Claims
- 1. A method for producing a photo resist comprising:
- (a)
- (1) providing a composition containing a polymer wherein the polymer consists essentially of a polymer having the formula: ##STR6## wherein R.sub.1 is hydrogen, methyl or ethyl, R.sub.2 is alkyl of from 1 to 6 carbon atoms, R.sub.3 is alkyl, aryl or alkylaryl, (PE) is selected from the group consisting of polyethers, polyesters and mixtures thereof, x is an integer of from 2 to 50 and R.sub.4 is alkyl, alkene, aryl or alkyl or alicyclic.
- (2) a photo initiator;
- (b) coating said composition onto at least a portion of a printed circuit board blank; and
- (c) contacting at least parts of said coated printed circuit board blank with actinic light radiation.
- 2. A method for producing a photo resist as in claim 1 wherein said composition contains an additive having the formula: ##STR7## wherein R.sub.4 is hydrogen, methyl or ethyl, R.sub.5 is alkyl of from 1 to 6 carbon atoms and R.sub.6 is alkyl, alkene, aryl or alkyl or alicyclic.
- 3. A method for producing a photo resist as in claim 1 wherein said photoinitiator is selected from the group consisting of benzophenone, acetophenone, acenaphthenequinone, O-methoxybenzophenone, dibenzosuberone, anthraquinone, hexanophenone and 2,2-dimethoxy 2-phenyl acetophenone.
- 4. A method for producing a photo resist as in claim 2 wherein said composition contains a multifunctional acrylate.
- 5. A method for producing a photo resist as in claim 4 wherein said composition additionally contains a multifunctional thiol.
- 6. A method for producing a hot melt photo resist comprising:
- (a)
- (1) providing a composition containing a polymer having the formula: ##STR8## wherein R.sub.1 is hydrogen, methyl or ethyl, R.sub.2 is alkyl of from 1 to 6 carbon atoms, --PE-- is selected from the group consisting of polyethers, polyesters and mixtures thereof, x is an integer of from 2 to 50 and R.sub.4 is alkyl, alkene, aryl or alicyclic, and
- (2) a photo initiator;
- (b) heating said composition to more than 50.degree. C. and coating said composition onto at least a part of a circuit board blank;
- (c) cooling said coated circuit board blank to less than 50.degree. C.
- (d) contacting at least part of said coated circuit board blank with actinic light radiation.
- 7. A method for producing a hot melt photo resist as in claim 2 wherein said photoinitiator is selected from the group consisting of benzophenone, acetophenone, acenaphthenequinone, O-methoxybenzophenone, dibenzosubenone, anthraquinone, hexanophenone and 2,2-dimethoxy-2-phenyl acetophenone.
- 8. A method for producing a hot melt photo resist as in claim 6 wherein said composition contains a multifunctional acrylate.
- 9. A method for producing a hot melt photo resist as in claim 8 wherein said composition contains a multifunctional thiol.
- 10. A method for producing a photo resist comprising:
- (a)
- (1) providing a composition containing a polymer having the formula: ##STR9## wherein R.sub.1 is hydrogen, methyl or ethyl, R.sub.2 is alkyl of from 1 to 6 carbon atoms, R.sub.3 is alkyl, aryl or alkylaryl, (PE) is selected from the group consisting of polyethers, polyesters and mixtures thereof, x is an integer of from 2 to 50 and R.sub.4 is alkyl, alkene, aryl or alkyl or alicyclic;
- (2) a photo initiator;
- (3) an additive having the formula: ##STR10## wherein R.sub.4 is hydrogen, methyl or ethyl, R.sub.5 is alkyl of from 1 to 6 carbon atoms and R.sub.6 is alkyl, alkene, aryl or alkyl or alicyclic;
- (4) and chain bridging agents selected from the group consisting of multifunctional acrylates and thiols;
- (b) coating said composition onto at least a portion of a printed circuit board blank; and
- (c) contacting at least parts of said coated printed circuit board blank with actinic light radiation.
- 11. A method for producing a photoresist comprising:
- (a)
- (1) providing a composition containing a polymer composition wherein the polymer composition consists essentially of a polymer having a molecular weight of about 250 to 10,000 and acid content of about 0.1 to 4.0 millequivalents/gram comprising a terminal carboxyl group at one end and a single terminal alkene unsaturation at the other end, said carboxyl group and alkene unsaturation being in a ratio on said polymer of about 1 to 1.
- (2) a photoinitiator;
- (b) coating said composition onto at least a portion of a printed circuit board blank; and
- (c) contacting at least parts of said coated printed circuit board blank with actinic light radiation.
- 12. A method for producing a photo resist as in claim 11 wherein said composition contains an additive having the formula: ##STR11## wherein R.sub.4 is hydrogen, methyl or ethyl, R.sub.5 is alkyl of from 1 to 6 carbon atoms and R.sub.6 is alkyl, alkene, aryl or alkyl or alicyclic.
- 13. A method for producing a photo resist as in claim 11 wherein said photoinitiator is selected from the group consisting of benzophenone, acetophenone, acenaphthenequinone, O-methoxybenzophenone, dibenzosuberone, anthraquinone, hexanophenone and 2,2-dimethoxy 2-phenyl acetophenone.
- 14. A method for producing a photo resist as in claim 12 wherein said composition contains a multifunctional acrylate.
- 15. A method for producing a photo resist as in claim 14 wherein said composition additionally contains a multifunctional thiol.
Parent Case Info
This application is a division, of application Ser. No. 06/225,809, filed Jan. 16, 1981, now U.S. Pat. No. 4,422,914.
US Referenced Citations (17)
Foreign Referenced Citations (7)
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1289075 |
Sep 1972 |
GBX |
1489425 |
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GBX |
1507808 |
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Divisions (1)
|
Number |
Date |
Country |
Parent |
225809 |
Jan 1981 |
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