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H01L23/293

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/293Organic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation structure
- Patent number 12,365,758
- Issue date Jul 22, 2025
- Industrial Technology Research Institute
- Cheng-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package cavities with polymer films
- Patent number 12,347,738
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of three-dimensional integrated circuit by encapsulation...
- Patent number 12,347,763
- Issue date Jul 1, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a resin member having a rib includi...
- Patent number 12,347,741
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Nobuyoshi Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with improved inspectability of stacked semico...
- Patent number 12,334,418
- Issue date Jun 17, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitor wafer and method of using the same
- Patent number 12,325,054
- Issue date Jun 10, 2025
- United Microelectronics Corp.
- Chih-Chieh Tsai
- B08 - CLEANING
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyamideimide resin, resin composition, and semiconductor device
- Patent number 12,319,814
- Issue date Jun 3, 2025
- Resonac Corporation
- Gaku Hashimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Edge encapsulation for high voltage devices
- Patent number 12,315,770
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Timothy Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages with wavelength-specific light filters
- Patent number 12,317,638
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Jo Bito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,300,587
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including stress buffering layer
- Patent number 12,300,677
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip heat dissipating structure, chip structure, circuit board and...
- Patent number 12,261,108
- Issue date Mar 25, 2025
- BITMAIN TECHNOLOGIES INC.
- Lei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for curable resins, cured product of said composition,...
- Patent number 12,258,472
- Issue date Mar 25, 2025
- ENEOS Corporation
- Yoshinori Nishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging film and preparation method thereof, and filter chip pack...
- Patent number 12,252,613
- Issue date Mar 18, 2025
- WUHAN CHOICE TECHNOLOGY CO., LTD.
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,250
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,224,184
- Issue date Feb 11, 2025
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including a protection layer
- Patent number 12,198,999
- Issue date Jan 14, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 12,183,646
- Issue date Dec 31, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...
- Publication number 20250239535
- Publication date Jul 24, 2025
- IBIDEN CO., LTD.
- Yuichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
- Publication number 20250233033
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- HUNG-TA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20250218989
- Publication date Jul 3, 2025
- INTELPRO INC.
- Lung-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIAZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID TRIAZOLE COMPOUND,...
- Publication number 20250206764
- Publication date Jun 26, 2025
- SHIKOKU CHEMICALS CORPORATION
- Koji TAKASAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250210530
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITI...
- Publication number 20250188223
- Publication date Jun 12, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Binod B. De
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...
- Publication number 20250174565
- Publication date May 29, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
- Wei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...
- Publication number 20250174573
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYESTER RESIN, RESIN COMPOSITION, CURED PRODUCT THEREOF, AND USE...
- Publication number 20250163228
- Publication date May 22, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...
- Publication number 20250155489
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Akio MATSUSHITA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250157868
- Publication date May 15, 2025
- United Microelectronics Corp.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging module and manufacturing method therefor
- Publication number 20250157903
- Publication date May 15, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jian WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ENCAPSULATION LAYERS
- Publication number 20250149507
- Publication date May 8, 2025
- SK HYNIX INC.
- Jae Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
- Publication number 20250140769
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yunyi Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ISOLATED DIES
- Publication number 20250140624
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hau NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FIXING PROTECTIVE MEMBER
- Publication number 20250140622
- Publication date May 1, 2025
- Disco Corporation
- Noboru TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...
- Publication number 20250140623
- Publication date May 1, 2025
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Zhiqiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140629
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Shingo HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Flexible Encapsulant Ove...
- Publication number 20250132211
- Publication date Apr 24, 2025
- JCET STATS ChipPAC Korea Limited
- YeoJun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...
- Publication number 20250132266
- Publication date Apr 24, 2025
- Universal Global Technology(Shanghai)Co.,Ltd.
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Anisotropic Thermal Dissipation Structure
- Publication number 20250125213
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Kun LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multifunctional Adhesion Promoter for Semiconductor Device Packages
- Publication number 20250122413
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGING METHOD AND PACKAGING BODY
- Publication number 20250125306
- Publication date Apr 17, 2025
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125229
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Taejun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Structure with Stress-Release Pattern to Enhance Package Yield
- Publication number 20250118683
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118626
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Encapsulation structure

Sensor package cavities with polymer films

Packaging of three-dimensional integrated circuit by encapsulation...

Semiconductor device comprising a resin member having a rib includi...

Semiconductor module with improved inspectability of stacked semico...

Monitor wafer and method of using the same

Chip package and method of forming the same

Polyamideimide resin, resin composition, and semiconductor device

Edge encapsulation for high voltage devices

Sensor packages with wavelength-specific light filters

Electronic component module

Semiconductor device package including stress buffering layer

Die interconnect substrate, an electrical device and a method for f...

Package structure and method for forming same

Semiconductor device and method for manufacturing the same

Reinforcing resin composition, electronic component, method for man...

Metal-bump sidewall protection

Flip chip package unit and associated packaging method

Chip heat dissipating structure, chip structure, circuit board and...

Composition for curable resins, cured product of said composition,...

Packaging film and preparation method thereof, and filter chip pack...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor package and method manufacturing the same

Semiconductor package

Package structure with warpage-control element

Methods for registration of circuit dies and electrical interconnects

Semiconductor module and power conversion apparatus

Electronic package including a protection layer

Semiconductor device with a dielectric between portions

Semiconductor package and method manufacturing the same

Patents Applicationslast 30 patents

COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPON...

PACKAGING STRUCTURE AND PREPARING METHOD THEREOF

Electronic Component

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

TRIAZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID TRIAZOLE COMPOUND,...

ELECTRONIC COMPONENT

POLYIMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITI...

EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...

PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...

POLYESTER RESIN, RESIN COMPOSITION, CURED PRODUCT THEREOF, AND USE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...

SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

Packaging module and manufacturing method therefor

SEMICONDUCTOR PACKAGE INCLUDING ENCAPSULATION LAYERS

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK

PACKAGES WITH ISOLATED DIES

METHOD OF FIXING PROTECTIVE MEMBER

HIGH-TEMPERATURE WIDE BANDGAP POWER MODULE AND PREPARATION METHOD T...

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Flexible Encapsulant Ove...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...

Integrated Circuit with Anisotropic Thermal Dissipation Structure

Multifunctional Adhesion Promoter for Semiconductor Device Packages

PACKAGING METHOD AND PACKAGING BODY

SEMICONDUCTOR DEVICE

IC Structure with Stress-Release Pattern to Enhance Package Yield

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...