Pop-up micro electro mechanical systems (MEMS) are fabricated by a process capable of creating complex millimeter-scale electromechanical devices, as described in U.S. patent application Ser. No. 13/961,510, filed on 7 Aug. 2013 and in U.S. Patent App. No. 61/862,066, filed on 4 Aug. 2013, both of which are incorporated herein by reference in their entirety.
A pop-up laminate structure, including an optical device, can comprise a plurality of rigid layers, wherein at least one of the rigid layers defines gaps extending through the rigid layer to form a plurality of rigid segments separated by the gaps in the rigid layer; at least one flexible layer that is substantially less rigid than the rigid segments, wherein the flexible layer is bonded to the rigid segments such that the flexible layer is exposed at the gaps between the rigid segments to form joints for folding; at least one optical component mounted to a rigid layer and configured to generate, capture or alter a light beam; and an actuator mounted to a rigid layer and configured to displace at least one rigid segment that, in turn, displaces the optical component. At least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure when the laminate is folded at the joints.
A method for fabricating a pop-up laminate structure including an optical device includes actuating an actuator mounted to at least one rigid segment among a plurality of rigid segments separated by gaps in a rigid layer. The rigid segments are flexibly joined by a flexible layer, and an optical device is mounted to at least one of the rigid segments. Actuation of the actuator displaces or changes the orientation of the optical device; and the optical device is used to generate, capture, or alter light using the optical device.
The pop-up MEMS paradigm can be used to manufacture complex articulated mechanisms with integrated pick-and-place components, such as electronics, actuators, and optics, making this process attractive for miniature optical devices. Here, examples of the following two such devices are presented: a one-degree-of-freedom (1-DOF) beam scanning mechanism and a three-degree-of-freedom (3-DOF) spherical parallel mechanism (SPM) capable of three-axis rotation of a beam-steering mirror, laser diode, or miniature camera. Various other devices can be made using the same principle.
Pop-up laminate structures with optical components and methods for fabricating and using such structures are described herein, where various embodiments of the apparatus and methods may include some or all of the elements, features and steps described below.
As described herein, embodiments of a pop-up laminate structure include at least the following components: a plurality of rigid layers, wherein at least one of the rigid layers defines gaps extending through the rigid layer to form a plurality of rigid segments separated by the gaps in the rigid layer; at least one flexible layer that is substantially less rigid than the rigid segments, wherein the flexible layer is bonded to the rigid segments such that the flexible layer is exposed at the gaps between the rigid segments to form joints for folding; at least one optical component mounted to a rigid layer and configured to generate, capture or alter a light beam; and an actuator mounted to a rigid layer and configured to displace at least one rigid segment that, in turn, displaces the optical component. At least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure when the laminate is folded at the joints.
In the accompanying drawings, like reference characters refer to the same or similar parts throughout the different views; and apostrophes are used to differentiate multiple instances of the same or similar items sharing the same reference numeral. The drawings are not necessarily to scale; instead, emphasis is placed upon illustrating particular principles in the exemplifications discussed below.
The foregoing and other features and advantages of various aspects of the invention(s) will be apparent from the following, more-particular description of various concepts and specific embodiments within the broader bounds of the invention(s). Various aspects of the subject matter introduced above and discussed in greater detail below may be implemented in any of numerous ways, as the subject matter is not limited to any particular manner of implementation. Examples of specific implementations and applications are provided primarily for illustrative purposes.
Unless otherwise herein defined, used or characterized, terms that are used herein (including technical and scientific terms) are to be interpreted as having a meaning that is consistent with their accepted meaning in the context of the relevant art and are not to be interpreted in an idealized or overly formal sense unless expressly so defined herein. For example, if a particular composition is referenced, the composition may be substantially, though not perfectly pure, as practical and imperfect realities may apply; e.g., the potential presence of at least trace impurities (e.g., at less than 1 or 2%) can be understood as being within the scope of the description; likewise, if a particular shape is referenced, the shape is intended to include imperfect variations from ideal shapes, e.g., due to manufacturing tolerances. Percentages or concentrations expressed herein can represent either by weight or by volume. Processes, procedures and phenomena described below can occur at ambient pressure (e.g., about 50-120 kPa—for example, about 90-110 kPa) and temperature (e.g., −20 to 50° C.—for example, about 10-35° C.) unless otherwise specified.
