Claims
- 1. A thermally conductive, non-electrically conductive molding composition having a thermal conductivity of at least 22W/m° K, comprising:a liquid crystal polymer base matrix; a thermally conductive, electrically conductive carbon flake filler loaded in said polymer base matrix; and a layer of thermally conductive and non-electrically conductive boron nitride coated on said thermally conductive filler, said coating encapsulating said carbon flake filler to provide a layer of electrical insulation around said filler.
- 2. A method of molding an electrically non-conductive, thermally conductive composition, having a thermal conductivity of at least 22W/m° K comprising the steps of:providing a liquid crystal polymer bass matrix material; providing a thermally conductive, electrically conductive carbon flake filler material; coating said filler material with boron nitride, said coating encapsulating said carbon flake filler to provide a layer of electrical insulation around said filler; mixing said filler material with said base matrix into a mixture; and molding said mixture into a net-shape molded article, wherein said article is thermally conductive and electrically non-conductive.
Parent Case Info
This application claims the benefit of Provisional Application No. 60/175,436, filed Jan. 11, 2000.
US Referenced Citations (41)
Foreign Referenced Citations (1)
Number |
Date |
Country |
WO9900325 |
Jul 1999 |
EP |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/175436 |
Jan 2000 |
US |