Claims
- 1. A thickened organic polymeric molding composition from which is absent an inorganic thickener selected from metal oxides and hydroxides and which said composition comprises a cooled mixture of:
- a cross-linkable base resin dissolved in an unsaturated monomer; and
- as a thickener and shrinkage control agent, an additive resin having a minimum of 8 and a maximum of 40 repeating units and selected from saturated polyesters and saturated amide waxes; said additive resin being crystalline at ambient temperature and having a melting point (T.sub.m) below a temperature (T.sub.c) at which the base resin cross-linking reaction proceeds at a significant rate; said additive resin and said base resin having a solubility parameter difference therebetween in the range 1 to 3.5 MPa.sup.1/2, whereby said additive resin is only partially compatible with the base resin;
- said partial degree of compatibility allowing crystallization of said additive in said mixture upon cooling from a temperature between T.sub.m and T.sub.c to a temperature between T.sub.m and ambient;
- whereby,
- (a) due to said cooling of said mixture from a temperature between T.sub.m and T.sub.c to a temperature below T.sub.m to produce said cooled mixture, said additive resin is in the form of crystals thereof distributed throughout the mixture, said crystallization thereby rendering the mixture thickened in the absence of a thickener selected from metal oxides and hydroxides; and
- (b) when the mixture is heated to a temperature above T.sub.m, said mixture is capable of melting and reversibly breaking down to enable said additive resin, in a molten state, to render the composition capable of shrinkage control during molding.
- 2. A composition as claimed in claim 1 wherein the solubility parameter difference is in the range 1.0 to 2.5 MPa.sup.1/2.
- 3. A composition as claimed in claim 1 wherein the base resin is an unsaturated polyester resin.
- 4. A composition as claimed in claim 3 wherein the monomeric solvent for the resin is a vinyl monomer.
- 5. A composition as claimed in claim 1 wherein the vinyl monomer is styrene.
- 6. A composition as claimed in claim 1 wherein the additive resin is a saturated polyester.
- 7. A composition as claimed in claim 6 wherein the polyester is polyethylene adipate or polyhexamethylene adipate.
- 8. The composition of claim 1 wherein the additive resin has a number average molecular weight of from about 1500 to about 3000.
- 9. The composition of claim 8, wherein the additive resin has a number average molecular weight of about 2000.
- 10. A composition as claimed in claim 1 wherein the amount of additive resin is 20 to 40% by weight of the base resin.
- 11. A composition as claimed in claim 1 comprising a free radical catalyst.
- 12. A composition as claimed in claim 1 comprising reinforcement.
- 13. A sheet moulding compound comprised of a composition as claimed in claim 12.
- 14. A granular moulding compound which comprises granules of a composition as claimed in claim 12.
- 15. A moulding compound comprised of a dough with a composition as claimed in claim 12.
- 16. A molded article produced from a cooled thickened organic polymeric composition capable of resisting post-molding shrinkage after being cross-linked, the thickened composition having absent therefrom an inorganic thickening agent selected from metal oxides and hydroxides and comprising:
- a cross-linkable base resin dissolved in an unsaturated monomer; and
- as a thickener and shrinkage control agent, an additive resin having a minimum of 8 and a maximum of 40 repeating units selected from the group consisting of saturated polyesters and saturated amide waxes, said additive resin being crystalline at ambient temperatures and having a melting point (T.sub.m) below a temperature (T.sub.c) at which the base resin cross-linking reaction proceeds at a significant rate;
- wherein the base resin and additive resin have a solubility parameter difference therebetween in the range of 1 to 3.5 MPa.sup.1/2 whereby the base resin and additive resin have only a partial degree of compatibility, thereby allowing crystallization of said additive resin in said mixture,
- whereby said composition, having cooled from a temperature between T.sub.m and T.sub.c to a temperature between T.sub.m and ambient, has crystals of said additive resin distributed throughout so as to be thickened thereby, even in the absence of the thickener selected from metal oxides and hydroxides, and
- whereby, due to melting of the additive resin, the composition may be reversibly broken down by heating to a temperature below T.sub.c.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8730153 |
Dec 1987 |
GBX |
|
Parent Case Info
This is a continuation of application Ser. No. 08/061,823 filed on May 13, 1993, now abandoned, which is in turn a continuation of U.S. Ser. No. 07/542,727 filed Jun. 22, 1990, now abandoned, which is a continuation of PCT/GB8801148, filed, Dec. 23, 1988 under 35 U.S.C. 120.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3994853 |
Hindersinn et al. |
Nov 1976 |
|
4895895 |
Osborne et al. |
Jan 1990 |
|
Foreign Referenced Citations (4)
Number |
Date |
Country |
0083837 |
Jul 1983 |
EPX |
1279387 |
Jun 1972 |
GBX |
1370138 |
Oct 1974 |
GBX |
1445926 |
Aug 1976 |
GBX |
Non-Patent Literature Citations (2)
Entry |
38-Plastics Fabr. Uses, vol. 108, 1988, p. 57. |
S. F. Bush, J. M. Methven & D. R. Blackburn, "Networks as the Basis of Pre-Thickening SMC", Biological and Synthetic Polymer Networks, pp. 321-334 (1988). |
Continuations (2)
|
Number |
Date |
Country |
Parent |
61823 |
May 1993 |
|
Parent |
542727 |
Jun 1990 |
|