Although the terms, first, second, third, etc., may be used herein to describe various elements, these elements are not to be limited by these terms. These terms are simply used to distinguish one element from another. Thus, a first element, discussed below, could be termed a second element without departing from the teachings of the exemplary embodiments.
Spatially relative terms, such as “above,” “below,” “left,” “right,” “in front,” “behind,” and the like, may be used herein for ease of description to describe the relationship of one element to another element, as illustrated in the figures. It will be understood that the spatially relative terms, as well as the illustrated configurations, are intended to encompass different orientations of the apparatus in use or operation in addition to the orientations described herein and depicted in the figures. For example, if the apparatus in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term, “above,” may encompass both an orientation of above and below. The apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. p Further still, in this disclosure, when an element is referred to as being “on,” “connected to,” “coupled to,” “in contact with,” etc., another element, it may be directly on, connected to, coupled to, or in contact with the other element or intervening elements may be present unless otherwise specified.
The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting of exemplary embodiments. As used herein, singular forms, such as “a” and “an,” are intended to include the plural forms as well, unless the context indicates otherwise. Additionally, the terms, “includes,” “including,” “comprises” and “comprising,” specify the presence of the stated elements or steps but do not preclude the presence or addition of one or more other elements or steps.
Additionally, the various components identified herein can be provided in an assembled and finished form; or some or all of the components can be packaged together and marketed as a kit with instructions (e.g., in written, video or audio form) for assembly and/or modification by a customer to produce a finished product.
Beam-scanning mechanisms are found in a variety of optical devices, including laser barcode scanners, scanning laser rangefinders, and scientific instrumentation. To achieve the scanning functionality, such mechanisms can either move the source of the beam directly (e.g., where a laser diode is used) or move a mirror that redirects the beam to the desired location. The latter approach is employed here in a first embodiment to produce a pop-up device. In particular embodiments, a simple electromagnetic actuator 29 is realized by positioning a permanent magnet 33, constrained to pivot around its axis, inside a coil 31, as shown in
Further, the pop-up mechanism can be used to implement the rotary actuator 29. As shown by the process flow in
Here, the permanent magnet 33 and magnetic coil 31 can be prefabricated components positioned on the pop-up MEMS laminate via pick and place—physical placement (shown as the Pick and Place II process step 18 in
The unfolding process 19 of fabrication is constrained by two Sarrus linkages 28 and 41 that constrain the magnet 33 to rise vertically and constrain the coil 31 to rise and rotate by 90 degrees. After the unfolding process is complete, the unfolding mechanism is locked in place using solder or glue (shown as the locking process step 20 in
In various embodiments of the method, any or all of steps 11, 14, 17, and 18 may be omitted. Further discussion of aspects of this methodology and pop-up laminate structures produced therefrom can be found in U.S. Pat. No. 8,834,666.
Note that pop-up MEMS can produce very complex and diverse folding mechanisms; therefore, the simple rotary actuator 29 can be implemented in a number of different ways. In the illustrated embodiment of
In this embodiment, the folding is achieved using Sarrus linkages 28 and 41 in the form of laminated components that enable vertical and rotating motion during pop-up assembly. The magnetic coil 31, which is applied as a pick-and-place component, undergoes 90° rotation during pop-up assembly. The magnet 33, meanwhile, which also is applied to the structure via a pick-and-place procedure, undergoes a vertical transition (in the orientation shown) during pop-up assembly. Once assembled, the principle flexures 35 (where the flexible layer is exposed by gaps between the rigid segments) enable actuated rotary motion when electric current flows through the magnetic coil 31 to generate a magnetic field that displaces the magnet 33. The dimensions (height, width and depth) of this actuator 29 can each be about 10 mm or less (e.g., 5-10 mm).
