Claims
- 1. A laminated molded body, comprising a heat molded body having at least one layer comprising a polypropylene resin composition containing 100 parts by weight of a polypropylene resin (A) having a die swell ratio of less than about 1.70 and about 0.01 to about 45 parts by weight of a polypropylene resin (B) having a die swell ratio of about 1.80 or more, and a substrate comprising a thermoplastic resin.
Priority Claims (3)
Number |
Date |
Country |
Kind |
2000-198909 |
Jun 2000 |
JP |
|
2000-198911 |
Jun 2000 |
JP |
|
2001-096100 |
Mar 2001 |
JP |
|
Parent Case Info
This is a divisional of application Ser. No. 09/892,532 filed Jun. 28, 2001 and now U.S. Pat. No. 6,512,050 the disclosure of which is incorporated herein by reference.
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
3987122 |
Bartz et al. |
Oct 1976 |
A |
5616627 |
Sakurai et al. |
Apr 1997 |
A |
5726269 |
Ima et al. |
Mar 1998 |
A |
5830402 |
Harada et al. |
Nov 1998 |
A |
6110986 |
Nozawa et al. |
Aug 2000 |
A |
Foreign Referenced Citations (4)
Number |
Date |
Country |
08-176234 |
Jul 1996 |
JP |
10-202720 |
Aug 1998 |
JP |
11-228629 |
Aug 1999 |
JP |
11-255825 |
Sep 1999 |
JP |
Non-Patent Literature Citations (1)
Entry |
Shibata et al., “Development of HMS-PP to polypropylene sheet field”, Montell-JPO (K.K.), Apr. 1998, pp. 8-11 with complete English translation. |