkyl, alkoxy, aryloxy, haloaryl, haloalkyl, haloacyl, aryl and acyl, and X is a linking group to the oligomer backbone selected from the group consisting of NH.sub.2, CHO, isocyanate, anhydride, carboxylic acid, ester, and acyl halide; provided that m or L.noteq.0 when the oligomer backbone is composed of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 1,3-bis(3-amino-phenoxy) benzene and X=NH.sub.2, said oligomer having a glass transition temperature (Tg) greater than 135.degree. C. after imidization, but prior to the onset of cure of the DASA end-caps.
- 16. The composite according to claim 15, wherein the fibers are carbon, aramid, glass, quartz, or silicon carbide.
- 17. A molded article prepared from the composition according to claim 1.
- 18. A molded article according to claim 17 prepared from a mixture of the polymerizable oligomer and less than 60 volume % filler.
- 19. An electronic device containing or encapsulated with a cured oligomer according to claim 2.
- 20. A method for forming dielectrically isolated island regions in a semiconductor substrate comprising:
- (a) forming in said substrate a recess trench pattern defining a plurality of isolated island regions,
- (b) filling said trenches with a composition containing the oligomer according to claim 1,
- (c) curing said composition in situ in the trenches to form an imidized three dimensional dielectric polyimide therein.
- 21. A method of forming multilevel metallurgy on a substrate having an integrated circuit device, comprising:
- (a) applying a coating composition containing the oligomer according to claim 1 to the surface of said substrate comprising the integrated circuit device thereby filling and substantially planarizing the substrate surface,
- (b) curing the composition to form a three dimensional imidized layer thereof,
- (c) forming via openings in the imidized layer extending to conductive portions of the integrated circuit device, and
- (d) forming a conductive pattern on the imidized layer and the openings to at least one of the underlaying conductive portions of the integrated circuit device.
- 22. An electronic component comprising an electric insulator that isolates portions of a substrate having circuitry formed therein containing the oligomer according to claim 2.
- 23. A substrate having a plurality of vertically spaced conductor patterns interconnected to each other and separated by an electric insulator therebetween, said insulator containing the curable composition according to claim 1, said curing being effected prior to the inclusion of an overlaying layer on said conductor pattern.
- 24. A semiconductor substrate containing isolated island regions separated by a trench pattern containing in situ cured polyimide obtained by curing a composition containing the oligomer according to claim 1.
- 25. A semiconductor substrate comprising isolated regions wherein said isolated regions comprise deep dielectric isolation cavities filled with a polyimide, and wherein said polyimide is obtained by in situ curing a composition containing the oligomer according to claim 1.
- 26. An adhesive containing the oligomer according to claim 1.
- 27. An adhesive according to claim 26, wherein the adhesive contains a thermally conductive filler selected from the group consisting of magnesium oxide, calcium carbonate, silicon dioxide, titanium dioxide, alumina, and diamond.
- 28. An adhesive according to claim 26, wherein the filler is electrically conductive and selected from the group consisting of powdered or flaked metal, or a mixture of powdered and flaked metal.
- 29. A composite prepared by combining reinforcing fibers with a polymerizable oligomer selected from the group consisting of polyamic acids, corresponding amic esters, corresponding isoimides, corresponding imides, and mixtures thereof, and wherein said polymerizable oligomer is end-capped with a diaryl substituted acetylene (DASA) having the general formula: ##STR20## wherein m=0 to 5, R is independently selected from the group consisting of halogen, C.sub.1 -C.sub.4 alkyl, alkoxy, aryloxy, haloaryl, haloalkyl, haloacyl, aryl and acyl, R.sup.10 is --O--, --S--, --C(CF.sub.3).sub.2 --, --SO.sub.2 --, ##STR21## --CH.sub.2 --, or --C(CH.sub.3).sub.2 --, and X is a linking group to the oligomer backbone selected from the group consisting of NH.sub.2, CHO, isocyanate, anhydride, carboxylic acid, ester, and acyl halide.
- 30. A moled article prepared from the composition according to claim 13.
- 31. An electronic device containing or encapsulated with the cured oligomer of claim 13.
- 32. An adhesive containing the oligomer according to claim 13.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 07/482,362 filed Feb. 20, 1990, now abandoned.
US Referenced Citations (9)
Non-Patent Literature Citations (4)
Entry |
T. Takeichi and J. K. Stille, Macromolecules, 19 2108 (1986). |
M. R. Unroe, et al., ACS Polymer Preprint, 26 (1) 136 (1985). |
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Continuation in Parts (1)
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Number |
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482362 |
Feb 1990 |
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