Further, pop-up MEMS can be used to manufacture much more complex optical mechanisms, such as the three-degree-of-freedom spherical-parallel mechanisms (SPM) 26 shown in
The pop-up assembly step can use a single linear degree of freedom to cause a structure to transform from its two-dimensional (collapsed) state 22 into its three-dimensional (expanded) state 23.
As shown in
As shown in step (A) of
The spherical-parallel-mechanism (SPM) motion is shown in
A three-degree-of-freedom spherical-parallel-mechanism assembly 26 is shown in
A sequence of stages in the pop-up expansion of a scaffold assembly on which an optical device can be mounted is shown in
After the spherical-parallel mechanism 26 is released from the assembly scaffold 24, rotational motion is imparted to three of the actuated links 32 to achieve the three-degree-of-freedom motion of the stage link 36, which can house a mirror, laser diode, camera, or other optical component 58. This motion can be generated by incorporating a simple electromagnetic actuator 29, similar to the one used in the one-degree-of-freedom beam scanning mechanism, into the connection between the ground link 30 and the actuated link 32. Other actuation methods, such as using a piezoelectric bimorph actuator 60 in the form of a laminate comprising a piezoelectric layer 62 and a second layer 64 formed, e.g., of metal and coupled via a conductive pathway 66 with a voltage source 68, as shown in
In describing embodiments of the invention, specific terminology is used for the sake of clarity. For the purpose of description, specific terms are intended to at least include technical and functional equivalents that operate in a similar manner to accomplish a similar result. Additionally, in some instances where a particular embodiment of the invention includes a plurality of system elements or method steps, those elements or steps may be replaced with a single element or step; likewise, a single element or step may be replaced with a plurality of elements or steps that serve the same purpose. Further, where parameters for various properties or other values are specified herein for embodiments of the invention, those parameters or values can be adjusted up or down by 1/100th, 1/50th, 1/20th, 1/10th, 1/5th, 1/3rd, 1/2, 2/3rd, 3/4th, 4/5th, 9/10th, 19/20th, 49/50th, 99/100th, etc. (or up by a factor of 1, 2, 3, 4, 5, 6, 8, 10, 20, 50, 100, etc.), or by rounded-off approximations thereof, unless otherwise specified. Moreover, while this invention has been shown and described with references to particular embodiments thereof, those skilled in the art will understand that various substitutions and alterations in form and details may be made therein without departing from the scope of the invention. Further still, other aspects, functions and advantages are also within the scope of the invention; and all embodiments of the invention need not necessarily achieve all of the advantages or possess all of the characteristics described above. Additionally, steps, elements and features discussed herein in connection with one embodiment can likewise be used in conjunction with other embodiments. The contents of references, including reference texts, journal articles, patents, patent applications, etc., cited throughout the text are hereby incorporated by reference in their entirety; and appropriate components, steps, and characterizations from these references may or may not be included in embodiments of this invention. Still further, the components and steps identified in the Background section are integral to this disclosure and can be used in conjunction with or substituted for components and steps described elsewhere in the disclosure within the scope of the invention. In method claims, where stages are recited in a particular order—with or without sequenced prefacing characters added for ease of reference—the stages are not to be interpreted as being temporally limited to the order in which they are recited unless otherwise specified or implied by the terms and phrasing.
The invention was supported, in whole or in part, by grants under Contract Number W911NF-08-2-0004 from the Army Research Laboratory and Contract Number CCF-0926148 from the National Science Foundation. The U.S. Government has certain rights in the invention.
Filing Document | Filing Date | Country | Kind |
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PCT/US2015/050366 | 9/16/2015 | WO | 00 |
Number | Date | Country | |
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62050829 | Sep 2014 | US |